Mould in form of water cooling demoulding

Abstract

The utility model discloses a mold in a water cooling demolding form, which relates to the technical field of injection molds and comprises a base, a female mold is arranged on the upper surface of the base, a supporting plate is fixedly connected to the upper end face of a supporting rod, a pneumatic telescopic rod is mounted on the upper surface of the supporting plate, and a male mold is fixedly connected to the telescopic end of the pneumatic telescopic rod. The telescopic end of the pneumatic telescopic rod penetrates through the supporting plate, a spring is fixedly connected to the inner bottom face of the female die, a lifting bottom plate is fixedly connected to the other end of the spring, a limiting rod is fixedly connected to the lower surface of the lifting bottom plate, a first water tank is installed on the right side face of the base, and a controller is installed on the surface of the first water tank; according to the mold taking-out device, the purpose of rapidly taking out a formed mold from the female mold is achieved through the arrangement of the spring, the lifting bottom plate and the limiting rod, and the purpose of improving the working efficiency is achieved through the arrangement of the first water tank and the second water tank.

Description

Technical Field

[0001] The utility model relates to the technical field of injection molds, in particular to a water-cooling demoulding mold. Background Art

[0002] Injection molding is a method for producing industrial products. Products usually use rubber injection molding and plastic injection molding. Injection molding can also be divided into injection molding compression molding and die casting. Injection molding machine (referred to as injection machine or injection molding machine) is the main molding equipment that uses plastic molding molds to make plastic products of various shapes of thermoplastics or thermosetting materials. Injection molding is achieved through injection molding machines and molds. At present, most injection molds on the market are inconvenient to use. Not only is the demoulding effect poor, it is difficult to achieve rapid separation between the injection molded product and the mold, affecting the injection molding production efficiency, and it is difficult to quickly cool down after injection molding. Demolding affects the operation of the staff and increases the burden on the staff. Therefore, we propose an injection mold that is easy to cool and demould.

[0003] In the Chinese utility model patent application disclosure CN219903197U, an injection mold that is easy to cool and demold is disclosed. Although the utility model solves the problem that the existing injection mold needs to be manually peeled off and removed by the human body through the cooperation between the limiting demolding unit and the lifting and pushing unit, which leads to reduced demolding efficiency, the cooperation between the driving motor, the active gear and the meshing gear plate can provide power output for the up and down movement of the meshing gear plate, so as to ensure that the push plate ejects the injection mold that has been cooled and formed, and realizes rapid demolding, avoids the situation that the injection molded product and the lower injection mold are tightly fitted and difficult to peel off, reduces the pressure of manual peeling, and improves the demolding efficiency. However, when the demolding work is carried out continuously, long-term use will cause the water temperature to rise, resulting in poor water cooling effect, affecting the normal work process, and having the disadvantage of low work efficiency. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a water-cooling demoulding mold, which solves the problems raised in the above-mentioned background technology.

[0005] To achieve the above purpose, the utility model is implemented through the following technical solutions: a water-cooled demoulding type mold, including a base, the upper surface of the base is provided with a concave mold, the upper surface of the base is fixedly connected to a support rod, the upper end surface of the support rod is fixedly connected to a support plate, the upper surface of the support plate is installed with a pneumatic telescopic rod, the telescopic end of the pneumatic telescopic rod is fixedly connected to a male mold, the telescopic end of the pneumatic telescopic rod passes through the support plate, the inner bottom surface of the concave mold is fixedly connected to a spring, the other end of the spring is fixedly connected to a lifting bottom plate, the lower surface of the lifting bottom plate is fixedly connected to a limiting rod, the right side of the base is installed with a first water tank, the surface of the first water tank is installed with a controller, and the first A semiconductor refrigerator is installed on the right side of the water tank, a first water pump is installed on the upper surface of the first water tank, the water inlet end of the first water pump is arranged in the first water tank, the output end of the first water pump is arranged with a first water inlet pipe, a first cooling cavity is opened inside the base, one end of the first water inlet pipe away from the first water pump is arranged in the first cooling cavity, a second water tank is installed on the left side of the base, a first water outlet pipe is arranged on the left side of the base, one end of the first water outlet pipe is arranged in the first cooling cavity, the other end of the first water outlet pipe is arranged in the second water tank, a second water pump is installed on the upper surface of the first water tank, the output end of the second water pump is arranged with a second water inlet pipe, and a second cooling cavity is opened inside the punch.

[0006] Optionally, the number of the springs and the number of the limiting rods are four, and they are distributed in a rectangular array.

[0007] Optionally, the refrigeration end of the semiconductor refrigerator is arranged in a first water tank, and a water level sensor is installed on the inner surface of the first water tank, and the water level sensor is electrically connected to the controller through a wire.

[0008] Optionally, the water inlet end of the second water pump is arranged in the first water tank, and the end of the second water inlet pipe away from the second water pump is arranged in the second cooling chamber.

[0009] Optionally, the semiconductor refrigerator, the water level sensor, the controller, the first water pump, the first water inlet pipe, the first water outlet pipe, the second water pump, the second water inlet pipe and the second water outlet pipe are each two in number and are symmetrically distributed on both sides of the base.

[0010] Optionally, a second water outlet pipe is arranged on the left side of the punch, one end of the second water outlet pipe is arranged in the second cooling cavity, and the other end of the second water outlet pipe is arranged in the second water tank. Beneficial Effects

[0011] The utility model provides a water cooling demoulding type mold, which has the following beneficial effects:

[0012] 1. The mold of the water-cooled demoulding type has the effect of facilitating the removal of the model through the arrangement of the spring, the lifting bottom plate and the limiting rod. When in use, after the raw material is injected into the die, the telescopic end of the pneumatic telescopic rod is controlled to extend outward, and the punch is driven downward by the pneumatic telescopic rod to make the punch enter the die and then squeeze the raw material on the upper surface of the die. During the extrusion process, the raw material is squeezed between the punch and the lifting bottom plate, and the lifting bottom plate is subjected to a downward force to shrink the spring. When the lower surface of the limiting rod contacts the ground of the die, the lifting bottom plate is limited. At this time, the raw material is compression-molded. After the cooling and molding is completed, the pneumatic telescopic rod controls the punch to move upward. While the punch moves, the spring's own elastic force is released, so that the lifting bottom plate moves upward on the inner surface of the die, and the model on the upper surface of the lifting bottom plate is pushed out of the die through the lifting bottom plate that moves upward, thereby achieving the purpose of quickly taking the molded model out of the die.

[0013] 2. The mold of the water-cooling demolding type has the effect of improving the cooling effect through the arrangement of the first water tank and the second water tank. When in use, after compression molding through the convex mold, when the compression molded model is cooled, the water in the first water tank is cooled under the action of the semiconductor refrigerator. When the semiconductor refrigerator is working, when a direct current passes through the semiconductor refrigerator, the Peltier effect will cause heat to transfer between the two semiconductor materials. When the current passes through the semiconductor material, the material on one side will absorb heat, while the other side will release heat, thus achieving a cooling effect, making one side colder and the other side hotter. The cooling end is arranged in the first water tank, and the cooled water in the first water tank is pumped into the first water inlet pipe through the first water pump, and then enters the first cooling chamber through the first water inlet pipe. After the cooling water in the first cooling chamber is filled, it enters the second water tank through the first water outlet pipe. When the cooling water is in the first cooling chamber, the model in the concave mold is subjected to heat absorption and cooling, which plays a role in the appearance of the model. At the same time, under the action of the second water pump, the cooling water is pumped into the second cooling chamber through the second water inlet pipe. After the second cooling chamber is filled with cooling water, it enters the second water tank through the second water outlet pipe. When the cooling water is in the second cooling chamber, the punch is cooled by heat transfer, and then the inner surface of the model is cooled, thereby playing a role in cooling the formed model. The water level in the first water tank is monitored by the water level sensor. When the water in the first water tank is used up, the first water pump and the second water pump stop working. At this time, the first water pump and the second water pump located on the upper surface of the second water tank start working. Similarly, the water in the second water tank is cooled by the semiconductor refrigerator installed on the outer surface of the second water tank. The cooling process starts when the cooling water enters the second water tank. In this cycle, the cooling water in the first water tank and the second water tank is used back and forth, and the two semiconductor refrigerators are used alternately, which plays a role in preventing the water temperature from rising all the time, and can keep the cooling effect all the time, so that the work can be carried out all the time, thereby achieving the purpose of improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0015] Figure 2 It is a structural schematic diagram of the cross section of the base of the utility model;

[0016] Figure 3 For this utility model Figure 2 The structural diagram at A in the middle;

[0017] Figure 4 It is a structural schematic diagram of a partial cross section of the utility model;

[0018] Figure 5 It is a schematic diagram of the structure of the utility model from a top view.

[0019] In the figure: 1. base; 2. die; 3. support rod; 4. support plate; 5. pneumatic telescopic rod; 6. punch; 7. spring; 8. lifting base plate; 9. limit rod; 10. first cooling chamber; 11. first water tank; 12. semiconductor refrigerator; 14. water level sensor; 15. controller; 16. first water pump; 17. first water inlet pipe; 18. second water tank; 19. first water outlet pipe; 20. second cooling chamber; 21. second water pump; 22. second water inlet pipe; 23. second water outlet pipe. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Example 1

[0021] See also Figures 1 to 3 The utility model provides a technical solution: a water-cooled demoulding type mold, including a base 1, a concave mold 2 is opened on the upper surface of the base 1, a support rod 3 is fixedly connected to the upper surface of the base 1, and the upper end surface of the support rod 3 is fixedly connected to the support plate 4, a pneumatic telescopic rod 5 is installed on the upper surface of the support plate 4, and the telescopic end of the pneumatic telescopic rod 5 is fixedly connected to the punch 6, and the telescopic end of the pneumatic telescopic rod 5 passes through the support plate 4, and a spring 7 is fixedly connected to the inner bottom surface of the concave mold 2, and the other end of the spring 7 is fixedly connected to the lifting bottom plate 8, and the lower surface of the lifting bottom plate 8 is fixedly connected to a limit rod 9, and the number of the spring 7 and the limit rod 9 are both four, and they are distributed in a rectangular array.

[0022] The cam 6 is pushed down by the pneumatic telescopic rod 5 so that the cam 6 can enter the cavity 2 and squeeze the raw material on the upper surface of the cavity 2. In the process of squeezing, the raw material is squeezed between the cam 6 and the lifting bottom plate 8. The lifting bottom plate 8 is subjected to a downward force, which causes the spring 7 to contract. When the lower surface of the limiting rod 9 contacts the ground of the cavity 2, the lifting bottom plate 8 is limited. At this time, the raw material is compression-molded. After the cooling molding is completed, the pneumatic telescopic rod 5 controls the cam 6 to move upward. While the cam 6 moves, the elastic force of the spring 7 is released, so that the lifting bottom plate 8 moves upward on the inner surface of the cavity 2. The model on the upper surface of the lifting bottom plate 8 is pushed out from the cavity 2 by the lifting bottom plate 8 that moves upward, thereby achieving the purpose of quickly taking the molded model out of the cavity 2. Example 2

[0023] See also Figures 1 to 5The utility model provides a technical solution: a water-cooled demoulding type mold, comprising a base 1, a concave mold 2 is provided on the upper surface of the base 1, a support rod 3 is fixedly connected to the upper surface of the base 1, a support plate 4 is fixedly connected to the upper end surface of the support rod 3, a pneumatic telescopic rod 5 is installed on the upper surface of the support plate 4, a convex mold 6 is fixedly connected to the telescopic end of the pneumatic telescopic rod 5, and the telescopic end of the pneumatic telescopic rod 5 passes through the support plate 4, a spring 7 is fixedly connected to the inner bottom surface of the concave mold 2, and the other end of the spring 7 is fixedly connected to a lifting bottom plate 8, and a limit rod 9 is fixedly connected to the lower surface of the lifting bottom plate 8, A first water tank 11 is installed on the right side of the base 1, a controller 15 is installed on the surface of the first water tank 11, a semiconductor refrigerator 12 is installed on the right side of the first water tank 11, a cooling end of the semiconductor refrigerator 12 is arranged in the first water tank 11, a water level sensor 14 is installed on the inner surface of the first water tank 11, and the water level sensor 14 is electrically connected to the controller 15 through a wire, a first water pump 16 is installed on the upper surface of the first water tank 11, a water inlet end of the first water pump 16 is arranged in the first water tank 11, and a first water inlet pipe 17 is arranged at the output end of the first water pump 16. A first cooling chamber 10 is provided on the base 1, one end of a first water inlet pipe 17 away from the first water pump 16 is arranged in the first cooling chamber 10, a second water tank 18 is installed on the left side of the base 1, a first water outlet pipe 19 is arranged on the left side of the base 1, one end of the first water outlet pipe 19 is arranged in the first cooling chamber 10, and the other end of the first water outlet pipe 19 is arranged in the second water tank 18, a second water pump 21 is installed on the upper surface of the first water tank 11, the water inlet end of the second water pump 21 is arranged in the first water tank 11, and one end of a second water inlet pipe 22 away from the second water pump 21 is arranged in the second cooling chamber 20 A second water inlet pipe 22 is provided at the output end of the second water pump 21, a second cooling chamber 20 is opened inside the punch 6, the semiconductor refrigerator 12, the water level sensor 14, the controller 15, the first water pump 16, the first water inlet pipe 17, the first water outlet pipe 19, the second water pump 21, the second water inlet pipe 22 and the second water outlet pipe 23 are all two in number and are symmetrically distributed on both sides of the base 1, a second water outlet pipe 23 is provided on the left side of the punch 6, one end of the second water outlet pipe 23 is provided in the second cooling chamber 20, and the other end of the second water outlet pipe 23 is provided in the second water tank 18.

[0024] In order to achieve the purpose of improving work efficiency, when in use, after compression molding by the male mold 6, when the compression molded model is cooled, the water in the first water tank 11 is cooled under the action of the semiconductor refrigerator 12. When the semiconductor refrigerator 12 is working, when a direct current passes through the semiconductor refrigerator 12, the Peltier effect causes heat to transfer between the two semiconductor materials. When the current passes through the semiconductor material, the material on one side absorbs heat, while the other side releases heat, thus achieving a cooling effect, so that one side The first side of the cooling water tank 11 is cooled, and the other side is heated. The cooling end is arranged in the first water tank 11. The cooled water in the first water tank 11 is pumped into the first water inlet pipe 17 through the first water pump 16, and then enters the first cooling chamber 10 through the first water inlet pipe 17. After the cooling water in the first cooling chamber 10 is filled, it enters the second water tank 18 through the first water outlet pipe 19. When the cooling water is in the first cooling chamber 10, the model in the concave mold 2 is heat-absorbed and cooled, and the outer surface of the model is cooled. At the same time, under the action of the second water pump 21, the cooling water is passed through the cooling chamber 10. The cooling water is pumped into the second cooling chamber 20 through the second water inlet pipe 22. After the second cooling chamber 20 is filled with cooling water, the cooling water enters the second water tank 18 through the second water outlet pipe 23. When the cooling water is in the second cooling chamber 20, the punch 6 is cooled by heat transfer, and then the inner surface of the model is cooled, thereby playing a role in cooling the mold after molding. The water level in the first water tank 11 is monitored by the water level sensor 14. When the water in the first water tank 11 is used up, the first water pump 16 and the second water pump 21 stop working. At this time, the second water tank 11 is located at the bottom of the second water tank 18. The first water pump 16 and the second water pump 21 on the upper surface of 18 start to work. Similarly, the water in the second water tank 18 is cooled by the semiconductor refrigerator 12 installed on the outer surface of the second water tank 18. The cooling process starts when the cooling water enters the second water tank 18, and the cycle continues. The cooling water in the first water tank 11 and the second water tank 18 is used back and forth, and the two semiconductor refrigerators 12 are used alternately, which prevents the water temperature from rising continuously, keeps the cooling effect, and thus allows the work to continue, thereby achieving the purpose of improving work efficiency.

[0025] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A water-cooled demoulding mold, comprising a base, Features: The upper surface of the base is provided with a concave mold, the upper surface of the base is fixedly connected with a support rod, the upper end surface of the support rod is fixedly connected with a support plate, the upper surface of the support plate is installed with a pneumatic telescopic rod, the telescopic end of the pneumatic telescopic rod is fixedly connected with a punch, the telescopic end of the pneumatic telescopic rod passes through the support plate, the inner bottom surface of the concave mold is fixedly connected with a spring, the other end of the spring is fixedly connected with a lifting bottom plate, the lower surface of the lifting bottom plate is fixedly connected with a limiting rod, the right side of the base is installed with a first water tank, the surface of the first water tank is installed with a controller, the right side of the first water tank is installed with a semiconductor refrigerator, the upper surface of the first water tank A first water pump is installed on the surface, the water inlet end of the first water pump is arranged in the first water tank, the output end of the first water pump is arranged with a first water inlet pipe, a first cooling cavity is opened inside the base, one end of the first water inlet pipe away from the first water pump is arranged in the first cooling cavity, a second water tank is installed on the left side of the base, a first water outlet pipe is arranged on the left side of the base, one end of the first water outlet pipe is arranged in the first cooling cavity, the other end of the first water outlet pipe is arranged in the second water tank, a second water pump is installed on the upper surface of the first water tank, a second water inlet pipe is arranged at the output end of the second water pump, and a second cooling cavity is opened inside the punch.

2. A water-cooled demoulding mold according to claim 1, Features: The number of the springs and the number of the limiting rods are both four and they are distributed in a rectangular array.

3. A water-cooled demoulding mold according to claim 1, Features: The refrigeration end of the semiconductor refrigerator is arranged in the first water tank, and a water level sensor is installed on the inner surface of the first water tank. The water level sensor is electrically connected to the controller through a wire.

4. A water-cooled demoulding mold according to claim 1, Features: The water inlet end of the second water pump is arranged in the first water tank, and the end of the second water inlet pipe away from the second water pump is arranged in the second cooling cavity.

5. A water-cooled demoulding mold according to claim 1, Features: The semiconductor refrigerator, the water level sensor, the controller, the first water pump, the first water inlet pipe, the first water outlet pipe, the second water pump, the second water inlet pipe and the second water outlet pipe are all in two numbers and are symmetrically distributed on both sides of the base.

6. A water-cooled demoulding mold according to claim 1, Features: A second water outlet pipe is arranged on the left side of the punch, one end of the second water outlet pipe is arranged in the second cooling cavity, and the other end of the second water outlet pipe is arranged in the second water tank.

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