Power conversion device and power supply apparatus

Abstract

The application provides a power conversion device and a power supply device, and relates to the technical field of power conversion devices. The power conversion device comprises a shell, a first circuit board and a second circuit board, the first circuit board and the second circuit board are both provided with electrical devices, the first circuit board and the second circuit board are electrically connected, a first wall and a second wall are oppositely arranged, the first circuit board is adjacently arranged with the first wall, and the second circuit board is adjacently arranged with the second wall. The first circuit board and the second circuit board are oppositely arranged, and the area of the first circuit board is larger than that of the second circuit board. The surface of the first circuit board away from the first wall is provided with a first electrical device and a second electrical device. The first electrical device and the second circuit board are oppositely arranged, the second electrical device and the second wall are oppositely arranged and are in heat-conducting contact with the second wall. The heat emission density of the second electrical device is greater than that of the first electrical device. The heat dissipation efficiency is improved, and multiple load outputs are realized.

Description

Technical Field

[0001] This application relates to the field of power conversion device technology, and more particularly to a power conversion device and power supply equipment. Background Technology

[0002] The reliable operation of power conversion devices is based on effective heat dissipation of power devices and reasonable layout of PCB boards.

[0003] Existing single-PCB integrated layouts are limited by terminal space and have insufficient load outputs, making them unsuitable for multi-output scenarios; dual-PCB architectures have complex assembly processes and insufficient heat dissipation efficiency for high-power devices, which restricts the development of power conversion devices. Summary of the Invention

[0004] The purpose of this application is to provide a power conversion device and power supply equipment that can improve heat dissipation efficiency while realizing multi-load output.

[0005] To achieve the above objectives, this application adopts the following technical solution: In a first aspect, this application provides a power conversion device, which includes a housing, a first circuit board, and a second circuit board. The housing accommodates the first and second circuit boards. Both the first and second circuit boards are provided with electrical components and are electrically connected. The housing includes a first wall and a second wall, which are disposed opposite to each other. The first circuit board and the first wall are adjacent to each other, and the second circuit board and the second wall are adjacent to each other. Specifically, the first and second circuit boards are disposed opposite to each other, and the area of ​​the first circuit board is larger than that of the second circuit board. The surface of the first circuit board facing away from the first wall is provided with a first electrical component and a second electrical component. The first electrical component and the second circuit board are disposed opposite to each other, and the second electrical component is disposed opposite to and in thermal contact with the second wall. The heat density of the second electrical component is greater than that of the first electrical component.

[0006] In the embodiments of this application, by setting the first circuit board and the second circuit board opposite to each other and respectively adjacent to the first wall and the second wall of the housing, and making the area of ​​the first circuit board larger than that of the second circuit board, a more reasonable layout can be achieved in the internal space of the housing, effectively improving the space utilization and integration of the housing.

[0007] Based on this, by setting a first electrical component and a second electrical component with a higher heat density on the side of the first circuit board away from the first wall, and making the second electrical component form a thermally conductive contact with the second wall of the housing, while the first electrical component is set facing the second circuit board, different heat dissipation paths are set for the first electrical component and the second electrical component with different heat densities. This allows the second electrical component with a high heat density to quickly transfer heat to the housing and dissipate it outward, reducing heat dissipation thermal resistance, reducing the temperature rise of local hot spots, and preventing the first electrical component and the second electrical component from being affected by heat accumulation, thus improving their working performance and service life.

[0008] In one possible implementation, a third electrical device is disposed on the surface of the second circuit board facing the first electrical device, and the heat density of the third electrical device is less than that of the second electrical device.

[0009] In the embodiments of this application, by placing a third electrical device with a lower heat density on the side of the second circuit board facing the first electrical device, and cooperating with the second electrical device to achieve thermal contact by being in close contact with the second wall of the housing, a thermal management setting of electrical devices with different heat densities is further formed. The second electrical device with a high heat density forms the shortest heat dissipation path along the second wall of the housing, so as to achieve rapid heat dissipation.

[0010] The third electrical component with low heat density is located between the first and second circuit boards. Because of the lower heat consumption and heat dissipation of the third electrical component, local heat accumulation will not occur between the first and second circuit boards. This reduces internal thermal field interference and thermal resistance, making the internal temperature distribution of the power conversion device reasonable and improving the heat dissipation capacity and operational reliability under high power density.

[0011] In one possible implementation, the first circuit board and the first wall are in thermally conductive contact, the second circuit board and the second wall are in thermally conductive contact, and both the outer surfaces of the first wall and the second wall are provided with heat dissipation structures.

[0012] In the embodiments of this application, a thermally conductive contact is formed between the first circuit board and the first wall of the housing, and a thermally conductive contact is formed between the second circuit board and the second wall of the housing. At the same time, heat dissipation structures are respectively provided on the outer surface of the first wall and the outer surface of the second wall, so that the heat generated by the operation of the electrical components on the first circuit board can be quickly conducted to the first wall through the first circuit board, and then dissipated to the external environment with the help of the heat dissipation structure provided on the outside of the first wall.

[0013] The heat generated by the third electrical component on the second circuit board can be conducted to the second wall through the second circuit board, and then dissipated outward through the heat dissipation structure set outside the second wall. Through the layout of the dual-sided heat dissipation structure set on the first and second circuit boards, the heat inside the housing can be separated and dissipated, which can effectively distribute the heat dissipation pressure, further reduce the thermal resistance of the power conversion device, improve the heat dissipation efficiency, and ensure the stable and reliable operation of the power conversion device under high power and high load conditions.

[0014] In one possible implementation, the heat dissipation structure includes heat dissipation fins or heat dissipation columns, and the length of the heat dissipation structure provided on the outer surface of the first wall is greater than the length of the heat dissipation structure provided on the outer surface of the second wall.

[0015] In the embodiments of this application, the heat dissipation structure can be heat dissipation fins or heat dissipation pillars. The length of the heat dissipation structure on the outer surface of the first wall is greater than the length of the heat dissipation structure on the outer surface of the second wall. The first circuit board, with its larger area, houses more electrical components, resulting in a greater total heat generation and higher heat dissipation requirements. The second circuit board, on the other hand, generates relatively less heat. By differentiating the lengths of the heat dissipation structures on the outer surfaces of the first and second walls, a longer heat dissipation structure for the first wall, which generates more heat, increases the heat dissipation area of ​​the first wall. This allows for faster heat dissipation from the electrical components on the first circuit board, preventing overheating and uneven temperature distribution due to insufficient heat dissipation. Simultaneously, the layout of the heat dissipation structure is rationally allocated within the effective space of the housing, preventing space waste and optimizing heat dissipation performance.

[0016] In one possible implementation, the heat dissipation structure includes heat dissipation fins and heat dissipation pillars. A third electrical device is disposed on the surface of the second circuit board facing the first electrical device, and the heat density of the third electrical device is less than that of the second electrical device. The heat dissipation structure disposed on the outer surface of the second wall includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure and the second electrical device are in thermally conductive contact, and the second heat dissipation structure and the second circuit board are in thermally conductive contact. The length of the first heat dissipation structure is greater than the length of the second heat dissipation structure.

[0017] In the embodiments of this application, a first heat dissipation structure and a second heat dissipation structure are partitioned on the outer surface of the second wall. The first heat dissipation structure is attached to a second electrical device with high heat density to form a thermally conductive contact, and the second heat dissipation structure is attached to a second circuit board to form a thermally conductive contact. The length of the first heat dissipation structure is greater than the length of the second heat dissipation structure.

[0018] For the second electrical component, which generates concentrated heat and suffers higher heat loss, a longer first heat dissipation structure is used to increase the heat exchange area, enhance heat conduction and dissipation capabilities, and dissipate heat from hot spots. For the second circuit board and the area where the third electrical component is located, which generates less heat and has a smaller heat load, a shorter second heat dissipation structure is used to meet the heat dissipation needs of the low-heat areas.

[0019] In one possible implementation, the distance between the second electrical device and the first circuit board is less than the distance between the second circuit board and the first circuit board. The surface of the second wall corresponding to the second electrical device protrudes towards the first wall. The first heat dissipation structure is disposed on the surface of the second wall corresponding to the second electrical device, and the second heat dissipation structure is disposed on the surface of the second wall corresponding to the second circuit board. The ends of the first heat dissipation structure and the second heat dissipation structure away from the second wall are located on the same plane.

[0020] In the embodiments of this application, by forming a protruding structure facing inward towards the second electrical component at the position corresponding to the second wall of the housing, and simultaneously arranging the first heat dissipation structure on the outer surface of the protrusion and the second heat dissipation structure on the plane area corresponding to the second wall and the second circuit board, and ensuring that the ends of the first and second heat dissipation structures away from the second wall are located in the same plane, it is possible to shorten the thermal conduction distance from the second electrical component to the second wall, further reduce the heat dissipation thermal resistance of high heat density devices, and also to distinguish the installation areas of the first and second heat dissipation structures through the protruding structure, so that the longer first heat dissipation structure and the shorter second heat dissipation structure are kept flush externally. While improving heat dissipation efficiency, it avoids the problem of uneven space occupation caused by the staggered height of the first and second heat dissipation structures, thereby achieving the effect of optimal internal heat dissipation performance and a regular and unified external structure, further improving the heat dissipation reliability and structural compactness of the power conversion device.

[0021] In one possible implementation, a power conversion circuit is provided on a first circuit board, a first connection terminal is provided on a second circuit board, and the housing also includes a third wall connecting the first wall and the second wall. The first connection terminal includes a first terminal and a second terminal. The first terminal is disposed facing the second circuit board, and the second terminal is disposed facing the third wall. The first terminal is connected to the second circuit board, and the second terminal is disposed through the third wall.

[0022] In the embodiments of this application, the power conversion circuit is disposed on the first circuit board, and the first connection terminal is disposed on the second circuit board accordingly. The housing is enclosed by the first wall and the second wall through the third wall. The first connection terminal includes a first terminal and a second terminal, with the first terminal facing the second circuit board and forming a stable electrical connection with the second circuit board, and the second terminal facing the third wall and extending through the outside of the third wall, thereby realizing the layout of internal circuit docking and external wiring lead-out.

[0023] This allows the connection between the first and second circuit boards inside the housing to be separated from the external wiring ports, preventing external terminals from occupying the heat dissipation areas of the first and second walls, ensuring the integrity and continuous heat conduction and dissipation capacity of the heat dissipation structure on the first and second walls and the outside, and preventing the main heat dissipation path from being damaged by openings or wiring.

[0024] Meanwhile, the space on the third wall of the housing is used for external terminal lead-out, which does not occupy the space between the first and second circuit boards. This facilitates the arrangement of power conversion circuits and various electrical components, isolates the power circuit heating from the terminal wiring area, prevents thermal and electromagnetic interference caused by the power circuit heating and the terminal wiring area, further optimizes the structural layout of the power conversion device, and improves the long-term reliability of the power conversion device.

[0025] In one possible implementation, the first connecting terminal along the arrangement direction of the first wall and the second wall includes a multi-layered arrangement of second terminals.

[0026] In the embodiments of this application, the second terminals are arranged in multiple layers and spaced apart along the arrangement direction of the first and second walls. This eliminates the need to widen the housing size and does not encroach on the main heat dissipation areas such as the first and second walls, or the space of power devices on the circuit board. Within the limited side mounting space, the number of external terminals is increased to meet the needs of multiple cable connections and multiple power inputs and outputs, adapting to high-power, multi-interface application scenarios.

[0027] In one possible implementation, each layer of the second terminal includes a positive terminal and a negative terminal, which are arranged alternately along a direction perpendicular to the first and second walls.

[0028] In the embodiments of this application, by arranging the positive and negative terminals alternately, the path length of the current transmission circuit can be shortened, bringing the positive and negative current circuits closer together. This effectively cancels out electromagnetic radiation generated during operation, reduces parasitic inductance in the circuit, and suppresses voltage spikes and high-frequency interference. Simultaneously, the spacing between the positive and negative terminals ensures sufficient electrical clearance and creepage distance, preventing safety hazards such as breakdown and short circuits under high-voltage conditions. This also improves the insulation protection capability and electrical safety of the positive and negative terminal connections, further ensuring the long-term stability of the power conversion device.

[0029] In one possible implementation, the first connection terminal also includes a busbar, with each layer of positive terminals connected to the busbar, or each layer of negative terminals connected to the busbar.

[0030] In the embodiments of this application, by setting a busbar at the first connection terminal, the positive terminal of each layer is connected to the corresponding busbar, or the negative terminal of each layer is connected to the corresponding busbar, and the busbar is used to realize the busbar conduction of multi-layer terminals of the same polarity.

[0031] By connecting the same type of terminals through the busbar, multiple currents can be collected, the conductive path can be shortened, the contact resistance and conduction loss can be reduced, and the heat accumulation in the terminal area can be reduced.

[0032] Simplify the wiring layout of the positive and negative terminals, reduce the arrangement of scattered wires, optimize the neatness of the wiring, reduce the difficulty of assembly and the risk of wiring interference, and improve the electrical safety and long-term operational reliability of the power conversion device.

[0033] In one possible implementation, the first electrical device includes a second connection terminal, one end of which is connected to the first circuit board, and the other end of which extends through a third wall.

[0034] In the embodiments of this application, the first electrical component is provided with a second connection terminal. One end of the second connection terminal is connected to the first circuit board to achieve circuit conduction, and the other end extends outward and penetrates the third wall. By placing the second connection terminal on the side of the third wall, forming a co-side arrangement with the first connection terminal, the lead-out position of the external interface of the power conversion device is unified, the wiring structure is organized, and centralized wiring and subsequent maintenance are facilitated.

[0035] Meanwhile, the second connection terminal is located on the third wall, which does not occupy the heat dissipation space of the first and second walls, and does not require damage to the heat dissipation structure of the first and second walls. This avoids the impact of external terminal openings and wiring on the heat dissipation channels of high-heat-generating components, further optimizing the structural layout of the power conversion device and the ease of use of the product. Furthermore, because the second connection terminal generates little heat, placing it on the corresponding area of ​​the first and second circuit boards reduces the impact on the electrical components on the second circuit board and lowers the risk of heat accumulation.

[0036] Secondly, this application provides a power supply device, which includes the power conversion device described in the first aspect, wherein multiple power conversion devices are connected in parallel or in series.

[0037] In the embodiments of this application, the power supply device uses multiple of the aforementioned power conversion devices connected in parallel or in series, which can adapt to application scenarios with different power levels and different voltage / current output requirements. Attached Figure Description

[0038] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application, and do not constitute an undue limitation of this application.

[0039] Figure 1 A structural block diagram of a power supply device provided in an embodiment of this application; Figure 2This is an exploded view of a power conversion device provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a power conversion device from another angle, provided in an embodiment of this application. Figure 4 This is a schematic diagram of the structure of a power conversion device from another angle, provided in an embodiment of this application. Figure 5 This is a partial structural schematic diagram of a power conversion device provided in an embodiment of this application; Figure 6 This is a schematic diagram of the structure of the second terminal of a power conversion device provided in an embodiment of this application. Detailed Implementation

[0040] The embodiments of this application are described below with reference to the accompanying drawings.

[0041] For ease of understanding, the English abbreviations and related technical terms used in the embodiments of this application will be explained and described below.

[0042] Maximum operating temperature refers to the maximum operating temperature of an electronic component. This is especially important for power devices, which generate heat during operation. If the ambient temperature is too high, it will reduce the component's efficiency, shorten its lifespan, and may even damage it. Every electronic component, and even different models of the same component, has its corresponding operating temperature range. When an electronic component operates outside its operating temperature range, its performance will degrade due to the unsuitable temperature, and it may even be damaged. Generally, electronic components have corresponding operating parameters, including an operating temperature range. The maximum value of this range is the maximum operating temperature.

[0043] Electromagnetic interference (EMI) refers to electromagnetic noise generated by rapid changes in voltage and current during the switching, conduction, and turn-off processes of a circuit. This noise is coupled to other devices, circuits, or systems through conduction or radiation, causing signal distortion, functional abnormalities, or performance degradation. It needs to be suppressed through layout optimization and filtering structures to meet electromagnetic compatibility requirements.

[0044] Power factor correction (PFC) is a power conversion unit used to improve the power factor of the power supply input and suppress harmonic distortion of the input current. It can reduce grid pollution and improve power utilization. It is widely used in the front-end rectification stage of high-power power supplies to achieve efficient and compliant power conversion.

[0045] A DC-DC converter is a power conversion circuit that converts a DC voltage amplitude to another target DC voltage amplitude. It includes boost, buck, and buck-boost topologies and is responsible for voltage regulation and power transfer in a power supply system. It is the core unit for realizing multi-channel isolated / non-isolated output.

[0046] Thermal interface material (TIM) is an interfacial medium that fills the space between power devices, power boards, and heat dissipation structures. It can eliminate contact gaps, reduce interfacial thermal resistance, improve the efficiency of heat conduction from the heat source to the heat dissipation structure, and ensure that the device temperature remains stable within the maximum operating temperature range.

[0047] Power Flow (PF): refers to the transmission path and conversion direction of electrical energy in a power conversion device. From the grid input, through EMI filtering, PFC correction, and DC / DC voltage regulation, it is finally transmitted to the load output, while TIM heat dissipation ensures stable power transmission.

[0048] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0049] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0050] It should be understood that the term "and / or" used in this document is merely a description of the same field in the related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0051] In some embodiments, the technical solution of this application can be applied to various power supply devices 1000 having a power conversion device 100. For example, Figure 1The present application provides a structural block diagram of a power supply device 1000. The power supply device 1000 can be an industrial power supply, such as a dedicated power supply for communication base stations, a power supply for power systems, a core power supply for industrial control, or a blade power supply. It can also be a data center power supply, a UPS power supply, an embedded power supply, a vehicle power supply, a photovoltaic inverter power supply, an energy storage converter power supply, etc.

[0052] This application uses the power supply device 1000 as an example to illustrate the blade power supply.

[0053] In the embodiments of this application, the power supply includes multiple power conversion devices 100, which are connected in parallel or in series to meet the requirements of different output voltages or output power. Parallel connection can realize power expansion, while series connection can realize voltage boosting, flexibly adapting to the electrical requirements of various loads. Figure 2 This is an exploded structural diagram of a power conversion device 100 provided in an embodiment of this application. Figure 3 This is a structural schematic diagram of a power conversion device 100 provided in an embodiment of this application from another angle.

[0054] like Figure 2 and Figure 3 As shown, in some embodiments, the power conversion device 100 includes a housing 110, a first circuit board 120, and a second circuit board 130. The housing 110 is used to house the first circuit board 120 and the second circuit board 130. Both the first circuit board 120 and the second circuit board 130 are provided with electrical components and are electrically connected. The housing 110 includes a first wall 111 and a second wall 112, which are disposed opposite to each other. The first circuit board 120 and the first wall 111 are disposed adjacent to each other, and the second circuit board 130 and the second wall 112 are disposed adjacent to each other.

[0055] The first circuit board 120 and the second circuit board 130 are arranged opposite to each other, and the area of ​​the first circuit board 120 is larger than the area of ​​the second circuit board 130. The surface of the first circuit board 120 away from the first wall 111 is provided with a first electrical component and a second electrical component. The first electrical component and the second circuit board 130 are arranged opposite to each other, and the second electrical component is arranged opposite to the second wall 112 and is in thermal contact with the second wall 112. The heat density of the second electrical component is greater than the heat density of the first electrical component.

[0056] In the embodiments of this application, the housing 110 is a cavity structure, the first wall 111 and the second wall 112 are the two main heat dissipation surfaces of the cavity structure, and the first wall 111 and the second wall 112 are enclosed by the side plate and the third wall 113 to form a complete accommodating space.

[0057] In some examples, the inner wall of the housing 110 is provided with reinforcing ribs or positioning columns to improve structural rigidity.

[0058] The first circuit board 120 and the second circuit board 130 are arranged in parallel. The length and width of the first circuit board 120 are both greater than those of the second circuit board 130. The first circuit board 120 covers the transverse space inside the housing 110, and the second circuit board 130 occupies the power distribution area at the end of the housing 110, forming a layout in which the first circuit board 120 and the second circuit board 130 are stacked.

[0059] The first circuit board 120 is the core power board, which undertakes the main power conversion functions such as power rectification, inversion, voltage regulation, and filtering. The second circuit board 130 is the power distribution board, which is responsible for power output distribution, terminal connection and auxiliary control.

[0060] The first circuit board 120 has a larger area, which can accommodate more high-power devices, longer power lines and more wiring space, to meet the layout requirements of high power density and high current transmission, while providing sufficient installation space for the second electrical device.

[0061] In some examples, the first circuit board 120 can be a multi-layer circuit board structure, with an inner layer consisting of a complete copper ground layer and a power layer, and an outer layer for arranging devices and signal lines. The power area and the signal area are physically separated to avoid power signal interference.

[0062] The second electrical component, as the main heat source of the power conversion device 100, is in close thermal contact with the second wall 112, shortening the heat conduction path and quickly dissipating heat to the outside, thus avoiding problems such as decreased device efficiency, shortened lifespan, or even burnout caused by high temperature.

[0063] In some examples, the bottom surface of the second electrical device is fixedly connected to the first circuit board, and the top surface of the second electrical device is attached to the second wall 112, ensuring that the thermally conductive cross-section material fills the gaps, so that heat is conducted from the second electrical device to the second wall 112, thereby improving heat dissipation efficiency.

[0064] The first electrical component has a low heat density and is arranged opposite to the second circuit board 130. This not only makes reasonable use of the unused space inside the housing 110 to achieve a compact structure, but also avoids the superposition of heat sources of low-heat-generating components and high-heat-generating components, thus preventing local heat accumulation.

[0065] In some examples, the second electrical device includes high-power, high-heat-density devices such as power transistors, PFC inductors, transformers, DC inductors, and bus capacitors.

[0066] For example, the power transistor can be a silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET), and the power transistor is mounted at the center of the first circuit board.

[0067] For example, PFC inductors and DC inductors can be magnetic ring structures.

[0068] For example, the bus capacitor can be a high-frequency, low-resistance electrolytic capacitor or a film capacitor to reduce ripple heating.

[0069] In some examples, the first electrical component includes low-power, low-heat-density components such as sampling resistors, control chips, signal connectors, and small-capacity capacitors, resulting in low heat generation.

[0070] For example, the sampling resistor can be a milliohm alloy resistor, an alloy sampling resistor, a surface-mount high-power shunt sampling resistor, a wire-wound sampling resistor, or a four-terminal Kelvin sampling resistor, etc., to achieve accurate current sampling.

[0071] For example, the control chip can be a power factor correction control chip (PFC control chip), a pulse width modulation control chip (PWM control chip), a microcontroller unit (MCU), or a digital signal processor (DSP), etc.

[0072] For example, signal connectors are used for internal circuit connections, and small-capacity capacitors are used for signal filtering and voltage regulation.

[0073] In some embodiments, a third electrical device is disposed on the surface of the second circuit board 130 facing the first electrical device, and the heat density of the third electrical device is less than that of the second electrical device.

[0074] The third electrical component is located on the inner surface of the second circuit board 130 facing the first circuit board 120, ensuring that a complete bonding surface is formed between the outer side of the second circuit board 130 and the second wall 112, without interfering with the heat conduction path.

[0075] In the embodiments of this application, the third electrical device is disposed on the side of the second circuit board 130 facing the first circuit board 120. The third electrical device has low heat generation, and the heat dissipation requirement can be met by air convection between the first circuit board 120 and the second circuit board 130. At the same time, it achieves a short-distance electrical connection with the first electrical device.

[0076] In some examples, the third electrical device is connected to the first electrical device via a copper jumper or flexible cable.

[0077] In some examples, the third electrical device includes power distribution protection and control elements such as fuses, relays, surge protectors, and sampling terminals, which mainly realize overcurrent protection, on / off control, and signal sampling functions of the output circuit, and generate relatively low heat.

[0078] For example, the fuse can be a surface mount fuse (SMF), a glass tube fuse (GTF), a ceramic fuse (CF), a time-delay fuse (TDF), or a high voltage DC fuse (HVDC-Fuse), etc.

[0079] For example, the relay can be an electromagnetic relay (EMR), a solid state relay (SSR), a power relay (PR), or a DC electromagnetic relay (DC-EMR), etc.

[0080] For example, the surge protector can be a varistor surge protector (VSP), a gas discharge tube surge protector (GDT-SP), a semiconductor surge protector (SSP), or a power port surge protector (PP-SP), etc. In some embodiments, the first circuit board 120 and the first wall 111 are in thermally conductive contact, the second circuit board 130 and the second wall 112 are in thermally conductive contact, and both the outer surfaces of the first wall 111 and the second wall 112 are provided with heat dissipation structures.

[0081] In the embodiments of this application, heat dissipation structures are provided on the outer surfaces of both the first wall 111 and the second wall 112. The heat dissipation structure on the outer surface of the first wall 111 forms a low-power heat dissipation path with the first circuit board 120 and the first electrical device, while the heat dissipation structure on the surface of the second wall 112 forms a high-power heat dissipation path with the second circuit board 130 and the second electrical device, thereby achieving hierarchical and directional heat dissipation of the heat source within the housing 110. In some examples, a thermally conductive insulating pad is provided between the first circuit board 120 and the first wall 111, with the first wall 111 in contact with the first circuit board 120. The heat dissipation structure on the outer surface of the first wall 111 consists of equally spaced parallel heat dissipation fins, with the fins extending in the same direction as the length of the housing 110, to increase the heat exchange area with the outside air. The low heat generated when the first electrical device is working is conducted to the first wall 111 via the first circuit board 120 and then dissipated by convection from the outer fins of the first wall 111.

[0082] In some examples, a high thermal conductivity thermal interface material is provided between the second electrical device and the second wall 112, and the heat dissipation substrate of the second electrical device is pressed against the second wall 112 to minimize the thermal resistance between the second electrical device and the second wall 112.

[0083] For example, the clamping force between the heat dissipation substrate of the second electrical device and the second wall 112 is achieved by locking the housing 110 with screws.

[0084] For example, the heat dissipation structure on the outside of the second wall 112 can be a comb-shaped or columnar dense heat dissipation array to ensure that the temperature of the second electrical device remains stable within a safe range under full load conditions.

[0085] Figure 4 This is a schematic diagram of the structure of a power conversion device 100 provided in an embodiment of this application. Figure 5 This is a partial structural schematic diagram of a power conversion device 100 provided in an embodiment of this application.

[0086] like Figure 4 and Figure 5 As shown, in some embodiments, the heat dissipation structure includes heat dissipation fins or heat dissipation columns, and the length of the heat dissipation structure provided on the outer surface of the first wall 111 is greater than the length of the heat dissipation structure provided on the outer surface of the second wall 112.

[0087] In the embodiments of this application, the first wall 111 corresponds to the power area of ​​the first circuit board 120, covering low-heat devices and some high-heat devices, with a large total heat dissipation. Therefore, a longer heat dissipation structure is provided to increase the heat dissipation area and enhance the convective heat transfer capability.

[0088] The second wall 112 corresponds to the power distribution area of ​​the second circuit board 130. It has a low heat density and a small total heat dissipation. A shorter heat dissipation structure is set up to meet the basic heat dissipation requirements and control the volume of the housing 110, so as to avoid installation interference caused by an excessively long heat dissipation structure.

[0089] In some embodiments, the heat dissipation structure includes heat dissipation fins or heat dissipation pillars, and a third electrical component is disposed on the surface of the second circuit board 130 facing the first electrical component. The heat density of the third electrical component is less than that of the second electrical component. The heat dissipation structure disposed on the outer surface of the second wall 112 includes a first heat dissipation structure 1121 and a second heat dissipation structure 1122. The first heat dissipation structure 1121 and the second electrical component are in thermally conductive contact, and the second heat dissipation structure 1122 and the second circuit board 130 are in thermally conductive contact. The length of the first heat dissipation structure 1121 is greater than the length of the second heat dissipation structure 1122.

[0090] In the embodiments of this application, a long-sized first heat dissipation structure 1121 is provided in the area corresponding to the high heat density second electrical device, so as to dissipate heat from the heat source through the ultra-large heat dissipation area and remove the concentrated heat generated by the high power device.

[0091] In the area corresponding to the low-heat second circuit board 130, a short-sized second heat dissipation structure 1122 is set to meet the basic heat dissipation of the power distribution device, avoid waste of heat dissipation resources, and at the same time optimize the weight and volume of the housing 110 structure, improve heat dissipation efficiency, and ensure the rationality of the power conversion device 100 structure.

[0092] In some examples, the length of the second heat dissipation structure 1122 is the same as the length of the second circuit board 130.

[0093] In some embodiments, the distance between the second electrical device and the first circuit board is less than the distance between the second circuit board and the first circuit board. The surface of the second wall corresponding to the second electrical device protrudes towards the first wall. The first heat dissipation structure is disposed on the surface of the second wall corresponding to the second electrical device, and the second heat dissipation structure is disposed on the surface of the second wall corresponding to the second circuit board. The ends of the first heat dissipation structure and the second heat dissipation structure away from the second wall are located on the same plane.

[0094] Based on the above-described heat dissipation layout, the embodiments of this application also optimize the arrangement of the connection terminals. Specific embodiments are as follows: In some embodiments, a power conversion circuit is provided on the first circuit board 120, a first connection terminal is provided on the second circuit board 130, and the housing 110 further includes a third wall 113 connecting the first wall 111 and the second wall 112. The first connection terminal includes a first terminal and a second terminal. The first terminal is disposed facing the second circuit board 130, and the second terminal is disposed facing the third wall 113. The first terminal is connected to the second circuit board 130, and the second terminal is disposed through the third wall 113.

[0095] In the embodiments of this application, the power flow of the power conversion circuit is U-shaped. Electrical energy is input to the first circuit board 120 from the second connection terminal of the third wall 113, then transmitted laterally to the other end of the housing 110 via the power conversion circuit, then longitudinally to the second circuit board 130, and finally output to the first connection terminal of the third wall 113, forming a U-shaped path with the lowest power transmission loss.

[0096] In the embodiments of this application, at least one load terminal 4 and battery terminal 6 are arranged side by side along the first direction X. By utilizing the continuous space along the length of the second circuit board 130, the load terminal and battery terminal are uniformly planned and arranged, which facilitates the centralized insertion and wiring of external cables. External cables can be inserted into the terminal block in batches along the same direction, avoiding electromagnetic interference and blockage of heat dissipation channels caused by messy cables.

[0097] In some examples, a gap is provided between the load terminals and the battery terminals to ensure electrical clearance and creepage distance.

[0098] Optionally, the load terminals and battery terminals are gold-plated to reduce contact resistance and improve insertion and removal life.

[0099] The unused space on the second circuit board 130 can be flexibly increased with load terminals according to actual load requirements, improving the flexibility of multi-output expansion. There is no need to reset the layout of the second circuit board 130; simply adding load terminal blocks to the unused space can expand the number of output channels, adapting to application scenarios with different power levels and different load quantities.

[0100] Figure 6 This is a schematic diagram of the structure of the second terminal of a power conversion device provided in an embodiment of this application.

[0101] like Figure 6 As shown, in some embodiments, the first connection terminal along the arrangement direction of the first wall 111 and the second wall 112 includes a multi-layered arrangement of second terminals 140.

[0102] In some examples, the second circuit board 130 has 3-5 sets of terminal pads reserved, which can be expanded to 8, 12 or 16 outputs as needed. Only the terminal blocks need to be replaced when expanding.

[0103] In the embodiments of this application, the first connecting terminal forms a multi-layered arrangement of second terminals 140 along the arrangement direction of the first wall 111 and the second wall 112. The arrangement direction of the second terminals 140 is consistent with the thickness direction of the housing 110, so that the multi-layered second terminals 140 are stacked in layers along the thickness direction in the space between the first circuit board 120 and the second circuit board 130, and are led out as a whole to the third wall 113 at the end of the housing 110, making full use of the space between the first circuit board 120 and the second circuit board 130 without increasing the installation size of the housing 110.

[0104] In some examples, the second terminal 140 is divided into three, four or five layers along the thickness direction of the housing 110.

[0105] Optionally, each terminal layer can independently transmit one power path, and insulating partitions can be installed between terminal layers to prevent discharge and interference between terminal layers. In some examples, a preset electrical clearance and creepage distance are maintained between adjacent second terminals 140, and they are separated and positioned by insulating supports, allowing each second terminal 140 to independently transmit power current.

[0106] In some embodiments, each layer of second terminal 140 includes a positive terminal and a negative terminal, and the positive terminal and the negative terminal are arranged alternately along a direction perpendicular to the first wall 111 and the second wall 112, so that the positive current path and the negative current path in the same layer form a power transmission channel with regular path.

[0107] In some examples, a gap is provided between the positive and negative terminals to prevent short circuits or high-voltage breakdowns within the same layer, while also allowing the alternating magnetic fields generated by the positive and negative currents to cancel each other out, reducing the parasitic inductance of the power circuit.

[0108] In some embodiments, the first connection terminal further includes a busbar, which extends along the length of the housing 110. Positive terminals in the same layer are all connected to the positive busbar to achieve equipotential current convergence, or negative terminals in the same layer are all rigidly connected to the negative busbar to achieve equipotential current convergence.

[0109] In some examples, the busbar is attached to the second circuit board 130 to provide a low-impedance transmission path for power current, enabling stable distribution of current output from multiple terminals, avoiding overheating of a single terminal, and reducing connection contact resistance, thereby improving efficiency and reliability during high current output.

[0110] In some embodiments, the first electrical device further includes a second connection terminal. One end of the second connection terminal is directly soldered and fixed to the control circuit area of ​​the first circuit board 120, and reliably connected to the control chip, sampling circuit, and drive circuit. The other end extends from the inside of the housing 110 toward the third wall 113 and is exposed outside the third wall 113 to form an externally pluggable signal interface.

[0111] The protruding position of the second connecting terminal and the power terminal of the first connecting terminal are arranged in sections on the third wall 113.

[0112] In some examples, the second connection terminal is a signal terminal, an auxiliary power supply terminal, or a communication terminal, used to transmit control signals, voltage and current monitoring signals, temperature signals, fault protection signals, and communication data.

[0113] Optionally, the signal terminals transmit TTL level signals, the auxiliary power supply terminals provide 5V / 12V auxiliary power, and the communication terminals adopt RS485 or CAN bus interfaces.

[0114] In the embodiments of this application, the second connection terminal is arranged separately from the first connection terminal for high-power transmission, which can block the strong electromagnetic interference generated by the power circuit during the switching process from being switched on to being coupled to the signal circuit, thereby avoiding problems such as control command malfunction, sampling data drift, and communication interruption.

[0115] It should be noted that the electronic components shown in this embodiment are only used to illustrate the design concept and advantages of this application, and do not mean that the power conversion device product only includes the above-mentioned electronic components in this embodiment. Under the design concept of this embodiment, other electronic components and other parts required to realize the power conversion function can be included in the power conversion device described in this embodiment.

[0116] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A power conversion device, characterized in that, The power conversion device includes a housing, a first circuit board, and a second circuit board. The housing accommodates the first and second circuit boards. Both the first and second circuit boards are equipped with electrical components and are electrically connected. The housing includes a first wall and a second wall, which are disposed opposite to each other. The first circuit board is adjacent to the first wall, and the second circuit board is adjacent to the second wall. The first circuit board and the second circuit board are arranged opposite to each other, and the area of ​​the first circuit board is larger than that of the second circuit board. The surface of the first circuit board away from the first wall is provided with a first electrical component and a second electrical component. The first electrical component and the second circuit board are arranged opposite to each other, and the second electrical component and the second wall are arranged opposite to each other and in thermal contact with the second wall. The heat density of the second electrical component is greater than that of the first electrical component.

2. The power conversion device according to claim 1, characterized in that, A third electrical component is disposed on the surface of the second circuit board facing the first electrical component, and the heat density of the third electrical component is less than that of the second electrical component.

3. The power conversion device according to claim 1 or 2, characterized in that, The first circuit board and the first wall are in thermally conductive contact, the second circuit board and the second wall are in thermally conductive contact, and both the outer surfaces of the first wall and the second wall are provided with heat dissipation structures.

4. The power conversion device according to claim 3, characterized in that, The heat dissipation structure includes heat dissipation fins or heat dissipation columns, and the length of the heat dissipation structure provided on the outer surface of the first wall is greater than the length of the heat dissipation structure provided on the outer surface of the second wall.

5. The power conversion device according to claim 3 or 4, characterized in that, The heat dissipation structure includes heat dissipation fins or heat dissipation pillars. A third electrical component is disposed on the surface of the second circuit board facing the first electrical component. The heat density of the third electrical component is less than that of the second electrical component. The heat dissipation structure provided on the outer surface of the second wall includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure is in thermal contact with the second electrical component, and the second heat dissipation structure is in thermal contact with the second circuit board. The length of the first heat dissipation structure is greater than the length of the second heat dissipation structure.

6. The power conversion device according to claim 5, characterized in that, The distance between the second electrical component and the first circuit board is less than the distance between the second circuit board and the first circuit board. The surface of the second wall corresponding to the second electrical component protrudes towards the first wall. The first heat dissipation structure is disposed on the surface of the second wall corresponding to the second electrical component. The second heat dissipation structure is disposed on the surface of the second wall corresponding to the second circuit board. The ends of the first heat dissipation structure and the second heat dissipation structure away from the second wall are located on the same plane.

7. The power conversion device according to any one of claims 1-6, characterized in that, The first circuit board is provided with a power conversion circuit, the second circuit board is provided with a first connection terminal, and the housing also includes a third wall connecting the first wall and the second wall. The first connection terminal includes a first terminal and a second terminal. The first terminal is disposed facing the second circuit board, the second terminal is disposed facing the third wall, the first terminal is connected to the second circuit board, and the second terminal is disposed through the third wall.

8. The power conversion device according to claim 7, characterized in that, Along the arrangement direction of the first wall and the second wall, the first connecting terminal includes multiple layers of second terminals arranged at intervals.

9. The power conversion device according to claim 8, characterized in that, Each layer of the second terminal includes a positive terminal and a negative terminal, which are arranged alternately along a direction perpendicular to the first wall and the second wall.

10. The power conversion device according to claim 9, characterized in that, The first connection terminal also includes a busbar, with each layer of positive terminals connected to the busbar, or each layer of negative terminals connected to the busbar.

11. The power conversion device according to any one of claims 7-10, characterized in that, The first electrical component includes a second connection terminal, one end of which is connected to the first circuit board, and the other end of which extends through the third wall.

12. A power supply device, characterized in that, The power supply device includes a plurality of power conversion devices as described in any one of claims 1-11, wherein the plurality of power conversion devices are connected in parallel or in series.

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