Assembly apparatus and assembly method for flexible circuit boards

Abstract

The application relates to a flexible circuit board assembling device and method, which comprises a conveying assembly including a first conveying part, a film tearing assembly including a movable clamping mechanism, the clamping mechanism being movable to a conveying path close to the first conveying part, the clamping mechanism including a first clamping part and a first suction part, the end of the first suction part being provided with a suction hole, the first clamping part being hinged with the first suction part, and the clamping end of the first clamping part being capable of abutting against the edge of the suction hole, and a transfer assembly including a movable suction mechanism, the suction mechanism being movable to the conveying path close to the first conveying part, the suction mechanism including a second suction part and a heating part, and the heating part being connected with the second suction part. The flexible circuit board assembling device and method can improve the assembling efficiency of the flexible circuit board.

Description

Technical Field

[0001] This invention relates to the field of assembly equipment technology, and in particular to an assembly equipment and method for flexible circuit boards. Background Technology

[0002] After the flexible circuit board is manufactured, it needs to be assembled with other materials. For example, during the assembly of a button, the flexible circuit board needs to be bonded to the housing and other materials. Currently, the flexible circuit board is assembled manually. In this process, the flexible circuit board is first moved to a heating mechanism, which heats the board to soften the adhesive. Then, the material is removed from the carrier, and the flexible circuit board is assembled and bonded to the material. Finally, the assembled material is placed back onto the carrier. This assembly process has many steps, resulting in low efficiency in assembling flexible circuit boards. Summary of the Invention

[0003] Therefore, the technical problem to be solved by the present invention is to provide an assembly apparatus and assembly method for flexible circuit boards, which can improve the assembly efficiency of flexible circuit boards.

[0004] To address the aforementioned technical problems, the present invention provides an assembly apparatus for flexible circuit boards, comprising: a conveying assembly including a first conveying member; a film-peeling assembly including a movable clamping mechanism, the clamping mechanism being movable toward a conveying path approaching the first conveying member, the clamping mechanism including a first clamping member and a first adsorption member, the end of the first adsorption member having an adsorption hole, the first clamping member being hinged to the first adsorption member, and the clamping end of the first clamping member being able to abut against the edge of the adsorption hole; and a transfer assembly including a movable adsorption mechanism, the adsorption mechanism being movable toward a conveying path approaching the first conveying member, the adsorption mechanism including a second adsorption member and a heating member, the heating member being connected to the second adsorption member.

[0005] In one embodiment of the present invention, the film-tearing assembly further includes a first driving member, a second driving member, and a collecting member. The second driving member is connected to the output end of the first driving member, and the driving path of the second driving member is perpendicular to the driving path of the first driving member. The output end of the second driving member is connected to a plurality of clamping mechanisms. The collecting member includes a collecting cavity communicating with a vacuum source. The end of the collecting member is provided with an opening communicating with the collecting cavity, and the clamping mechanism is able to correspond to the position of the opening.

[0006] In one embodiment of the present invention, the clamping mechanism further includes a third driving member, the first clamping member is provided with a guide groove, the output end of the third driving member is hinged to the guide groove, and the end of the first adsorption member is also provided with an air blowing hole.

[0007] In one embodiment of the present invention, the transfer assembly further includes a drive mechanism and a mounting frame, the output end of the drive mechanism is connected to the mounting frame, the adsorption mechanism is connected to the mounting frame, and the mounting frame is movable and rotatable.

[0008] In one embodiment of the present invention, the transfer assembly further includes a leveling mechanism connected between the output end of the drive mechanism and the mounting bracket. The leveling mechanism includes a first leveling seat, a second leveling seat, and a third leveling seat. The output end of the drive mechanism is connected to the first leveling seat, and the mounting bracket is connected to the third leveling seat. The first leveling seat is hinged to the second leveling seat, and the second leveling seat is hinged to the third leveling seat. The rotation axes of the first leveling seat and the second leveling seat are perpendicular to the rotation axes of the second leveling seat and the third leveling seat. A first elastic member is provided between the first leveling seat and the second leveling seat, and between the second leveling seat and the third leveling seat. The second leveling seat is connected to a first adjusting member that can abut against the first leveling seat, and the third leveling seat is connected to a second adjusting member that can abut against the second leveling seat.

[0009] In one embodiment of the present invention, the adsorption mechanism further includes a heat insulation plate and a heat dissipation block, the second adsorption element is connected to the heat dissipation block, the heat dissipation block is connected to the heat insulation plate, and the heat insulation plate is connected to the mounting bracket.

[0010] In one embodiment of the present invention, the adsorption mechanism further includes a first detection element, a second elastic element, a third elastic element, and a connecting seat. The two ends of the second elastic element are respectively connected to the mounting frame and the heat insulation plate. The first detection element is connected to the connecting seat, the connecting seat is connected to the heat insulation plate, and the two ends of the third elastic element are respectively connected to the first detection element and the mounting frame.

[0011] In one embodiment of the present invention, a storage component is further included. The storage component includes a connecting frame, a positioning plate, and a storage plate. The positioning plate is connected to the connecting frame, and the storage plate is detachably connected to the positioning plate. The storage plate is provided with a plurality of storage slots, and the adsorption mechanism is capable of moving toward the storage plate.

[0012] In one embodiment of the invention, a feeding assembly is further included, the feeding assembly including a feeding channel and a movable seat movable within the feeding channel, the adsorption mechanism being movable toward an end of the feeding channel.

[0013] This invention also provides an assembly method for flexible circuit boards, which uses the above-mentioned assembly device for flexible circuit boards to assemble flexible circuit boards and materials, including the following steps: Step S1: A first conveyor conveys the material to the film-tearing position; Step S2: A clamping mechanism clamps and adsorbs the protective film of the material and then moves to detach the protective film from the material; Step S3: The first conveyor conveys the material to the assembly position; Step S4: The adsorption mechanism adsorbs the flexible circuit board and then heats the flexible circuit board; Step S5: The adsorption mechanism drives the flexible circuit board to adhere to the material.

[0014] The technical solution of the present invention has the following advantages compared with the prior art:

[0015] The present invention discloses an assembly apparatus and method for flexible circuit boards. Through the cooperation of a first clamping member and a first adsorption member in a clamping mechanism, the first adsorption member can adsorb a protective film. By rotating the first clamping member, the protective film can be clamped between the first clamping member and the first adsorption member, thereby enabling the clamping mechanism to stably detach the protective film from the material. Through the arrangement of a second adsorption member and a heating member, the heating member can heat the flexible circuit board during the transfer process by the second adsorption member. The cooperation of the film-peeling assembly and the transfer assembly reduces the assembly steps of the flexible circuit board and enables automatic assembly, thus improving the assembly efficiency of the flexible circuit board. Attached Figure Description

[0016] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0017] Figure 1 This is a schematic diagram of the structure of an assembly device for flexible circuit boards according to the present invention;

[0018] Figure 2 This is a partial structural diagram of the conveying component;

[0019] Figure 3 This is a schematic diagram of the film-tear assembly;

[0020] Figure 4 yes Figure 3 Partial structural diagram;

[0021] Figure 5 This is a schematic diagram of the adsorption mechanism;

[0022] Figure 6 yes Figure 5 Partial structural diagram;

[0023] Figure 7 This is a schematic diagram of the leveling mechanism;

[0024] Figure 8 yes Figure 7 Partial structural diagram;

[0025] Figure 9 This is a structural diagram of the feeding assembly;

[0026] Figure 10 yes Figure 9 Partial structural diagram;

[0027] Figure 11 This is a schematic diagram of the material distribution mechanism;

[0028] Figure 12 yes Figure 9 Partial structural diagram;

[0029] Figure 13 This is a schematic diagram of the structure for storing components;

[0030] Figure 14 This is a schematic diagram of the detection component.

[0031] Explanation of reference numerals in the accompanying drawings: 1. Base plate; 2. Conveying assembly; 3. Detection assembly; 4. Transfer assembly; 5. Feeding assembly; 6. Film tearing assembly; 7. Third detection component; 8. Replenishment platform; 9. Storage assembly; 21. First conveying component; 22. Carrier; 23. Barcode scanner; 24. Stopping mechanism; 25. Lifting mechanism; 26. Baffle; 31. Twelfth driving component; 32. Thirteenth driving component; 33. Fourth detection component; 41. Drive module; 42. Fourth driving component; 43. Fifth driving component; 44. Leveling mechanism; 45. First detection component; 46. Second detection component; 47. Second adsorption component; 48. Mounting bracket; 49. Heat insulation plate; 51. Support frame; 52. Sixth driving component; 53. Second conveying component; 54. Second clamping component; 55. Mounting plate; 56. Transfer plate; 57. Material distribution mechanism; 61. Collecting component; 62. Opening; 63. First driving component; 64. Second driving component 65. Third driving component; 66. First clamping component; 67. First suction component; 68. Suction hole; 69. Air blowing hole; 71. Cleaning component; 91. Connecting frame; 92. Positioning plate; 93. Storage plate; 94. Storage slot; 441. First leveling seat; 442. Second leveling seat; 443. Third leveling seat; 444. First adjusting component; 445. Second adjusting component; 446. Connecting shaft; 447. First elastic component; 451. Third elastic component Components; 452, Connecting seat; 471, Temperature sensor; 472, Heating component; 491, Second elastic component; 492, Heat sink; 511, Feeding channel; 512, Discharge channel; 521, Movable seat; 541, Eighth driving component; 551, Seventh driving component; 552, Material passage; 561, Eleventh driving component; 571, Ninth driving component; 572, Tenth driving component; 573, Material distribution plate; 574, Protrusion; 661, Guide groove. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0033] Reference Figures 1 to 6 As shown, an assembly apparatus for flexible circuit boards according to the present invention includes: a conveying assembly 2, including a first conveying member 21; a film-peeling assembly 6, including a movable clamping mechanism, the clamping mechanism being movable toward the conveying path of the first conveying member 21, the clamping mechanism including a first clamping member 66 and a first adsorption member 67, the end of the first adsorption member 67 being provided with an adsorption hole 68, the first clamping member 66 being hinged to the first adsorption member 67, and the clamping end of the first clamping member 66 being able to abut against the edge of the adsorption hole 68; and a transfer assembly 4, including a movable adsorption mechanism, the adsorption mechanism being movable toward the conveying path of the first conveying member 21, the adsorption mechanism including a second adsorption member 47 and a heating member 472, the heating member 472 being connected to the second adsorption member 47.

[0034] In this embodiment, an assembly apparatus for a flexible circuit board is provided. When assembling the flexible circuit board with the material, the first conveyor 21 first conveys the material to the film-tearing position. Then, the adsorption hole 68 of the first adsorption member 67 in the clamping mechanism adsorbs the protective film of the material, and the first clamping member 66 clamps the protective film. Next, the clamping mechanism moves away from the material, thereby causing the protective film to detach from the material. Then, the first conveyor 21 conveys the material to the assembly position. After the adsorption mechanism adsorbs the flexible circuit board, the heating member 472 heats the flexible circuit board. Finally, the adsorption mechanism drives the flexible circuit board to adhere to the material, thereby completing the assembly of the flexible circuit board and the material. The first clamping member 66 and the first adsorption member 67 in the clamping mechanism work together to adsorb the protective film. The rotation of the first clamping member 66 allows the protective film to be clamped between the first clamping member 66 and the first adsorption member 67, thus enabling the clamping mechanism to stably detach the protective film from the material. The second adsorption member 47 and the heating member 472 are provided so that the heating member 472 can heat the flexible circuit board during the transfer process of the flexible circuit board by the second adsorption member 47. The cooperation between the film-peeling assembly 6 and the transfer assembly 4 can reduce the assembly steps of the flexible circuit board and realize the automatic assembly of the flexible circuit board, thereby improving the assembly efficiency of the flexible circuit board.

[0035] Reference Figure 1 As shown, the assembly apparatus for flexible circuit boards also includes a base plate 1, which supports the conveying assembly 2 and the transfer assembly 4.

[0036] Reference Figure 2 As shown, the conveying assembly 2 includes a first conveyor 21. Specifically, the conveying assembly 2 is connected to the base plate 1. The first conveyor 21 can be considered as a double-layer belt conveyor device. The first conveyor 21 is used to convey the carrier 22, which is used to carry materials. A barcode scanner 23 is connected to the input end of the first conveyor 21. The barcode scanner 23 is connected to the controller. When the carrier 22 moves to the barcode scanning position, the barcode scanner 23 scans and records the material. The conveying assembly 2 also includes a stop mechanism 24 and a lifting mechanism 25. The stop mechanism 24 is connected to the first conveyor 21 and is used to block and position the carrier 22, so that the carrier 22 can be located at the film-tearing position and the assembly position. The lifting mechanism 25 is located below the stop positioning position. The first conveyor 21 is also connected to a baffle 26. The blocking part of the baffle 26 is located above the positioning position. The lifting side of the lifting mechanism 25 is provided with a positioning post, which can be inserted into the positioning hole at the bottom of the carrier 22. When the carrier 22 is blocked by the blocking mechanism 24, the lifting side of the lifting mechanism 25 rises and abuts against the bottom of the carrier 22, so that the positioning pin is inserted into the positioning hole, thereby positioning the carrier 22. Then, the lifting mechanism 25 drives the carrier 22 to rise, so that the top edge of the carrier 22 abuts against the blocking part of the baffle 26, thereby fixing the carrier 22 and preventing the carrier 22 from shaking and causing the flexible circuit board to shift when assembling materials on the carrier 22.

[0037] Reference Figure 3 and Figure 4 As shown, the film-tearing assembly 6 includes a movable clamping mechanism that can move along the conveying path close to the first conveying member 21. The clamping mechanism includes a first clamping member 66 and a first suction member 67. The end of the first suction member 67 is provided with a suction hole 68. The first clamping member 66 is hinged to the first suction member 67, and the clamping end of the first clamping member 66 can abut against the edge of the suction hole 68. Specifically, the clamping mechanism also includes a third driving member 65, which is a linear driving member and connected to the first suction member 67. The side wall of the first clamping member 66 near one end of the third driving member 65 is provided with a guide groove 661. The output end of the third driving member 65 is hinged to the guide groove 661, meaning that the output end of the third driving member 65 can rotate relative to the guide groove 661 while also moving along the guide groove 661, thereby enabling the third driving member 65 to drive the first clamping member 66 to rotate. The end of the first adsorption member 67 is also provided with an air blowing hole 69. Both the air blowing hole 69 and the adsorption hole 68 at the end of the first adsorption member 67 are connected to a vacuum source. The adsorption hole 68 is located on the protrusion at the end of the first adsorption member 67. The end of the first clamping member 66 is provided with a protrusion that can abut against the edge of the protrusion. Thus, after the protective film is adsorbed by the adsorption hole 68, the first clamping member 66 can clamp the protective film. When it is necessary to remove the protective film from the clamping mechanism, the first clamping member 66 is opened and air is blown onto the protective film through the air blowing hole 69, so that the protective film can be removed from the first adsorption member 67.

[0038] The film-peeling assembly 6 also includes a first driving member 63, a second driving member 64, and a collecting member 61. The second driving member 64 is connected to the output end of the first driving member 63. Both the second driving member 64 and the first driving member 63 are linear driving members, and the driving path of the second driving member 64 is perpendicular to the driving path of the first driving member 63. The output end of the second driving member 64 is connected to multiple clamping mechanisms arranged in sequence. In this embodiment, the output end of the second driving member 64 is connected to four clamping mechanisms. The collecting member 61 is connected to the base plate 1. The collecting member 61 includes a collecting cavity communicating with a vacuum source. The top end of the collecting member 61 is provided with an opening 62 communicating with the collecting cavity. The number and position of the openings 62 correspond to the clamping mechanisms. Through the cooperation of the first driving member 63 and the second driving member 64, the clamping mechanisms can be aligned with the positions of the openings 62. When the protective film is detached from the clamping mechanism, the protective film enters the collecting cavity through the opening 62 and then moves to the outside through a pipe connected to the collecting cavity.

[0039] Reference Figures 5 to 8 As shown, the transfer assembly 4 includes a movable adsorption mechanism that can move along the conveying path close to the first conveyor 21. The adsorption mechanism includes a second adsorption element 47 and a heating element 472. The heating element 472 can be considered as a heating rod and is connected to the second adsorption element 47. The heating element 472 can heat the second adsorption element 47, thereby heating the flexible circuit board when the second adsorption element 47 adsorbs the flexible circuit board. The second adsorption element 47 is also connected to a temperature sensor 471, which is connected to a controller and is used to detect the temperature of the second adsorption element 47.

[0040] The transfer assembly 4 also includes a drive mechanism and a mounting frame 48. The output end of the drive mechanism is connected to the mounting frame 48, and the adsorption mechanism is also connected to the mounting frame 48. The mounting frame 48 is movable and rotatable. Specifically, the drive mechanism includes a drive module 41, a fourth drive member 42, and a fifth drive member 43. The drive module 41 can be considered as a gantry transfer mechanism and is connected to the base plate 1. The fourth drive member 42 is a linear drive member, and the drive module 41, in conjunction with the fourth drive member 42, can drive the adsorption mechanism to move along three axes. The fifth drive member 43 is a rotary drive member, connected to the output end of the fourth drive member 42, and the output end of the fifth drive member 43 is connected to the mounting frame 48, thereby enabling the fifth drive member 43 to drive the adsorption mechanism to rotate. The first drive member 63 is connected to the support structure of the drive module 41.

[0041] The transfer assembly 4 also includes a leveling mechanism 44, which is connected between the output end of the drive mechanism and the mounting bracket 48. The leveling mechanism 44 includes a first leveling seat 441, a second leveling seat 442, and a third leveling seat 443. The output end of the drive mechanism is connected to the top of the first leveling seat 441, and the mounting bracket 48 is connected to the bottom of the third leveling seat 443. The first leveling seat 441 is hinged to the second leveling seat 442, and the second leveling seat 442 is hinged to the third leveling seat 443. Specifically, the first leveling seat 441 and the second leveling seat 442, and the second leveling seat 442 and the third leveling seat 443 are all hinged via a connecting shaft 446. The rotation axes of the first leveling seat 441 and the second leveling seat 442 are perpendicular to the rotation axes of the second leveling seat 442 and the third leveling seat 443, meaning that the rotation directions of the first leveling seat 441 and the third leveling seat 443 relative to the second leveling seat 442 are different, thereby achieving multi-directional adjustment of the adsorption mechanism. A first elastic element 447 is provided between the first leveling seat 441 and the second leveling seat 442, and between the second leveling seat 442 and the third leveling seat 443. The second leveling seat 442 is connected to a first adjusting element 444 that abuts against the first leveling seat 441, and the third leveling seat 443 is connected to a second adjusting element 445 that abuts against the second leveling seat 442. Specifically, the first elastic element 447 can be considered as a spring, and the first adjusting element 444 and the second adjusting element 445 can both be considered as adjusting screws. The first leveling seat 441 and the second leveling seat 443 are perpendicular to the rotation axes of the second leveling seat 442 and the third leveling seat 443. The first elastic member 447 between the first leveling seat 441 and the second leveling seat 442 is located on the opposite side away from the first adjusting member 444. The first elastic member 447 between the second leveling seat 442 and the third leveling seat 443 is located on the opposite side away from the second adjusting member 445. Thus, by rotating the first adjusting member 444 and the second adjusting member 445, the posture of the second leveling seat 442 and the third leveling seat 443 can be adjusted, thereby adjusting the posture of the adsorption mechanism.

[0042] The adsorption mechanism also includes a heat insulation plate 49 and a heat dissipation block 492. The second adsorption element 47 is connected to the heat dissipation block 492, the heat dissipation block 492 is connected to the heat insulation plate 49, and the heat insulation plate 49 is connected to the mounting bracket 48. The heat dissipation block 492 is provided with multiple heat dissipation grooves. The heat dissipation block 492 is used to dissipate heat from the second adsorption element 47. The heat dissipation block 492 and the heat insulation plate 49 are used to prevent components near the second adsorption element 47 from being damaged due to overheating.

[0043] The adsorption mechanism also includes a first detection element 45, a second elastic element 491, a third elastic element 451, and a connecting seat 452. The second elastic element 491 can be considered as a tension spring, and its two ends are connected to the mounting bracket 48 and the heat insulation plate 49, respectively. The second elastic element 491 is used to counteract the gravity of the second adsorption element 47, the heat insulation plate 49, and the heat sink 492. The first detection element 45 is connected to the controller and can be considered as a pressure detection element. The first detection element 45 is connected to the connecting seat 452, and the connecting seat 452 is connected to the heat insulation plate 49. The third elastic element 451 can be considered as a compression spring, and its two ends are connected to the first detection element 45 and the mounting bracket 48, respectively. When the adsorption end of the second adsorption element 47 abuts against the flexible circuit board, the first detection element 45 is used to detect the pressure applied by the second adsorption element 47 to the flexible circuit board.

[0044] The transfer assembly 4 also includes a second detection element 46, which is connected to the bottom end of the fourth drive element 42. The second detection element 46 can be regarded as a vision detection element, which can monitor, position and visually inspect the flexible circuit board.

[0045] Reference Figures 9 to 12 As shown, the flexible circuit board assembly apparatus also includes a feeding assembly 5, which includes a feeding channel 511 and a movable seat 521 that can move within the feeding channel 511. The adsorption mechanism can move towards the end of the feeding channel 511. Specifically, the feeding assembly 5 also includes a support frame 51, a sixth drive member 52, a movable seat 521, and a second conveyor 53. The support frame 51 is connected to the base plate 1. The feeding channel 511 is arranged vertically and located within the support frame 51, and the outlet of the feeding channel 511 is located at the top of the support frame 51. The second conveyor 53 can be considered as a belt conveyor. The second conveyor 53 is connected to the support frame 51 and located at the inlet of the feeding channel 511. The second conveyor 53 is used to convey a tray carrying a flexible circuit board. The sixth driving member 52 is a linear driving member, and it is connected to the support frame 51 and arranged along the feeding channel 511. The movable seat 521 is connected to the output end of the sixth driving member 52 and slidably connected to the support frame 51, so that the sixth driving member 52 can drive the movable seat 521 to move along the feeding channel 511. The conveying path of the second conveyor 53 intersects with the moving path of the movable seat 521, so that the second conveyor 53 can convey the tray carrying the flexible circuit board to the movable seat 521. Then, the movable seat 521 drives the tray to rise until the tray moves to the outlet of the feeding channel 511. Preferably, the second conveyor 53 includes two conveyor belt conveying mechanisms, which are slidably connected to the support frame 51 through a slide rail, so that the distance between the conveyor belt conveying mechanisms can be adjusted, thereby enabling the second conveyor 53 to convey trays of different widths.

[0046] The feeding assembly 5 also includes a seventh drive member 551 and a mounting plate 55. The seventh drive member 551 is a linear drive member and is connected to the top side wall of the support frame 51. The mounting plate 55 is connected to the output end of the seventh drive member 551 and is located at the outlet position of the feeding channel 511. The seventh drive member 551 can drive the mounting plate 55 to move along the extension path of the feeding channel 511, that is, the seventh drive member 551 can drive the mounting plate 55 to rise and fall. The mounting plate 55 has a material passage 552 corresponding to the port position of the feeding channel 511, and the material tray can pass through the material passage 552 of the mounting plate 55. The feeding assembly 5 also includes a clamping module, which includes an eighth drive member 541 and a second clamping member 54. The eighth drive member 541 is a linear drive member and is connected to the mounting plate 55. The output end of the eighth drive member 541 is connected to the second clamping member 54. The mounting plate 55 is connected to two adjacent eighth drive members 541, and the driving paths of the two eighth drive members 541 are in opposite directions. The second clamping member 54 is slidably connected to the mounting plate 55. The two eighth driving members 541 can drive the two second clamping members 54 to move closer to the feed port 552, so that the two second clamping members 54 can clamp the material tray protruding from the feed port 552 on the mounting plate 55, thereby fixing the position of the material tray.

[0047] The feeding assembly 5 also includes a dispensing mechanism 57, which is connected to the support frame 51 and located below the mounting plate 55. The dispensing mechanism 57 includes a ninth drive member 571, a tenth drive member 572, and a dispensing plate 573. The ninth drive member 571 and the tenth drive member 572 are both linear drive members with perpendicular drive paths. The output end of the ninth drive member 571 is connected to the tenth drive member 572, and the output end of the tenth drive member 572 is connected to the dispensing plate 573. The ninth drive member 571 and the tenth drive member 572 can cooperate to drive the dispensing plate 573 to rise and move into the feeding channel 511. The end of the dispensing plate 573 is provided with a protrusion 574 extending into the feeding channel 511. Through the cooperation of the ninth drive member 571 and the tenth drive member 572, the protrusion 574 can be inserted into the bottom side of the edge of the tray held by the clamping module, thereby preventing multiple trays from sticking together due to jamming, static electricity, etc., which would cause the clamping module to clamp multiple trays at the same time.

[0048] The feeding assembly 5 also includes a discharge channel 512 parallel to the feeding channel 511. The discharge channel 512 is used to accommodate empty trays. The inlet of the discharge channel 512 is located at the top of the support frame 51. The internal structure of the discharge channel 512 is the same as that of the feeding channel 511. The inlet of the discharge channel 512 is equipped with a seventh drive component 551, a mounting plate 55 and a clamping module with the same structure as the outlet of the feeding channel 511. These will not be described in detail.

[0049] The feeding assembly 5 also includes a transfer plate 56 and an eleventh drive member 561. The transfer plate 56 is slidably connected to the top of the support frame 51, and the transfer plate 56 can move along the arrangement path of the feeding channel 511 and the unloading channel 512. The eleventh drive member 561 is a linear drive member, and the transfer plate 56 is connected to the output end of the eleventh drive member 561. The eleventh drive member 561 can drive the transfer plate 56 to move, so that the transfer plate 56 can move to the corresponding position of the outlet of the feeding channel 511 and the inlet of the unloading channel 512. The transfer plate 56 is located between the mounting plate 55 and the top of the support frame 51. After the clamping module clamps the tray, the seventh drive unit 551 drives the clamping module to rise, thereby raising the tray. Then, the transfer plate 56 moves to the bottom of the tray, and the clamping module resets and descends, placing the tray on the transfer plate 56. This makes the unloading of the flexible circuit boards in the tray more stable and avoids inaccurate positioning due to tray shaking. After all the flexible circuit boards in the tray have been removed, the transfer plate 56 moves to the position corresponding to the inlet of the unloading channel 512. Then, the clamping module corresponding to the unloading channel 512 clamps the tray on the transfer plate 56 and raises the tray. Then, the transfer plate 56 moves to the position corresponding to the outlet of the feeding channel 511. Finally, the clamping module lowers the tray and places it on the movable seat 521 in the unloading channel 512, thus completing the unloading of the empty tray.

[0050] Reference Figure 1 As shown, the flexible circuit board assembly device also includes a third detection element 7 and a cleaning element 71, both of which are connected to the base plate 1. The third detection element 7 can be considered as a vision inspection device connected to the controller, and the cleaning element 71 can be considered as a plasma cleaning device. After the adsorption mechanism adsorbs the flexible circuit board on the tray, the adsorption mechanism first moves the flexible circuit board to the detection position of the third detection element 7. The third detection element 7 detects the flexible circuit board. When the detection is qualified, the adsorption mechanism then moves the flexible circuit board to the cleaning position of the cleaning element 71, thereby cleaning the flexible circuit board.

[0051] Reference Figure 13 As shown, the flexible circuit board assembly device also includes a storage component 9, which includes a connecting frame 91, a positioning plate 92, and a storage plate 93. The connecting frame 91 is connected to the base plate 1, and the positioning plate 92 is connected to the top side of the connecting frame 91. The storage plate 93 and the positioning plate 92 are detachably connected. Specifically, the storage plate 93 and the positioning plate 92 are positioned and locked together by positioning pins. The storage plate 93 is provided with multiple storage slots 94 for accommodating flexible circuit boards that have failed the test. The adsorption mechanism can move towards the storage plate 93. When the third testing element 7 tests the flexible circuit board and the flexible circuit board fails the test, the adsorption mechanism moves the flexible circuit board into the storage slot 94.

[0052] Reference Figure 1 As shown, the flexible circuit board assembly device also includes a feeding platform 8, which is provided with a feeding trough. The feeding trough is used to accommodate flexible circuit boards that have passed the test. When some flexible circuit boards adsorbed by the transfer component 4 fail the test, the flexible circuit boards that fail the test are moved to the storage trough 94, and then the flexible circuit boards on the feeding platform 8 are fed to ensure that the transfer component 4 is in a fully loaded state, thereby preventing some materials on the carrier 22 from failing to assemble with the flexible circuit boards.

[0053] Reference Figure 14 As shown, the flexible circuit board assembly device also includes a detection component 3, which includes a fourth detection element 33, a twelfth driving element 31, and a thirteenth driving element 32. The twelfth driving element 31 is connected to the base plate 1. Both the twelfth driving element 31 and the thirteenth driving element 32 are linear driving elements with mutually perpendicular driving paths. The output end of the twelfth driving element 31 is connected to the thirteenth driving element 32. The fourth detection element 33 can be considered as a vision inspection device connected to the controller. The fourth detection element 33 is connected to the output end of the thirteenth driving element 32. The twelfth driving element 31 and the thirteenth driving element 32 can cooperate to drive the fourth detection element 33 to move, thereby enabling the fourth detection element 33 to position the material on the carrier 22 conveyed by the first conveyor 21. At the same time, the fourth detection element 33 can also inspect the assembled flexible circuit board and the material. In this embodiment, the flexible circuit board assembly device includes two detection components 3. One detection component 3 is used to detect and position the material on the carrier 22 conveyed by the first conveyor 21, and the other detection component 3 is used to position the flexible circuit board on the tray at the outlet of the feeding channel 511 in the feeding component 5.

[0054] In use, the first conveyor 21 and conveyor carrier 22 move to the scanning position, and the scanning unit 23 scans and records the material. Then, the first conveyor 21 and conveyor carrier 22 move to the film-tearing position, and the adsorption hole 68 of the first adsorption member 67 adsorbs the protective film of the material. The first clamping member 66 clamps the protective film. Then, the clamping mechanism moves to the collection position above the collecting member 61, the first clamping member 66 opens, and the air blowing hole 69 blows air into the protective film, causing the protective film to detach from the first adsorption member 67 and enter the collection chamber. Then, the first conveyor 21 and conveyor carrier 22 move to the assembly position, and then the two fourth detection members 33 respectively detect the flexible material on the tray. The circuit board and the material on the carrier 22 are positioned. Then, the adsorption mechanism adsorbs the flexible circuit board on the tray and moves the flexible circuit board to the detection position of the third detection element 7. The third detection element 7 detects the flexible circuit board. When the detection is qualified, the adsorption mechanism moves the flexible circuit board to the cleaning position of the cleaning element 71. The cleaning element 71 cleans the flexible circuit board. Then, the adsorption mechanism heats the flexible circuit board. After heating, the adsorption mechanism moves the flexible circuit board to fit the material. Then, the fourth detection element 33 detects the assembled flexible circuit board and the material. After the detection is completed, the first conveying element 21 moves the carrier 22 to the outside.

[0055] The present invention also provides an assembly method for flexible circuit boards, which uses the above-mentioned assembly device for flexible circuit boards to assemble flexible circuit boards and materials, including the following steps: Step S1: The first conveyor 21 conveys the material to the film-tearing position; Step S2: The clamping mechanism clamps and adsorbs the protective film of the material and then moves to detach the protective film from the material; Step S3: The first conveyor 21 conveys the material to the assembly position; Step S4: The adsorption mechanism adsorbs the flexible circuit board and then heats the flexible circuit board; Step S5: The adsorption mechanism drives the flexible circuit board to adhere to the material.

[0056] The present invention discloses an assembly apparatus and method for flexible circuit boards. Through the cooperation of a first clamping member 66 and a first adsorption member 67 in a clamping mechanism, the first adsorption member 67 can adsorb a protective film. The rotation of the first clamping member 66 allows the protective film to be clamped between the first clamping member 66 and the first adsorption member 67, thereby enabling the clamping mechanism to stably detach the protective film from the material. The arrangement of a second adsorption member 47 and a heating member 472 allows the heating member 472 to heat the flexible circuit board during the transfer process by the second adsorption member 47. The cooperation of the film-peeling assembly 6 and the transfer assembly 4 reduces the number of assembly steps for the flexible circuit board and enables automatic assembly, thus improving the assembly efficiency of the flexible circuit board.

[0057] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. An assembly apparatus for flexible circuit boards, characterized in that, include: A conveying assembly, including a first conveying element; A film-tearing assembly includes a movable clamping mechanism that can move toward a conveying path approaching a first conveyor. The clamping mechanism includes a first clamping member and a first adsorption member. The end of the first adsorption member is provided with an adsorption hole. The first clamping member is hinged to the first adsorption member, and the clamping end of the first clamping member can abut against the edge of the adsorption hole. The transfer assembly includes a movable adsorption mechanism that can move toward a transport path approaching the first conveyor. The adsorption mechanism includes a second adsorption element and a heating element connected to the second adsorption element.

2. The assembly apparatus for flexible circuit boards according to claim 1, characterized in that: The film-tearing assembly further includes a first driving member, a second driving member, and a collecting member. The second driving member is connected to the output end of the first driving member, and the driving path of the second driving member is perpendicular to the driving path of the first driving member. The output end of the second driving member is connected to a plurality of clamping mechanisms. The collecting member includes a collecting cavity communicating with a vacuum source. The end of the collecting member is provided with an opening communicating with the collecting cavity, and the clamping mechanism can correspond to the position of the opening.

3. The assembly apparatus for flexible circuit boards according to claim 1, characterized in that: The clamping mechanism further includes a third driving member. The first clamping member is provided with a guide groove. The output end of the third driving member is hinged to the guide groove. The end of the first adsorption member is also provided with an air blowing hole.

4. The assembly apparatus for flexible circuit boards according to claim 1, characterized in that: The transfer assembly also includes a drive mechanism and a mounting frame. The output end of the drive mechanism is connected to the mounting frame, the adsorption mechanism is connected to the mounting frame, and the mounting frame is capable of movement and rotation.

5. The assembly apparatus for flexible circuit boards according to claim 4, characterized in that: The transfer assembly further includes a leveling mechanism connected between the output end of the drive mechanism and the mounting bracket. The leveling mechanism includes a first leveling seat, a second leveling seat, and a third leveling seat. The output end of the drive mechanism is connected to the first leveling seat, and the mounting bracket is connected to the third leveling seat. The first leveling seat is hinged to the second leveling seat, and the second leveling seat is hinged to the third leveling seat. The rotation axes of the first leveling seat and the second leveling seat are perpendicular to the rotation axes of the second leveling seat and the third leveling seat. A first elastic element is provided between the first leveling seat and the second leveling seat, and between the second leveling seat and the third leveling seat. The second leveling seat is connected to a first adjusting element that can abut against the first leveling seat, and the third leveling seat is connected to a second adjusting element that can abut against the second leveling seat.

6. The assembly apparatus for flexible circuit boards according to claim 4, characterized in that: The adsorption mechanism further includes a heat insulation plate and a heat dissipation block. The second adsorption element is connected to the heat dissipation block, the heat dissipation block is connected to the heat insulation plate, and the heat insulation plate is connected to the mounting bracket.

7. The assembly apparatus for flexible circuit boards according to claim 6, characterized in that: The adsorption mechanism further includes a first detection element, a second elastic element, a third elastic element, and a connecting seat. The two ends of the second elastic element are respectively connected to the mounting frame and the heat insulation plate. The first detection element is connected to the connecting seat, and the connecting seat is connected to the heat insulation plate. The two ends of the third elastic element are respectively connected to the first detection element and the mounting frame.

8. The assembly apparatus for flexible circuit boards according to claim 1, characterized in that: It also includes a storage component, which includes a connecting frame, a positioning plate, and a storage plate. The positioning plate is connected to the connecting frame, and the storage plate is detachably connected to the positioning plate. The storage plate is provided with multiple storage slots, and the adsorption mechanism can move toward the storage plate.

9. The assembly apparatus for flexible circuit boards according to claim 1, characterized in that: It also includes a feeding assembly, which includes a feeding channel and a movable seat that can move within the feeding channel, and the adsorption mechanism can move toward the end of the feeding channel.

10. An assembly method for a flexible circuit board, characterized in that, Assembling a flexible circuit board with materials using the flexible circuit board assembly apparatus according to any one of claims 1-9 includes the following steps: Step S1: The first conveyor moves the material to the film-tearing position; Step S2: After the clamping mechanism clamps and adsorbs the protective film of the material, it moves to detach the protective film from the material. Step S3: The first conveyor transports the material to the assembly position; Step S4: After the adsorption mechanism adsorbs the flexible circuit board, it heats the flexible circuit board; Step S5: The adsorption mechanism drives the flexible circuit board to adhere to the material.

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