Electron beam deflection multi-source x-ray tomography apparatus and method

Abstract

A kind of electron beam deflection type multi-emitting point X tomography device and method, including stage, multi-angle X-ray generator and detector module, multi-angle X-ray generator is arranged at one side of stage and detector module is arranged at the other side of stage, stage carries the object to be detected and drives it to move, multi-angle X-ray generator includes multiple X-ray emitting points and emits X-ray to the imaging area of stage from different directions, detector module receives the X-ray emitted by each X-ray emitting point to imaging area, when the detection area of the object to be detected is driven into imaging area by moving unit, the X-ray emitted by these X-ray emitting points can pass through the detection area, so that detector module receives the X-ray passing through the detection area to obtain different angle detection area image, these detection area images can be used to construct the three-dimensional tomographic image of detection area;Therefore, the present application greatly shortens the overall imaging time, reduces the manufacturing cost of electron beam deflection type multi-emitting point X tomography device.

Description

Technical Field

[0001] This invention relates to an electron beam deflection multi-emission point X-ray tomography apparatus and method, and more particularly, to an electron beam deflection multi-emission point X-ray tomography apparatus and method for semiconductor detection. Background Technology

[0002] With the rapid development of technology, semiconductor components have been widely used in consumer electronics, communication equipment, electric vehicles, artificial intelligence, and high-performance computing, and are an indispensable core technology in various critical systems. As manufacturing processes continue to advance, the structure of semiconductor components is becoming increasingly complex. To maintain yield rates, effectively detecting internal structural defects and improving detection efficiency has become a crucial issue in semiconductor manufacturing and quality control. In conventional techniques, X-ray tomography (CT) scans can be used to detect the internal structure of semiconductor components.

[0003] Conventional X-ray computed tomography (CT) devices employ a configuration of a single X-ray emission point paired with a single two-dimensional detector. For flat semiconductor samples, there are two scanning methods: 1) fixing the X-ray emission point while simultaneously driving the semiconductor sample and detector to perform corresponding circular movements and acquire images at different positions; 2) fixing the semiconductor sample while simultaneously driving the X-ray source and detector to perform staggered circular movements and acquire images at different positions. In both scanning methods, structural images of a single specific region within the semiconductor sample at different angles can be obtained from different positions. These structural images at different angles can be used to reconstruct a three-dimensional tomographic image of that specific region, from which structural defects can be detected at that specific location. However, at any given time, conventional technology can only acquire a two-dimensional image of a single specific region of the sample from a single angle using a single set of two-dimensional detectors. To acquire images from other specific angles, the sample scanning mechanism must again drive the detector and semiconductor sample or X-ray emission point to perform the aforementioned movements to move to different angles before images of the same specific region from other angles can be acquired. Obtaining images of a single, specific region of a semiconductor sample from multiple angles requires repeating the aforementioned process. The constant waiting for the sample scanning mechanism to move and reposition significantly increases scanning time. Furthermore, semiconductor testing involves inspecting multiple regions of a single sample, not just a single region. The repeated movement and repositioning of the sample scanning mechanism further exacerbates this, significantly increasing both testing time and cost.

[0004] Therefore, there is an urgent need for a new type of X-ray tomography device to solve the problems of conventional technology. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide an electron beam deflection multi-emission point X-ray tomography device and method, which can overcome the defects of the prior art, significantly shorten the overall image generation time, and reduce the manufacturing cost of the electron beam deflection multi-emission point X-ray tomography device.

[0006] To achieve the above objectives, the present invention discloses an electron beam deflection type multi-emission point X-ray tomography device, characterized in that it comprises:

[0007] A stage includes a moving unit for carrying an object to be tested and moving the object to be tested, and the stage has an image acquisition area.

[0008] A multi-angle X-ray generator is disposed on one side of the stage. The multi-angle X-ray generator includes an electron beam emitter, an electron beam deflection module, and an X-ray generation target. The electron beam emitter emits an electron beam toward the X-ray generation target. The electron beam deflection module deflects the electron beam's propagation direction so that the electron beam enters different positions on the X-ray generation target, forming multiple X-ray emission points. These X-ray emission points emit X-rays from different directions toward the imaging area of ​​the stage.

[0009] A detector module is disposed on the other side of the stage. The detector module is used to receive the X-rays emitted by the X-ray emission points toward the imaging area.

[0010] The moving unit moves a detection area of ​​the object to be tested into the imaging area. The X-rays emitted by the X-ray emission points pass through the detection area of ​​the object to be tested, and the detector module receives the X-rays to obtain multiple images of the detection area of ​​the object to be tested from different angles.

[0011] The X-ray emission points are arranged on a first plane on one side of the stage, and a detection surface of the detector module is located on a second plane on the other side of the stage. The first plane and the second plane are parallel to each other.

[0012] The detector module's detection surface is divided into multiple sub-detection surfaces through physical or software partitioning. These sub-detection surfaces receive X-rays emitted from corresponding X-ray emission points toward the imaging area, thereby obtaining images of the detection area from different angles.

[0013] The device further includes a construction module for connecting to the detector module. The construction module is used to receive images of the areas to be detected from the detector module and construct a three-dimensional tomographic image of the area to be detected based on the images of the areas to be detected.

[0014] The construction module includes at least one artificial intelligence model, which is used to perform noise reduction processing on the images of the areas to be detected to generate a high-quality two-dimensional image, and to perform sparse solution three-dimensional reconstruction processing on the high-quality two-dimensional image to generate a full-view three-dimensional image, and to perform super-resolution processing on the full-view three-dimensional image to generate a high-resolution three-dimensional tomographic image. The training dataset used to train the at least one artificial intelligence model includes datasets of long-exposure images and short-exposure images of different sample types, datasets of a large number of skewed images and a small number of skewed images, and datasets of images captured by partitioning and not partitioning the imaging area.

[0015] The electron beam deflection module generates different magnetic or electromagnetic fields at different time points, so that the electron beam is incident on the X-ray generating target at different time points, corresponding to the positions of the X-ray emission points, so that the different X-ray emission points emit X-rays at different time points.

[0016] The detector module includes multiple detectors to receive the X-rays emitted from the X-ray emission points toward the imaging area and to obtain images of the area to be detected from different angles.

[0017] The X-ray emission points are arranged on a first plane on one side of the stage, and the detectors are arranged on a second plane on the other side of the stage, with the first and second planes being parallel to each other.

[0018] Among them, the X-ray emission points are arranged in at least one of the following: ring-shaped, linear, matrix-shaped, and non-uniform arrangement.

[0019] A method for multi-emission point X-ray tomography with electron beam deflection is also disclosed, characterized by comprising the following steps:

[0020] An object to be tested is placed on a moving unit of a stage, so that a test area of ​​the object to be tested is moved to an image acquisition area of ​​the stage;

[0021] Multiple X-ray emission points of a multi-angle X-ray generator emit X-rays from different directions toward the imaging area of ​​the stage; and

[0022] A detector receives X-rays from different directions passing through the imaging area and the object to be inspected, and obtains multiple images of the object to be inspected at different angles.

[0023] The X-ray emission points are arranged on a first plane on one side of the stage, and the at least one detector is arranged on a second plane on the other side of the stage, the first plane and the second plane being parallel to each other.

[0024] This further includes the following steps:

[0025] A construction module receives images of the areas to be detected from at least one detector and constructs a three-dimensional tomographic image of the area to be detected based on the images of the areas to be detected.

[0026] This further includes the following steps:

[0027] The module receives images of the areas to be detected generated by at least one detector, and performs noise reduction processing on the images of the areas to be detected using at least one artificial intelligence model in the module to generate a high-quality image. The high-quality image is then subjected to sparse solution three-dimensional reconstruction processing to generate a full-view image, and the full-view image is subjected to super-resolution processing to generate a high-resolution three-dimensional tomographic image.

[0028] The training dataset used to train the at least one artificial intelligence model includes datasets of long-exposure images and short-exposure images of different sample types, datasets of a large number of angled images and a small number of angled images, and datasets of images taken in sections and without sections of the image area.

[0029] This further includes the following steps:

[0030] An electron beam is emitted from an electron beam emitting end of the multi-angle X-ray generator; and

[0031] An electron beam deflection module of the multi-angle X-ray generator generates a magnetic field or an electromagnetic field to change the direction of the electron beam, so that the electron beam is incident on the positions of different X-ray emission points on an X-ray generation target, so that the X-ray generation target emits X-rays toward the imaging area of ​​the stage at the position where the electron beam is incident.

[0032] This further includes the following steps:

[0033] The electron beam deflection module generates different magnetic fields or electromagnetic fields at different time points, causing the electron beam to be incident on the X-ray generating target at different time points, corresponding to different X-ray emission points, so that different X-ray emission points emit X-rays at different time points.

[0034] In summary, the electron beam deflection multi-emission point X-ray tomography apparatus and method of the present invention can emit multiple X-rays from a single detection area of ​​the object under test from different angles through multiple X-ray emission points. On the other side, a detector with multiple sub-detection surfaces or multiple detectors corresponding to the X-ray emission points receive the X-rays passing through the detection area from different angles, thereby obtaining images of the detection area from multiple angles and reconstructing a three-dimensional tomographic image of the detection area. Therefore, the detection area only needs to be moved to the imaging area of ​​the stage to obtain two-dimensional images from multiple angles for reconstruction at once. Compared to conventional techniques that require movement and positioning before obtaining two-dimensional images from each angle, this significantly shortens the overall imaging time. Furthermore, by using electron beam deflection, one X-ray generator can produce multiple X-ray emission points with different emission angles, reducing the manufacturing cost of the electron beam deflection multi-emission point X-ray tomography apparatus. In conclusion, the electron beam deflection multi-emission point X-ray tomography apparatus and method of the present invention significantly saves detection time and has lower detection costs. Attached Figure Description

[0035] Figure 1 A schematic diagram of an electron beam deflection multi-emission point X-ray tomography apparatus according to a specific embodiment of the present invention is shown.

[0036] Figure 2 Showing Figure 1 A schematic diagram of an electron beam deflection multi-emission point X-ray tomography device for detecting an object to be tested.

[0037] Figure 3 Showing Figure 1 A schematic diagram of an electron beam deflection multi-emission point X-ray tomography device detecting the object to be tested from another angle.

[0038] Figure 4 A schematic diagram of an X-ray generator according to another specific embodiment of the present invention is shown.

[0039] Figure 5 A schematic diagram of an electron beam deflection multi-emission point X-ray tomography apparatus according to another specific embodiment of the present invention is shown.

[0040] Figure 6 Showing Figure 5 A schematic diagram of an electron beam deflection multi-emission point X-ray tomography device for detecting an object to be tested.

[0041] Figure 7 Showing Figure 5 A schematic diagram of an electron beam deflection multi-emission point X-ray tomography device detecting the object to be tested from another angle.

[0042] Figure 8A flowchart illustrating the steps of an electron beam deflection multi-emission point X-ray tomography method according to a specific embodiment of the present invention is shown.

[0043] Figure 9 A flowchart illustrating the steps of an electron beam deflection multi-emission point X-ray tomography method according to another specific embodiment of the present invention is shown.

[0044] Figure 10 A flowchart illustrating the steps of an electron beam deflection multi-emission point X-ray tomography method according to another specific embodiment of the present invention is shown. Detailed Implementation

[0045] To make the advantages, spirit, and features of the present invention easier and clearer to understand, detailed descriptions and discussions will follow with reference to specific embodiments and the accompanying drawings. It is important to note that these specific embodiments are merely representative examples of the present invention, and the specific methods, apparatuses, conditions, materials, etc., exemplified are not intended to limit the invention or the corresponding specific embodiments. Furthermore, the devices in the figures are only used to illustrate their relative positions and are not drawn to scale; this is to be stated beforehand.

[0046] In the description of this specification, references to terms such as "one embodiment," "another embodiment," or "part of an embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment is included in at least one embodiment of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments.

[0047] Please refer to the following: Figure 1 as well as Figure 2 , Figure 1 A schematic diagram of an electron beam deflection type multi-emission point X-ray tomography device 1 according to a specific embodiment of the present invention is shown. Figure 2 Showing Figure 1 A schematic diagram of an electron beam deflection multi-emission point X-ray tomography device 1 detecting the object 2 to be tested. (See diagram) Figure 1 As shown, the electron beam deflection multi-emission point X-ray tomography apparatus 1 of this specific embodiment includes a stage 10, a multi-angle X-ray generator 3, and a detector module 14, wherein the multi-angle X-ray generator 3 includes multiple X-ray emission points 12. Furthermore, as... Figure 2As shown, multiple X-ray emission points 12 are disposed on one side of the stage 10, while the detector module 14 is disposed on the other side of the stage 10. The detector module 14 has a detection surface 140, which is software-divided into multiple sub-detection surfaces 142, each sub-detection surface 142 corresponding to one of the multiple X-ray emission points 12. The stage 10 has a moving unit 100 and an imaging area 102. The X-ray emission points 12 emit X-rays towards the imaging area 102, and the X-rays pass through the imaging area 102 and reach the sub-detection surfaces 142 of the detector module 14, where they are received. Please note that... Figure 2 This is a two-dimensional side view of the electron beam deflection type multi-emission point X-ray tomography device 1, showing only two X-ray emission points 12 and the corresponding two sub-detection surfaces 142 viewed from one side. However, in practice, the number of X-ray emission points 12 and sub-detection surfaces 142 is not limited to this. Figure 2 The two shown are not limited to Figure 2 The setting location.

[0048] In this specific embodiment, the stage 10 can be used to support the flat object to be tested 2 on it, and the object to be tested 2 can be moved by the moving unit 100 (for the sake of simplicity in the drawings, Figure 2 (The moving unit is omitted). In practice, the object to be tested 2 can be, but is not limited to, a semiconductor wafer. The moving unit 100 can move the area 20 to be tested on the object to be tested 2 onto the imaging area 102 of the stage 10. At this time, as... Figure 2 The two X-ray emission points 12 shown can emit X-rays from different directions to the imaging area 102 of the stage 10, and pass through the imaging area 102 and the detection area 20 of the object to be inspected 2 located thereon. Then, the corresponding sub-detection surfaces 142 on the detector module 14 receive the X-rays from different directions and generate images of the detection area. These images of the detection area are two-dimensional images of the structure in the same detection area 20 from different angles. Therefore, the moving unit 100 only needs to move the object to be inspected 2 once to obtain two-dimensional structural images of a detection area 20 from multiple angles.

[0049] Please refer to again Figure 1 The electron beam deflection multi-emission point X-ray tomography device 1 further includes a construction module 16 connected to a detector module 14. This module receives images of the target area from different angles generated by the detector module 14 and reconstructs these two-dimensional structural images into three-dimensional tomographic images of the structure of the target area 20, for subsequent determination of whether there are defects in the structure of the target area 20. Furthermore, to prevent X-ray divergence from each X-ray emission point 12 from affecting other parts of the object 2 under test, the electron beam deflection multi-emission point X-ray tomography device 1 may further include a shield 18, such as... Figure 2As shown. The shield 18 has multiple openings corresponding to each X-ray emission point 12 and the imaging area 102, so that the X-rays emitted by each X-ray emission point 12 can only pass through the imaging area 102 and the area to be detected 20 thereon, and block other possible divergent parts of the X-rays, so as to avoid the X-rays affecting the parts of the object to be detected 2 other than the area to be detected 20 where the imaging is being performed, thereby reducing the exposure dose of the object to be detected 2.

[0050] As mentioned above, the number and location of X-ray emission points 12 and sub-detection surfaces 142 are not limited to... Figure 2 As shown, in practice, to obtain images of the area to be detected from more angles, X-ray emission points 12 can be set from various directions, and the detection surface 140 of the detector module 14 can be divided into corresponding sub-detection surfaces 142. Please refer to... Figure 3 , Figure 3 Showing Figure 1 This is a schematic diagram of an electron beam deflection multi-emission X-ray tomography device 1 detecting the object 2 at another angle. Please note that for the sake of simplicity, [the diagram is incomplete]. Figure 3 The stage 10 is omitted, and only the relative relationship between the X-ray emission point 12, the object to be detected 2, and the detector module 14 is shown. For example... Figure 3 As shown, the number of X-ray emission points 12 can be 12, with 11 X-ray emission points 12 arranged in a ring and one X-ray emission point 12 located in the center of the ring. The number of sub-detection surfaces 142 is also 12, with 11 sub-detection surfaces 142 also arranged in a ring and one sub-detection surface 142 located in the center of the ring, to receive the X-rays emitted by the corresponding X-ray emission points 12. Therefore, the moving unit 100 only needs to move the object to be detected 2 once to obtain two-dimensional structural images of the detection area 20 from 12 angles. Similarly, the number of X-ray emission points 12 and sub-detection surfaces 142 is not limited to... Figure 3 The 12 elements are not limited to a ring arrangement, but can be determined according to the needs of the user or designer. For example, they can also be arranged in a linear, matrix, non-uniform, or combination of the above arrangements.

[0051] In this specific embodiment, 12 X-ray emission points 12 are arranged in a ring on the first plane S1, while the sub-detection surfaces 142 of the detector module 14 are arranged in a ring on the second plane S2. The first plane S1 and the second plane S2 are parallel to each other and also parallel to the object to be detected 2. Due to the parallel arrangement, the distance from each X-ray emission point 12 to the object to be detected 2 is proportional to the vertical distance from each X-ray emission point 12 to the corresponding sub-detection surface 142. Therefore, the images of the area to be detected at different angles generated by each sub-detection surface 142 have the same magnification, and can be used to reconstruct three-dimensional tomographic images without magnification correction.

[0052] The aforementioned construction module 16's function of reconstructing three-dimensional tomographic images from two-dimensional images at different angles can be achieved by artificial intelligence. Please refer to [further details needed]. Figure 1 In this specific embodiment, the construction module 16 includes at least one artificial intelligence model 160. The artificial intelligence model 160 is used to perform noise reduction processing on these images to generate high-quality two-dimensional images, and to perform sparse resolution three-dimensional reconstruction processing on the high-quality two-dimensional images to generate full-view three-dimensional images. It can also perform super-resolution processing on the full-view three-dimensional images to generate high-resolution three-dimensional tomographic images. In practice, the process by which the artificial intelligence model 160 performs super-resolution processing on the full-view three-dimensional images to generate high-resolution three-dimensional tomographic images can specifically involve the artificial intelligence model re-slicing the full-view three-dimensional images into multi-layered two-dimensional distributed images, selecting necessary layers for super-resolution processing, and then generating high-resolution three-dimensional tomographic images. Performing super-resolution processing only on necessary layers, compared to performing super-resolution processing on all layers, further reduces the computational load of the artificial intelligence model 160, thereby improving efficiency. However, in practice, whether to perform super-resolution processing on the full-view three-dimensional images can be adjusted according to user needs. The training dataset used to train the artificial intelligence model 160 includes datasets of long-exposure images and short-exposure images of different sample types, datasets of a large number of angled images and a small number of angled images, and datasets of images taken in sections and without sections.

[0053] Since these training data sets contain a large number of two-dimensional images of the same detection area from different angles and the three-dimensional tomographic images reconstructed from them, as well as a small number of two-dimensional images from different angles and the three-dimensional tomographic images reconstructed from them, the trained artificial intelligence model is capable of simulating three-dimensional tomographic images reconstructed from a large number of two-dimensional images from different angles using a small number of two-dimensional images from different angles. Therefore, the electron beam deflection multi-emission point X-ray tomography device 1 can achieve the effect of generating high-resolution three-dimensional tomographic images from a large number of X-ray emission points 12 and sub-detection surfaces 142 by setting a relatively small number of X-ray emission points 12 and sub-detection surfaces 142 (e.g., the aforementioned 12).

[0054] Furthermore, the artificial intelligence model 160 may include an artifact removal model to generate high-resolution three-dimensional tomographic images by performing super-resolution processing on full-view 3D images. In other words, the artifact removal model can identify artifact structures based on the full-view 3D images and remove them to generate high-resolution three-dimensional tomographic images. The artifact removal model is trained based on a machine learning algorithm to learn the correspondence between a full-view 3D image constructed from T two-dimensional images of a standard object and a high-resolution three-dimensional tomographic image constructed from P two-dimensional images, where P > T. That is, this invention can generate high-resolution three-dimensional tomographic images from a smaller number of images of the object to be detected using the artifact removal model, thereby reducing the number of images required, shortening the detection time, and improving overall imaging efficiency and accuracy.

[0055] like Figure 1 As shown, multiple X-ray emission points 12 located at different positions can be generated by a multi-angle X-ray generator 3 in this specific embodiment. Please refer to... Figure 4 , Figure 4 Showing Figure 1 A detailed schematic diagram of the multi-angle X-ray generator 3 is provided. In this specific embodiment, the multi-angle X-ray generator 3 may include an electron beam emitting end 30, an electron beam deflection module 32, and an X-ray generating target 34. The electron beam emitting end 30 emits an electron beam 300 toward the X-ray generating target 34, and the X-ray generating target 34 receives the electron beam 300 and emits X-rays 340 outward from the other side of the receiving point. The X-ray generating target 34 may be a flat plate design and may be located on the aforementioned first plane S1. In practice, the electron beam deflection module 32 may be a magnetic field generating module or an electromagnetic field generating module, used to generate a magnetic field or electromagnetic field in the multi-angle X-ray generator 3. When the electron beam deflection module 32 is not activated, the electron beam 300 emitted by the electron beam emitting end 30 will be incident straight onto the X-ray generating target 34. However, when the electron beam deflection module 32 is activated and generates a magnetic field or electromagnetic field, the forward direction of the electron beam 300 is affected by the magnetic field or electromagnetic field and deflected, thus incident on other positions of the X-ray generating target 34, such as... Figure 4 As shown. By controlling the magnetic or electromagnetic fields generated by the electron beam deflection module 32, the position of the electron beam 300 incident on the X-ray generating target 34 can be further controlled, and these positions are the positions of the aforementioned X-ray emission points 12. For example, by generating 12 different magnetic or electromagnetic fields, the electron beam 300 can be incident on 12 positions arranged in a ring on the X-ray generating target 34 to form the 12 X-ray emission points 12 in the aforementioned specific embodiment. In addition, by adjusting more or fewer different magnetic or electromagnetic fields, the number and position of the X-ray emission points 12 can also be controlled to obtain images of the detection area with different numbers and angles.

[0056] In this specific embodiment, the electron beam deflection module 32 of the multi-angle X-ray generator 3 can generate different magnetic or electromagnetic fields at different time points, causing the electron beam 300 emitted from the electron beam emitting end 30 to be deflected in different directions at different time points and incident on different positions of the X-ray generating target 34 (i.e., the positions of the X-ray emitting points 12). This allows the aforementioned multiple X-ray emitting points 12 to emit X-rays separately according to different times. In other words, within a certain time point, only one direction of X-rays passes through and images the detection area 20 of the object to be detected 2. However, the present invention is not limited to this. In practice, the multi-angle X-ray generator 3 may also have multiple electron beam emitting ends 30 in conjunction with one or more electron beam deflection modules 32, so that multiple electron beams, in conjunction with magnetic or electromagnetic field deflection, simultaneously incident on multiple different positions of the X-ray generating target 34, allowing the aforementioned multiple X-ray emitting points 12 to simultaneously emit X-rays that pass through the detection area 20 and image.

[0057] In the aforementioned specific embodiment, multiple sub-detection surfaces 142 of the detector module 14 respectively receive X-rays emitted from multiple X-ray emission points 12 from different directions. However, when the X-rays have a large deflection angle, multiple detectors can also capture images separately. Please refer to... Figures 5 to 7 , Figure 5 A schematic diagram of an electron beam deflection type multi-emission point X-ray tomography device 1 according to another specific embodiment of the present invention is shown. Figure 6 Showing Figure 5 A schematic diagram of an electron beam deflection multi-emission point X-ray tomography device 1 detecting the object to be tested 2. Figure 7 Showing Figure 5 A schematic diagram of an electron beam deflection multi-emission point X-ray tomography device 1 detecting the object 2 at another angle. (See diagram) Figures 5 to 7 As shown, the difference between this specific embodiment and the previous specific embodiments lies in that the detector module of the electron beam deflection multi-emission point X-ray tomography device 1 in this specific embodiment has multiple detectors 14', each detector 14' corresponding to the position of each X-ray emission point 12, and is used to receive X-rays emitted from different X-ray emission points 12. Please note that the other units of the electron beam deflection multi-emission point X-ray tomography device 1 in this specific embodiment, including the multi-angle X-ray generator 3, are the same as the units corresponding to the previous specific embodiments, and therefore will not be described again here.

[0058] Each detector 14' can also be disposed on the second plane S2, just like the sub-detection surface 142 in the aforementioned specific embodiment. In other words, the distance from each X-ray emission point 12 to the object to be detected 2 is proportional to the vertical distance from each X-ray emission point 12 to the corresponding detector 14'. Therefore, the images of the area to be detected at different angles generated by each detector 14' have the same magnification, and can be used to reconstruct three-dimensional tomographic images without magnification correction.

[0059] Please see Figure 8 , Figure 8 A flowchart illustrating the steps of an electron beam deflection multi-emission point X-ray tomography method according to a specific embodiment of the present invention is shown. Please note that... Figure 5 The method can be achieved by the electron beam deflection multi-emission point X-ray tomography device 1 of the aforementioned specific embodiment. Therefore, the steps of the electron beam deflection multi-emission point X-ray tomography method are described below by each unit in the electron beam deflection multi-emission point X-ray tomography device 1.

[0060] like Figure 8 As shown, the electron beam deflection multi-emission point X-ray tomography method of this specific embodiment includes the following steps: Step S40, the object to be tested 2 is placed on the moving unit 100 of the stage 10, so that the area to be tested 20 of the object to be tested 2 is moved into the imaging area 102 of the stage 10; Step S42, multiple X-ray emission points 12 of the multi-angle X-ray generator 3 emit X-rays from different directions toward the imaging area 102 of the stage 10; Step S44, a single detector (such as the aforementioned detector module 14 with multiple sub-detection surfaces 142) or multiple detectors 14' respectively receive the X-rays passing through the imaging area 102 and the area to be tested 20 of the object to be tested 2 from different directions, and obtain multiple images of the area to be tested 20 at different angles. The multiple images of the area to be tested obtained by the method of this specific embodiment are two-dimensional images, which can be used to reconstruct the three-dimensional tomographic image of the area to be tested 20, thereby determining whether there are structural defects in the area to be tested 20. Therefore, the method of this specific embodiment further includes step S46: receiving the images of the areas to be detected from the detection module 14 or the detector 14' using the construction module 16, and constructing a three-dimensional tomographic image of the area 20 to be detected of the object to be detected 2 based on the images of the areas to be detected. As mentioned above, in step S44, X-rays can be received and imaged by multiple detectors 14' set corresponding to each X-ray emission point 12, or X-rays can be received and imaged by multiple sub-detection surfaces 142 divided by a detection module 14.

[0061] In practice, for objects under inspection, especially semiconductor wafers, it may be necessary to inspect multiple areas for structural defects to determine yield. For multiple areas to be inspected, the steps of the method in this specific embodiment can be repeated to obtain three-dimensional tomographic images of each area. Thus, the inspection of each area only requires one movement and positioning to obtain images from multiple angles, significantly saving inspection time.

[0062] Similarly, the electron beam deflection multi-emission point X-ray tomography method of the present invention, which reconstructs multiple two-dimensional structural images from different angles into three-dimensional tomographic images using a construction module, can also be achieved by an artificial intelligence module. Please refer to Figure 9 , Figure 9A flowchart illustrating the steps of an electron beam deflection multi-emission point X-ray tomography method according to another specific embodiment of the present invention is shown. Figure 9 As shown, the difference between this specific embodiment and the previous specific embodiment lies in that the method of this specific embodiment includes step S460: receiving the images of the areas to be detected by the construction module 16 from the detection module 14 or the detector 14', performing noise reduction processing on the images of the areas to be detected by the artificial intelligence model 160 in the construction module 16 to generate high-quality images, performing sparse de-3D reconstruction processing on the high-quality images to generate full-view images, and performing super-resolution processing on the full-view images to generate high-resolution 3D tomographic images. Please note that the other steps of the method in this specific embodiment are largely the same as the steps corresponding to the aforementioned specific embodiments, and therefore will not be repeated here.

[0063] As mentioned earlier, multiple X-ray emission points used for detection can be generated by a single X-ray generator. Please refer to... Figure 10 , Figure 10 A flowchart illustrating the steps of an electron beam deflection multi-emission point X-ray tomography method according to another specific embodiment of the present invention is shown. Figure 7 As shown, the difference between this specific embodiment and the aforementioned specific embodiment lies in that the method of this specific embodiment further includes the following steps: step S420, emitting an electron beam 300 from the electron beam emitting end 30 of the multi-angle X-ray generator 3; and step S422, generating a magnetic field or electromagnetic field with the electron beam deflection module 32 to change the forward direction of the electron beam 300, causing the electron beam 300 to be incident on different positions on the X-ray generating target 34, so that the X-ray generating target 34 emits X-rays towards the imaging area 102 of the stage 10 at the position where the electron beam 300 is incident. The position where the electron beam 300 is incident on the X-ray generating target 34 due to the change in forward direction caused by the magnetic field or electromagnetic field is the position of the aforementioned X-ray emission point 12. Therefore, in step S422, changing the magnetic field or electromagnetic field at different time points can change the incident position of the electron beam 300, that is, change the position of the X-ray emission point 12, so that different X-ray emission points emit X-rays at different time points. Please note that the other steps of the method in this specific embodiment are largely the same as those in the aforementioned specific embodiments, and therefore will not be repeated here.

[0064] In summary, the electron beam deflection multi-emission point X-ray tomography apparatus and method of the present invention utilizes multiple X-ray emission points in conjunction with multiple detectors to directly acquire two-dimensional structural images of a single detection area from multiple angles while the stage moves and the object to be detected is positioned once, and then reconstructs these images to obtain a three-dimensional tomographic image, significantly shortening the overall image acquisition time. Furthermore, by using electron beam deflection, a single X-ray generator can produce multiple X-ray emission points with different emission angles, reducing manufacturing costs. Moreover, by utilizing an artificial intelligence model, high-resolution three-dimensional tomographic images can be generated from a small number of two-dimensional images of the object to be detected from different angles, which not only improves efficiency and image accuracy but also effectively reduces the number of X-ray emission points and detectors required for reconstructing the three-dimensional tomographic image.

[0065] The detailed description of the preferred embodiments above is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the invention to the preferred embodiments disclosed above. Rather, the aim is to cover various modifications and equivalent arrangements within the scope of the patent claims made by this invention. Therefore, the scope of the patent claims made by this invention should be interpreted in the broadest possible sense based on the foregoing description, so as to cover all possible modifications and equivalent arrangements.

Claims

1. An electron beam deflection type multi-emission point X-ray tomography device, characterized in that... Include: A stage includes a moving unit for carrying an object to be tested and moving the object to be tested, and the stage has an image acquisition area. A multi-angle X-ray generator is disposed on one side of the stage. The multi-angle X-ray generator includes an electron beam emitter, an electron beam deflection module, and an X-ray generation target. The electron beam emitter emits an electron beam toward the X-ray generation target. The electron beam deflection module deflects the electron beam's propagation direction so that the electron beam enters different positions on the X-ray generation target, forming multiple X-ray emission points. These X-ray emission points emit X-rays from different directions toward the imaging area of ​​the stage. A detector module is disposed on the other side of the stage. The detector module is used to receive the X-rays emitted by the X-ray emission points toward the imaging area. The moving unit moves a detection area of ​​the object to be tested into the imaging area. The X-rays emitted by the X-ray emission points pass through the detection area of ​​the object to be tested, and the detector module receives the X-rays to obtain multiple images of the detection area of ​​the object to be tested from different angles.

2. The electron beam deflection type multi-emission point X-ray tomography device as described in claim 1, characterized in that, The X-ray emission points are arranged on a first plane on one side of the stage, and a detection surface of the detector module is located on a second plane on the other side of the stage. The first plane and the second plane are parallel to each other.

3. The electron beam deflection type multi-emission point X-ray tomography device as described in claim 2, characterized in that, The detector module's detection surface is divided into multiple sub-detection surfaces through physical or software partitioning. These sub-detection surfaces receive X-rays emitted from corresponding X-ray emission points toward the imaging area, thereby obtaining images of the detection area from different angles.

4. The electron beam deflection type multi-emission point X-ray tomography device as described in claim 1, characterized in that, It further includes a construction module for connecting to the detector module, the construction module being used to receive the images of the areas to be detected from the detector module, and to construct a three-dimensional tomographic image of the area to be detected of the object to be detected based on the images of the areas to be detected.

5. The electron beam deflection type multi-emission point X-ray tomography device as described in claim 4, characterized in that, The construction module includes at least one artificial intelligence model, which is used to perform noise reduction processing on the images of the areas to be detected to generate a high-quality two-dimensional image, and to perform sparse solution three-dimensional reconstruction processing on the high-quality two-dimensional image to generate a full-view three-dimensional image, and to perform super-resolution processing on the full-view three-dimensional image to generate a high-resolution three-dimensional tomographic image. The training dataset used to train the at least one artificial intelligence model includes datasets of long-exposure images and short-exposure images of different sample types, datasets of a large number of skewed images and a small number of skewed images, and datasets of images captured by partitioning and not partitioning the imaging area.

6. The electron beam deflection type multi-emission point X-ray tomography device as described in claim 1, characterized in that, The electron beam deflection module generates different magnetic or electromagnetic fields at different time points, so that the electron beam is incident on the X-ray generating target at different time points corresponding to the positions of the X-ray emission points, so that the different X-ray emission points emit X-rays at different time points.

7. The electron beam deflection type multi-emission point X-ray tomography device as described in claim 1, characterized in that, The detector module contains multiple detectors, which are used to receive the X-rays emitted by the X-ray emission points toward the imaging area, and to obtain images of the areas to be detected from different angles.

8. The electron beam deflection type multi-emission point X-ray tomography device as described in claim 7, characterized in that, The X-ray emission points are arranged on a first plane on one side of the stage, and the detectors are arranged on a second plane on the other side of the stage, the first plane and the second plane being parallel to each other.

9. The electron beam deflection type multi-emission point X-ray tomography device as described in claim 1, characterized in that, These X-ray emission points are arranged in at least one of the following: ring-shaped, linear, matrix-shaped, and non-uniform arrangement.

10. A method for multi-emission point X-ray tomography using electron beam deflection, characterized in that... Includes the following steps: An object to be tested is placed on a moving unit of a stage, so that a test area of ​​the object to be tested is moved to an image acquisition area of ​​the stage; Multiple X-ray emission points of a multi-angle X-ray generator emit X-rays from different directions toward the imaging area of ​​the stage; and A detector receives X-rays from different directions passing through the imaging area and the object to be inspected, and obtains multiple images of the object to be inspected at different angles.

11. The electron beam deflection multi-emission point X-ray tomography method as described in claim 10, characterized in that, The X-ray emission points are arranged on a first plane on one side of the stage, and the at least one detector is arranged on a second plane on the other side of the stage, the first plane and the second plane being parallel to each other.

12. The electron beam deflection multi-emission point X-ray tomography method as described in claim 10, characterized in that, Further steps include: A construction module receives images of the areas to be detected from at least one detector and constructs a three-dimensional tomographic image of the area to be detected based on the images of the areas to be detected.

13. The electron beam deflection multi-emission point X-ray tomography method as described in claim 12, characterized in that, Further steps include: The module receives images of the areas to be detected generated by at least one detector, and performs noise reduction processing on the images of the areas to be detected using at least one artificial intelligence model in the module to generate a high-quality image. The high-quality image is then subjected to sparse solution three-dimensional reconstruction processing to generate a full-view image, and the full-view image is subjected to super-resolution processing to generate a high-resolution three-dimensional tomographic image. The training dataset used to train the at least one artificial intelligence model includes datasets of long-exposure images and short-exposure images of different sample types, datasets of a large number of angled images and a small number of angled images, and datasets of images taken in sections and without sections of the image area.

14. The electron beam deflection multi-emission point X-ray tomography method as described in claim 10, characterized in that, Further steps include: An electron beam is emitted from an electron beam emitting end of the multi-angle X-ray generator; and An electron beam deflection module of the multi-angle X-ray generator generates a magnetic field or an electromagnetic field to change the direction of the electron beam, so that the electron beam is incident on the positions of different X-ray emission points on an X-ray generation target, so that the X-ray generation target emits X-rays toward the imaging area of ​​the stage at the position where the electron beam is incident.

15. The electron beam deflection multi-emission point X-ray tomography method as described in claim 14, characterized in that, Further steps include: The electron beam deflection module generates different magnetic fields or electromagnetic fields at different time points, causing the electron beam to be incident on the X-ray generating target at different time points, corresponding to different X-ray emission points, so that different X-ray emission points emit X-rays at different time points.

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