Test fixture for manufacturing integrated optoelectronic device
By designing test fixtures for optoelectronic devices, using drive shafts and bevel gears to drive chip clamping assembly and probe adjustment, the flexibility of multi-electrode structure chip testing is solved, and stable clamping of chips of different types and sizes is achieved Holding and probe position adjustment improves test flexibility and accuracy.
Patent Information
- Application Number
- CN202420592424.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2024-12-06
- Estimated Expiration
- 2034-03-26
AI Technical Summary
It is difficult to effectively test optoelectronic chips with multiple electrode structures, especially resonant cavity enhancement detectors and tunable semiconductor lasers. It is inconvenient to independently adjust the probe structure of multiple electrode structures.
A test fixture for the manufacture of integrated optoelectronic devices is designed, including mounting box, support seat, test base, connecting shaft, adjustment gear, bevel gear, transmission shaft and chip clamping assembly, to drive the umbrella through the transmission shaft The gears and adjustment gears rotate to achieve movement and positioning of multiple sets of chip clamping components, and adjust the probe position through the articulated adjustment rod and compression spring.
It realizes stable clamping and probe position adjustment of different types and sizes of optoelectronic chips, improves testing flexibility and accuracy, and is suitable for testing of multiple types of optoelectronic chips.
Smart Images
Figure CN222125322U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor testing, in particular to a testing fixture for manufacturing integrated optoelectronic devices. Background Art
[0002] Semiconductor optoelectronic devices, such as lasers, photodetectors, modulators and optical amplifiers, are the core devices of modern fiber-optic communications. Accurate testing of semiconductor optoelectronic chips is an important reference for chip preparation, establishment of equivalent circuit models and package design. Since semiconductor optoelectronic chips are very small, in order to facilitate testing and prevent damage to the chip, people often use gold wire to connect the electrodes on the chip to the gold-plated microcrystalline glass before testing. In this way, the chip can be loaded with signals by pressing the probe on the microcrystalline glass during testing. For the simplest and most common semiconductor optoelectronic chip with a non-coplanar dual-electrode structure, it is generally placed on a conductive metal carrier during testing, and the lower electrode of the chip is used as the ground electrode. The signal of the upper electrode is loaded by applying the probe fixed on the fine-tuning frame to the microcrystalline glass connected to it.
[0003] At present, the functions of optoelectronic devices are becoming more and more perfect, and their electrode structures are becoming more and more diverse. For example, for resonant cavity enhanced detectors, temperature control electrodes are required in addition to signal electrodes; for tunable semiconductor lasers, electrodes for adjusting amplitude and phase are also required. For optoelectronic chips with multiple electrode structures, it is very inconvenient to use an independently adjusted probe structure corresponding to each electrode during the test process. For this reason, we propose a test fixture for manufacturing integrated optoelectronic devices to solve the above problems. Utility Model Content
[0004] In view of the deficiencies of the prior art, the utility model provides a test fixture for manufacturing integrated optoelectronic devices, which solves the problems raised in the above background technology.
[0005] To achieve the above objectives, the utility model is implemented through the following technical solutions: a test fixture for manufacturing integrated optoelectronic devices, comprising an installation box, a protective top cover is fixedly installed on the top of the installation box, a support seat is fixedly installed inside the installation box, and a test base is arranged on the top of the support seat, a connecting shaft located in the middle of the support seat is movably installed on the inner side of the installation box, and an adjusting gear is fixedly sleeved on the top of the connecting shaft, a bevel gear 1 is fixedly sleeved on the outside of the connecting shaft, a transmission shaft is movably installed on the installation box, and a bevel gear 2 matching the bevel gear 1 is fixedly sleeved on the end of the transmission shaft, a plurality of chip clamping assemblies for clamping optoelectronic chips are arranged on the top of the support seat, a probe adjustment assembly is arranged on one side of the top of the protective top cover, and the probe adjustment assembly includes a probe for testing the optoelectronic chip.
[0006] Preferably, one end of the transmission shaft is inserted into the middle of the support seat, the bevel gear 2 at one end of the transmission shaft is located below the bevel gear 1, and the outer edge of the bevel gear 2 is meshed with the bevel gear 1.
[0007] Preferably, there are four chip clamping assemblies, and the four chip clamping assemblies are located around the test base. The chip clamping assemblies include a transmission rack, a transmission arm, a connecting back plate, an adjusting screw, and a locking plate. The transmission rack is clamped on the top of the support base.
[0008] Preferably, the transmission rack is located outside the adjusting gear, and the transmission rack and the adjusting gear are in the same plane, and the transmission rack and the adjusting gear are meshed with each other.
[0009] Preferably, one end of the transmission rack away from the adjusting gear is fixedly connected to a transmission arm, and the end of the transmission arm is fixedly connected to a connecting back plate, an adjusting screw is threadedly connected to the connecting back plate, and the end of the adjusting screw is movably connected to a locking plate.
[0010] Preferably, the probe adjustment assembly includes a mounting seat, a slide seat, an adjustment rod 1, an adjustment rod 2, a probe, a locking knob, and a compression spring. The mounting seat is fixedly mounted on the top of the protective top cover, and a slide seat is movably mounted on the mounting seat.
[0011] Preferably, an ear plate is provided on one side of the slide seat, and the slide seat is hinged with an adjusting rod 1 through the ear plate, an adjusting rod 2 is hinged at one end of the adjusting rod 1, and a probe is fixedly sleeved on the end of the adjusting rod 2, a locking knob is threadedly connected at the connection between the adjusting rod 2 and the adjusting rod 1, a locking knob is threadedly connected at the connection between the adjusting rod 1 and the ear plate, and a compression spring is movably sleeved on the mounting seat and located above the slide seat.
[0012] The utility model provides a test fixture for manufacturing integrated optoelectronic devices, which has the following
[0013] Beneficial effects:
[0014] 1. The test fixture for manufacturing integrated optoelectronic devices, the probe is installed on the slide seat through the hinged adjustment rod 2 and the adjustment rod 1, and the position of the probe can be adjusted by adjusting the angles of the adjustment rod 1 and the adjustment rod 2, so that the electrodes at different positions of the probe optoelectronic chip can be tested, so that the fixture can be widely used in different types of optoelectronic chip testing. In addition, after the probe position is adjusted, the slide seat and the probe are applied with elastic force by compressing the spring, so that the probe can be stably pressed at the chip test position.
[0015] 2. The test fixture for manufacturing integrated optoelectronic devices drives bevel gear 2, bevel gear 1 and adjusting gear to rotate through a transmission shaft, thereby driving multiple sets of chip clamping components to move. The multiple sets of chip clamping components cooperate with each other to clamp and position the optoelectronic chip, thereby ensuring the stability of the chip during testing. At the same time, the position of the locking plate is adjusted by rotating the adjusting screw according to the chip size, so that chips of different sizes can be positioned, increasing the scope of application. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the structure of the utility model after overall assembly;
[0017] Figure 2 This is a schematic diagram of the structure inside the installation box of the utility model;
[0018] Figure 3 This is a schematic diagram of the structure of the top of the support seat of the utility model;
[0019] Figure 4 This is a schematic structural diagram of the cross section of the support seat of the utility model;
[0020] Figure 5 This is a schematic diagram of the structure of the chip clamping assembly of the utility model;
[0021] Figure 6 It is a structural schematic diagram of the probe adjustment component of the utility model.
[0022] In the figure: 1. Installation box; 2. Protective top cover; 3. Support seat; 4. Test base; 5. Connecting shaft; 6. Adjusting gear; 7. Chip clamping assembly; 71. Transmission rack; 72. Transmission arm; 73. Connecting back plate; 74. Adjusting screw; 75. Locking plate; 8. Bevel gear one; 9. Bevel gear two; 10. Transmission shaft; 11. Probe adjustment assembly; 111. Mounting seat; 112. Sliding seat; 113. Adjusting rod one; 114. Adjusting rod two; 115. Probe; 116. Locking knob; 117. Compression spring. DETAILED DESCRIPTION
[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0024] See also Figure 1 , 23. The utility model provides a technical solution: a test fixture for manufacturing integrated optoelectronic devices, comprising an installation box 1, a protective top cover 2 is fixedly installed on the top of the installation box 1, a support seat 3 is fixedly installed inside the installation box 1, and a test base 4 is arranged on the top of the support seat 3, a connecting shaft 5 located in the middle of the support seat 3 is movably installed on the inner side of the installation box 1, and an adjusting gear 6 is fixedly sleeved on the top of the connecting shaft 5, when the adjusting gear 6 rotates, multiple groups of transmission racks 71 can be synchronously driven to move, so as to achieve synchronous adjustment of multiple groups of chip clamping assemblies 7, an outer fixed sleeve of the connecting shaft 5 is provided with a bevel gear 1 8, a transmission shaft 10 is movably installed on the installation box 1, and a bevel gear 2 9 matching the bevel gear 1 8 is fixedly sleeved on the end of the transmission shaft 10, and the bevel gear 2 9 and the bevel gear 1 8 and the adjusting gear 6 are driven by the transmission shaft 10. The wheel 6 rotates, thereby driving the multiple groups of chip clamping assemblies 7 to move. The multiple groups of chip clamping assemblies 7 cooperate with each other to clamp and position the optoelectronic chip, thereby ensuring the stability of the chip during testing. The top of the support seat 3 is provided with a plurality of chip clamping assemblies 7 that can clamp the optoelectronic chip. Through the cooperation of the multiple groups of chip clamping assemblies 7, the chip to be tested can be clamped on all sides to ensure the stability of the chip during testing. A probe adjustment assembly 11 is provided on one side of the top of the protective top cover 2, and the probe adjustment assembly 11 includes a probe 115 that can test the optoelectronic chip. The probe 115 is installed on the slide seat 112 through a hinged adjustment rod 114 and an adjustment rod 113. The position of the probe 115 can be adjusted by adjusting the angles of the adjustment rod 113 and the adjustment rod 114, so that the electrodes at different positions of the optoelectronic chip of the probe 115 can be tested.
[0025] See also Figure 3 , 4 One end of the transmission shaft 10 is passed through the middle of the support seat 3, and the support seat 3 can provide auxiliary support for the transmission shaft 10 to ensure the stability of the transmission shaft 10 during rotation and adjustment. The bevel gear 29 at one end of the transmission shaft 10 is located below the bevel gear 18, and the outer edge of the bevel gear 29 is meshed with the bevel gear 18. The transmission is carried out through the bevel gear 29 and the bevel gear 18 to ensure that the transmission shaft 10 can drive the adjustment gear 6 to rotate, thereby realizing the adjustment of the position of the chip clamping assembly 7.
[0026] See also Figure 4 , 5, the number of chip clamping assemblies 7 is four groups, and the four groups of chip clamping assemblies 7 are located around the test base 4. Through the cooperation of multiple groups of chip clamping assemblies 7, the chip to be tested can be clamped around to ensure the stability of the chip during testing. The chip clamping assembly 7 includes a transmission rack 71, a transmission arm 72, a connecting back plate 73, an adjusting screw 74, and a locking plate 75. The transmission rack 71 is clamped on the top of the support base 3. The top of the support base 3 is provided with a card slot that cooperates with the transmission rack 71 to ensure the stability of the transmission rack 71 when moving. The transmission rack 71 is located on the outside of the adjusting gear 6. When the adjusting gear 6 rotates, it can synchronously drive the multiple groups of transmission racks 71 to move, thereby realizing the synchronous adjustment of the multiple groups of chip clamping assemblies 7, and the transmission rack 71 and the adjusting gear 6 are in the same plane. The transmission rack 71 and the adjusting gear 6 are meshed with each other, and the adjusting gear 6 is driven to rotate through the transmission shaft 10, which can drive the transmission rack 71 to move, and realize the adjustment of the position of the transmission arm 72 and the locking plate 75, thereby realizing the chip clamping and locking.
[0027] The end of the transmission rack 71 away from the adjusting gear 6 is fixedly connected to a transmission arm 72, and the end of the transmission arm 72 is fixedly connected to a connecting back plate 73. The transmission shaft 10 drives the bevel gear 2 9 and the bevel gear 1 8 and the adjusting gear 6 to rotate, thereby driving multiple groups of chip clamping assemblies 7 to move. The multiple groups of chip clamping assemblies 7 cooperate with each other to clamp and position the optoelectronic chip to ensure the stability of the chip during testing. An adjusting screw 74 is threadedly connected to the connecting back plate 73, and the end of the adjusting screw 74 is movably connected to a locking plate 75. After the position of the transmission arm 72 is adjusted, the adjusting screw 74 is rotated to adjust the position of the locking plate 75 according to the chip size, so as to achieve positioning of chips of different sizes and increase the scope of application.
[0028] See also Figure 1 , 6 The probe adjustment assembly 11 includes a mounting seat 111, a slide 112, an adjustment rod 113, an adjustment rod 114, a probe 115, a locking knob 116, and a compression spring 117. The mounting seat 111 is fixedly mounted on the top of the protective top cover 2, and the slide 112 is movably mounted on the mounting seat 111. The probe 115 is mounted on the slide 112 through the hinged adjustment rod 114 and the adjustment rod 1 113. By adjusting the angles of the adjustment rod 1 113 and the adjustment rod 1 114, the position of the probe 115 can be adjusted, so that the electrodes at different positions of the optoelectronic chip of the probe 115 can be tested.
[0029] An ear plate is provided on one side of the slide 112, and the slide 112 is hinged with an adjusting rod 113 through the ear plate, and an adjusting rod 2 114 is hinged at one end of the adjusting rod 113, and a probe 115 is fixedly sleeved on the end of the adjusting rod 2 114, and a locking knob 116 is threadedly connected at the connection between the adjusting rod 2 114 and the adjusting rod 1 113, and a locking knob 116 is threadedly connected at the connection between the adjusting rod 1 113 and the ear plate. When the positions of the adjusting rod 1 113 and the adjusting rod 2 114 are adjusted, the locking knob 116 can be rotated to lock the adjusting rod 1 113 with the ear plate and the adjusting rod 2 114, so as to ensure the stable position of the probe 115, and a compression spring 117 located above the slide 112 is movably sleeved on the mounting seat 111. After the position of the probe 115 is adjusted, the compression spring 117 applies elastic force to the slide 112 and the probe 115, so that the probe 115 can be stably pressed and held in the chip testing position.
[0030] In summary, when the test fixture for manufacturing integrated optoelectronic devices is used, the signal source connected to the probe 115 is turned off, the optoelectronic chip is placed on the top of the test base 4, and the transmission shaft 10 is rotated to drive the bevel gear 2 9 and the bevel gear 1 8 to rotate, thereby driving the adjustment gear 6 to rotate, driving the transmission rack 71 in the multiple groups of chip clamping assemblies 7 to move synchronously, thereby driving the multiple groups of transmission arms 72 and locking plates 75 to move. When any two groups of locking plates 75 clamp the two sides of the chip, stop rotating the transmission shaft 10, and then rotate the other two groups of adjustment screws 74 to The other two sets of locking plates 75 clamp the other two sides of the chip. Through the cooperation of the transmission arm 72 that is adjusted once and the locking plate 75 that is adjusted twice, chips of different sizes can be clamped. After the chip is positioned, the locking knob 116 is rotated to release the restriction on the position of the probe 115, and the probe 115 is pulled to the electrode of the chip to be tested. Then the locking knob 116 is rotated to lock the position of the probe 115. The locking knob 116 is pressed against the chip test electrode by the elastic force of the compressed spring 117, and the loading signal is adjusted to test the performance of the optoelectronic chip.
[0031] In the description of the present utility model, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model; the terms "first", "second", and "third" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article, or apparatus.
[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A test fixture for manufacturing integrated optoelectronic devices, comprising a mounting box (1), a protective top cover (2) being fixedly mounted on the top of the mounting box (1), characterized in that: A support seat (3) is fixedly installed inside the installation box (1), and a test base (4) is arranged on the top of the support seat (3); a connecting shaft (5) located in the middle of the support seat (3) is movably installed inside the installation box (1), and an adjusting gear (6) is fixedly sleeved on the top of the connecting shaft (5); a bevel gear 1 (8) is fixedly sleeved on the outside of the connecting shaft (5); a transmission shaft (10) is movably installed on the installation box (1), and a bevel gear 2 (9) matching the bevel gear 1 (8) is fixedly sleeved on the end of the transmission shaft (10); a plurality of chip clamping assemblies (7) capable of clamping optoelectronic chips are arranged on the top of the support seat (3); a probe adjustment assembly (11) is arranged on one side of the top of the protective top cover (2), and the probe adjustment assembly (11) includes a probe (115) capable of testing the optoelectronic chip.
2. A test fixture for manufacturing integrated optoelectronic devices according to claim 1, characterized in that: One end of the transmission shaft (10) is inserted into the middle of the support seat (3), and the bevel gear 2 (9) at one end of the transmission shaft (10) is located below the bevel gear 1 (8), and the outer edge of the bevel gear 2 (9) is meshed with the bevel gear 1 (8).
3. A test fixture for manufacturing integrated optoelectronic devices according to claim 1, characterized in that: The number of the chip clamping assemblies (7) is four, and the four groups of chip clamping assemblies (7) are located around the test base (4). The chip clamping assemblies (7) include a transmission rack (71), a transmission arm (72), a connecting back plate (73), an adjusting screw (74), and a locking plate (75). The transmission rack (71) is clamped on the top of the support base (3).
4. A test fixture for manufacturing integrated optoelectronic devices according to claim 3, characterized in that: The transmission rack (71) is located outside the adjusting gear (6), and the transmission rack (71) and the adjusting gear (6) are located in the same plane, and the transmission rack (71) and the adjusting gear (6) are meshed with each other.
5. A test fixture for manufacturing integrated optoelectronic devices according to claim 4, characterized in that: One end of the transmission rack (71) away from the adjustment gear (6) is fixedly connected to a transmission arm (72), and the end of the transmission arm (72) is fixedly connected to a connecting back plate (73), an adjusting screw (74) is threadedly connected to the connecting back plate (73), and the end of the adjusting screw (74) is movably connected to a locking plate (75).
6. A test fixture for manufacturing integrated optoelectronic devices according to claim 1, characterized in that: The probe adjustment assembly (11) comprises a mounting seat (111), a slide seat (112), an adjustment rod 1 (113), an adjustment rod 2 (114), a probe (115), a locking knob (116), and a compression spring (117); the mounting seat (111) is fixedly mounted on the top of the protective top cover (2); and the slide seat (112) is movably mounted on the mounting seat (111).
7. A test fixture for manufacturing integrated optoelectronic devices according to claim 6, characterized in that: An ear plate is provided on one side of the slide seat (112), and the slide seat (112) is hinged with an adjusting rod 1 (113) through the ear plate, an adjusting rod 2 (114) is hinged at one end of the adjusting rod 1 (113), and a probe (115) is fixedly sleeved on the end of the adjusting rod 2 (114), a locking knob (116) is threadedly connected at the connection between the adjusting rod 2 (114) and the adjusting rod 1 (113), and a locking knob (116) is threadedly connected at the connection between the adjusting rod 1 (113) and the ear plate, and a compression spring (117) located above the slide seat (112) is movably sleeved on the mounting seat (111).