Sensor circuit board heating circuit
By designing a heating circuit on the sensor circuit board, and using the MCU microcontroller to control the heating resistance and temperature measurement resistance, the closed-loop control of the circuit board temperature is achieved, which solves the problem of circuit board temperature control in low-temperature environments and improves the measurement accuracy.
Patent Information
- Application Number
- CN202420258006.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-02
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-02-02
AI Technical Summary
The prior art is difficult to effectively control the temperature of electronic product circuit boards in low temperature environments, resulting in the chip measurement accuracy being affected and high-precision measurements cannot be achieved in low temperature environments.
Design a sensor circuit board heating circuit, including a power module and an MCU microcontroller, connect the heating resistor and the ADC sampling terminal to connect the temperature measurement resistor to realize heating and temperature feedback on the circuit board, and use the PID algorithm to perform closed-loop control. , keep the chip at a constant temperature.
It realizes constant temperature control of circuit boards and chips in low temperature environments, improves measurement accuracy, and adapts to low temperature working environments.
Smart Images
Figure CN222145429U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board temperature control, in particular to a sensor circuit board heating circuit. Background Art
[0002] At present, many electronic products have the need to work in low-temperature climate environments. For example, in many areas in northern my country, the temperature can drop to 0℃~-40℃ in winter. However, many electronic products are limited by the operating temperature range of electronic materials (especially chips), and it is difficult to adapt to low-temperature working environments. At present, the temperature control of electronic product circuit boards is more about cooling operations, such as water cooling and air cooling. There is still a lack of heating and heat preservation means for circuit boards. Due to the different temperature drift characteristics of chips, the measurement accuracy is seriously affected by temperature, and high-precision measurement cannot be achieved well. The utility model designs a heating circuit, which heats the circuit board itself to a certain temperature, so that the chip can be kept at a constant temperature, thereby achieving high-precision low-temperature drift measurement. Utility Model Content
[0003] In order to solve the problems in the above background technology, the technical solution adopted by the utility model to solve the technical problem is: a sensor circuit board heating circuit, which includes: a power module and an MCU microcontroller, the power module is electrically connected to the MCU microcontroller, the MCU microcontroller is provided with a PWM control end and an ADC sampling end, the MCU microcontroller is electrically connected to a heating resistor through the PWM control end, and the MCU microcontroller is electrically connected to a temperature measuring resistor through the ADC sampling end.
[0004] As a preferred technical solution of the utility model, the heating resistors include R3, R4, R7, and R10, and one end pins of R3, R4, R7, and R10 are connected in parallel to the power module.
[0005] As a preferred technical solution of the present utility model, the other end pin of R3 is electrically connected to transistor Q1, the other end pin of R4 is electrically connected to transistor Q2, the other end pin of R7 is electrically connected to transistor Q3, and the other end pin of R10 is electrically connected to transistor Q4.
[0006] As a preferred technical solution of the present utility model, R1 and R2 are electrically connected in parallel at one end of the transistor Q1, and the pins of R1 and one end of the transistor Q1 are both connected to the ground wire GND; R5 and R6 are electrically connected in parallel at one end of the transistor Q2, and the pins of R5 and one end of the transistor Q2 are both connected to the ground wire GND.
[0007] As a preferred technical solution of the present utility model, one end of the transistor Q3 is electrically connected in parallel with R8 and R9, and the pins of R8 and one end of the transistor Q3 are both connected to the ground wire GND; one end of the transistor Q4 is electrically connected in parallel with R11 and R12, and the pins of R11 and one end of the transistor Q4 are both connected to the ground wire GND.
[0008] As a preferred technical solution of the present utility model, the PWM control is electrically connected in parallel to one end of the R2, R6, R9, and R12 pins, the temperature measuring resistors include RT1, RT2, RT3, and RT4, and one end of the RT1, RT2, RT3, and RT4 pins is electrically connected in parallel to the ADC sampling end.
[0009] As a preferred technical solution of the utility model, the RT1, RT2, RT3 and RT4 are all NTC resistors, the other ends of the RT1, RT2, RT3 and RT4 pins are connected in parallel with R13, R14, R15, R16 and R17, and one end of the R13, R14, R15, R16 and R17 pins are connected in parallel to the ADC sampling end.
[0010] As a preferred technical solution of the present invention, the resistance values of R3, R4, R7 and R10 are the same, and the resistance values of R3, R4, R7 and R10 are all 100Ω.
[0011] As a preferred technical solution of the present utility model, the MCU microcontroller is also provided with a 458 communication circuit.
[0012] The utility model has the following advantages: the MCU microcontroller controls R3, R4, R7, and R10 through the PWM control terminal to turn on or off the power supply, thereby heating the circuit board, and obtains the real-time circuit board temperature by sampling the impedance of the NTC resistor to achieve closed-loop control. The heating circuit formed can ensure that the circuit board and the chip on the circuit board are at a relatively constant temperature, thereby achieving high-precision measurement. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a circuit diagram of a preferred embodiment of the utility model;
[0014] Figure 2 This is a schematic diagram of the operating principle of the circuit board heating circuit of the preferred embodiment of the utility model;
[0015] Figure 3 This is a schematic diagram of the operating principle of the power module circuit of the preferred embodiment of the utility model;
[0016] Figure 4 It is a schematic diagram of the operation principle of the communication circuit of structure 458 of the preferred embodiment of the utility model;
[0017] Figure 5 This is a schematic diagram of the operating principle of the MCU circuit of the preferred embodiment of the utility model;
[0018] Figure 6 This is a schematic diagram of the operating principle of the RT1 and RT2 temperature measurement network circuits of the preferred embodiment of the utility model;
[0019] Figure 7 It is a schematic diagram of the operating principle of the RT3 and RT4 temperature measurement network circuits of the preferred embodiment of the utility model. DETAILED DESCRIPTION
[0020] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0022] The utility model will be further described below in conjunction with the accompanying drawings.
[0023] Please refer to Figure 1-Figure 6 The utility model discloses a sensor circuit board heating circuit, comprising: a power module and an MCU microcontroller, the power module is electrically connected to the MCU microcontroller, the MCU microcontroller is provided with a PWM control terminal and an ADC sampling terminal, the MCU microcontroller is electrically connected to a heating resistor through the PWM control terminal, and the MCU microcontroller is electrically connected to a temperature measuring resistor through the ADC sampling terminal.
[0024] Among them, the heating resistors include R3, R4, R7, and R10, and the pins at one end of R3, R4, R7, and R10 are connected in parallel to the power module, the pin at the other end of R3 is electrically connected to the transistor Q1, the pin at the other end of R4 is electrically connected to the transistor Q2, the pin at the other end of R7 is electrically connected to the transistor Q3, the pin at the other end of R10 is electrically connected to the transistor Q4, one end of the transistor Q1 is electrically connected to R1 and R2 in parallel, and the pins at one end of R1 and the transistor Q1 are both connected to the ground wire GND, one end of the transistor Q2 is electrically connected to R5 and R6 in parallel, and the pins at one end of R5 and the transistor Q2 are both connected to the ground wire GND.
[0025] Among them, one end of the transistor Q3 is electrically connected in parallel with R8 and R9, and the pins of R8 and one end of the transistor Q3 are connected to the ground wire GND. One end of the transistor Q4 is electrically connected in parallel with R11 and R12, and the pins of R11 and one end of the transistor Q4 are connected to the ground wire GND. The PWM control is electrically connected in parallel with one end of the pins of R2, R6, R9, and R12. The temperature measuring resistors include RT1, RT2, RT3, and RT4. One end of the pins of RT1, RT2, RT3, and RT4 is electrically connected in parallel to the ADC. At the sampling end, RT1, RT2, RT3 and RT4 are all NTC resistors, and the other end of the RT1, RT2, RT3 and RT4 pins are connected in parallel with R13, R14, R15, R16 and R17. One end of the R13, R14, R15, R16 and R17 pins are connected in parallel to the ADC sampling end. The resistance values of R3, R4, R7 and R10 are the same, and the resistance values of R3, R4, R7 and R10 are all 100Ω. The MCU microcontroller is also equipped with a 458 communication circuit.
[0026] In summary, the MCU microcontroller controls R3, R4, R7, and R10 through the PWM control end to turn on or off the power supply, thereby heating the circuit board; the MCU microcontroller samples the temperature on the circuit board through the ADC sampling segment in conjunction with RT1, RT2, RT3, and RT4 to achieve temperature feedback, and then controls PWM through the PID algorithm to achieve a stable temperature.
[0027] The above are only preferred implementations of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
[0028] Other parts of the present invention not described in detail belong to the prior art and will not be described in detail here.
[0029] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.
Claims
1. A sensor circuit board heating circuit, characterized in that: include: A power supply module and an MCU microcontroller, wherein the power supply module is electrically connected to the MCU microcontroller, the MCU microcontroller is provided with a PWM control terminal and an ADC sampling terminal, the MCU microcontroller is electrically connected to a heating resistor via the PWM control terminal, and the MCU microcontroller is electrically connected to a temperature measuring resistor via the ADC sampling terminal, and the real-time circuit board temperature is obtained by sampling the impedance of the NTC resistor to achieve closed-loop control.
2. A sensor circuit board heating circuit as claimed in claim 1, characterized in that: The heating resistors include R3, R4, R7, and R10, and one end pin of R3, R4, R7, and R10 is connected in parallel to the power module.
3. A sensor circuit board heating circuit as claimed in claim 2, characterized in that: The other end pin of R3 is electrically connected to transistor Q1, the other end pin of R4 is electrically connected to transistor Q2, the other end pin of R7 is electrically connected to transistor Q3, and the other end pin of R10 is electrically connected to transistor Q4.
4. A sensor circuit board heating circuit as claimed in claim 3, characterized in that: One end of the transistor Q1 is electrically connected to R1 and R2 in parallel, and the pins of R1 and one end of the transistor Q1 are both connected to the ground line GND. One end of the transistor Q2 is electrically connected to R5 and R6 in parallel, and the pins of R5 and one end of the transistor Q2 are both connected to the ground line GND.
5. A sensor circuit board heating circuit as claimed in claim 3, characterized in that: One end of the transistor Q3 is electrically connected to R8 and R9 in parallel, and the pins of R8 and one end of the transistor Q3 are both connected to the ground line GND. One end of the transistor Q4 is electrically connected to R11 and R12 in parallel, and the pins of R11 and one end of the transistor Q4 are both connected to the ground line GND.
6. A sensor circuit board heating circuit as claimed in claim 1, characterized in that: The PWM control is electrically connected in parallel to one end of the pins R2, R6, R9, and R12. The temperature measuring resistors include RT1, RT2, RT3, and RT4. One end of the pins RT1, RT2, RT3, and RT4 is electrically connected in parallel to the ADC sampling end.
7. A sensor circuit board heating circuit as claimed in claim 6, characterized in that: The RT1, RT2, RT3 and RT4 are all NTC resistors, and the other ends of the RT1, RT2, RT3 and RT4 pins are connected in parallel with R13, R14, R15, R16 and R17, and one end of the R13, R14, R15, R16 and R17 pins are connected in parallel to the ADC sampling end.
8. A sensor circuit board heating circuit as claimed in claim 2, characterized in that: The resistance values of R3, R4, R7 and R10 are the same, and the resistance values of R3, R4, R7 and R10 are all 100Ω.
9. A sensor circuit board heating circuit as claimed in claim 1, characterized in that: The MCU microcontroller is also provided with a 458 communication circuit.