High-heat-resistant copper-based composite material and high-throughput preparation method and application thereof

Abstract

This invention discloses a high-heat-resistant copper-based composite material and its high-throughput preparation method and application, belonging to the field of copper-based composite material technology. The method includes: mixing Cu-Sn alloy powder and Cu2O powder to obtain a mixed sample; subjecting the mixed sample to cold isostatic pressing to obtain a pressed block; subjecting the pressed block to an in-situ reaction to obtain a Cu-SnO2 composite material; reducing the Cu-SnO2 composite material to obtain an intermediate material; and hot-extruding the intermediate material to obtain the high-heat-resistant copper-based composite material. This method achieves uniform dispersion of nanoscale reinforcing phases through an endogenous approach. Based on this, it can be further combined with a high-throughput method to rapidly prepare copper-based composite materials with good tensile strength, electrical conductivity, and elongation, thereby effectively reducing preparation time and cost, and is particularly suitable for the verification of new materials.

Description

Technical Field

[0001] This invention relates to the field of copper-based composite materials technology, and more specifically, to a high heat-resistant copper-based composite material and its high-throughput preparation method and application. Background Technology

[0002] Copper matrix composites (CMCs) are novel material systems composed of copper or copper alloys as the matrix, combined with one or more reinforcing phases (including metals, ceramics, carbon materials, etc.). The essence of this material design lies in combining the superior electrical / thermal conductivity of the copper matrix with the load-bearing capacity, wear resistance, or special functions of the reinforcing phases to achieve synergistic performance optimization. Traditional methods of adding reinforcing phases through mechanical stirring often result in uneven dispersion of the reinforcing phases and incoherent interfaces, leading to a significant weakening of plasticity while increasing the strength of the composite material. Furthermore, current methods for preparing high-performance copper matrix composites typically employ trial-and-error approaches, which are time-consuming, costly, and yield unsatisfactory results.

[0003] In view of this, the present invention is proposed. Summary of the Invention

[0004] The purpose of this invention is to provide a high heat-resistant copper-based composite material and its high-throughput preparation method and application, so as to solve or improve the above-mentioned technical problems.

[0005] This invention can be implemented as follows: In a first aspect, the present invention provides a high-throughput preparation method for a high heat-resistant copper-based composite material, comprising the following steps: mixing Cu-Sn alloy powder with Cu2O powder to obtain a mixed sample; subjecting the mixed sample to cold isostatic pressing to obtain a pressed block; subjecting the pressed block to an in-situ reaction to obtain a Cu-SnO2 composite material; reducing the Cu-SnO2 composite material to obtain an intermediate material; and hot-extruded the intermediate material to obtain a high heat-resistant copper-based composite material.

[0006] In an optional embodiment, Cu-Sn alloy powder and Cu2O powder are mixed in different proportions to obtain N mixed samples; the N mixed samples are simultaneously placed in a multi-cavity rubber mold, and the multi-cavity rubber mold is placed in a cold isostatic press for pressing to obtain N pressed blocks; the N pressed blocks are simultaneously subjected to in-situ reaction to obtain N Cu-SnO2 composite materials; the N Cu-SnO2 composite materials are reduced to obtain N intermediate materials; the density and microhardness of the N intermediate materials are tested, and the high-quality intermediate materials are hot-extruded according to the test results to obtain a high heat-resistant copper-based composite material; N≥20.

[0007] In an optional embodiment, the mass ratio of Cu-Sn alloy powder to Cu2O powder is 10:1 to 45:1; The Sn content in Cu-Sn alloy powder is 1wt%~2.5wt%; In an optional embodiment, the D of Cu-Sn alloy powder 50 The thickness is 30μm to 50μm. In an optional implementation, the D of Cu2O powder 50 The size ranges from 1μm to 5μm.

[0008] In an optional embodiment, the ball-to-powder ratio of Cu-Sn alloy powder to Cu2O powder is 6:1 to 10:1, and the mixing time is 10h to 15h.

[0009] In an optional implementation, the pressure of cold isostatic pressing is ≥180MPa, and the time of cold isostatic pressing is 10min~15min.

[0010] In an optional embodiment, the in-situ reaction temperature is 700℃~1000℃, the reaction time is 1h~6h, and the vacuum degree is ≤20Pa.

[0011] In an optional embodiment, the in-situ reaction temperature is 800℃~900℃, the reaction time is 1h~6h, and the vacuum degree is ≤0.1Pa.

[0012] In an optional implementation, the reduction temperature is 250℃~300℃ and the reduction time is 2h~3h.

[0013] In an optional embodiment, the hot extrusion temperature is 800℃~900℃, the extrusion ratio is 20~50, and the extrusion speed is 8mm / s~12mm / s.

[0014] Secondly, the present invention provides a high heat-resistant copper-based composite material, which is prepared by any of the preparation methods described in the foregoing embodiments; High heat-resistant copper-based composite materials have at least one of the following characteristics: Feature 1: The tensile strength of the high heat-resistant copper-based composite material is 320MPa~360MPa; Feature 2: The electrical conductivity of the high heat-resistant copper-based composite material is ≥80% IACS; Feature 3: The elongation of the high heat-resistant copper-based composite material is 25%~35%.

[0015] Thirdly, the present invention provides an electrical contact material, which includes the high heat-resistant copper-based composite material of the aforementioned embodiments.

[0016] The beneficial effects of this invention include: This method achieves uniform dispersion of nanoscale reinforcing phases through an endogenous approach, enhancing the strength of the composite material while also providing good plasticity. By further combining this with a high-throughput method, copper-based composite materials with excellent tensile strength, electrical conductivity, and elongation can be rapidly prepared, effectively reducing preparation time and cost. This, in turn, significantly shortens research and development time and improves the efficiency of new material verification. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 The XRD pattern of the high heat-resistant copper-based composite material in the experimental example; Figure 2 for Figure 1 Enlarged view of the area within the dashed box; Figure 3 Here is a scanning electron microscope image of the high heat-resistant copper-based composite material in the experimental example; Figure 4 The image shows the EBSD of the high heat-resistant copper-based composite material in the experimental example. Figure 5 This is the KAM diagram of the high heat-resistant copper-based composite material in the experimental example. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all conventional products that can be purchased commercially.

[0020] The following is a detailed description of the high heat-resistant copper-based composite material, its high-throughput preparation method, and its applications provided by this invention.

[0021] This invention provides a high-throughput preparation method for high heat-resistant copper-based composite materials, comprising the following steps: S1: Mix Cu-Sn alloy powder with Cu2O powder to obtain a mixed sample; S2: The mixed sample is subjected to cold isostatic pressing to obtain a compressed block; S3: The pressed block is reacted in situ to obtain Cu-SnO2 composite material; S4: Reduce the Cu-SnO2 composite material to obtain an intermediate material; S5: The intermediate material is hot-extruded to obtain a high heat-resistant copper-based composite material.

[0022] In some alternative implementations, the above method may include the following steps: S1: Cu-Sn alloy powder and Cu2O powder were mixed in different proportions to obtain N mixed samples; S2: Place N mixed samples simultaneously into a multi-cavity rubber mold, and place the multi-cavity rubber mold into a cold isostatic press for cold isostatic pressing to obtain N pressed blocks; S3: Simultaneously perform in-situ reaction on N pressed blocks to obtain N Cu-SnO2 composite materials; S4: Reduce N Cu-SnO2 composite materials to obtain N intermediate materials; S5: Density and microhardness tests are performed on N intermediate materials. Based on the test results, the high-quality intermediate materials are hot-extruded to obtain a high-heat-resistant copper-based composite material.

[0023] In some optional embodiments, N ≥ 2. Correspondingly, the number of cavities in the multi-cavity rubber mold is ≥ 2. In other optional embodiments, N ≥ 20. Correspondingly, the number of cavities in the multi-cavity rubber mold is ≥ 20, such as 20 to 50.

[0024]

Step S1

[0025] If the mass ratio of Cu-Sn alloy powder to Cu2O powder is less than 10:1 (e.g., 8:1), it is not conducive to the uniform coating of Cu2O powder on the surface of Cu-Sn alloy powder, which in turn is not conducive to the dispersion of the composite powder; if the mass ratio of Cu-Sn alloy powder to Cu2O powder is greater than 45:1 (e.g., 50:1), it is not conducive to the full oxidation of Sn atoms in Cu-Sn alloy powder.

[0026] In some optional embodiments, the Sn content in the Cu-Sn alloy powder can be 1wt% to 2.5wt%, such as 1wt%, 1.5wt%, 2wt% or 2.5wt%, or other values ​​within the range of 1wt% to 2.5wt%.

[0027] If the Sn content in Cu-Sn alloy powder is less than 1wt%, it is not conducive to the formation of enough SnO2 particles, and the strengthening effect is not obvious; if the Sn content in Cu-Sn alloy powder is greater than 2.5wt%, it is not conducive to improving the conductivity of the composite material.

[0028] In some alternative embodiments, the D of Cu-Sn alloy powder 50 It can be 30μm~50μm, such as 30μm, 35μm, 40μm, 45μm or 50μm, or other values ​​within the range of 30μm~50μm.

[0029] In some alternative implementations, the D of Cu2O powder 50 It can be 1μm to 5μm, such as 1μm, 2μm, 3μm, 4μm or 5μm, or other values ​​within the range of 1μm to 5μm.

[0030] It should be noted that the D of Cu2O powder 50 D smaller than Cu-Sn alloy powder 50 This facilitates the uniform coating of Cu2O powder onto the surface of Cu-Sn alloy powder, promoting the internal oxidation reaction.

[0031] In some alternative embodiments, Cu-Sn alloy powder and Cu2O powder can be mixed in a Y-type mixer, which is beneficial for ensuring that Cu-Sn alloy powder and Cu2O powder are fully and uniformly mixed.

[0032] In some optional embodiments, the ball-to-powder ratio when mixing Cu-Sn alloy powder and Cu2O powder can be 6:1 to 10:1, such as 6:1, 7:1, 8:1, 9:1 or 10:1, or other values ​​within the range of 6:1 to 10:1.

[0033] In some optional embodiments, the mixing time of Cu-Sn alloy powder and Cu2O powder can be 10h to 15h, such as 10h, 11h, 12h, 13h, 14h or 15h, or other values ​​within the range of 10h to 15h.

[0034]

Step S2

[0035] In some optional implementations, the cold isostatic pressing time can be 10 min to 15 min, such as 10 min, 11 min, 12 min, 13 min, 14 min or 15 min, or other values ​​within the range of 10 min to 15 min.

[0036]

S3 Steps

[0037] In some alternative implementations, the in-situ reaction time can be 1h to 6h, such as 1h, 2h, 3h, 4h, 5h or 6h, or other values ​​within the range of 1h to 6h.

[0038] In some optional embodiments, the vacuum degree of the in-situ reaction is ≤20 Pa. If the vacuum degree of the in-situ reaction is higher than 20 Pa, it will lead to excessive oxygen content, slowing down the progress of the internal oxidation reaction and increasing the oxygen content in the composite material. In some more typical embodiments, the vacuum degree of the in-situ reaction is ≤0.1 Pa.

[0039] In some typical implementations, the in-situ reaction is carried out at a temperature of 800°C for 2 hours, with a vacuum degree of ≤0.1 Pa.

[0040] The above-mentioned in-situ reaction process can be carried out in a high-temperature furnace.

[0041] Continuing from the above, Cu and SnO2 were obtained through the in-situ reaction described above. This process yielded in-situ endogenous particles with a size of approximately 100 nm to 1 μm.

[0042]

Step S4

[0043] In some alternative implementations, the restoration time can be 2h to 3h, such as 2h, 2.5h or 3h, or other values ​​within the range of 2h to 3h.

[0044] The reduction process described above can be carried out in a hydrogen furnace.

[0045] The above reduction process mainly serves to reduce unreacted Cu2O in the powder and remove oxygen elements that may be introduced during the preparation process.

[0046]

S5 Steps

[0047] In some alternative implementations, the extrusion ratio of hot extrusion can be 20 to 50, such as 20, 25, 30, 35, 40, 45 or 50, or other values ​​within the range of 20 to 50.

[0048] In some alternative implementations, the extrusion speed of hot extrusion can be 8 mm / s to 12 mm / s, such as 8 mm / s, 9 mm / s, 10 mm / s, 11 mm / s or 12 mm / s, or other values ​​within the range of 8 mm / s to 12 mm / s.

[0049] In some alternative implementations, the density test is performed using Archimedes' method of water displacement; the microhardness test is performed using Brinell hardness.

[0050] Building upon the above, the preparation method provided by this invention effectively solves the problem of uneven dispersion of nano-reinforcing phases in copper-based composite materials and the difficulty in synergistically improving strength and plasticity. Specifically, by combining endogenous in-situ reaction and hot extrusion, the uniform dispersion of the reinforcing phase in the matrix is ​​achieved, solving the problem of uneven dispersion of nano-reinforcing phases in copper-based composite materials. By improving the interface matching between the reinforcing phase and the matrix, the fine reinforcing phase acts as pinning points, hindering grain growth and ensuring that the material's strength is improved while maintaining good plasticity, thus solving the problem of the difficulty in synergistically improving strength and plasticity. Furthermore, the method provided by this invention, through high-throughput design, can rapidly prepare copper-based composite materials with good tensile strength, electrical conductivity, and elongation, effectively reducing preparation time and cost, and is particularly suitable for the verification of new materials.

[0051] Accordingly, the present invention also provides a high heat-resistant copper-based composite material, which is prepared by the above-described preparation method.

[0052] In some alternative embodiments, the high heat-resistant copper-based composite material has a tensile strength of 320 MPa to 360 MPa.

[0053] In some alternative embodiments, the conductivity of the high heat-resistant copper-based composite material is ≥80% IACS, for example, it can be 82% IACS to 86% IACS.

[0054] In some alternative embodiments, the elongation of the high heat-resistant copper-based composite material is 25% to 35%, for example, it can be 25% to 35%.

[0055] In addition, the present invention also provides an electrical contact material comprising the above-mentioned high heat-resistant copper-based composite material.

[0056] In some alternative implementations, the electrical contact material may include, for example, electrical contact materials used in low-voltage electrical appliances, new energy vehicles, and other fields.

[0057] The features and performance of the present invention will be further described in detail below with reference to embodiments.

[0058] Example 1 This embodiment provides a method for preparing a high heat-resistant copper-based composite material, including the following steps: S1: Cu-Sn alloy powder (D 50 (50μm, Sn content in Cu-Sn alloy powder is 2wt%) and Cu2O powder (D 50 The particles (5 μm in diameter) were mixed in a Y-type mixer at a ratio of 17:1, with a ball-to-particle ratio of 8:1 and a mixing time of 12 hours to obtain a mixed sample.

[0059] S2: Place the mixed sample in a rubber mold, and then place the rubber mold into a cold isostatic press for pressing to obtain a pressed block. The pressure of the cold isostatic press is 200 MPa, and the cold isostatic press time is 10 min. S3: The pressed block is placed in a high-temperature furnace for in-situ reaction to obtain Cu-SnO2 composite material. The in-situ reaction temperature is 850℃, the time is 4h, and the vacuum degree is 0.1Pa.

[0060] S4: The Cu-SnO2 composite material was reduced in a hydrogen furnace at a reduction temperature of 300℃ for 3 hours to obtain an intermediate material.

[0061] S5: The intermediate material is hot-extruded to obtain a high heat-resistant copper-based composite material. The hot extrusion temperature is 800℃, the extrusion ratio is 50, and the extrusion speed is 10mm / s.

[0062] Example 2 This embodiment provides a method for preparing a high heat-resistant copper-based composite material, including the following steps: S1: Cu-Sn alloy powder (D 50 (40μm, Sn content in Cu-Sn alloy powder is 1wt%) and Cu2O powder (D 50The particles (2 μm in diameter) were mixed in a Y-type mixer at a ratio of 35:1, with a ball-to-particle ratio of 6:1 and a mixing time of 15 h to obtain a mixed sample.

[0063] S2: Place the mixed sample in a rubber mold, and then place the rubber mold into a cold isostatic press for pressing to obtain a pressed block. The pressure of the cold isostatic press is 180 MPa, and the cold isostatic press time is 15 min. S3: The pressed block is placed in a high-temperature furnace for in-situ reaction to obtain Cu-SnO2 composite material. The in-situ reaction temperature is 800℃, the time is 2h, and the vacuum degree is 0.1Pa.

[0064] S4: The Cu-SnO2 composite material was reduced in a hydrogen furnace at a reduction temperature of 250℃ for 3 hours to obtain an intermediate material.

[0065] S5: The intermediate material is hot-extruded to obtain a high heat-resistant copper-based composite material. The hot extrusion temperature is 800℃, the extrusion ratio is 20, and the extrusion speed is 8mm / s.

[0066] Example 3 This embodiment provides a method for preparing a high heat-resistant copper-based composite material, including the following steps: S1: Cu-Sn alloy powder (D 50 (30μm, Sn content in Cu-Sn alloy powder is 2.5wt%) and Cu2O powder (D 50 The particles (1 μm in diameter) were mixed in a Y-type mixer at a ratio of 10:1, with a ball-to-particle ratio of 10:1 and a mixing time of 10 hours to obtain a mixed sample.

[0067] S2: Place the mixed sample in a rubber mold, and then place the rubber mold into a cold isostatic press for pressing to obtain a pressed block. The pressure of the cold isostatic press is 300 MPa, and the cold isostatic press time is 10 min. S3: The pressed block is placed in a high-temperature furnace for in-situ reaction to obtain Cu-SnO2 composite material. The in-situ reaction temperature is 900℃, the time is 2h, and the vacuum degree is 0.1Pa.

[0068] S4: The Cu-SnO2 composite material was reduced in a hydrogen furnace at a reduction temperature of 280℃ for 2 hours to obtain an intermediate material.

[0069] S5: The intermediate material is hot-extruded to obtain a high heat-resistant copper-based composite material. The hot extrusion temperature is 900℃, the extrusion ratio is 50, and the extrusion speed is 12mm / s.

[0070] Example 4 The difference between this embodiment and Embodiment 1 is that in S4, the in-situ reaction temperature is 700°C and the reaction time is 6 hours.

[0071] Example 5 The difference between this embodiment and Embodiment 1 is that in S4, the in-situ reaction temperature is 1000℃ and the reaction time is 1h.

[0072] Example 6 This embodiment provides a method for preparing a high heat-resistant copper-based composite material, including the following steps: S1: Cu-Sn alloy powder (D 50 (50μm) and Cu2O powder (D 50 The particles (3μm in diameter) were mixed in different proportions in a Y-type mixer with a ball-to-particle ratio of 8:1 and a mixing time of 12 hours, resulting in 20 mixed samples, as shown in Table 1.

[0073] Table 1 Composition of Mixed Samples

[0074] S2: Twenty mixed samples were simultaneously placed in a multi-cavity rubber mold (each mixed sample was placed in a separate cavity), and the multi-cavity rubber mold was placed in a cold isostatic press for pressing to obtain 20 pressed blocks. The pressure of the cold isostatic press was 200 MPa, and the pressing time was 10 min. S3: Twenty pressed blocks were placed in a high-temperature furnace for simultaneous in-situ reaction to obtain 20 Cu-SnO2 composite materials. The in-situ reaction temperature was 850℃, the time was 4h, and the vacuum degree was 0.1Pa.

[0075] S4: 20 Cu-SnO2 composite materials were reduced in a hydrogen furnace at a reduction temperature of 300℃ for 3 hours to obtain 20 intermediate materials.

[0076] S5: Density and microhardness tests were conducted on 20 intermediate materials. Density was tested using Archimedes' displacement method; microhardness was tested using Brinell hardness. The test results are shown in Table 2. Based on the results in Table 2, the high-quality intermediate material 17 was hot-extruded to obtain a high-heat-resistant copper-based composite material. The hot-extruded temperature was 800℃, the extrusion ratio was 50, and the extrusion speed was 10 mm / s.

[0077] Table 2 Test Results

[0078] Example 7 The difference between this embodiment and embodiment 6 is that in S5, the hot extrusion temperature is 900℃, the extrusion ratio is 40, and the extrusion speed is 8mm / s.

[0079] Example 8 The difference between this embodiment and embodiment 6 is that in S5, the hot extrusion temperature is 850°C, the extrusion ratio is 20, and the extrusion speed is 12 mm / s.

[0080] Comparative Example 1 This comparative example provides a copper-based composite material, the preparation method of which is as follows: Cu powder (D 50 (30μm) and nano SnO2 powder (D 50 The powder (500 nm) was ball-milled with 2% wt SnO2, and then subjected to cold isostatic pressing followed by hot extrusion. The ball milling parameters, cold isostatic pressing parameters, and extrusion parameters were all consistent with those in Example 1.

[0081] Comparative Example 2 The difference between this comparative example and Example 1 is that the mass ratio of Cu-Sn alloy powder to Cu2O powder is 5:1.

[0082] Comparative Example 3 The difference between this comparative example and Example 1 is that the mass ratio of Cu-Sn alloy powder to Cu2O powder is 55:1.

[0083] Comparative Example 4 The difference between this comparative example and Example 1 is that the Sn content in the Cu-Sn alloy powder is 0.5 wt%.

[0084] Comparative Example 5 The difference between this comparative example and Example 1 is that the Sn content in the Cu-Sn alloy powder is 3wt%.

[0085] Comparative Example 6 The difference between this comparative example and Example 1 is that the D of the Cu2O powder... 50 D with Cu-Sn alloy powder 50 They are the same, both being 50μm.

[0086] Comparative Example 7 The difference between this comparative example and Example 1 is that the in-situ reaction temperature is 650°C.

[0087] Comparative Example 8 The difference between this comparative example and Example 1 is that the in-situ reaction temperature is 1050°C.

[0088] Comparative Example 9 The difference between this comparative example and Example 1 is that the vacuum degree of the in-situ reaction is 25 Pa.

[0089] Test case (1) Taking the high heat-resistant copper-based composite material obtained in step S5 of Example 1 as an example, its XRD characterization was performed, and the results are as follows: Figure 1 and Figure 2 As shown.

[0090] Depend on Figure 1 and Figure 2 It can be seen that after the internal oxidation reaction, the SnO2 peak was generated in the composite material, while the Cu2O peak disappeared.

[0091] (2) Taking the high heat-resistant copper-based composite material obtained in step S5 of Example 1 as an example, its characterization was performed by scanning electron microscopy, and the results are as follows: Figure 3 As shown.

[0092] Depend on Figure 3 It can be seen that there are a large number of fine SnO2 particles in the extruded composite material, and the SnO2 particles are evenly distributed.

[0093] (3) Taking the high heat-resistant copper-based composite material obtained in step S5 of Example 1 as an example, its EBSD characterization was performed, and the results are as follows: Figure 4 As shown.

[0094] Depend on Figure 4 It can be seen that the composite material is mainly composed of recrystallized grains, with large-angle grain boundaries accounting for 93.9% and grain size of about 5μm.

[0095] (4) Taking the high heat-resistant copper-based composite material obtained in step S5 of Example 1 as an example, its KAM characterization was performed, and the results are as follows: Figure 5 As shown. By Figure 5 It can be seen that the dislocation density of the composite material is greatly increased after the introduction of SnO2 particles, which has a large number of dislocation pile-ups at the grain boundaries.

[0096] (5) The high heat-resistant copper-based composite materials obtained in Examples 1-8 and Comparative Examples 1-9 were tested for performance, and the results are shown in Table 3.

[0097] The tensile strength and elongation were tested in accordance with GB / T 228.1-2021, and the conductivity was tested in accordance with GB / T3048.2-2007.

[0098] Table 3 Test Results

[0099] As can be seen from Table 3, the method provided by the present invention can prepare copper-based composite materials with good tensile strength, electrical conductivity and elongation.

[0100] In summary, the method provided by this invention effectively solves the problems of uneven dispersion of nano-reinforcing phases and difficulty in synergistically improving strength and plasticity in copper-based composite materials. Furthermore, the high-throughput approach effectively reduces material preparation time and cost, making it particularly suitable for the verification of new materials, significantly shortening research and development time and improving verification efficiency. The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A high-throughput preparation method for a high-heat-resistant copper-based composite material, characterized in that, Includes the following steps: Cu-Sn alloy powder and Cu2O powder are mixed to obtain a mixed sample; the mixed sample is subjected to cold isostatic pressing to obtain a pressed block; the pressed block is subjected to in-situ reaction to obtain a Cu-SnO2 composite material; the Cu-SnO2 composite material is reduced to obtain an intermediate material; the intermediate material is hot-extruded to obtain a high heat-resistant copper-based composite material.

2. The high-throughput preparation method according to claim 1, characterized in that, Cu-Sn alloy powder and Cu2O powder were mixed in different proportions to obtain N mixed samples. The N mixed samples were simultaneously placed in a multi-cavity rubber mold, and the multi-cavity rubber mold was placed in a cold isostatic press for cold isostatic pressing to obtain N pressed blocks. The N pressed blocks were simultaneously subjected to in-situ reaction to obtain N Cu-SnO2 composite materials. The N Cu-SnO2 composite materials were reduced to obtain N intermediate materials. The density and microhardness of the N intermediate materials were tested. Based on the test results, the high-quality intermediate materials were hot-extruded to obtain a high-heat-resistant copper-based composite material. N≥20。 3. The high-throughput preparation method according to claim 1 or 2, characterized in that, The mass ratio of the Cu-Sn alloy powder to the Cu2O powder is 10:1 to 45:

1. The Sn content in the Cu-Sn alloy powder is 1wt%~2.5wt%; The Cu-Sn alloy powder has D 50 The thickness is 30μm~50μm; The Cu2O powder D 50 The size ranges from 1μm to 5μm.

4. The high-throughput preparation method according to claim 1 or 2, characterized in that, The ball-to-powder ratio of the Cu-Sn alloy powder to the Cu2O powder is 6:1 to 10:1, and the mixing time is 10h to 15h.

5. The high-throughput preparation method according to claim 1 or 2, characterized in that, The pressure of cold isostatic pressing is ≥180MPa, and the time for cold isostatic pressing is 10min~15min.

6. The high-throughput preparation method according to claim 1 or 2, characterized in that, The in-situ reaction temperature is 700℃~1000℃, the reaction time is 1h~6h, and the vacuum degree is ≤20Pa.

7. The high-throughput preparation method according to claim 1 or 2, characterized in that, The reduction temperature is 250℃~300℃, and the reduction time is 2h~3h.

8. The high-throughput preparation method according to claim 1 or 2, characterized in that, The hot extrusion temperature is 800℃~900℃, the extrusion ratio is 20~50, and the extrusion speed is 8mm / s~12mm / s.

9. A high heat-resistant copper-based composite material, characterized in that, Prepared by the preparation method according to any one of claims 1 to 8; The high heat-resistant copper-based composite material has at least one of the following characteristics: Feature 1: The tensile strength of the high heat-resistant copper-based composite material is 320MPa~360MPa; Feature 2: The electrical conductivity of the high heat-resistant copper-based composite material is ≥80% IACS; Feature 3: The elongation of the high heat-resistant copper-based composite material is 25%~35%.

10. An electrical contact material, characterized in that, The electrical contact material includes the high heat-resistant copper-based composite material as described in claim 9.

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