switch

Abstract

The present application aims to provide a switch capable of achieving miniaturization and / or thinness even when a sensor and a contact switch are arranged in a straight line. The switch includes a substrate having a housing, a plurality of fixed contacts arranged on an upper surface of the substrate, a movable contact arranged on the upper surface of the substrate and deformed by being pressed to make the plurality of fixed contacts conductive with each other, a pressing member for pressing the movable contact, and a semiconductor element connected to a lower surface of the substrate and arranged in the housing at a position opposite to the movable contact.

Description

Technical Field

[0001] This invention relates to a switch. Background Technology

[0002] Previously, a switch with a sensor and a spring member that performs a reversing action in response to pressing the dome is known as a movable contact. For example, International Publication No. 2010 / 35705 discloses a configuration in which the electrostatic capacitance sensor 9 and the dome-shaped contact switch 10 are arranged in a straight line in an input device 1 that includes the electrostatic capacitance sensor 9 and the dome-shaped contact switch 10. Summary of the Invention

[0003] However, in the switch structure described in International Publication No. 2010 / 35705, there is space for the switch 10 between the base substrate 8 and the support substrate 20, and space S for the sensor 9 between the base substrate 8 and the light guide sheet 5. Therefore, the height of the switch structure in the pressing direction is increased. Consequently, miniaturization and even thinning of the switch structure are difficult.

[0004] The purpose of this disclosure is to provide a switch that can be miniaturized or even made thinner even when the sensor and contact switch are arranged in a straight line.

[0005] The switch disclosed herein includes: a substrate having a receiving portion; a plurality of fixed contacts disposed on the upper surface of the substrate; a movable contact disposed on the upper surface of the substrate and deformable by pressing to make the plurality of fixed contacts interconnected; a pressing member for pressing the movable contact; and a semiconductor element connected to the lower surface of the substrate and disposed in the receiving portion at a position opposite to the movable contact.

[0006] Preferably, in the switch disclosed herein, the substrate includes a first substrate and a second substrate, a plurality of fixed contacts are disposed on the upper surface of the first substrate, and the second substrate has the receiving portion which is joined to the lower surface of the first substrate and formed by a through hole.

[0007] Preferably, the switch according to this disclosure further comprises: a first lower surface wiring pattern disposed on the lower surface of a first substrate and connected to a semiconductor element; a first lower surface conductor surface disposed on the lower surface of the first substrate; a plurality of second upper surface conductor surfaces disposed on the upper surface of the second substrate; and a plurality of second lower surface conductor surfaces disposed on the lower surface of the second substrate.

[0008] The lower surface wiring pattern and a portion of the first lower surface conductor, a portion of the first lower surface conductor and a portion of the second upper surface conductor, and a portion of the second upper surface conductor and a portion of the second lower surface conductor are electrically connected, respectively.

[0009] Preferably, the switch disclosed herein further comprises: a first upper surface conductor surface connected to a plurality of fixed contacts.

[0010] The other portions of the first upper surface conductor and the first lower surface conductor, the other portions of the first lower surface conductor and the second upper surface conductor, and the other portions of the second upper surface conductor and the second lower surface conductor are respectively electrically connected.

[0011] Preferably, the switch disclosed herein further comprises: a first substrate through-hole connecting a first upper surface conductor and a first lower surface conductor; and a second substrate through-hole connecting a second upper surface conductor and a second lower surface conductor.

[0012] Preferably, the switch disclosed herein further comprises a sealing resin disposed within a through hole to seal the wiring pattern on the first lower surface and the terminals of the semiconductor element connected to the wiring pattern on the first lower surface.

[0013] Preferably, in the switch disclosed herein, the pressing component is a magnet, and the semiconductor element is a magnetic sensor that detects changes in the magnetic field caused by the movement of the magnet in the pressing direction.

[0014] Preferably, the switch disclosed herein also includes a contact prevention part that prevents contact between the lower surface of the magnet and the movable contact.

[0015] Preferably, in the switch disclosed herein, a portion of the magnet is positioned at the same location as the outer edge of the receiving portion in top view.

[0016] According to the switch disclosed herein, since the substrate has a receiving portion for accommodating semiconductor elements, even when the sensor and the contact switch are arranged in a straight line, a switch capable of miniaturization and / or thinning can be provided. Attached Figure Description

[0017] Figure 1 This is a 3D view of switch 1.

[0018] Figure 2 yes Figure 1 An exploded perspective view of switch 1 is shown.

[0019] Figure 3 It is along Figure 1 The diagram shows a cross-sectional view of switch 1 on line AA'.

[0020] Figure 4 (a) is a top view of the first substrate, (b) is a bottom view of the first substrate, (c) is a top view of the second substrate, and (d) is a bottom view of the second substrate.

[0021] Figure 5 (a) is a diagram showing the configuration relationship between the first substrate and the second substrate, and (b) is a cross-sectional view along line BB' shown in (a).

[0022] Figure 6 (a) is a graph showing the relationship between travel and operating load in switch 1, and (b) is a graph showing the relationship between travel and operating load in the comparative example.

[0023] Figure 7 This is a 3D view of switch 2.

[0024] Figure 8 yes Figure 7 An exploded perspective view of switch 2 is shown.

[0025] Figure 9 It is along Figure 7 The diagram shows a cross-sectional view of switch 2 on line AA'.

[0026] Figure 10 (a) is included along Figure 7 (a) is a partial perspective view of the first resin housing of the AA' line shown, and (b) is a partial cross-sectional view showing the configuration relationship between the first resin housing and the magnet.

[0027] Figure 11 (a) is a top view of the first substrate of switch 2, and (b) is a bottom view of the first substrate of switch 2.

[0028] Figure 12 This is a three-dimensional view of the second substrate of switch 2.

[0029] Figure 13 (a) is a top view showing the configuration relationship between the second substrate and the magnet involved in switch 2, and (b) is a cross-sectional view along line BB' shown in (a).

[0030] Figure 14 This is a 3D view of switch 3.

[0031] Figure 15 yes Figure 14 The exploded perspective view of switch 3 shown.

[0032] Figure 16 It is along Figure 14 The diagram shows a cross-sectional view of switch 3 on line AA'.

[0033] Figure 17 (a) is a perspective view of the second resin housing of switch 3 viewed from the lower surface direction, and (b) is a bottom view showing the arrangement of the second resin housing and the magnet shown in (a).

[0034] Figure 18This is a top view of the first substrate of switch 3.

[0035] Figure 19 (a) is a top view of the second substrate of switch 3, and (b) is a bottom view of the second substrate shown in (a).

[0036] Figure 20 This is a 3D view of switch 4.

[0037] Figure 21 yes Figure 20 An exploded perspective view of switch 4 is shown.

[0038] Figure 22 (a) is a top view of the substrate, and (b) is a bottom view of the substrate.

[0039] Figure 23 (a) is a perspective view of the lead frame disposed in the substrate from an obliquely upward view, and (b) is a perspective view of the lead frame disposed in the substrate from an obliquely downward view.

[0040] Figure 24 It is along Figure 20 The diagram shows a cross-sectional view of switch 4 on line AA'.

[0041] Figure 25 (a) is a top view of switch 5, (b) is a bottom view of switch 5, and (c) is a cross-sectional view of switch 5 along line AA' shown in (a).

[0042] Figure 26 This is a 3D view of switch 6.

[0043] Figure 27 It is along Figure 26 The diagram shows a cross-sectional view of switch 6 on line AA'.

[0044] Figure 28 (a) is a top view of the substrate 300 of switch 6, and (b) is a bottom view of the substrate 300 of switch 6. Detailed Implementation

[0045] The switch involved in this disclosure will now be described with reference to the accompanying drawings. However, it should be noted that the scope of the present invention is not limited to these embodiments, but extends to the invention as described in the claims and its equivalents. In the following description, the X-axis, Y-axis, and Z-axis directions are used as needed. These directions are mutually perpendicular. The Y-axis direction corresponds to the pressing direction.

[0046] (Implementation Method 1)

[0047] Figure 1 This is a perspective view of the switch 1 according to embodiment 1. Figure 2 yes Figure 1The exploded perspective view of switch 1 shown. Figure 3 It is along Figure 1 The diagram shows a cross-sectional view of switch 1 on line AA'.

[0048] The switch 1 includes a first substrate 11, a second substrate 12, a magnetic sensor 14, three fixed contacts 21a, 21b, and 21f, a movable contact 30, a first sheet 40, a magnet 50, a first frame member 60, a second frame member 61, and a second sheet 70. The three fixed contacts 21a, 21b, and 21f are arranged on the upper surface of the first substrate 11.

[0049] The second substrate 12 has a receiving portion 13 at its center for housing a magnetic sensor 14. The receiving portion 13 is formed by a through hole penetrating the second substrate 12. Since the height of the second substrate 12 in the Y-axis direction is greater than the height of the magnetic sensor 14, the magnetic sensor 14 is housed within the receiving portion (through hole) 13. The upper surface of the second substrate 12 is joined to the lower surface of the first substrate 11. The joining includes bonding, adhesion, fixation, welding, pressing, or the combination of the first substrate 11 and the second substrate 12, and / or fastening. In switch 1, the joining of the first substrate 11 and the second substrate 12 is based on adhesive bonding.

[0050] The magnetic sensor 14 is an example of a semiconductor element that detects changes in the magnetic field caused by movement of the magnet 50 along the Y-axis. The magnetic sensor 14 is a Hall element that detects changes in the magnetic field using the Hall effect. The Hall element is formed, for example, using InSb, GaAs, or InAs as semiconductors. The magnetic sensor 14 is disposed on the lower surface of the first substrate 11 and positioned opposite the movable contact 30, across the first substrate 11. In the switch 1, the magnetic sensor 14 has five terminals 141.

[0051] The movable contact 30 is composed of a first spring member 31 and a second spring member 32. Each spring member 31, 32 is a flexible conductive member with a convex shape, or in other words, bent into a centrally protruding dome shape. In this embodiment, the first spring member 31 and the second spring member 32 have the same shape and overlap in the Y-axis direction. The first spring member 31 and the second spring member 32 are disposed opposite to the magnetic sensor 14, separated by the first substrate 11. The two ends of the second spring member 32 are respectively disposed on the substrate 11 in contact with peripheral fixed contacts 21b, 21f. The first spring member 31 and the second spring member 32 are, for example, made of stainless steel.

[0052] The first sheet 40 is a flexible insulating resin sheet. The first sheet 40 has a contact-prevention function to prevent the magnet 50 from contacting the movable contact 30. The first sheet 40 is configured to cover the fixed contacts 21a, 21b, 21f and the movable contact 30. The lower surface end of the first sheet 40 is joined to the upper surface of the second frame member 61. The upper surface of the first sheet 40 contacts the magnet 50. The upper surface end of the first sheet 40 is joined to the lower surface of the first frame member 60. The bonding of the first sheet 40 to the first frame member 60 and the second frame member 61 is based on adhesive bonding.

[0053] Magnet 50, an example of a pressing member, is a permanent magnet with a cylindrical shape. Magnet 50 presses the movable contact 30 via the first sheet 40. Magnet 50 is aligned in a straight line with magnetic sensor 14 in the pressing direction. Therefore, when magnet 50 is pressed, the distance between magnet 50 and magnetic sensor 14 shortens, allowing magnetic sensor 14 to detect changes in the magnetic field even when the magnetic force of magnet 50 is weak.

[0054] The upper surface of magnet 50 is bonded to the lower surface of the second sheet 70. This bonding is based on adhesive. The lower surface of magnet 50 contacts the upper surface of the first sheet 40. That is, magnet 50 is held between the upper surface of the first sheet 40 and the lower surface of the second sheet 70.

[0055] The first frame member 60 has a rectangular opening in the center. The lower surface of the first frame member 60 is joined to the upper end of the first sheet 40. The upper surface of the first frame member 60 is joined to the lower end of the second sheet 70. The joining of the first frame member 60 to the first sheet 40 and the second sheet 70 is achieved by applying adhesive to the top and bottom of the first frame member 60 and bonding it thereto.

[0056] The second frame member 61 has a rectangular opening in the center. The second frame member 61 is disposed on the upper surface of the first substrate 11, such that the fixed contacts 21a, 21b, 21f and the movable contact 30 are located inside the opening. The lower surface of the second frame member 61 is bonded to the upper end of the first substrate 11. The upper surface of the second frame member 61 is bonded to the lower end of the first sheet 40. The bonding of the second frame member 61 to the first substrate 11 and the first sheet 40 is achieved by applying adhesive to both the upper and lower surfaces of the second frame member 61 and bonding them together.

[0057] The second sheet 70 is a flexible insulating resin sheet. The lower surface end of the second sheet 70 is joined to the upper surface of the first frame member 60. The lower surface of the second sheet 70 is joined to the magnet 50.

[0058] When the magnet 50 is pressed via the second sheet 70, the first spring member 31 is pressed via the first sheet 40. This reverses the convex shape of the first spring member 31 and the second spring member 32, and the center of the second spring member 32 also contacts the central fixed contact 21a. Since the two ends of the second spring member 32 contact the peripheral fixed contacts 21b and 21f respectively, the central fixed contact 21a and each of the peripheral fixed contacts 21b and 21f are connected, and the switch becomes open.

[0059] Figure 4 (a) is a top view of the first substrate 11 (movable contact 30 side). Figure 4 (b) is a bottom view of the first substrate 11. Figure 4 (c) is a top view of the second substrate (from the side of the first substrate 11). Figure 4 (d) is a bottom view of the second substrate.

[0060] like Figure 4 As shown in (a), on the upper surface of the first substrate 11, there are first upper surface wiring patterns 22a, 22b, and 22f that are electrically connected to fixed contacts 21a, 21b, and 21f, respectively, and first upper surface pads 24a, 24b, and 24f that are electrically connected to the first upper surface wiring patterns 22a, 22b, and 22f, respectively. Additionally, on the upper surface of the first substrate 11, there are also first upper surface pads 24c, 24d, 24e, 24g, and 24h that are not connected to the first upper surface wiring patterns 22a, 22b, and 22f.

[0061] like Figure 4 As shown in (b), on the lower surface of the first substrate 11, there are first lower surface wiring patterns 23c, 23d, 23e, 23g, and 23h that are electrically connected to each terminal 141 of the magnetic sensor 14, and first lower surface pads 25c, 25d, 25e, 25g, and 25h that are electrically connected to the first lower surface wiring patterns 23c, 23d, 23e, 23g, and 23h, respectively. Additionally, on the lower surface of the first substrate 11, there are also first lower surface pads 25a, 25b, and 25f that are not connected to the first lower surface wiring patterns 23c, 23d, 23e, 23g, and 23h. Furthermore, in Figure 4 In (b), magnetic sensor 14 is not shown.

[0062] like Figure 4 As shown in (c), eight second upper surface pads 26a to 26h are disposed on the upper surface of the second substrate 12, as follows: Figure 4 As shown in (d), eight second lower surface pads 27a to 27h are disposed on the lower surface of the second substrate 12.

[0063] Eight first substrate end-face through holes 16a to 16h are disposed on the side of the first substrate 11. The first substrate end-face through holes 16a to 16h are electrically connected to the first upper surface pads 24a to 24h and the first lower surface pads 25a to 25h of the first substrate 11, respectively. Eight second substrate end-face through holes 17a to 17h are disposed on the side of the second substrate 12. The second substrate end-face through holes 17a to 17h are electrically connected to the second upper surface pads 26a to 26h and the second lower surface pads 27a to 27h of the second substrate 12, respectively. Hereinafter, the first substrate end-face through holes 16a to 16h and the second substrate end-face through holes 17a to 17h will sometimes be simply referred to as "end-face through holes 15a to 15h".

[0064] The through-holes 16a-16h on the first substrate end face and the through-holes 17a-17h on the second substrate end face are generally arranged in a straight line in the Y-axis direction. Therefore, the first lower surface pads 25a-25h and the second upper surface pads 26a-26h are generally arranged in a straight line in the Y-axis direction and are electrically connected, for example, via solder. As a result, the first upper surface pads 24a-24h, the first lower surface pads 25a-25h, the second upper surface pads 26a-26h, and the second lower surface pads 27a-27h are interconnected via the through-holes 15a-15h.

[0065] Figure 5 (a) is a diagram showing the configuration relationship between the first substrate 11 and the second substrate 12. Figure 5 (b) is along Figure 5 The cross-sectional view of line BB' shown in (a). Figure 5 In (a), the magnetic sensor 14 and the sealing resin 19 are omitted, indicating that from Figure 1 Observe the state of switch 1 from the bottom.

[0066] A portion of the first lower surface wiring patterns 23c, 23d, 23e, 23g, and 23h are disposed within the receiving portion (through hole) 13 of the second substrate 12 at a position opposite to the magnetic sensor 14. The first lower surface wiring patterns 23c, 23d, 23e, 23g, and 23h are respectively connected to the five terminals 141 of the magnetic sensor 14.

[0067] like Figure 5 As shown in (b), the sealing resin 19 fills the through-hole 13 of the second substrate 12 and also fills the exposed portion of the lower surface of the first substrate 11. Thus, the terminal 141 and the wiring patterns 23c, 23d, 23e, 23g, and 23h disposed on the first lower surface opposite the through-hole 13 are sealed by the sealing resin 19. The sealing resin 19 seals the terminal 141 and a portion of the body of the magnetic sensor 14 (excluding the terminal 141) in the Y-axis direction. The sealing resin 19 is formed, for example, of epoxy resin.

[0068] Figure 6 (a) is a graph showing the relationship between travel and operating load in switch 1, and (b) is a graph showing the relationship between travel and operating load in the comparative example. Figure 6 In the graphs shown in (a) and (b), the horizontal axis represents the stroke (in millimeters), the left vertical axis represents the operating load (in Newtons), and the right vertical axis represents the output of the magnetic sensor 40. Figure 6 In (a), curve 601 represents the relationship between the travel of switch 1 and the operating load, and curve 602 represents the relationship between the travel of switch 1 and the output of magnetic sensor 40. Figure 6 In (b), curve 603 represents the relationship between stroke and operating load in the comparative example, and curve 604 represents the relationship between stroke and output of magnetic sensor 40 in the comparative example. Additionally, in Figure 6 In (b), curve 602 is also recorded, which shows the relationship between the travel in switch 1 and the output of magnetic sensor 40.

[0069] like Figure 3 As shown, in switch 1, the upper surface of magnet 50 is pressed against the side of spring member 30 by the second sheet 70. Therefore, as Figure 6 As shown in curves 601 and 602 of (a), the operating load relative to the stroke is the same as the initial value of the magnetic sensor output, and the output change of the magnetic sensor 14 is linked to the reaction force change of the movable contact 30. Thus, the switch 1 has both the function of switching based on the presence or absence of conduction between the fixed contacts 21a, 21b, 21f and the spring member (movable contact) 30, and the function of detecting the pressure change of the spring member 30 when it is pressed.

[0070] Figure 6 The comparative example shown in (b) assumes that the pressing member 50 in switch 1 is made of resin instead of a magnet, and that a magnet, separate from switch 1, is positioned above the pressing member 50. In this comparative example, the other constructions are the same as in switch 1. On the other hand, as shown in curve 604, in this comparative example, a gap is created between switch 1 and the magnet, and the magnet's action begins earlier than the pressing action of switch 1. Therefore, the output of the magnetic sensor 14 begins before the change in operating load.

[0071] In switch 1, a magnetic sensor 14 is disposed on the lower surface of the first substrate 11, and a receiving portion (through hole) 13 for accommodating the magnetic sensor 14 is disposed on the second substrate 12, which is bonded to the lower surface of the first substrate 11. Therefore, in switch 1, even if the magnetic sensor 14 and the movable contact 30 are arranged in a straight line, the height of the switch 1 in the pressing direction can be suppressed, and the miniaturization and / or thinning of switch 1 can be achieved.

[0072] In switch 1, the receiving portion 13 housing the magnetic sensor 14 is formed by a through hole penetrating the second substrate 12, and includes a sealing resin 19. The sealing resin 19 seals the first lower surface wiring patterns 23c, 23d, 23e, 23g, 23h disposed within the through hole 13, as well as the terminal 141 of the magnetic sensor 14. Therefore, in switch 1, the terminal 141 and the first lower surface wiring patterns 23c, 23d, 23e, 23g, 23h disposed within the through hole 13 can be made dustproof and waterproof, and the terminal 141 can be prevented from falling off the first substrate 11.

[0073] In switch 1, a first sheet 40 is provided, which is disposed between magnet 50 and movable contact 30 and prevents contact between magnet 50 and movable contact 30. Without the first sheet 40, the lower surface end of magnet 50 may wear and break due to repeated contact with movable contact 30. Especially when the conductive material of movable contact 30 is formed into a hard material such as metal, the possibility of magnet 50 breaking is high. Therefore, in switch 1, by providing the first sheet 40, contact between magnet 50 and movable contact 30 can be prevented, and wear of magnet 50 can be suppressed.

[0074] In switch 1, magnet 50 is held between first sheet 40 and second sheet 70. First sheet 40 is configured to cover fixed contacts 21a, 21b, 21f and movable contact 30. First sheet 40 and second sheet 70 are joined to first frame member 60. Therefore, in switch 1, a cover structure that provides dust and water protection for fixed contacts 21a, 21b, 21f and movable contact 30 can be easily provided, positional displacement of magnet 50 in the pressing direction can be suppressed, and high detection accuracy of magnetic sensor 14 can be maintained.

[0075] In switch 1, various substrates (e.g., first substrate 11 and second substrate 12) can be configured as printed wiring substrates, or substrates formed by using conductive ink or conductive adhesive to form wiring patterns and pads on insulating material. The same applies to switches 2, 3, and 6, which will be described later.

[0076] (Implementation Method 2)

[0077] Figure 7 This is a perspective view of switch 2 according to embodiment 2. Figure 8 yes Figure 7 The exploded perspective view of switch 2 shown. Figure 9 It is along Figure 7 The cross-sectional view of switch 2 on line AA' is shown (sealing resin is not shown). Figure 10 (a) is included along Figure 7A partial perspective view of the first resin housing 80, showing a cross-section of the first resin housing 80 along line AA'. Figure 10 (b) is a partial cross-sectional view showing the arrangement of the first resin housing 80 and the magnet 50. Switch 2 differs from switch 1 in aspects such as the cover structure and magnet housing structure, the structure of the fixing contacts, the upper and lower wiring patterns of the first substrate, and the shape of the housing portion of the second substrate. Furthermore, in Figures 7-10 In this document, the same symbols are used to mark the same structures as those of switch 1 described above, and the descriptions are omitted as appropriate.

[0078] The switch 2 includes a first substrate 11', a second substrate 12', a magnetic sensor 14, five fixed contacts 21a' to 21e', a movable contact 30', a magnet 50, an adhesive member 62', and a first resin housing 80. The five fixed contacts 21a' to 21e' are arranged on the upper surface of the first substrate 11'.

[0079] The upper surface of the second substrate 12' is bonded to the lower surface of the first substrate 11'. The second substrate 12' has a centrally located receiving portion 13' for housing the magnetic sensor 14. In switch 2, viewed from above, the receiving portion 13' is elliptical. When switch 2 is viewed from above, a portion of the outer edge of the receiving portion 13' is positioned at the same location as a portion of the magnet 50. The height of the second substrate 12' in the Y-axis direction is greater than the height of the magnetic sensor 14.

[0080] The movable contact 30' is constituted by a third spring member 30'. The third spring member 30' is a flexible conductive member having a dome-shaped bend with a central protrusion. The third spring member 30' has a pressing part 301' and four feet 302'. The pressing part 301' is formed to protrude downward from the dome-shaped top of the third spring member 30', and contacts the central fixed contact 21a' when the third spring member 30' is pressed. The four feet 302' are formed to protrude obliquely downward from the ends of the third spring member 30' respectively. The third spring member 30' is disposed on the substrate 11' with each of its four feet 302 contacting the peripheral fixed contacts 21b' to 21e'. The third spring member 30' is disposed opposite the magnetic sensor 14 across the first substrate 11'. The third spring component 30' is, for example, made of stainless steel.

[0081] When the third spring member 30' is pressed, the convex shape of the third spring member 30' is reversed, and the lower part 301' contacts the central fixed contact 21a'. The central fixed contact 21a' and each peripheral fixed contact 21b' to 21e' are connected, and the switch becomes open.

[0082] The adhesive member 62' is a pressure-sensitive adhesive sheet with a central opening. The outline and shape of the opening of the adhesive member 62' are substantially the same as those of the third spring member 30', and it accommodates the third spring member 30'. The adhesive member 62' is disposed along the end of the substrate 11', such that the peripheral fixing points 21b' to 21e' are located inside the opening. The lower and upper surfaces of the adhesive member 62' are bonded to the first substrate 11' and the first resin housing 80, respectively.

[0083] The first resin housing 80 is a flexible resin housing with a convex shape, and its outline is approximately the same as that of the switch 2. The first resin housing 80 has the functions of housing the magnet 50, housing the movable contact 30' and being dustproof and waterproof, and pressing the movable contact 30'. The first resin housing 80 has a first pressing part 81, a first magnet housing part 82, a first cover part 83, a first frame part 84, an opening part 85, and a contact prevention part 86. The first resin housing 80, including each part 81 to 84 and 86, is integrally formed of resin.

[0084] The first pressing part 81 is disposed on the upper surface of the magnet 50, and when pressed, it presses the magnet 50 toward the movable contact 30' side.

[0085] The first magnet receiving portion 82 is disposed below the first pressing portion 81 and houses the magnet 50 inside. The interior of the first magnet receiving portion 82 is substantially consistent with the outline and shape of the magnet 50, suppressing the positional displacement of the magnet 50 in the X, Y, and Z axis directions. The first cover portion 83 connects the first magnet receiving portion 82 and the first frame portion 84.

[0086] The first frame portion 84 has a movable contact opening 851 at its center that substantially matches the outline and shape of the third spring member 30' and accommodates the third spring member 30'. Because the shape of the movable contact opening 851 in the first frame portion 84 substantially matches the outline of the third spring member 30', positional displacement of the movable contact 30' is suppressed when the third spring member 30' is positioned on the upper surface of the first substrate 11'. The lower surface of the first frame portion 84 is bonded to the adhesive member 62'.

[0087] The opening 85 consists of a movable contact opening 851 and a magnet opening 852. The movable contact opening 851 is an opening for receiving the movable contact 30', and its shape is generally consistent with the outline of the third spring member 30'. Similar to the second resin housing 90 of the switch 3 described later, the movable contact opening 851 has a recess for receiving the foot 302' of the movable contact 30'.

[0088] The magnet opening 852 is an opening for housing the magnet 50 in the first magnet housing 82. A contact prevention portion 86 is disposed on the outer edge of the magnet opening 852. The contact prevention portion 86 is positioned below the lower surface of the magnet 50 in the pressing direction and contacts the movable contact 30'. In other words, the contact prevention portion 86 ensures space for preventing contact between the magnet 50 and the movable contact 30' in the pressing direction. When pressed, the movable contact 30' deforms under the force from the contact prevention portion 86 and does not contact the magnet 50.

[0089] The contact prevention part 86 is composed of a protrusion 861 and a cutout 862. The protrusion 861 is formed protruding inward toward the magnet 50 in the XZ plane. The protrusion 861, together with the first pressing part 81, clamps the magnet 50. The protrusion 861 prevents contact between the magnet 50 and the movable contact 30' while suppressing the positional displacement of the magnet 50 in the pressing direction.

[0090] The cutout 862 is formed on a portion of the protrusion 861 to accommodate the magnet 50 in the magnet receiving portion 82. The outer edge of the opening formed by the protrusion 861 is smaller than the outer edge of the magnet 50. Therefore, by forming the cutout 862 on a portion of the protrusion 861, the magnet 50 becomes easier to accommodate in the magnet receiving portion 82.

[0091] Figure 11 (a) is a top view of the first substrate 11' of switch 2 (movable contact 30' side), and (b) is a bottom view of the first substrate 11' of switch 2. Figure 12 This is a perspective view of the second substrate 12' of switch 2.

[0092] like Figure 11 As shown in (a), on the upper surface of the first substrate 11', there are first upper surface wiring patterns 22a', 22bc, 22cd, and 22de that are electrically connected to five fixed contacts 21a' to 21e', and first upper surface pads 24a to 24c that are electrically connected to the first upper surface wiring patterns 22a', 22bc, 22cd, and 22de. Additionally, on the upper surface of the first substrate 11', there are also first upper surface pads 24d to 24h that are not connected to the first upper surface wiring patterns 22a', 22bc, 22cd, and 22de.

[0093] like Figure 11As shown in (b), on the lower surface of the first substrate 11', there are first lower surface wiring patterns 23d' to 23h' that are electrically connected to each terminal 141 of the magnetic sensor 14, and first lower surface pads 25d to 25h that are electrically connected to the first lower surface wiring patterns 23d' to 23h'. In addition, on the lower surface of the first substrate 11', there are also first lower surface pads 25a to 25c that are not connected to the first lower surface wiring patterns 23d' to 23h'.

[0094] Figure 12 This is a perspective view of the second substrate 12' involved in switch 2. (See diagram below.) Figure 12 As shown, eight second upper surface pads 26a to 26h are disposed on the upper surface of the second substrate 12'. In addition, eight second lower surface pads (not shown) are disposed on the lower surface of the second substrate 12' at positions corresponding to the second upper surface pads 26a to 26h, respectively.

[0095] Eight first substrate end face through holes 16a-16h are disposed on the side of the first substrate 11'. Each first substrate end face through hole 16a-16h is electrically connected to each first upper surface pad 24a-24h and each first lower surface pad 25a-25h of the first substrate 11'. Eight second substrate end face through holes 17a-17h are disposed on the side of the second substrate 12'. Each second substrate end face through hole 17a-17h is electrically connected to each second upper surface pad 26a-26h and each second lower surface pad of the second substrate 12'.

[0096] In switch 2, the through holes 16a-16h on the end faces of the first substrate and the through holes 17a-17h on the end faces of the second substrate are also generally arranged in a straight line in the Y-axis direction. Therefore, the pads 25a-25h on the first lower surface and the pads 26a-26h on the second upper surface are generally arranged in a straight line in the Y-axis direction, for example, by soldering. As a result, the pads 24a-24h on the first upper surface, the pads 25a-25h on the first lower surface, the pads 26a-26h on the second upper surface, and the pads 15a-15h on the second lower surface are interconnected via the through holes 15a-15h.

[0097] Figure 13 (a) is a top view showing the configuration relationship between the second substrate 12' and the magnet 50 in switch 2. Figure 13 (b) is a cross-sectional view along line BB' shown in (a). The receiving portion 13' is formed by a through hole penetrating the second substrate 12'. Similarly, in switch 2, the terminals 141 of the magnetic sensor 14 and a portion of the first lower surface wiring patterns 23d' to 23h' disposed opposite to the receiving portion (through hole) 13' are sealed with a sealing resin (not shown).

[0098] In switch 2, a portion of magnet 50 is positioned at the same location as the outer edge of through hole 13' in top view. Therefore, when magnet 50 is pressed, the force of magnet 50 in the pressing direction is transmitted to the vicinity of the outer edge of through hole 13' in second substrate 12'. The case where a portion of magnet 50 is positioned at the same location as the outer edge of through hole 13' in top view also includes the case where the outlines of magnet 50 and through hole 13' are identical in top view.

[0099] In switch 2, a magnetic sensor 14 is disposed on the lower surface of the first substrate 11', and a receiving portion (through hole) 13' for accommodating the magnetic sensor 14 is disposed on the second substrate 12' which is bonded to the lower surface of the first substrate 11'. Therefore, in switch 2, even if the magnetic sensor 14 and the movable contact 30' are arranged in a straight line, miniaturization and / or thinning of switch 2 can be achieved.

[0100] In switch 2, a portion of magnet 50 is positioned at the same level as the outer edge of the receiving portion (through hole) 13' when viewed from above. Therefore, when magnet 50 is pressed, the force of magnet 50 in the pressing direction is also transmitted to the second substrate 12' located at the outer edge of the receiving portion 13'. Thus, in switch 2, bending of the third spring member 30' and the first substrate 11' when pressed can be suppressed. This is effective when permanent magnets are used for magnet 50, when magnet 50 is large, and when the weight of magnet 50 increases.

[0101] In switch 2, the first resin housing 80 includes a first pressing portion 81, a first magnet receiving portion 82, a first cover portion 83, a first frame portion 84, and a contact prevention portion 86. Therefore, switch 2 can provide a housing that simultaneously functions as a magnet 50 receiving portion, a dustproof and waterproof portion such as the movable contact 30', and a pressing portion of the movable contact 30'. Since the first resin housing 80 has multiple functions, the number of parts can be reduced, thus enabling miniaturization and / or thinning of switch 2.

[0102] In switch 2, a contact prevention portion 86 is formed on the outer edge of the magnet opening 852 formed on the lower surface of the first magnet receiving portion 82. Therefore, in switch 2, the magnet 50 can be easily received in the first magnet receiving portion 82 with a simple structure, and the lower surface of the magnet 50 can be prevented from contacting the movable contact 30'.

[0103] (Implementation Method 3)

[0104] Figure 14 This is a perspective view of switch 3 according to embodiment 3. Figure 15 yes Figure 14 The exploded perspective view of switch 3 shown. Figure 16 It is along Figure 14The diagram shows a cross-sectional view of switch 3 on line AA'. Figure 17 (a) is a perspective view of the second resin housing 90 of switch 3 viewed from the lower surface direction. Figure 17 (b) means Figure 17 The diagram (a) shows the arrangement of the second resin housing 90 and the magnet 50. Furthermore, in switch 3, the same symbols are used for structures identical to those in switch 1 and switch 2 described above, and explanations are omitted where appropriate.

[0105] The switch 3 includes a first substrate 11", a second substrate 12", a magnetic sensor 14, five fixed contacts 21a", 21c", 21d", 21e", and 21f", a movable contact 30", a magnet 50, an adhesive member 62', and a second resin housing 90. The upper surface of the first substrate 11" is bonded to the lower surface of the second substrate 12". The bonding between the first substrate 11" and the second substrate 12" is based on adhesive bonding.

[0106] The second substrate 12" has a receiving portion 13" at its center for housing the magnetic sensor 14. The receiving portion 13" is formed by a through hole penetrating the second substrate 12". Similar to switch 1 and switch 2, since the height of the second substrate 12" in the Y-axis direction is higher than the height of the magnetic sensor 14, the magnetic sensor 14 is housed within the through hole (receiving portion) 13". Five fixing contacts 21a", 21c", 21d", 21e", and 21f are arranged on the upper surface of the second substrate 12".

[0107] The movable contact 30" is constituted by a fourth spring member 30". The fourth spring member 30" is a flexible conductive member having a dome-shaped bend that protrudes centrally. The fourth spring member 30" has a pressing part 301" and multiple feet 302". The pressing part 301" is formed on the dome-shaped top of the fourth spring member 30" and contacts the fixed contact 21a" when the fourth spring member 30" is pressed. The multiple feet 302" are formed to protrude obliquely downward from the ends of the fourth spring member 30". The fourth spring member 30" is disposed on the second substrate 12" such that the multiple feet 302" each contact the peripheral fixed contacts 21c" to 21f". A magnetic sensor 14 is disposed below the fourth spring member 30". The fourth spring member 30" is made of, for example, stainless steel.

[0108] When the fourth spring member 30" is pressed, the convex shape of the fourth spring member 30" is reversed, and the lower part 301" contacts the central fixed contact 21a" and the central fixed contact 21a" and the peripheral fixed contacts 21c" to 21f" are connected, and the switch becomes open.

[0109] The second resin housing 90 is a flexible resin housing with a convex shape, and its outline is approximately the same as that of the switch 3. The second resin housing 90 has the same function as the first resin housing 80. The second resin housing 90 has a second pressing part 91, a second magnet receiving part 92, a second cover part 93, a second frame part 94, and a second side wall part 98. Furthermore, the second pressing part 91, the second magnet receiving part 92, the second cover part 93, the second frame part 94, and the second side wall part 98 are integrally formed of resin.

[0110] The second pressing part 91 is disposed on the lower side of the magnet 50, and when pressed, it presses the magnet 50 toward the movable contact 30". The second pressing part 91 also serves as a contact prevention part to prevent contact between the movable contact 30" and the magnet 50. In other words, the second pressing part 91, which is also a contact prevention part, is disposed between the lower surface of the magnet 50 and the movable contact 30" in the pressing direction, and prevents contact between the magnet 50 and the movable contact 30". The upper surface of the second pressing part 91 is bonded to the lower surface of the magnet 50. The bonding between the upper surface of the second pressing part 91 and the lower surface of the magnet 50 is based on adhesive bonding.

[0111] The second magnet receiving portion 92 is formed above the second pressing portion 91 and houses the magnet 50 inside. The interior of the second magnet receiving portion 92 is substantially consistent with the outline and shape of the magnet 50, suppressing the positional displacement of the magnet 50 in the XZ plane. The second cover portion 93 connects the second magnet receiving portion 92 and the second frame portion 94.

[0112] The second frame portion 94 has an opening at its center that substantially matches the outline and shape of the fourth spring member 30" and accommodates the fourth spring member 30". The opening of the second frame portion 94 has a recess 99 for accommodating the foot 302" of the movable contact 30". Thus, by combining the fact that the shape of the opening substantially matches the outline of the fourth spring member 30", the positional displacement of the movable contact (fourth spring member) 30" is suppressed when it is positioned on the upper surface of the second substrate 12". The lower surface of the second frame portion 94 is bonded to the adhesive member 62'. Thus, combined with the second cover portion 93, etc., a dustproof and waterproof function is achieved for the upper surface of the second substrate 12". The second sidewall portion 98 is a sidewall for forming the second magnet receiving portion 92. The second sidewall portion 98 suppresses the positional displacement of the magnet 50 in the XZ plane.

[0113] Figure 18 This is a top view of the first substrate 11" of switch 3 (side view of the second substrate 12"). For example... Figure 18As shown, the upper surface of the first substrate 11" is provided with first upper surface wiring patterns 22b", 22d", 22f", 22g", and 22h" that are electrically connected to each terminal 141 of the magnetic sensor 14, and first upper surface pads 24b", 24d", 24f", 24g", and 24h that are electrically connected to the first upper surface wiring patterns 22b", 22d", 22f", 22g", and 22h".

[0114] On the upper surface of the first substrate 11", third upper surface wiring patterns 28a to 28f are disposed at positions different from the first upper surface wiring patterns 22b", 22d", 22f", 22g", and 22h", and first upper surface pads 24a, 24c, and 24e are electrically connected to the third upper surface wiring patterns 28a, 28c, and 28e, respectively. On the lower surface of the first substrate 11", eight first lower surface pads (not shown) are disposed, each corresponding to the first upper surface pads 24a to 24h.

[0115] The third upper surface wiring patterns 28a to 28f each have connecting surfaces 281a to 281f. Each connecting surface 281a to 281f is positioned opposite to each second lower surface pad 27a to 27f, and is electrically connected to each second lower surface pad 27a to 27f, for example, by soldering.

[0116] Figure 19 (a) is a top view of the second substrate 12" of switch 3 (movable contact 30" side). Figure 19 (b) is Figure 19 (a) is a bottom view of the second substrate 12".

[0117] like Figure 19 As shown in (a), on the upper surface of the second substrate 12", there are second upper surface wiring patterns 23ab', 23cd', and 23ef' that are electrically connected to fixed contacts 21a', 21c', 21d', 21e', and 21f', and second upper surface pads 26a to 26f that are electrically connected to the second upper surface wiring patterns 23ab', 23cd', and 23ef'.

[0118] like Figure 19 As shown in (b), six second lower surface pads 27a to 27f are disposed on the lower surface of the second substrate 12".

[0119] On the side of the first substrate 11" are eight first substrate end face through holes 16a to 16h. Each first substrate end face through hole 16a to 16h is electrically connected to each first upper surface pad 24a to 24h and each first lower surface pad of the first substrate 11" respectively. On the outside of the receiving portion (through hole) 13" in the XZ plane of the second substrate 12" are six second substrate through holes 18a to 18f. The second substrate through holes 18a to 18f are electrically connected to each second upper surface pad 26a to 26f and each second lower surface pad 27a to 27f of the second substrate 12" respectively.

[0120] In switch 3, a magnetic sensor 14 is disposed on the upper surface of the first substrate 11”, and a receiving portion (through hole) 13” for receiving the magnetic sensor 14 is disposed on the second substrate 12”. Therefore, even if the magnetic sensor 14 and the movable contact 30” are arranged in a straight line, the miniaturization and / or thinning of switch 3 can be achieved.

[0121] In switch 3, the connecting surfaces 281a, 281c, 281e of the third upper surface wiring patterns 28a, 28c, 28e connected to the first upper surface pads 24a, 24c, 24e are electrically connected to the second lower surface pads 27a, 27c, 27e. Therefore, the fixed contacts 21a" ", 21c" ", 21d" ", 21e" ", 21f" are connected to the third upper surface wiring patterns 28a ~ 28f of the first substrate 11" via the second upper surface wiring pattern 23" of the second substrate 12", and are connected to other electronic components via the through holes 16a ~ 16h of the first substrate end face and the pads.

[0122] In switch 3, the second resin housing 90 includes a second pressing portion 91 that also serves as a contact prevention portion, a second magnet receiving portion 92, a second cover portion 93, and a second frame portion 94. Therefore, switch 3 can provide a housing that combines the functions of receiving magnet 50, dustproof and waterproof functions of movable contact 30", and pressing function of movable contact 30".

[0123] In switch 3, the second pressing part 91 also serves as a contact prevention part. Therefore, in switch 3, the magnet 50 can be prevented from contacting the movable contact 30" through a simple structure.

[0124] (Implementation Method 4)

[0125] Figure 20 This is a perspective view of switch 4 according to embodiment 4. Figure 21 This is an exploded 3D view of switch 4. Figure 22 (a) is a top view of the substrate 10 (movable contact 30 side). Figure 22 (b) is a bottom view of substrate 10. Figure 23(a) is a perspective view of the lead frames 210 and 230 arranged in the substrate 10, viewed from an obliquely upward angle. Figure 23 (b) is a perspective view of the lead frames 210 and 230 arranged in the substrate 10, viewed from a slightly lower angle. Figure 24 It is along Figure 20 The diagram shows a cross-sectional view of switch 4 on line AA'.

[0126] Switch 4 differs from Switch 1 in the following ways: it integrates the functions of the first and second substrates within a single substrate (in other words, the first and second substrates are integrally formed), and it uses a lead frame instead of wiring patterns and pads. Furthermore, in Switch 4, the same numbers are used for structures identical to those in Switch 1, and their descriptions are omitted.

[0127] The switch 4 includes a substrate 10, a magnetic sensor 14, a movable contact 30, a first sheet 40, a magnet 50, a first frame member 60, a second sheet 70, and seven lead frames 210a, 210b, 230a to 230e disposed within the substrate 10.

[0128] Substrate 10 is a substrate for... Figure 23 (a) and Figure 23 The seven lead frames 210a, 210b, and 230a-230e shown in (b) are integrally formed and fixed with resin or the like. They have a recess 200 on the upper surface and a receiving portion 213 on the lower surface. A magnetic sensor 14 is housed within the receiving portion 213. A portion of the outer edge of the receiving portion 213, similar to that of the switch 2, is located at the same position as a portion of the outer edge of the magnet 50. The height of the substrate 10 in the Y-axis direction is higher than the height of the magnetic sensor 14.

[0129] Within the recess 200 of the substrate 10, portions of the lead frames 210a and 210b are exposed. A portion of the center of the movable contact 30 contacts a portion of the lead frame 210a exposed within the recess 200 when pressed. Since the end of the movable contact 30 is configured to contact a portion of the lead frame 210b exposed within the recess 200, pressing the movable contact 30 connects the lead frames 210a and 210b, turning the switch on. That is, the lead frames 210a and 210b function as fixed contacts. Furthermore, the front ends of the lead frames 210a and 210b protrude from the outside of the substrate 10 as contacts 211a and 211b, respectively.

[0130] Lead frames 230a-230e are disposed within the housing portion 213, with a portion of each exposed. The portions of the lead frames 230a-230e exposed within the housing portion 213 are electrically connected to terminals 141 of the magnetic sensor 14. In the switch 4, the lead frames 230a-230e exposed within the housing portion 213 and the terminals 141 of the magnetic sensor 14 are sealed within the housing portion 213 by a sealing resin (not shown). Furthermore, the front ends of the lead frames 230a-230e protrude from the substrate 10 as contacts 231a-231e.

[0131] Lead frames 210a, 210b and 230a-230e are arranged within the substrate 10 in a state of isolation and insulation. The lead frames 210a, 210b and 230a-230e are formed to have portions that do not overlap with the movable contact 30 in the pressing direction. The substrate 10 is fabricated by fixing these non-overlapping portions with resin while maintaining the isolation and insulation of each lead frame. Furthermore, in the central portion of the substrate 10, lead frames 210a and 210b are positioned closer to the movable contact 30 than lead frames 230a-230e.

[0132] In switch 4, since the magnetic sensor 14 is housed in the receiving portion 213 of the substrate 10, the height of the switch 4 in the pressing direction can be suppressed. If substrate 10 is used, the separation of the first substrate 11 and the second substrate 12 in switch 1 will no longer occur, and the durability of switch 4 will be improved.

[0133] Figure 25 (a) is a top view of switch 5, (b) is a bottom view of switch 5, and (c) is a cross-sectional view of switch 5 along line AA' shown in (a).

[0134] Switch 5 is a variation of switch 4. In switch 4, the contacts 211a, 211b, and 231a-231e protruding from the substrate 10 are arranged in switch 5 to curve downwards from the side to the lower surface to prevent them from protruding from the substrate 10. Compared to switch 1, switch 5 is identical to switch 4 in that the first and second substrates are integrally formed, and a lead frame is used instead of wiring patterns and pads. In switch 5, the same numbers are used for structures identical to those in switch 4, and their descriptions are omitted.

[0135] Contacts 211a', 211b', and 231a' to 231e' in switch 5 correspond to contacts 211a, 211b, and 231a to 231e in switch 4. In Figure 25 In the top view of switch 5 shown in (a), contacts 211a', 211b', and 231a' to 231e' are not visible, but... Figure 25In the bottom view of switch 5 shown in (c), contacts 211a', 211b', and 231a' to 231e' are visible on the lower surface of switch 5. Switch 5 is connected to an external substrate or the like through the various contacts arranged on the lower surface of switch 5.

[0136] In switch 5, the magnetic sensor 14 is disposed in the recess 213 formed on the substrate 10, which is the same as in switch 4. However, the recess 213 is completely filled with sealing resin 291, so that the magnetic sensor 14 does not come into contact with the outside air.

[0137] In switch 5, a recess 213 is formed on substrate 10, and a magnetic sensor 14 is disposed in the recess 213. The recess is filled with sealing resin 291 to isolate the magnetic sensor 14 from the outside. However, when substrate 10 is formed including lead frames 230a to 230e, the magnetic sensor 14 may also be included in the substrate 10 integrally.

[0138] (Implementation Method 5)

[0139] Figure 26 This is a perspective view of the switch 6 according to embodiment 5. Figure 27 It is along Figure 26 The diagram shows a cross-sectional view of switch 6 on line AA'. Figure 28 (a) is a top view of the substrate 300 of switch 6. Figure 28 (b) is a bottom view of the substrate 300 of switch 6.

[0140] Switch 6 is a variation of switch 1, the difference being that the first substrate 11 and the second substrate 12 in switch 1 are formed into a single substrate 300. Switch 6 includes substrate 300, magnetic sensor 14, movable contact 30, first sheet 40, magnet 50, first frame member 60, second frame member 61, and second sheet 70. Since the magnetic sensor 14, movable contact 30, first sheet 40, magnet 50, first frame member 60, second frame member 61, and second sheet 70 have the same structure as switch 1, their description is omitted.

[0141] like Figure 28 As shown in (a), three fixed contacts 21a, 21b, and 21f are disposed on the upper surface of the substrate 300. In addition, first upper surface wiring patterns 22a, 22b, and 22f, which are electrically connected to the fixed contacts 21a, 21b, and 21f, and first upper surface pads 24a, 24b, and 24f, which are electrically connected to the first upper surface wiring patterns 22a, 22b, and 22f, are disposed on the upper surface of the substrate 300.

[0142] like Figure 28As shown in (b), on the lower surface of the substrate 300, there are lower surface wiring patterns 323c, 323d, 323e, 323g, and 323h that are electrically connected to each terminal 141 of the magnetic sensor 14, and lower surface pads 327c, 327d, 327e, 327g, and 327h that are electrically connected to the lower surface wiring patterns 323c, 323d, 323e, 323g, and 323h, respectively. Furthermore, in Figure 28 In (b), magnetic sensor 14 is not shown.

[0143] The lower surface wiring patterns 323c, 323d, 323e, 323g, and 323h are formed continuously from the inner bottom surface of the receiving portion 13 formed on the lower surface of the substrate 300, through the inner side surface of the receiving portion 13, to the lower surface of the substrate 300. The terminal 141 of the magnetic sensor 14 and the lower surface wiring patterns 323c, 323d, 323e, 323g, and 323h are connected on the inner bottom surface of the receiving portion 13.

[0144] Three substrate end face through holes 316a, 316b, and 316f are disposed on the side of the substrate 300. The substrate end face through hole 316a is electrically connected to the upper surface pad 24a and the lower surface pad 327a of the substrate 300, the substrate end face through hole 316b is electrically connected to the upper surface pad 24b and the lower surface pad 327b of the substrate 300, and the substrate end face through hole 316f is electrically connected to the upper surface pad 24f and the lower surface pad 327f of the substrate 300.

[0145] On the lower surface of the substrate 300, there are lower surface pads 327a, 327b, and 327f that are electrically connected to three fixed contacts 21a, 21b, and 21f, and lower surface pads 327c, 327d, 327e, 327g, and 327h that are electrically connected to the magnetic sensor 14. In this way, in the switch 6, the connection to the three fixed contacts 21a, 21b, and 21f and the magnetic sensor 14 can be obtained only through the lower surface of the substrate 300, and the switch 6 can be easily electrically connected to an external substrate or the like.

[0146] In switch 6, since the lower surface wiring patterns 323c, 323d, 323e, 323g, and 323h are arranged inside the housing 13, the entire housing 13, including the magnetic sensor 14, is sealed with sealing resin 319. Sealing resin 319 is a resin of the same material as sealing resin 19.

[0147] (Examples of variations of each switch)

[0148] In switch 4, a recess 200 is provided on the upper surface of substrate 10 to provide a movable contact 30, but the recess 200 may not be provided on the upper surface of substrate 10. For example, the upper surface of substrate 10 may be flat, and a frame member for receiving the movable contact 30 may be provided between substrate 10 and first sheet 40.

[0149] In switch 4, it is described that each lead frame 210, 230 is arranged in a substrate 10 formed of resin, but the substrate 10 may also be composed of multiple stacked substrates.

[0150] In switches 2 and 4, a portion of the magnet 50 is positioned at the same location as the outer edge of the through hole (receiving part) 13' in top view, but the same construction can also be used in switches 1 and 3.

[0151] In switches 1 to 3, a receiving portion is formed by a through hole through the substrate, but the receiving portion only needs to be able to accommodate the magnetic sensor 14, or it can be a non-through recess.

[0152] In switches 1 to 6, a magnetic sensor 14, which is a semiconductor element, is used, but other semiconductor elements such as LEDs can also be used. When an LED, which is a light-emitting element, is used instead of the magnetic sensor 14, the opening / closing of the switch can be visually perceived by illuminating the light-emitting element when the switch is turned on, or vice versa.

[0153] In switches 1, 2, and 6, end face through holes are listed as an example of through holes, but through holes that penetrate the substrate can also be configured at the ends of each substrate.

[0154] In switch 1, a portion of the magnetic sensor 14 (semiconductor element) is sealed by filling with sealing resin 19, but the entire body of the magnetic sensor 14 (semiconductor element) can also be sealed. The same applies to switches 2 and 4.

[0155] In switches 1 and 2, the first upper surface pads connected to the wiring pattern on the first upper surface and the first upper surface pads connected to the wiring pattern on the first lower surface are respectively connected to different first substrate vias. However, a portion of the plurality of first upper surface pads connected to the wiring pattern on the first upper surface and a portion of the plurality of first lower surface pads connected to the wiring pattern on the first lower surface can also be connected to different first substrate vias. That is, a portion of the first substrate vias can also be wiring patterns that are conductive to both the fixed contact and the magnetic sensor 14 (semiconductor element). Even in this case, the vias on the end face of the first substrate can be effectively utilized, and the wiring pattern can be simplified.

[0156] In switches 2 and 3, pads disposed at the ends of the substrate are used to make the upper and lower surfaces of the substrate conductive. However, bonding pads disposed outside the ends of the substrate can also be used instead of pads. Furthermore, the pads and bonding pads are examples of conductive surfaces formed by conductive members.

[0157] In switches 1 to 6, the movable contact has a convex (dome-shaped) shape. However, the shape of the movable contact is only required to deform by pressing to allow multiple fixed contacts to conduct to each other; it does not necessarily have to be convex. For example, in switch 1, the fixed contacts 21b and 21f can be made higher than the substrate 11, while the movable contact 30 can be made flat, with a gap provided between the fixed contact 21a and the movable contact 30. In this case, the same effect as when the movable contact 30 is formed into a curved dome shape can be obtained.

[0158] In switches 1 to 6, the movable contact 30 is composed of two spring members 30 and 31, but the number of spring members is not particularly limited and can be more than three or one.

[0159] In switches 1 and 4, the first sheet 40 and the first frame member 60 can also be integrally formed. In this case, the possibility of the first sheet 40 and the first frame member 60 peeling off is eliminated, and the durability of the cover structure is improved.

[0160] In switches 1 and 4, the first sheet 40 and the magnet 50 can be joined. The joining of the first sheet 40 and the magnet 50 can be based on adhesive bonding, adhesive sheet bonding, or a combination thereof.

[0161] In switches 1 to 6, magnet 50 is a cylindrical permanent magnet, but it is not limited to this. For example, the shape of magnet 50 can also be a polygonal prism. In addition, magnet 50 is not limited to a permanent magnet; for example, it can also be an electromagnet that has a magnetic effect only when an electric current flows through it.

[0162] In switches 1 to 6, magnet 50 is used as a pressing member, but it is not limited to this; for example, it can also be a member with a specified rigidity.

[0163] In switches 1 and 4, the opening of the second frame member 61 may also have a profile and shape that are substantially consistent with each spring member 31, 32, and accommodate each spring member 31, 32. In this case, the second frame member 61 can suppress the positional displacement of the movable contact 30 when the movable contact 30 is disposed on the upper surface of the first substrate 11.

[0164] In switch 2, the first resin housing 80 has a cutout 862 in the contact prevention part 86, but the cutout 862 may not be provided.

[0165] In switch 2, the lower surface of the first pressing part 81 can also be joined to the upper surface of the magnet 50. Therefore, not only the cutout 862, but also the protrusion 861 can be eliminated. The joining of the lower surface of the first pressing part 81 and the upper surface of the magnet 50 can be achieved by applying an adhesive to the lower surface of the first pressing part 81, or by using a pressure-sensitive adhesive sheet.

[0166] In switches 2 and 3, the outline and shape of the opening of the adhesive member 62' are roughly the same as those of each spring member, but the opening can also be rectangular.

[0167] In switches 2 and 3, as long as each substrate and each resin housing are joined, the adhesive member 62' may not be provided. For example, the first substrate 11' (second substrate 12") and the first resin housing 80 (second resin housing 90) may also be joined by an adhesive or even an adhesive sheet.

[0168] In switches 1-3, the bonding of the first substrate and the second substrate is based on adhesive bonding, but the bonding is not limited to adhesive bonding; it can also be achieved by bonding with pressure-sensitive adhesive sheets. The same applies to the bonding of other components to each other. For example, the bonding of the second pressing part 91 of the second resin housing 90 and the magnet 50 can also be based on the bonding of adhesive sheets.

[0169] In switches 1 to 4, the combination of the cover structure and the substrate is just one example and is not limited thereto. For example, a second cover member 90 may be disposed on each substrate 11' and 12' of switch 2, and each resin housing 80 and 90 may be disposed on substrate 10. The same applies to the combination of the movable contact and the cover structure.

[0170] In switch 3, six second substrate through holes 18a to 18f disposed in the central part of the second substrate 12" are used to make the upper and lower surfaces of the second substrate 12" conductive. However, in order to make the upper and lower surfaces of the second substrate 12" conductive, a structure such as eight first substrate end face through holes 16a to 16h disposed on the side of the first substrate 11" and pads disposed therearound can also be used.

[0171] In switches 1 to 5, the first substrate may also be composed of multiple components or substrates. Similarly, in switches 1 to 5, the second substrate may also be composed of multiple components or substrates.

[0172] The following notes further disclose the implementation methods and variations thereof described above.

[0173] (Postscript 1)

[0174] A switch having:

[0175] substrate;

[0176] Multiple fixed contacts are disposed on the upper surface of the substrate;

[0177] Movable contacts are disposed on the upper surface of the substrate and deformed by pressing to make the plurality of fixed contacts interconnected;

[0178] A pressing component, used to press the movable contact; and

[0179] A semiconductor element is disposed on the lower surface of the substrate and at a position opposite to the movable contact, separated by the substrate.

[0180] The substrate has a receiving portion for accommodating the semiconductor element.

[0181] (Postscript 2)

[0182] A switch having:

[0183] First substrate;

[0184] Multiple fixed contacts are disposed on the upper surface of the first substrate;

[0185] Movable contacts are disposed on the upper surface of the first substrate and can be deformed by pressing to make the plurality of fixed contacts interconnected.

[0186] A pressing component is used to press the movable contact;

[0187] A semiconductor element is disposed on the lower surface of the first substrate and at a position opposite to the movable contact across the first substrate;

[0188] A plurality of first lower surface conductor surfaces are located on the lower surface of the first substrate and disposed at the ends of the first substrate;

[0189] A first lower surface wiring pattern is disposed on the lower surface of the first substrate and is connected to the semiconductor element and a portion of the plurality of first lower surface conductor surfaces;

[0190] A second substrate, bonded to the lower surface of the first substrate, and having a receiving portion for accommodating the semiconductor element; and

[0191] A plurality of second upper surface conductor surfaces are located on the upper surface of the second substrate and disposed at the ends of the second substrate.

[0192] A portion of the first lower surface conductor surface connected to the first lower surface wiring pattern and a portion of the plurality of second upper surface conductor surfaces are electrically connected.

[0193] (Note 3)

[0194] The switch described in Appendix 2 also has the following features:

[0195] A plurality of first substrate through-holes are disposed at the ends of the first substrate; and

[0196] Multiple through-holes in the second substrate are disposed at the ends of the second substrate.

[0197] The first lower surface conductor surface is a first lower surface pad connected to the through hole of the first substrate.

[0198] The second upper surface conductor surface is a second upper surface pad connected to the second substrate through hole.

[0199] (Note 4)

[0200] The switch described in Appendix 3 also has the following features:

[0201] A plurality of first upper surface pads are disposed on the upper surface of the first substrate and each is connected to a through-hole of the first substrate; and

[0202] A first upper surface wiring pattern is disposed on the upper surface of the first substrate and is connected to the fixed contact and a portion of the plurality of first upper surface pads.

[0203] A portion of the plurality of first upper surface pads connected to the first upper surface wiring pattern and a portion of the plurality of first lower surface pads connected to the first lower surface wiring pattern are connected to different first substrate vias.

[0204] (Note 5)

[0205] In the switch described in Appendix 2

[0206] The receiving portion is formed by a through hole penetrating the second substrate.

[0207] It also includes a sealing resin disposed within the through hole to seal the first lower surface wiring pattern and the terminals of the semiconductor element connected to the first lower surface wiring pattern.

[0208] (Note 6)

[0209] A switch having:

[0210] Second substrate;

[0211] Multiple fixed contacts are disposed on the upper surface of the second substrate;

[0212] Movable contacts are disposed on the upper surface of the second substrate and are deformed by pressing to make the plurality of fixed contacts interconnected.

[0213] A pressing component is used to press the movable contact;

[0214] A first substrate is bonded to the lower surface of the second substrate;

[0215] A semiconductor element is disposed on the upper surface of the first substrate and below the movable contact;

[0216] A plurality of first upper surface conductor surfaces are disposed on the upper surface of the first substrate and at the ends of the first substrate;

[0217] A first upper surface wiring pattern is disposed on the upper surface of the first substrate and is connected to the semiconductor element and a portion of the plurality of first upper surface conductor surfaces;

[0218] A housing portion disposed on the second substrate and housing the semiconductor element; and

[0219] A plurality of second lower surface conductor surfaces are located on the lower surface of the second substrate and disposed on the second substrate.

[0220] The first upper surface conductor surface connected to the first upper surface wiring pattern is electrically connected to a portion of the plurality of second lower surface conductor surfaces.

[0221] (Note 7)

[0222] The switch described in Appendix 6 also has the following features:

[0223] A plurality of first substrate through-holes are disposed at the ends of the first substrate; and

[0224] Multiple first lower surface pads are located on the lower surface of the first substrate and are each connected to a through-hole of the first substrate.

[0225] The first upper surface conductor surface is the first upper surface pad connected to the first substrate through hole.

[0226] (Postscript 8)

[0227] The switch described in Appendix 7 also has the following features:

[0228] Multiple second substrate through-holes are disposed on the outside of the receiving portion in the second substrate;

[0229] Multiple second upper surface pads are disposed on the upper surface of the second substrate and each is connected to a through-hole of the second substrate;

[0230] Multiple second lower surface pads are disposed on the lower surface of the second substrate and each is connected to a through-hole of the second substrate;

[0231] A second upper surface wiring pattern is disposed on the upper surface of the second substrate and connected to each of the fixed contacts and each of the second upper surface pads; and

[0232] A third upper surface wiring pattern is disposed on the upper surface of the first substrate and connected to the plurality of second lower surface pads.

[0233] (Note 9)

[0234] In any of the switches described in Appendix 1 to 8,

[0235] The pressing component is a magnet.

[0236] The semiconductor element is a magnetic sensor that detects changes in the magnetic field caused by the movement of the magnet in the pressing direction.

[0237] It also includes a contact prevention part to prevent contact between the lower surface of the magnet and the movable contact.

[0238] (Postscript 10)

[0239] In the switch described in Appendix 9,

[0240] A portion of the magnet is positioned at the same location as the outer edge of the receiving portion when viewed from above.

[0241] (Postscript 11)

[0242] In the switch described in Appendix 9,

[0243] The contact prevention part is a first sheet arranged to cover the plurality of fixed contacts and movable contacts.

[0244] It also has:

[0245] A frame member disposed on the upper surface of the first sheet; and

[0246] A second sheet is disposed on the upper surface of the frame member and clamps the magnet between it and the first sheet.

[0247] (Postscript 12)

[0248] In the switch described in Appendix 11,

[0249] The first sheet and the frame member are integrally formed.

[0250] (Postscript 13)

[0251] The switch described in Appendix 9 further comprises a first resin housing on which the contact prevention portion is formed in a portion thereof.

[0252] The first resin housing includes:

[0253] The first pressing part is disposed on the upper surface of the magnet;

[0254] A first magnet receiving section, which houses the said magnet;

[0255] A first frame portion, which is configured such that the movable contact is located inside it; and

[0256] A first cover portion connects the first magnet receiving portion and the first frame portion, and covers the movable contact.

[0257] The contact prevention portion is formed on the outer edge of the opening, and the opening is formed on the lower surface of the first magnet receiving portion.

[0258] (Postscript 14)

[0259] The switch described in Appendix 9 further comprises a second resin housing in which the contact prevention portion is formed in a portion thereof.

[0260] The second resin housing includes:

[0261] The second magnet receiving section contains the said magnet;

[0262] The second frame portion is configured such that the movable contact is located inside it; and

[0263] The second cover portion connects the second magnet receiving portion and the second frame portion, and covers the movable contact.

[0264] The contact prevention part is formed on the lower surface of the magnet and also serves as a pressing part for pressing the movable contact when it is pressed.

[0265] (Postscript 15)

[0266] In any of the switches described in Appendix 2 to 8,

[0267] The first substrate and the second substrate are integrally formed.

[0268] (Postscript 16)

[0269] A switch having:

[0270] First substrate;

[0271] Multiple fixed contacts are disposed on the upper surface of the first substrate;

[0272] Movable contacts are disposed on the upper surface of the first substrate and can be deformed by pressing to make the plurality of fixed contacts interconnected.

[0273] A pressing component, used to press the movable contact; and

[0274] A semiconductor element is disposed on the lower surface of the first substrate and at a position opposite to the movable contact, separated by the first substrate.

[0275] The first substrate has a receiving portion for accommodating the semiconductor element.

[0276] (Postscript 17)

[0277] The switch described in Appendix 16 also has:

[0278] The second substrate is bonded to the lower surface of the first substrate;

[0279] A second upper surface wiring pattern is disposed on the upper surface of the second substrate and connected to the semiconductor element;

[0280] A second upper surface conductor surface is disposed on the upper surface of the second substrate; and

[0281] Multiple second lower surface conductor surfaces are disposed on the lower surface of the second substrate.

[0282] The second upper surface wiring pattern is electrically connected to a portion of the second upper surface conductor surface, and a portion of the second upper surface conductor surface is electrically connected to a portion of the second lower surface conductor surface.

[0283] (Postscript 18)

[0284] The switch described in Appendix 17 also has:

[0285] A first upper surface conductor surface is disposed on the upper surface of the first substrate and connected to the plurality of fixed contacts; and

[0286] The first lower surface conductor surface is disposed on the lower surface of the first substrate.

[0287] The upper surface conductor and the first lower surface conductor are electrically connected.

[0288] The first lower surface conductor is electrically connected to another part of the second upper surface conductor, and the other part of the second upper surface conductor is electrically connected to another part of the second lower surface conductor.

[0289] (Postscript 19)

[0290] A switch having:

[0291] A substrate having a receiving section;

[0292] Multiple first fixing contacts are disposed on the upper surface of the substrate;

[0293] Multiple second fixed contacts are arranged within the receiving section;

[0294] Multiple second fixing contacts are disposed on the side or lower surface of the substrate;

[0295] Movable contacts are disposed on the upper surface of the substrate and deformed by pressing to make the plurality of fixed contacts interconnected;

[0296] A pressing component, used to press the movable contact; and

[0297] A semiconductor element, which is connected to the plurality of second fixed contacts, is disposed at a position opposite to the movable contact and within the receiving portion.

[0298] (Postscript 20)

[0299] The switch described in Appendix 19 also has:

[0300] A first lead frame electrically connects a portion of the plurality of first fixed contacts and the plurality of third fixed contacts; and

[0301] The second lead frame electrically connects the plurality of second fixed contacts and the remaining portion of the plurality of third fixed contacts.

Claims

1. A switch, characterized in that, have: A substrate having a receiving section; Multiple fixed contacts are disposed on the upper surface of the substrate; Movable contacts are disposed on the upper surface of the substrate and can be deformed by pressing to make the plurality of fixed contacts interconnected. A pressing component is used to press the movable contact; as well as A semiconductor element is attached to the lower surface of the substrate and disposed within the receiving portion at a position opposite to the movable contact.

2. The switch according to claim 1, characterized in that, The substrate includes a first substrate and a second substrate. The plurality of fixing contacts are disposed on the upper surface of the first substrate; The second substrate has the receiving portion that is bonded to the lower surface of the first substrate and is formed by a through hole.

3. The switch according to claim 2, characterized in that, It also has: A first lower surface wiring pattern is disposed on the lower surface of the first substrate and connected to the semiconductor element; A first lower surface conductor surface is disposed on the lower surface of the first substrate; Multiple second upper surface conductor surfaces are disposed on the upper surface of the second substrate; as well as Multiple second lower surface conductor surfaces are disposed on the lower surface of the second substrate. The lower surface wiring pattern is electrically connected to a portion of the first lower surface conductor, a portion of the first lower surface conductor and a portion of the second upper surface conductor, and a portion of the second upper surface conductor and a portion of the second lower surface conductor, respectively.

4. The switch according to claim 2 or 3, characterized in that, It also has a first upper surface conductor surface, which is connected to the plurality of fixed contacts. The first upper surface conductor is electrically connected to another part of the first lower surface conductor, the other part of the first lower surface conductor is electrically connected to another part of the second upper surface conductor, and the other part of the second upper surface conductor is electrically connected to another part of the second lower surface conductor.

5. The switch according to claim 3 or 4, characterized in that, It also has: A first substrate through-hole connects the first upper surface conductor surface and the first lower surface conductor surface; and The second substrate through-hole connects the second upper surface conductor surface and the second lower surface conductor surface.

6. The switch according to any one of claims 2 to 5, characterized in that, It also includes a sealing resin disposed within the through hole and sealing the first lower surface wiring pattern and the terminals of the semiconductor element connected to the first lower surface wiring pattern.

7. The switch according to any one of claims 1 to 6, characterized in that, The pressing component is a magnet. The semiconductor element is a magnetic sensor that detects changes in the magnetic field caused by the movement of the magnet in the pressing direction.

8. The switch according to claim 7, characterized in that, It also has a contact prevention part that prevents the lower surface of the magnet from contacting the movable contact.

9. The switch according to claim 8, characterized in that, A portion of the magnet is positioned at the same location as the outer edge of the receiving portion when viewed from above.

Images