Water type mold temperature controller with cooling device

Abstract

The utility model discloses a water type mold temperature controller with a cooling device, which belongs to the technical field of water type mold temperature controllers and comprises a shell of the mold temperature controller, a water tank and a heater, a water inlet pipe is connected between the water tank and the heater, a filter is installed on the side wall of the water inlet pipe, a water outlet pipe and a water return pipe are inserted into one side of the heater side by side, and electromagnetic valves are installed on the water outlet pipe and the water return pipe correspondingly; and the cold end of the semiconductor refrigeration plate is tightly attached to the corresponding side of the heater, the hot end of the semiconductor refrigeration plate is connected with two connecting plates side by side, a cooling fan is installed in the middle of each connecting plate in a nested mode, an air outlet located below the cooling fans is formed in the bottom of the shell, and a dustproof net is installed on the inner side of each air outlet in a nested mode. The water type mold temperature controller with the cooling device is higher in heat dissipation efficiency so as to ensure long-term stable operation of the heater.

Description

Technical Field

[0001] The utility model belongs to the technical field of water-type mold temperature controllers, in particular to a water-type mold temperature controller with a cooling device. Background Art

[0002] A water-type mold temperature controller is a professional equipment, mainly used for mold temperature control during injection molding, blow molding, extrusion molding and other processes. Its working principle is to heat water to a certain temperature, and transport the heated water to the mold that needs to be heated through a water pump to heat the mold, thereby ensuring that the plastic achieves the best physical properties such as fluidity, plasticity and hardness during the injection molding, blow molding, extrusion molding and other processes. Since its heater needs to work for a long time, it is inevitable that a lot of heat will accumulate inside the equipment. In order to avoid damage to the internal structure due to continuous high temperature, a cooling device needs to be designed for it.

[0003] Although the existing device is designed with multiple cooling fans, the heat dissipation efficiency is not high enough by using the direct blowing method of the fans.

[0004] For example, the Chinese utility model application number CN201820223268.5 is a water-type mold temperature controller with a cooling device, including a main body and a cooling device, the main body including a shell, a water tank, a water inlet channel, a heater, a water pump, a pulley and a control panel, the control panel is arranged on the left side of the shell, the control panel is fixedly connected to the left surface of the shell, the pulley is arranged on the lower surface of the shell, the pulley is fixedly connected to the lower surface of the shell, the water pump is arranged in the inner cavity of the shell, the water pump is fixedly connected to the bottom of the inner cavity of the shell, the heater is arranged on the right side of the water pump, and the heater is fixedly connected to the inner cavity wall of the shell. The heat dissipation efficiency of this device is not high enough by using a fan direct blowing method. Utility Model Content

[0005] The utility model aims to provide a water-type mold temperature controller with a cooling device to solve the problems raised in the background technology.

[0006] To achieve the above purpose, the utility model provides the following technical solution: a water-type mold temperature controller with a cooling device, comprising:

[0007] The housing of the mold temperature controller and the water tank and heater installed inside the housing;

[0008] A water inlet pipe is connected between the water tank and the heater, and a filter is installed on the side wall of the water inlet pipe. A water outlet pipe and a water return pipe are plugged in side by side on one side of the heater, and both the water outlet pipe and the water return pipe are installed with solenoid valves. A semiconductor refrigeration plate is installed on one side of the heater, and the cold end of the semiconductor refrigeration plate is close to the corresponding side of the heater. Two connecting plates are connected in side by side on the hot end of the semiconductor refrigeration plate, and a heat dissipation fan is nested in the middle of the connecting plate. The bottom of the shell is constructed with an air outlet located below the heat dissipation fan, and a dustproof net is nested on the inner side of the air outlet.

[0009] In a further embodiment, a maintenance opening corresponding to the heater is constructed on one side of the housing, and a baffle is hingedly connected to the maintenance opening, and a lock is installed between the baffle and the corresponding side of the maintenance opening.

[0010] In a further embodiment, a control board is installed on one side of the housing, and the control board is electrically connected to the water pump, the electric heater, and the solenoid valve respectively.

[0011] In a further embodiment, a return pipe is installed between the heater and corresponding sides of the water tank, and a water pump is installed on the side wall of the return pipe.

[0012] In a further embodiment, the water pump is installed at the inner bottom of the housing, and a vibration-damping pad is installed at the connection between the water pump and the housing.

[0013] In a further embodiment, movable wheels with braking function are installed at the four corners of the bottom of the shell, and a handle is installed on the upper part of the outer wall of one side of the shell.

[0014] In a further embodiment, a lighting lamp located above the heater is installed on the inner top of the housing.

[0015] Compared with the prior art, the technical effects and advantages of the utility model are as follows:

[0016] The water-type mold temperature controller with a cooling device, the existing solution usually adopts a fan direct blowing method to take away the heat generated by the heater, which is undoubtedly not high enough in heat dissipation efficiency and cannot fully take away the heat generated by the long-term operation of the heater. The present solution cools down the heater by direct contact between the semiconductor refrigeration plate and the heater, and then adopts a plurality of fans to directly blow the heat to the hot end of the semiconductor refrigeration plate. The heat conduction method is more efficient, which can fully take away the heat generated by the long-term operation of the heater, avoid internal heat accumulation, and have higher heat dissipation efficiency to ensure the long-term stable operation of the heater.

[0017] A baffle is installed on the side where the control panel is located. The baffle can be opened by unlocking the lock of the baffle. Then the heater and the structure used for heat dissipation can be maintained through the inspection port, which makes maintenance more convenient for maintenance personnel.

[0018] The water-type mold temperature controller with a cooling device has higher heat dissipation efficiency to ensure long-term stable operation of the heater. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a structural schematic diagram of the utility model;

[0021] Figure 2 For the utility model Figure 1 Cross-sectional view along the aa direction;

[0022] Figure 3 For the utility model Figure 2 A magnified view of the structure in the middle.

[0023] Description of reference numerals:

[0024] In the figure: 1. Shell; 2. Water tank; 3. Heater; 4. Water pump; 5. Return pipe; 6. Water outlet pipe; 7. Semiconductor refrigeration plate; 8. Cooling fan; 9. Dust net; 10. Water inlet pipe; 11. Filter; 12. Water filling pipe; 13. Baffle; 14. Light; 15. Moving wheel; 16. Handle; 17. Label; 18. Vibration damping pad; 19. Control panel. DETAILED DESCRIPTION

[0025] In the following description, a large number of specific details are given to provide a more thorough understanding of the utility model. However, it is obvious to those skilled in the art that the utility model can be implemented without one or more of these details. In other examples, in order to avoid confusion with the utility model, some technical features known in the art are not described.

[0026] Unless otherwise defined, the directions of up, down, left, right, front, back, inside and outside involved in this document are based on the directions of up, down, left, right, front, back, inside and outside in the figures shown in the present utility model, and are explained here together.

[0027] The connection method can be bonding, welding, bolt connection, etc., depending on actual needs.

[0028] In order to achieve higher heat dissipation efficiency and ensure the smooth operation of the heater 3, as Figures 1 to 3As shown: the shell 1 of the mold temperature controller and the water tank 2 and the heater 3 installed on the inner side of the shell 1 by multiple sets of screws. The heater 3 can heat water using the existing principle. The top of the water tank 2 is plugged with a water adding pipe 12 that runs through the shell 1. Water can be added to the water tank 2 through the water adding pipe 12. A water inlet pipe 10 is connected between the water tank 2 and the heater 3. The water tank 2 can input water into the heater 3 through the water inlet pipe 10, and a filter 11 is installed on the side wall of the water inlet pipe 10. The filter 11 can filter the water in the water inlet pipe 10 using the existing principle to avoid scale generation in the heater 3.

[0029] A return pipe 5 is installed between the corresponding sides of the heater 3 and the water tank 2, and a water pump 4 is installed on the side wall of the return pipe 5. The water pump 4 is installed on the inner bottom of the shell 1 through a mounting seat. The water in the heater 3 can flow back to the water tank 2 through the water pump 4 and the return pipe 5. A vibration damping pad 18 is installed at the connection between the water pump 4 and the shell 1 to provide vibration damping for the water pump 4 to reduce the noise of the water pump 4 during operation. An outlet pipe 6 and a return pipe that penetrate the shell 1 are plugged side by side on one side of the heater 3. The outlet pipe 6 and the return pipe are welded with flanges at the ends away from the shell 1 for convenient connection with the mold. Hot water circulates through the outlet pipe 6, the mold, and the return pipe, and the outlet pipe 6 and the return pipe are both equipped with solenoid valves for convenient control of the opening and closing of the outlet pipe 6 and the return pipe.

[0030] A semiconductor refrigeration plate 7 is installed on one side of the heater 3, and the cold end of the semiconductor refrigeration plate 7 is close to the corresponding side of the heater 3. The cold end of the semiconductor refrigeration plate 7 can be refrigerated using the existing principle to cool the side wall of the heater 3. The heat dissipation effect is better by heat conduction. The hot end of the semiconductor refrigeration plate 7 is connected to two connecting plates side by side by screws, and a heat dissipation fan 8 is nested in the middle of the connecting plate. The two heat dissipation fans 8 continuously blow air downward to quickly take away the heat from the hot end of the semiconductor refrigeration plate 7. The bottom of the outer shell 1 is constructed with an air outlet located below the heat dissipation fan 8, and a dustproof net 9 is nested on the inner side of the air outlet to prevent dust from entering the inner side of the outer shell 1.

[0031] Moving wheels 15 with braking function are installed at the four corners of the bottom of the shell 1. A handle 16 is welded on the upper part of the outer wall of one side of the shell 1. The corners of the handle 16 are arc-shaped structures to improve the grip feel. The moving wheel 15 and the handle 16 are used to facilitate the movement of the device. A nameplate 17 is bonded to the outer wall of one side of the shell 1. The nameplate 17 marks the parameter information of the device for easy understanding.

[0032] One side of the shell 1 is constructed with an inspection port corresponding to the heater 3, and the inspection port is hinged with a baffle 13, and a lock is installed between the baffle 13 and the corresponding side of the inspection port. The baffle 13 can be opened by opening the lock, and then the internal structure can be maintained through the inspection port. A control board 19 is installed on one side of the shell 1, and the control board 19 is electrically connected to the water pump 4, the electric heater, and the solenoid valve respectively. The control board 19 can control the connected components using existing principles. A lighting lamp 14 located above the heater 3 is installed on the inner top of the shell 1, and the lighting lamp 14 is also electrically connected to the control board 19. Turn on the lighting lamp 14 to ensure illumination to avoid unclear visibility of the internal structure during maintenance.

[0033] The heater 3, water pump 4, semiconductor refrigeration plate 7, cooling fan 8, solenoid valve, and lighting lamp 14 are all set as conventional instruments. The working principle, size and model are irrelevant to the function of this application, so they are not described in detail, and they are all controlled by the control board 19.

[0034] How it works

[0035] The water-type mold temperature controller with a cooling device moves the device to a specified position and connects it to an external power supply, connects the mold to the outlet pipe 6 and the return pipe through a flange, and the water in the water tank 2 is filtered through a filter 11 and then flows into the heater 3. The heater 3 heats the water using the existing principle and then discharges it into the mold through the outlet pipe 6 for heating. The hot water flows back to the heater 3 through the return pipe. At this time, the cold end of the semiconductor refrigeration plate 7 is refrigerated using the existing principle to cool the side wall of the heater 3. At the same time, two cooling fans 8 continue to blow air downward to quickly take away the heat from the hot end of the semiconductor refrigeration plate 7, thereby ensuring that the heater 3 can operate smoothly for a long time.

[0036] It should be noted that, in this article, relational terms such as one and two are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions. The sentence "includes an element defined by ... does not exclude the existence of other identical elements in the process, method, article or device including the element".

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A water-type mold temperature controller with a cooling device, comprising: A housing (1) of the mold temperature controller and a water tank (2) and a heater (3) installed inside the housing (1); The invention is characterized in that: a water inlet pipe (10) is connected between the water tank (2) and the heater (3), and a filter (11) is installed on the side wall of the water inlet pipe (10); a water outlet pipe (6) and a water return pipe are plugged in parallel on one side of the heater (3), and both the water outlet pipe (6) and the water return pipe are installed with solenoid valves; a semiconductor refrigeration plate (7) is installed on one side of the heater (3), and the cold end of the semiconductor refrigeration plate (7) is close to the corresponding side of the heater (3); two connecting plates are connected in parallel to the hot end of the semiconductor refrigeration plate (7), and a heat dissipation fan (8) is nested in the middle of the connecting plate; the bottom of the housing (1) is structured with an air outlet located below the heat dissipation fan (8), and a dustproof net (9) is nested on the inner side of the air outlet.

2. A water-type mold temperature controller with a cooling device according to claim 1, characterized in that: One side of the housing (1) is provided with an inspection port corresponding to the heater (3), and the inspection port is hinged with a baffle (13), and a lock is installed between the baffle (13) and the corresponding side of the inspection port.

3. The water-type mold temperature controller with a cooling device according to claim 1, characterized in that: A control panel (19) is installed on one side of the housing (1), and the control panel (19) is electrically connected to the water pump (4), the electric heater, and the solenoid valve respectively.

4. The water-type mold temperature controller with a cooling device according to claim 1, characterized in that: A return pipe (5) is installed between the corresponding sides of the heater (3) and the water tank (2), and a water pump (4) is installed on the side wall of the return pipe (5).

5. The water-type mold temperature controller with a cooling device according to claim 4, characterized in that: The water pump (4) is installed at the inner bottom of the outer shell (1), and a vibration-damping pad (18) is installed at the connection between the water pump (4) and the outer shell (1).

6. The water-type mold temperature controller with a cooling device according to claim 1, characterized in that: Moving wheels (15) with a braking function are installed at the four corners of the bottom of the housing (1), and a handle (16) is installed on the upper part of the outer wall of one side of the housing (1).

7. The water-type mold temperature controller with a cooling device according to claim 1, characterized in that: A lighting lamp (14) located above the heater (3) is installed on the inner top of the housing (1).

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