Wafer edge searching mechanical arm

Abstract

The utility model provides a wafer edge searching mechanical arm which comprises an upper arm. The rotating disc is arranged on one side of the upper arm, and a rotating disc rotating shaft on the rotating disc is rotationally connected to the upper arm; the driving part is used for driving the turntable to rotate around the turntable rotating shaft; the sensing piece is used for sensing the notch in the wafer; the upper arm is provided with a gap sensing hole, and a gap of the wafer passes through a connecting line between the sensing element of the sensing piece and the gap sensing hole during rotation; by arranging the rotating disc, the driving piece and the induction piece, the driving piece drives the rotating disc to rotate while the upper arm rotates, the induction piece induces the notch of the wafer to achieve the purpose of edge searching of the wafer, edge searching in the wafer transfer process is achieved, and the wafer machining efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer etching technology, in particular to a wafer edge-finding mechanical arm. Background Art

[0002] At present, the semiconductor industry often uses notches to determine the position of the wafer and realize wafer edge finding. A notch refers to a missing corner deliberately formed on the wafer. In the current process, edge finding is usually performed through an optical laser sensor. That is, the wafer is placed on the sample table, and it is assumed that the laser is blocked by the wafer at this time. At this time, the wafer starts to rotate, and when it rotates to the notch position, the laser emitted by the red laser can reach the laser collector through the cut groove, and then the position information of the notch on the wafer can be obtained by calculation.

[0003] In the current wafer edge-finding process, a robotic arm is usually used to transfer the wafer to an edge-finding chamber for edge-finding, and then the wafer after edge-finding is moved to a subsequent processing chamber. This operation step takes a lot of time. Summary of the invention

[0004] In view of the shortcomings of the prior art, the utility model provides a wafer edge-finding robot arm, which can complete the wafer edge-finding operation during the wafer transfer process, not only omitting the action of transferring the wafer to and from the edge-finding chamber, but also omitting the arrangement of the edge-finding chamber, greatly improving the work efficiency. The technical solution adopted by the utility model is:

[0005] A wafer edge-finding robot arm comprises: an upper arm; a turntable, which is arranged on one side of the upper arm, and the turntable shaft on the turntable is rotatably connected to the upper arm; a driving member, which is used to drive the turntable to rotate around the turntable shaft; and a sensing member, which is used to sense a notch on a wafer.

[0006] Furthermore, a notch sensing hole is provided on the upper arm, and the notch of the wafer passes through a line between the sensing element of the sensing component and the notch sensing hole during rotation.

[0007] Furthermore, the notch sensing hole passes through the upper arm, and a sensing component is provided on one side and / or the other side of the upper arm.

[0008] Furthermore, a driving wheel is arranged at the output end of the driving member, a driven wheel is coaxially arranged on the rotating shaft of the turntable, and the driving wheel and the driven wheel are connected to each other through a transmission member.

[0009] Furthermore, a cooling pipeline is provided on the upper arm, and a path of at least a part of the cooling pipeline corresponds to the turntable.

[0010] Furthermore, a cooling groove is provided on the upper arm, and at least a part of the cooling pipeline is arranged in the cooling groove.

[0011] Furthermore, it also includes a lower arm, which is buckled with the upper arm so that an inner cavity is formed between the upper arm and the lower arm.

[0012] Furthermore, a camera is arranged on the upper arm, and the lens of the camera is aimed at the front side of the wafer.

[0013] Furthermore, it also includes: a support, which is slidably connected to the upper arm so that the support can be close to or away from the turntable; and a shell, which is rotatably connected to the support, and the camera is hidden in the shell.

[0014] Furthermore, a nozzle is provided on the upper arm, the air inlet of the nozzle is connected to the purge pipeline, and the air outlet of the nozzle is aligned with the center of the wafer; and / or a temperature sensor is provided on the upper arm, and the temperature sensor is aligned with the back side of the wafer.

[0015] Advantages of the utility model:

[0016] By setting a turntable, a driving part and a sensing part, the upper arm rotates while the driving part drives the turntable to rotate, and the sensing part is used to sense the notch of the wafer to achieve the purpose of wafer edge finding, so as to realize edge finding during wafer transportation and greatly improve wafer processing efficiency;

[0017] Through the cooperation of the driving wheel, the driven wheel and the transmission member, the driving member does not need to be directly connected to the turntable, so that the driving member and the turntable are arranged at intervals and on the same side, thereby reducing the thickness of the entire mechanical arm;

[0018] By setting up cooling pipes, the flow of refrigerant in the cooling pipes is used to generate heat exchange with the wafers on the turntable, so as to achieve the purpose of cooling the wafers;

[0019] By setting up cooling slots, the linear distance between the cooling pipe and the wafer is reduced, the wafer cooling efficiency is improved, and the amount of refrigerant is saved;

[0020] By providing the lower arm and the inner cavity, the driving wheel, the driven wheel, the transmission member are hidden in the inner cavity, and / or part of the cooling pipeline is hidden in the inner cavity, so as to achieve dustproof protection effect;

[0021] The edge-finding process of the wafer is recorded and monitored by setting a camera, the surface of the wafer is purged by setting a nozzle, and the temperature on the back of the wafer is monitored by setting a temperature sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a structural diagram of the utility model from the first perspective.

[0023] Figure 2This is a structural diagram from a second perspective of the present invention with the lower arm removed.

[0024] Figure 3 This is an exploded view of the turntable, cooling pipe and upper arm of the utility model from the first perspective.

[0025] Figure 4 This is an exploded view of the turntable, cooling pipeline and upper arm of the utility model from a second perspective.

[0026] Figure 5 It is a longitudinal sectional view of the utility model.

[0027] Figure 6 This is a structural diagram of the utility model from the third viewing angle.

[0028] In the figure: 1-upper arm, 1a-notch sensing hole, 1b-cooling groove, 1c-slide groove, 1d-U-shaped clip, 1e, 14a-adjustment hole, 1f-motor groove, 2-turntable, 2a-turntable shaft, 2b-anti-slip gasket, 3-driving member, 4-sensing member, 5-driving wheel, 6-driven wheel, 7-transmission member, 8-cooling pipeline, 81-first section, 81a-semicircular pipeline, 82b, 82c, 82d-straight pipeline, 9-lower arm, 9a-inner cavity, 10-camera, 11-support, 12-housing, 12a-rocker arm, 12b-protective plate, 12c-quartz plate, 13-nozzle, 13a-purge pipeline, 14-temperature sensor, 15-bracket, 15a, 15b-adjustment groove. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0030] The utility model provides a wafer edge-finding robot arm, comprising: an upper arm 1; a turntable 2, which is arranged on one side of the upper arm 1, and a turntable shaft 2a on the turntable 2 is rotatably connected to the upper arm 1; a driving member 3, which is used to drive the turntable 2 to rotate around the turntable shaft 2a; a sensing member 4, which is used to sense a notch on a wafer; and a control system, which is used to control the working state of each electrical component in the robot arm.

[0031] In one embodiment, as shown in the attached Figure 1 and Figure 2 As shown, the upper arm 1 is a strip-shaped plate structure, one end of which is configured as a semicircle, corresponding to the shape of the turntable 2, and the other end is used to connect the robot body to enable the robot arm to operate between various process chambers; the diameter of the turntable 2 does not exceed the width of the upper arm 1 to protect the turntable 2 from collision; the control system can be selected from PLC.

[0032] In a specific embodiment, the turntable 2 is located on the upper side of the upper arm 1 close to a semicircular end of the upper arm 1, and the turntable shaft 2a is perpendicularly connected to the upper arm 1 along the vertical direction.

[0033] Furthermore, in order to ensure that the surface of the wafer is not higher than the upper surface of the upper arm 1 when the wafer is placed on the turntable 2, a step is arranged at one end of the upper arm 1, and the turntable 2 is located at the step of the upper arm 1; further, in order to make the step adapt to the shape of the wafer, the side wall of the step is arc-shaped.

[0034] By setting the driving component 3 and the sensing component 4, after the wafer is placed on the turntable 2, the upper arm 1 transfers the wafer to the next process chamber along with the movement of the robot, and at the same time the driving component 3 drives the turntable 2 to rotate, and the turntable 2 stops rotating when the sensing component 4 senses the notch on the wafer, indicating that the wafer has completed the edge-finding action, thereby omitting the arrangement of the wafer edge-finding chamber, saving the wafer processing time, and greatly improving the wafer processing efficiency.

[0035] The way the sensor detects the wafer gap is as shown in the attached figure. Figure 1 and Figure 2 As shown, a notch sensing hole 1a is provided on the upper arm 1, and the notch of the wafer passes through the line between the sensing element of the sensing member 4 and the notch sensing hole 1a when rotating.

[0036] Specifically, during the rotation of the wafer, when the wafer separates the notch sensing hole 1a from the sensing part 4, the sensing element of the sensing part 4 cannot match the notch sensing hole 1a, and the sensing part 4 transmits a signal of not detecting the notch to the control system, and the driving part 3 continues to work until the wafer notch rotates to the line between the sensing element of the sensing part 4 and the notch sensing hole 1a, and the sensing element of the sensing part 4 matches the notch sensing hole 1a, and the sensing part transmits a signal of notch detection to the control system, and then the control system controls the driving part 3 to stop working, and the turntable 2 stops rotating accordingly, indicating that the wafer has completed the edge finding operation.

[0037] In one embodiment, the notch sensing hole 1 a passes through the upper arm 1 , and a sensing element 4 is disposed on one side of the upper arm 1 .

[0038] In a specific embodiment, the notch sensing hole 1a is perpendicular to the surface of the upper arm 1, and the sensing element 4 is a laser sensor, which is located on the upper surface of the upper arm 1; when the notch sensing hole 1a is separated from the sensing element 4 during the rotation of the wafer, the laser emitted downward by the laser transmitter is received by the laser receiver through reflection of the wafer, and the laser receiver receives the reflected light signal for a short time, so the laser sensor transmits a signal that the wafer notch is not detected to the control system; when the wafer notch rotates to the line between the sensing element of the sensing element 4 and the notch sensing hole 1a, the laser emitted by the laser transmitter passes downward through the wafer notch and the notch sensing hole 1a until it encounters an obstruction, and the laser emitted by the laser transmitter is received by the laser receiver through reflection of the obstruction, and the laser receiver receives the reflected light signal for a long time, so the laser sensor transmits a signal that the wafer notch is detected to the control system.

[0039] In one embodiment, the notch sensing hole 1 a passes through the upper arm 1 , and a sensing element 4 is disposed on the other side of the upper arm 1 .

[0040] In a specific embodiment, the notch sensing hole 1a is perpendicular to the surface of the upper arm 1, and the sensing element 4 is a laser sensor, which is located on the lower surface of the upper arm 1; when the notch sensing hole 1a is separated from the sensing element 4 during the rotation of the wafer, the laser emitted upward by the laser transmitter is received by the laser receiver through reflection of the wafer, and the laser receiver receives the reflected light signal for a short time, so the laser sensor transmits a signal that the wafer notch is not detected to the control system; when the wafer notch rotates to the line between the sensing element of the sensing element 4 and the notch sensing hole 1a, the laser emitted by the laser transmitter passes upward through the wafer notch and the notch sensing hole 1a until it encounters an obstruction, and the laser emitted by the laser transmitter is received by the laser receiver through reflection of the obstruction, and the laser receiver receives the reflected light signal for a long time, so the laser sensor transmits a signal that the wafer notch is detected to the control system.

[0041] In one embodiment, the notch sensing hole 1 a passes through the upper arm 1 , and sensing elements 4 are respectively disposed on both sides of the upper arm 1 .

[0042] In a specific embodiment, the notch sensing hole 1a is perpendicular to the surface of the upper arm 1, and the sensing component 4 is a laser sensor. Two of the laser sensors are distributed on the upper and lower surfaces of the upper arm 1. The two laser sensors emit lasers and receive lasers at the same time, making the notch sensing more accurate. When one of the sensing components 4 is damaged, the other sensing component 4 can still work normally, reducing the number of shutdowns for maintenance.

[0043] In other embodiments, the sensing element 4 is an infrared sensor, an ultrasonic sensor or other ranging sensors.

[0044] In order to reduce the thickness of the robot arm in the vertical direction near the turntable 2, it is convenient for the turntable 2 to approach and enter other process chambers, so that the robot arm avoids other process chambers, such as the attached Figure 2 As shown, the drive member 3 is arranged at a distance from the turntable 2 on the upper arm 1 .

[0045] In one embodiment, the transmission connection between the driving member 3 and the turntable 2 is realized on the basis of the spaced arrangement of the driving member 3 and the turntable 2. A driving wheel 5 is provided at the output end of the driving member 3, and a driven wheel 6 is coaxially provided on the turntable shaft 2a. The driving wheel 5 and the driven wheel 6 are connected through a transmission member 7.

[0046] The driving wheel 5, the driven wheel 6, and the transmission member 7 constitute a transmission part. There are four forms of positional relationship between the transmission part, the turntable 2, and the driving member:

[0047] In the first form, the turntable 2 and the driving member 3 are arranged on the upper side of the upper arm 1, and the driving wheel 5, the driven wheel 6, and the transmission member 7 are arranged on the lower side of the upper arm 1; in this embodiment, the turntable shaft 2a and the output ends of the driving member 3 respectively penetrate the upper arm 1, and the driving wheel 5 is driven to rotate through the driving member 3, and the power is transmitted to the driven wheel 6 through the transmission member 7, and finally the turntable 2 is rotated through the turntable shaft 2a; when the driving member 3 stops working, the driving wheel 5, the transmission member 7, the driven wheel 6, and the turntable shaft 2a stop moving synchronously, and the turntable 2 also stops rotating;

[0048] In the second form, the turntable 2 and the driving member 3 are arranged on the upper side of the upper arm 1, and the driving wheel 5, the driven wheel 6, and the transmission member 7 are arranged on the upper side of the upper arm 1; in this embodiment, one end of the turntable shaft 2a is rotatably connected to the upper arm 1, and the transmission process is the same as above;

[0049] In the third form, the turntable 2 is arranged on the upper side of the upper arm 1, the driving member 3 is arranged on the lower side of the upper arm 1, and the driving wheel 5, the driven wheel 6, and the transmission member 7 are all arranged on the upper side of the upper arm 1; in this embodiment, one end of the turntable shaft 2a passes through the upper arm 1, and the transmission process is the same as above;

[0050] In the fourth form, the turntable 2 is arranged on the upper side of the upper arm 1, the driving member 3 is arranged on the lower side of the upper arm 1, the driving wheel 5, the driven wheel 6, and the transmission member 7 are all arranged on the lower side of the upper arm 1; in this embodiment, the output end of the driving member 3 passes through the upper arm 1, and the transmission process is the same as above.

[0051] The drive member 3 and the turntable 2 are arranged at intervals through the transmission member 7, so that the drive member 3 and the turntable 2 can be distributed at the two ends of the upper arm 1, balancing the weight of the two ends of the upper arm 1, preventing the side tilt or deformation of the upper arm caused by excessive weight at one end, and appropriately reducing the thickness of the upper arm, thereby making the overall thickness of the robotic arm thinner.

[0052] The driving member 3 can be a rotation driving device such as a stepping motor, a DC motor, or a servo motor.

[0053] In a specific embodiment, the driving wheel 5 and the driven wheel 6 are sprockets, and the transmission member 7 is a chain.

[0054] In another specific embodiment, the driving wheel 5 and the driven wheel 6 are pulleys, and the transmission member 7 is a belt.

[0055] In other embodiments, the driving wheel 5 and the driven wheel 6 are gears, and the transmission member 7 includes a plurality of gears meshed sequentially along the length direction of the upper arm 1; the meshing of the plurality of gears enables stable transmission of power.

[0056] The present application does not limit the diameter ratio between the driving wheel 5 and the driven wheel 6. The rotation speed of the turntable 2 can be changed by changing the diameter ratio between different transmission elements to ensure the stability of the wafer placed on the turntable.

[0057] In one embodiment, as shown in the attached Figure 2-Figure 4 As shown, a cooling pipeline 8 is provided on the upper arm 1 , and a path of at least a portion of the cooling pipeline 8 corresponds to the turntable 2 .

[0058] By adding a cooling pipeline 8 to the upper arm 1 and introducing a flowing refrigerant into the cooling pipeline 8, the refrigerant is indirectly heat-exchanged with the wafers on the turntable 2, thereby achieving non-contact cooling of the wafers.

[0059] In a specific embodiment, the cooling pipeline 8 is arranged on the lower side of the upper arm 1 and is spaced apart from the turntable 2; the cooling pipeline 8 includes at least a first section 81, and the first section 81 includes a semicircular pipeline 81a and a linear pipeline 81b. The center of the semicircular pipeline 81a coincides with the center of the turntable shaft 2a, so that the turntable transfers heat more evenly; the two ends of the semicircular pipeline 81a are respectively linear pipelines 81b, and the linear pipeline 81b preferably extends along the length direction of the upper arm 1 to make the cooling pipeline 8 structure symmetrical to avoid the upper arm 1 tilting and causing the wafer to tilt.

[0060] Furthermore, in order to bring the cooling pipeline 8 closer to the wafer, improve the cooling effect, and save the amount of refrigerant, a cooling groove 1b is provided on the upper arm 1, and at least part of the cooling pipeline 8 is provided in the cooling groove 1b.

[0061] It can be understood that the shape of the cooling groove 1b is adapted to the first section 81, including a semicircular groove and two linear grooves, the semicircular pipeline 81a is arranged in the semicircular groove, and the linear pipeline 81b is arranged in the linear groove.

[0062] In a specific embodiment, one end of the linear groove of the cooling groove 1b extends away from the turntable 2 and is connected to the other end of the upper arm 1; in this embodiment, one end of the linear pipeline 81b passes through the upper arm 1 along the linear groove and is used to connect to the refrigeration system to achieve continuous circulation and transportation of the refrigerant.

[0063] In another specific embodiment, one end of the linear groove of the cooling groove 1b extends in a direction away from the turntable 2, but does not exceed the other end of the upper arm 1; at this time, the first section 81 also includes a linear pipeline 81c and a linear pipeline 81d, and each of the linear pipelines 81b is connected to the linear pipeline 81c at one end away from the semicircular pipeline 81a, and the other end of the linear pipeline 81c extends to the side away from the upper arm 1 and is connected to the linear pipeline 81d, and the other end of the linear pipeline 81d passes through the upper arm 1; by avoiding the space on the lower side of the upper arm 1 through the linear pipelines 81c and 81d, when the support 11 is slidably set on the upper arm 1, sufficient operating space can be reserved for the fasteners between the support 11 and the upper arm 1, so that it is convenient to operate the fasteners to change the fixed state or sliding state of the support 11.

[0064] Furthermore, in order to reduce the length of the straight pipeline 81d, the cooling pipeline 8 also includes at least one second section 82. The other end of each of the straight pipelines 81d is connected to the second section 82 through a joint. When the upper arm 1 is long, a plurality of second sections 82 can be connected in series to achieve long-distance transportation of the refrigerant. The pipeline length requirement is low, and the upper arms 1 of different lengths can be used by splicing, thereby avoiding sagging caused by a single cooling pipeline 8 being too long and hindering the circulation of the refrigerant.

[0065] In another embodiment, the cooling pipe 8 is arranged on the upper side of the upper arm 1 and on the same side as the turntable 2. Although arranging the cooling pipe 8 and the turntable on the same side can further shorten the distance between the cooling pipe 8 and the wafer, when the refrigerant in the cooling pipe 8 leaks, the refrigerant is more likely to be directly sprayed or blown onto the wafer, which poorly reduces the process safety of the wafer.

[0066] In one embodiment, as shown in the attached Figure 5 As shown, a lower arm 9 is provided on the side of the upper arm 1 away from the turntable 2, so that an inner cavity 9a is formed between the upper arm 1 and the lower arm 9. The inner cavity 9a provides a hidden space for the transmission part and / or the cooling pipeline 8 and plays a protective effect.

[0067] There are three specific ways to form the inner cavity 9a: in the first, the cross-section of the upper arm 1 is rectangular, the cross-section of the lower arm 9 is U-shaped, the lower arm 9 is buckled on the lower surface of the upper arm 1, and the inner cavity 9a is formed on the inner side of the lower arm 9; in the second, the cross-section of the upper arm 1 is U-shaped, the cross-section of the lower arm 9 is rectangular, the upper arm 1 is buckled on the upper surface of the lower arm 9, and the inner cavity 9a is formed on the inner side of the upper arm 1; in the third, the cross-sections of the upper arm 1 and the lower arm 9 are both U-shaped, the upper arm 1 and the lower arm 9 are buckled together, and the inner cavity 9a is formed between the upper arm 1 and the lower arm 1.

[0068] The connection method between the upper arm 1 and the lower arm 9 is not limited, and they can be fixed by common fasteners such as bolts, nuts, pins, buckles, and clamps. Since the cooling pipeline 8 transports the refrigerant separately, the inner cavity 9a does not participate in the storage or sealing of the refrigerant, so a sealing ring can be set between the upper arm 1 and the lower arm 9, or no sealing treatment can be performed.

[0069] In a specific embodiment, the transmission part is located in the inner cavity 9a, and the driving wheel 5, the driven wheel 6, and the transmission member 7 are all hidden in the inner cavity 9a. The inner cavity 9a provides protection for the transmission part to prevent external forces from damaging the transmission elements of the transmission part.

[0070] In another specific embodiment, the cooling pipeline 8 is located in the inner cavity 9a, and the inner cavity 9a provides a relatively narrow chamber for the cooling pipeline 8, which is beneficial to the insulation of the refrigerant in the cooling pipeline 8 and reduces heat loss. Moreover, when the refrigerant is a liquid refrigerant, when the cooling pipeline 8 leaks, the inner cavity 9a can temporarily store the refrigerant to prevent the refrigerant from immediately leaking into the wafer processing environment.

[0071] In another specific embodiment, the transmission part and the cooling pipeline 8 are both located in the inner cavity 9a; in this case, the semicircular pipeline 81a in the cooling pipeline 8 is coaxially arranged with the driven wheel 6, so that the transmission member 7 is located on the inner side of the linear pipeline 81b, avoiding interference between the cooling pipeline 8 and the transmission member 7.

[0072] In one embodiment, please refer to the attached Figure 1 and Figure 2 The upper arm 1 is provided with a camera 10, and the lens of the camera 10 is aimed at the front of the wafer. The camera 10 is used to record the situation of the wafer during the process of the robot taking the wafer and sending the wafer into the reaction chamber. When the wafer is damaged, the cause of the wafer damage can be understood through the impact recorded by the camera 10, so as to quickly solve the problem.

[0073] Furthermore, in order to be able to adjust the position of the camera 10 and record the camera angle more accurately, a support 11 is slidably provided on the upper arm 1, and a shell 12 is rotatably connected to the support 11, and the camera 10 is hidden in the shell 12.

[0074] In a specific embodiment, a slide groove 1c is provided on the upper arm 1 along its length direction, and the slide groove 1c vertically penetrates the upper arm 1, and the support 11 is slidably connected to the slide groove 1c. More specifically, the support 11 is slidably connected to the slide groove 1c through a bolt and nut assembly. When the nut is loosened, the support 11 is moved so that the bolt slides along the slide groove 1c, so that the support 11 is close to or away from the turntable 2, thereby adjusting the distance between the camera 10 and the wafer, and then the nut is tightened, and the position of the support 11 is fixed under the action of the clamping force of the bolt and nut, and then the position of the camera 10 is also fixed. There is no limit to the number of slide grooves 1c and the number of bolt and nut assemblies.

[0075] In another specific embodiment, the support 11 is slidably connected to the upper arm 1 through a slide rail, a plurality of pin holes are arranged on the upper arm 1 at intervals along its length direction, and corresponding pin holes and pins are arranged on the support 11. When the support 11 slides to the desired position, the pin is inserted into the corresponding pin hole to fix the position of the support 11.

[0076] The housing 12 is used to protect the camera 10 and prevent the camera 10 from being hit.

[0077] In a specific embodiment, a rocker arm 12a is disposed at the closed end of the housing 12, and the rocker arm 12a is rotatably connected to the support 11 through a bolt and nut assembly.

[0078] In order to further protect the camera 10 and not affect normal video recording, a protective plate 12 b with holes is installed at the open end of the housing 12 , and a quartz plate 12 c is arranged in the hole of the protective plate 12 b.

[0079] In one embodiment, please refer to the attached Figure 6 The upper arm 1 is provided with a nozzle 13, the air inlet of the nozzle 13 is connected to the purge pipeline 13a, and the air outlet of the nozzle 13 is aligned with the center of the wafer. The purge pipeline 13a is connected to the air supply system to achieve the dust removal effect by blowing the nozzle 13 on the surface of the wafer.

[0080] In a specific embodiment, a U-shaped clamp 1d is installed on the upper arm 1, and the blowing direction is adjusted by adjusting the upper and lower positions of the nozzle on the U-shaped clamp. The nozzle 13 is fixed by tightening the nuts on both sides of the U-shaped clamp 1d.

[0081] In a specific embodiment, the purge pipeline 13a is fixed to the side of the upper arm 1 by a fixing member such as a clamp.

[0082] In one embodiment, as shown in the attached Figure 1 and Figure 6 As shown, a temperature sensor 14 is provided on the upper arm 1, and the temperature sensor 14 is aligned with the back of the wafer. By providing the temperature sensor 14 to monitor the temperature of the back of the wafer, the cooling effect of the wafer can be more clearly understood. The temperature sensor is specifically an infrared sensor.

[0083] Furthermore, an L-shaped bracket 15 is installed on the side of the upper arm 1, and the temperature sensor 14 is set on the bracket 15; by adding the bracket 15, the gap between the temperature sensor 14 and the upper arm 1 is increased to avoid the temperature sensor 14 being unable to align with the back of the wafer.

[0084] In a specific embodiment, an adjustment hole 1e is provided on the side of the upper arm 1, and a strip-shaped adjustment groove 15a is provided on the side of the bracket 15. The bracket 15 with the adjusted position can be fixed in the adjustment hole 1e by setting a fastener so that the fastener passes through the adjustment groove 15a and is fixed in the adjustment hole 1e, thereby realizing the adjustment of the position of the temperature sensor 14 in the height direction of the upper arm 1.

[0085] In a specific embodiment, an arc-shaped adjustment groove 15b is provided on the surface of the bracket 15, and an adjustment hole 14a is provided on the surface of the temperature sensor 14. The temperature sensor 14 with adjusted angle can be fixed by setting a fastener to pass through the adjustment groove 15b and be fixed in the adjustment hole 14a, thereby realizing the adjustment of the angle of the temperature sensor 14 in the horizontal plane of the upper arm 1.

[0086] In one embodiment, as shown in the attached Figure 3 As shown, the surface of the turntable 2 is recessed with an anti-skid washer 2b, and the surface of the anti-skid washer 2b is aligned with the surface of the turntable 2; by providing the anti-skid washer 2b, the friction with the wafer surface is increased, thereby improving the stability of the wafer during rotation.

[0087] In one embodiment, as shown in the attached Figure 3 As shown, in order to more stably fix the driving member 3 on the upper arm 1 , a motor slot 1f is provided on the upper arm 1 , and the driving member 3 is fixed in the motor slot 1f.

[0088] In summary, the present application integrates the transfer and edge finding of wafers, greatly improves the process efficiency, saves time, and has wafer cooling and purging functions. The thickness of the side of the robotic arm close to the turntable is small, and the weight at both ends of the robotic arm is balanced, and the process is stable.

[0089] Finally, it should be noted that the above specific implementation methods are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to examples, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A wafer edge finding robot arm, characterized in that: include: Upper arm (1); A turntable (2) is arranged on one side of the upper arm (1), and a turntable shaft (2a) on the turntable (2) is rotatably connected to the upper arm (1); A driving member (3) for driving the turntable (2) to rotate around the turntable shaft (2a); The sensing element (4) is used to sense the notch on the wafer.

2. The wafer edge-finding robot according to claim 1, characterized in that: A notch sensing hole (1a) is provided on the upper arm (1), and the notch of the wafer passes through a line between the sensing element of the sensing component (4) and the notch sensing hole (1a) when rotating.

3. The wafer edge-finding robot according to claim 2, characterized in that: The notch sensing hole (1a) passes through the upper arm (1), and a sensing element (4) is provided on one side and / or the other side of the upper arm (1).

4. The wafer edge-finding robot according to claim 1, characterized in that: The output end of the driving member (3) is provided with a driving wheel (5), and the rotating shaft (2a) of the rotating disk is coaxially provided with a driven wheel (6), and the driving wheel (5) and the driven wheel (6) are connected to each other by a transmission member (7).

5. The wafer edge-finding robot according to claim 1, characterized in that: The upper arm (1) is provided with a cooling pipeline (8), and at least a part of the path of the cooling pipeline (8) corresponds to the rotating disk (2).

6. The wafer edge-finding robot arm according to claim 5, characterized in that: The upper arm (1) is provided with a cooling groove (1b), and at least a portion of the cooling pipeline (8) is arranged in the cooling groove (1b).

7. The wafer edge-finding robot according to claim 4 or 5, characterized in that: It also comprises a lower arm (9) which is buckled with the upper arm (1) so that an inner cavity (9a) is formed between the upper arm (1) and the lower arm (9).

8. The wafer edge-finding robot according to any one of claims 1 to 5, characterized in that: A camera (10) is provided on the upper arm (1), and a lens of the camera (10) is aimed at the front side of the wafer.

9. The wafer edge-finding robot arm according to claim 8, characterized in that: Also includes: A support (11) is slidably connected to the upper arm (1) so that the support (11) can move closer to or farther from the turntable (2); The outer shell (12) is rotatably connected to the support (11), and the camera (10) is hidden in the outer shell (12).

10. The wafer edge-finding robot according to any one of claims 1 to 5, characterized in that: The upper arm (1) is provided with a nozzle (13), the air inlet of the nozzle (13) is connected to the purge pipeline (13a), and the air outlet of the nozzle (13) is aligned with the center of the wafer; and / or A temperature sensor (14) is provided on the upper arm (1), and the temperature sensor (14) is aligned with the back side of the wafer.

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