Laser press bonding apparatus and method

Abstract

A laser press bonding apparatus includes a carrier configured for placement of a substrate with an electronic component placed thereon via a solder material, a press head having a bottom surface and configured for operable pressing of the electronic component against the substrate via the solder material at its bottom surface, a heating member embedded within the press head and configured for preheating of the press head prior to the press head pressing the electronic component against the substrate, and a laser source configured for irradiation of a laser beam through the preheated press head to the carrier after the press head is preheated to bond the electronic component to the substrate via the solder material while the electronic component is pressed against the substrate.

Description

Technical Field

[0001] This application generally relates to semiconductor technology, and more specifically, to laser pressure bonding apparatus and methods. Background Technology

[0002] Laser compression bonding (LCB), or welding process, has been used to replace conventional large-scale reflow soldering processes for semiconductor packaging because thermal stress within the semiconductor package can be reduced during the laser compression bonding process. Preheating the compression tool in the LCB process can effectively improve bonding efficiency. However, conventional methods of preheating the compression tool with a high-power laser can damage components within the semiconductor package.

[0003] Therefore, a new laser pressure bonding device and method are needed. Summary of the Invention

[0004] The objective of this application is to provide a laser pressure bonding (LCB) apparatus and method to avoid undesirable damage to the semiconductor package during the preheating period of the LCB process in semiconductor packaging.

[0005] According to one aspect of this application, a laser pressure bonding apparatus is provided. The laser pressure bonding apparatus includes: a carrier configured to hold a substrate, wherein electronic components are placed on the substrate via a bonding material; a pressure head having a bottom surface and configured to operably press the electronic components against the substrate via the bonding material at its bottom surface; a heating member embedded within the pressure head and configured to preheat the pressure head before the pressure head presses the electronic components against the substrate; and a laser source configured to irradiate the carrier with a laser beam through the preheated pressure head after the pressure head has been preheated, so as to bond the electronic components to the substrate via the bonding material when the electronic components are pressed against the substrate.

[0006] According to another aspect of this application, a method for forming a preheatable pressure head is provided. The method includes: providing a pressure head having a groove pattern located on its bottom surface and recessed into the pressure head; depositing an electrically heatable material on the bottom surface of the pressure head and on the inner surface of the groove pattern; removing a portion of the electrically heatable material on the bottom surface of the pressure head, and retaining a portion of the electrically heatable material on the inner surface of the groove pattern as an electrically heatable coating; and mounting a pair of electrodes to the pressure head and connecting the pair of electrodes to the electrically heatable coating such that the pressure head is preheated by the electrically heatable coating by a voltage source applied between the pair of electrodes.

[0007] According to another aspect of this application, a laser pressure bonding method is provided. The method includes: placing a substrate on a carrier; preheating the pressure head to at least a predetermined temperature using a heating member embedded within the pressure head; pressing an electronic component against the substrate via a bonding material through the preheated pressure head; and irradiating the carrier with a laser beam generated by a laser source through the preheated pressure head to bond the electronic component to the substrate via the bonding material.

[0008] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and do not limit the invention. Furthermore, the accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with this specification, serve to explain the principles of the invention. Attached Figure Description

[0009] The accompanying drawings referenced herein form part of this specification. The features shown in the drawings are only illustrative of some embodiments of this application, and not all embodiments of this application, unless the detailed description clearly indicates otherwise, and the reader of this specification should not infer the contrary.

[0010] Figure 1a and 1b A laser pressure bonding apparatus according to an embodiment of this application is shown.

[0011] Figures 1c to 1e An exemplary groove pattern of a laser pressure head according to an embodiment of this application is shown.

[0012] Figures 2a to 2c A method for forming a pressure head according to an embodiment of this application is shown.

[0013] Use the same icon number to refer to the same or similar parts in a continuous diagram. Detailed Implementation

[0014] The following detailed description of exemplary embodiments of this application takes into account the accompanying drawings, which form a part of the description. The drawings illustrate specific exemplary embodiments in which this application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice this application. Those skilled in the art may further utilize other embodiments of this application and make logical, mechanical, and other changes without departing from the spirit or scope of this application. Therefore, the reader of the following detailed description should not interpret the description in a limiting sense, and only the appended claims define the scope of embodiments of this application.

[0015] In this application, unless otherwise expressly stated, the use of the singular includes the plural form. In this application, unless otherwise stated, the use of “or” means “and / or”. Furthermore, the use of the term “including” and other forms such as “includes” and “included” is not restrictive. Additionally, unless otherwise expressly stated, terms such as “element” or “component” cover both elements and components comprising one unit and elements and components comprising more than one sub-unit. Furthermore, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0016] As used herein, for ease of description, spatial relative terms such as “below,” “under,” “above,” “upper,” “upper,” “lower,” “left,” “right,” “vertical,” “horizontal,” and “side” may be used to describe the relationship between an element or feature and another element (or feature) or feature (or feature), as shown in the diagrams. In addition to the orientations depicted in the diagrams, the spatial relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein shall be interpreted accordingly. It should be understood that when an element is referred to as “connected to” or “coupled to” another element, the element may be directly connected to or coupled to the other element, or there may be intermediate elements present.

[0017] Laser bonding (LCB) tools are typically made of transparent materials with low thermal conductivity and high heat capacity, such as quartz, fused silica, sapphire, or ZnSe. The thermal properties of transparent materials increase the difficulty of heating and cooling LCB tools compared to conventional metal indenters or tools. In some cases, preheating the LCB tool is preferred to reduce significant temperature changes during or before the LCB process, for example, using laser preheating employed by the LCB tool. However, the inventors of this application have noted that components within semiconductor packages processed by LCB tools can be easily damaged by high-power lasers.

[0018] To address the aforementioned problems, a laser pressure bonding apparatus is proposed that preheats an LCB tool, such as the pressure head of an LCB device, to a predetermined temperature before performing the LCB process. Specifically, the pressure head can be heated by a heating element such as a heating strip. Unlike conventional methods of heating the LCB tool during the preheating process (which can damage components within the semiconductor package), the method of preheating the LCB tool according to some embodiments of this application exhibits high uniformity in temperature control and thus avoids undesirable damage to the semiconductor package. Furthermore, the method of preheating the LCB tool according to this application is also more cost-effective to implement.

[0019] Figure 1a and 1b A laser pressure bonding apparatus 100 according to an embodiment of this application is shown. Specifically, Figure 1a The laser pressure bonding apparatus 100 is shown operating in bonding mode, and Figure 1b The laser pressure bonding device 100 is shown operating in preheating mode.

[0020] like Figure 1a As shown, the laser pressure bonding apparatus 100 includes a carrier 111, such as a carrier platform for placing a substrate 105, and a pressure head 106, which is typically positioned above the carrier 111 and movable relative to the carrier 111. The pressure head 106 can hold and move an electronic component 108 to be bonded to the substrate 105. Specifically, the pressure head 106 may include a rear surface on which the electronic component 108 is attached. When the pressure head 106 moves the electronic component 108 onto the substrate 105 via the bonding material 110, the rear surface may face the substrate 105 and the carrier 111 below it. In some examples, the electronic component 108 may have a first set of conductive patterns, such as contact pads, on its rear surface, and the substrate 105 may have a second set of conductive patterns, such as contact pads, on its front surface, the layout of which may be the same as or similar to the layout of the first set of conductive patterns of the electronic component 108. The welding material 110 may be pre-formed on one or both of the two sets of conductive patterns, such that the two sets of conductive patterns are bonded together using a bonding process, thereby electrically and mechanically connecting the electronic component 108 to the substrate 105. In some embodiments, the electronic component 108 may be a semiconductor chip, while in other embodiments, the electronic component 108 may be a semiconductor package or other similar device or module.

[0021] A laser pressure bonding apparatus 100 is used to perform a laser pressure bonding process on an electronic component 108 and a substrate 105 to bond them together. Therefore, a laser source 112 is employed in the laser pressure bonding apparatus 100, which generates a laser beam 114 to provide laser energy to heat and reflow the solder material 110 between the electronic component 108 and the substrate 105. Specifically, the laser source 112 can be positioned above a pressure head 106 and facing the front surface of the pressure head 106. During the laser pressure bonding process, the laser beam 114 can be emitted from the laser source 112 toward the carrier 111, passing at least through the central portion 106a of the pressure head 106 to heat the solder material 110. Sufficient laser energy can be applied to the solder material 110 during the bonding process to melt and reflow the solder material 110. When the laser source 112 is turned off, the molten solder material 110 can solidify into solder bumps between the substrate 105 and the electronic component 108. In this way, electronic component 108 can be bonded to substrate 105 via solder bumps after the bonding process as a single electronic package.

[0022] exist Figure 1a In the embodiment shown, the pressure head 106 has a convex rear surface. Specifically, the rear surface of the pressure head 106 in the central portion 106a (i.e., the location where the electronic component 108 is attached) is lower and closer to the carrier 111 than the rear surface in the peripheral portion 106b surrounding the central portion 106a. In this case, when the pressure head 106 presses the electronic component 108 against the substrate 105 via the soldering material 110, the rear surface in the central portion 106a can contact the electronic component 108, while the rear surface in the peripheral portion 106b can be further away from the substrate 105 and the carrier 111, thereby leaving sufficient space between the carrier 111 and the pressure head 106, which avoids undesirable conflicts that could contaminate or even damage the pressure head 106. However, it is understood that the pressure head 106 may have a rear surface of other shapes. For example, the rear surface of the pressure head 106 can be flat in both the central portion 106a and the peripheral portion 106b.

[0023] Because the pressure head 106 can hold and displace the electronic component 108, at least one through-hole 116 can be formed in the pressure head 106, passing through the central portion 106a to apply vacuum pressure to the electronic component 108, thereby firmly attracting and holding the electronic component 108. For example, a vacuum source can be fluidly connected to the through-hole 116 to supply vacuum pressure. The vacuum pressure can be applied during the movement of the electronic component 108 with the pressure head 106, but can be released when the electronic component 108 is in place on the substrate 105, for example during a bonding process. Furthermore, the pressure head 106 can be mechanically coupled to a driver or actuator (not shown) that can automatically move the pressure head 106 under the control of a controller, host device, or server, or manually move the pressure head under the control of a user. Furthermore, when the electronic component 108 is placed on the substrate 105 via the soldering material 110, a driver or actuator can apply force to the pressure head 106, which in turn provides pressure at the soldering material 110 to assist the bonding process.

[0024] like Figure 1a As shown, when the laser pressure bonding apparatus 100 is performing a laser pressure bonding process, it operates in bonding mode. However, when preheating of the pressure head is required, the laser pressure bonding apparatus 100 can switch to... Figure 1b The operation is shown in the preheating mode. In the preheating mode, the pressure head 106 can be preheated to a predetermined saturation temperature by the heating element integrated with the pressure head 106.

[0025] like Figure 1bAs shown, a heating element 103 is embedded within a pressure head 106. Specifically, the pressure head 106 has a bottom surface 101, which includes a groove pattern 104 slightly recessed into the bottom surface 101. The bottom surface 101 may be a flat surface to form a stable connection between the pressure head 106 and the electronic component 108 when the electronic component 108 is picked up or held by the pressure head 106, for example, by vacuum pressure. Since the groove pattern 104 is recessed into the pressure head 106, the heating element 103 may be formed within the groove of the groove pattern 104. Specifically, the heating element 103 may be an electrically heatable coating formed on the inner surface (including the bottom and sidewalls) of the groove of the groove pattern 104. In some embodiments, the heating element may include a heating strip, which is typically made of a material with suitable resistivity and embedded in the groove pattern 104. The dimensions of the heating strip 109 may be designed according to the width, length, and / or depth of the groove of the groove pattern 104. Therefore, when a voltage difference is applied to the heating strip to generate a current flowing through it, the heating strip can generate heat. In some embodiments, the heating element 103 is formed only within the groove pattern 104 and not on the bottom surface 101 of the pressure head 106, and most of the laser energy can pass through the bottom surface of the pressure head 106 from the laser source to the carrier 111 without the heating strip, thereby allowing the laser pressure bonding apparatus 100 to still perform the laser pressure bonding process. In some alternative embodiments, the heating element 103 may also be partially formed on the bottom surface 101, provided that the laser energy can effectively pass through the pressure head 106 without being blocked by the heating element 103.

[0026] Figure 1c An exemplary layout of a groove pattern according to an embodiment of this application is shown. Figure 1c As shown, the groove pattern 104 can be formed in a layout with multiple rows and columns that intersect each other. Furthermore, a pair of electrodes 107 can be mounted to the pressure head 106, for example, at both ends of the groove pattern near two corresponding sides of the pressure head 106. The pair of electrodes 107 are made of a conductive material such as copper or silver and are attached to the pressure head 106 using a conductive adhesive or mechanical clamping mechanism. The pair of electrodes 107 are in direct contact with the electrically heatable coating or heating strip within the groove pattern 104, thereby ensuring reliable electrical contact and minimizing contact resistance. A voltage source or power control unit (not shown) is electrically coupled to or integrated into the pressure head 106 to control the magnitude of the voltage between the pair of electrodes 107, thereby regulating the heat generated by the electrically heatable coating or heating strip. As heat is generated by the electrically heatable coating or heating strip within the groove pattern 104 and conducted to other areas of the pressure head 106, the pressure head 106 can be preheated to a desired temperature, such as a predetermined saturation temperature, which can help to… Figure 1aThe subsequent bonding process is shown in the diagram. In some embodiments, the pair of electrodes 107 may be wrapped with heat-resistant tape 107a made of a non-conductive material such as plastic or ceramic. The heat-resistant tape 107a provides an insulating layer that prevents the pair of electrodes 107 from direct contact with other components. The heat-resistant tape 107a can also serve as a protective barrier to protect the pair of electrodes 107 from physical damage and environmental factors such as dust and moisture.

[0027] Although the groove pattern 104 is in Figure 1c The groove pattern 104 is depicted as having multiple rows and columns that intersect each other, but it is understood that the shape of the groove pattern 104 is not limited to this example. The groove pattern 104 can be formed in any desired shape and configuration to accommodate the specific assembly requirements of different electronic components to achieve a higher degree of integration and optimal performance, as well as preheating of the pressure head. Figure 1d and 1e Two further exemplary layouts of groove patterns according to some embodiments of this application are shown. For example... Figure 1d and 1e As shown, the groove pattern 104 may contain rows that are parallel to each other. Figure 1d ), or contains rows connected together in a zigzag or zigzag shape ( Figure 1e The groove pattern with these layouts similarly ensures that the heating elements embedded in the grooves of the groove pattern are distributed on the pressure head, or more specifically, on the convex central area of ​​the pressure head that is in direct contact with the electronic components, thereby achieving uniform heating of the pressure head.

[0028] As described above, the heating element 103 is used to preheat the pressure head to at least a predetermined temperature, such as about 60°C to 70°C. The heating element 103 may comprise an electrically heatable coating deposited on the inner surface of the groove pattern 104 or a heating strip embedded in the groove pattern. The material used for the electrically heatable coating or heating strip needs to provide good thermal conductivity while remaining stable at high temperatures under laser irradiation during subsequent bonding processes. For example, the material may be ITO (indium tin oxide), NiCr (nickel chromium), Ti (titanium), Mo (molybdenum), Pt (platinum), Al (aluminum), graphene / CNT (carbon nanotubes), PEDOT:PSS (conductive polymer), or silver nanowires. In some embodiments, the heating element can be recycled in the next preheating process. Furthermore, the heating element 103 occupies less than 50% of the bottom area of ​​the pressure head 106 to achieve high light transmittance of the pressure head.

[0029] Laser pressure bonding method can be used Figure 1a and 1b The laser pressure bonding apparatus 100 shown herein will be used for implementation. Reference will be made below. Figure 1a and 1bDescribe the method.

[0030] Specifically, the laser pressure bonding apparatus 100 first enters a preheating mode to perform a preheating process on the pressure head 106 via a heating element 103 embedded therein. A pair of electrodes 107 connected to a power source can apply a voltage to the heating element 103 to generate a current flowing through it. The preheating process can last from several seconds to several minutes or even longer to allow the pressure head 106 to reach a predetermined temperature. In some embodiments, the predetermined temperature may be determined or adjusted based on the material and size of the pressure head 106, as well as the heating method and heating parameters, or some other factors. In the above embodiments, the predetermined temperature of the pressure head 106 is approximately 60°C to 70°C.

[0031] After the preheating step, the laser pressure bonding apparatus 100 can be switched to operation in the bonding process. Specifically, the substrate 105 can be placed on the carrier 111 of the laser pressure bonding apparatus 100. The pressure head 106 can pick up the electronic component 108 and move it to place it on the substrate 105 via the solder material 110. The electronic component 108 can then be pressed against the substrate 105 by the pressure head 106. The laser beam 114 can then be irradiated onto the carrier 111 from the light source 112 above the pressure head 106. The laser beam 114 can pass through the pressure head 106 and reach the electronic component 108 and the solder material 100 to heat them, thereby reflow soldering the solder material 110 and bonding the electronic component 108 to the substrate 105 via the solder material 110. Depending on the amount and composition of the solder material 110, the emission of the laser beam 114 can be configured or adjusted to supply sufficient energy to the solder material 110, which will not be described in detail hereafter. During laser irradiation, pressure can be applied to the electronic component 108 via the pressure head 106 to assist the bonding process. In one example, the laser source power is approximately 140W, with a beam size of 19×17mm. 2 .

[0032] Preheating the compression tool using a heating element effectively reduces damage to semiconductor packages, such as substrates, caused by excessive laser power during conventional preheating processes. Furthermore, compared to conventional laser heating, heating elements within the pressure head or tool reduce UPH (units per hour) because they offer better control over temperature variations and maintain process stability. Additionally, preheating by the heating element improves heat distribution on the pressure head, which helps prevent unwanted thermal stresses within the substrate being processed by the pressure head due to uneven heat distribution.

[0033] As described above, the heating element 103 is embedded within the pressure head 106, and in some examples, the heating element 103 may be formed on the pressure head 106 using a coating process or a similar process. These processes are easy to implement and can reduce the cost of integrating the heating element 103 into the pressure head 106.

[0034] Figures 2a to 2c A method for forming a preheatable pressure head according to an embodiment of this application is shown.

[0035] like Figure 2a As shown, a pressure head 206 is provided, for example, placed on a platform. The pressure head 206 may be made of a transparent material such as quartz, fused silica, sapphire, or ZnSe, which has low thermal conductivity, which is detrimental to dissipating heat accumulated in the pressure head 206 during the laser pressing process. The pressure head 206 has a groove pattern 204 recessed into its bottom surface, wherein the groove pattern 204 may be formed by methods such as micromachining, laser ablation, or chemical etching. In some embodiments, the groove pattern 204 has a depth in the range of 0.1 mm to 1 mm and a width in the range of 0.2 mm to 2 mm. Furthermore, the bottom surface of the pressure head 206 may be pre-treated with surface treatments, such as plasma etching or chemical oxidation, to enhance adhesion and compatibility with the electrically heatable material to be formed.

[0036] Next, the electrothermal material 203a is deposited on the bottom surface of the pressure head 206 and formed on the corresponding inner surface of the grooves in the groove pattern 204, the inner surface being slightly recessed from the bottom surface of the pressure head 206. In some embodiments, the electrothermal material 203a is deposited by dispensing a paste containing a mixture of carbon nanotubes and metal oxide particles (e.g., titanium oxide or chromium oxide). The paste is selectively dispensed onto the bottom and inner surfaces of the groove pattern 204 using a precision dispensing system or a screen printing process. Thus, the electrothermal material 203a can be uniformly distributed, with a thickness ranging from 10 to 50 micrometers. In other embodiments, the electrothermal material 203a can be deposited by sputtering or other suitable processes. The conditions of the sputtering process, such as the target material composition, chamber pressure, gas flow rate, and deposition time, can be adjusted and optimized as needed to achieve a uniform coating.

[0037] Next, as Figure 2b As shown, a portion of the electrically heated material formed on the bottom surface of the pressure head 206 is removed, while the electrically heated coating on the inner surface of the grooves of the groove pattern 204 is retained, to form a heating element 203, which may be discontinuous on the bottom surface of the pressure head 206. For example, the removal process can be achieved by polishing. Alternatively, mechanical scraping or laser ablation techniques can be used to selectively remove the electrically heated material from the bottom surface while retaining the coating in the groove pattern 204.

[0038] Next, as Figure 2cAs shown, the pressure head 206 is flip-up, and a pair of electrodes 207 can be mounted onto the pressure head 206 and connected to the heating element 203. The pair of electrodes 207 can be mounted at other locations on the pressure head 206, but it is desirable to ensure reliable contact and connection between the pair of electrodes 207 and the heating element 203 without damaging the pressure head 206. Following the above steps, a preheatable pressure head 206 is formed. The preheatable pressure head 206 can be assembled with other components of the laser pressure bonding apparatus.

[0039] The discussion herein includes numerous illustrative figures illustrating various parts of a laser pressure bonding apparatus and the laser pressure bonding method implemented therethrough. For clarity, such figures do not show all aspects of each exemplary method. Any of the example methods provided herein may share any or all characteristics with any or all other methods provided herein.

[0040] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and alterations can be made thereto, and additional embodiments can be implemented, without departing from the broader scope of the invention as set forth in the appended claims. Furthermore, other embodiments will be apparent to those skilled in the art upon consideration of practice of one or more embodiments of the invention disclosed herein. Therefore, the examples in this application and herein are intended to be considered exemplary only, and the true scope and spirit of the invention are indicated by the following list of exemplary claims.

Claims

1. A laser pressure bonding device, characterized in that, The laser pressure bonding device includes: A carrier configured to hold a substrate, wherein electronic components are placed on the substrate via soldering material; A pressure head having a bottom surface and configured to operably press the electronic component against the substrate via the soldering material at the bottom surface of the pressure head; A heating element, embedded within the pressure head and configured to preheat the pressure head before it presses the electronic component against the substrate; and A laser source configured to irradiate the carrier through the preheated pressure head after the pressure head has been preheated, so as to bond the electronic components to the substrate via the welding material when the electronic components are pressed against the substrate.

2. The laser pressure bonding device according to claim 1, characterized in that, The pressure head has a groove pattern located on the bottom surface of the pressure head and recessed into the pressure head, and the heating member is formed inside the groove pattern.

3. The laser pressure bonding apparatus according to claim 2, characterized in that, The heating element includes an electrically heatable coating deposited on the inner surface of the groove pattern.

4. The laser pressure bonding device according to claim 2, characterized in that, The groove pattern comprises multiple rows and columns that intersect each other.

5. The laser pressure bonding apparatus according to claim 2, characterized in that, The groove pattern is not formed on the bottom surface of the pressure head.

6. The laser pressure bonding apparatus according to claim 2, characterized in that, The heating element occupies less than 50% of the bottom area of ​​the pressure head.

7. The laser pressure bonding apparatus according to claim 2, characterized in that, The heating element is configured to preheat the pressure head to at least a predetermined temperature.

8. The laser pressure bonding apparatus according to claim 7, characterized in that, The predetermined temperature is 60°C to 70°C.

9. The laser pressure bonding apparatus according to claim 2, characterized in that, The pressure head includes at least one through-hole therethrough to apply vacuum pressure to the electronic component to carry the electronic component, and wherein the at least one through-hole is fluidly connected to the groove pattern.

10. A method for forming a preheatable pressure head, characterized in that, The method includes: A pressure head is provided, wherein the pressure head has a groove pattern located on its bottom surface and recessed into the pressure head; The electrically heatable material is deposited on the bottom surface of the pressure head and on the inner surface of the groove pattern; Remove the portion of the electrically heated material located on the bottom surface of the pressure head, and retain the portion of the electrically heated material located on the inner surface of the groove pattern as an electrically heated coating; and A pair of electrodes is mounted onto the pressure head and connected to the electrically heatable coating, such that the pressure head is preheated by the electrically heatable coating via a voltage source applied between the pair of electrodes.

11. The method according to claim 10, characterized in that, Depositing an electrically heatable material includes sputtering the electrically heatable material onto the pressure head.

12. The method according to claim 10, characterized in that, Depositing an electrically heating material involves coating a paste of the electrically heating material onto the pressure head.

13. The method according to claim 10, characterized in that, Mounting a pair of electrodes onto the pressure head includes attaching two conductive strips to the pressure head.

14. A laser pressure bonding method, characterized in that, The laser pressure bonding method includes: Place the substrate on the carrier; The pressure head is preheated to at least a predetermined temperature using a heating element embedded within it; Electronic components are pressed onto the substrate via soldering material using a preheated pressure head; and A laser beam generated by a laser source is passed through the preheated pressure head and irradiated onto the carrier to bond the electronic components to the substrate via the welding material.

15. The laser pressure bonding method according to claim 14, characterized in that, The pressure head has a groove pattern located on its bottom surface and recessed into the pressure head, and the heating element is formed inside the groove pattern.

16. The laser pressure bonding method according to claim 15, characterized in that, The heating element includes an electrically heatable coating deposited on the inner surface of the groove pattern.

17. The laser pressure bonding method according to claim 14, characterized in that, The predetermined temperature is 60°C to 70°C.

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