Double-sided heat dissipation device for computer mainboard

Abstract

The utility model discloses a computer mainboard double-face heat dissipation device, and particularly relates to the technical field of computer heat dissipation, the computer mainboard double-face heat dissipation device comprises a first heat conduction plate, a first heat conduction copper pipe is connected in the first heat conduction plate in a penetrating mode, cooling liquid is added in the first heat conduction copper pipe, one end of the first heat conduction copper pipe is connected with a first hose, and the other end of the first hose is connected with a second hose. A heat dissipation mechanism is arranged at one end of the first hose; a direct-current water pump is started, low-temperature cooling liquid in a third heat conduction copper pipe is guided into a first heat conduction copper pipe through a first hose, then guided into a first flow dividing pipe and a second heat conduction copper pipe through a second hose, and finally guided into the third heat conduction copper pipe again through a third hose; the back face of a mainboard and the surface of a CPU are conveniently cooled through low-temperature cooling liquid, meanwhile, an air inlet fan and an exhaust fan are started, cooling of cooling liquid in cooling fins and a third heat conduction copper pipe is accelerated, the effect of circulating cooling is achieved, and then the two faces of a computer are conveniently cooled.

Description

Technical Field

[0001] The utility model relates to the technical field of computer heat dissipation, in particular to a double-sided heat dissipation device for a computer mainboard. Background Art

[0002] There are many reasons why the computer motherboard heats up, mainly because the CPU on the computer motherboard heats up. The CPU is one of the most important components on the motherboard, and its operation will generate a lot of heat. If the heat dissipation is poor or the system load is too high, it will cause the motherboard to overheat. In general, the motherboard heats up due to the heat generated by the operation of various hardware components on the motherboard, which needs to be dissipated by a radiator.

[0003] At present, computer motherboard heat dissipation is generally achieved by opening multiple heat dissipation holes inside the case and installing several cooling fans to achieve air circulation inside the case, thereby achieving the purpose of reducing the temperature of the motherboard. However, the heat dissipation efficiency is not high. The cooling fan mainly cools one side of the motherboard, while the other side lacks heat dissipation, which is prone to poor heat dissipation. Utility Model Content

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A double-sided heat dissipation device for a computer mainboard, comprising:

[0006] A first heat-conducting plate, wherein a first heat-conducting copper tube is connected through the interior of the first heat-conducting plate, a coolant is added inside the first heat-conducting copper tube, one end of the first heat-conducting copper tube is connected to a first hose, and one end of the first hose is provided with a heat dissipation mechanism;

[0007] One end of the heat dissipation mechanism is connected to a third hose, one end of the third hose is connected to a second shunt pipe, five second heat-conducting copper tubes are connected to the outside of the second shunt pipe, the outside of the five second heat-conducting copper tubes is connected to a second heat-conducting plate, and one end of the five second heat-conducting copper tubes extends to the outside of the second heat-conducting plate and is connected to the first shunt pipe, the outside of the first shunt pipe is connected to a second hose, and one end of the second hose is fixedly connected to the first heat-conducting copper tube.

[0008] In a possible implementation, the heat dissipation mechanism includes a third heat-conducting copper tube connected to one end of the first hose, the outer side of the third heat-conducting copper tube is connected to a heat dissipation fin, and one end of the third heat-conducting copper tube extends to the outer side of the heat dissipation fin and is connected to a DC water pump, and one end of the water inlet of the DC water pump is fixedly connected to the third hose;

[0009] The left side of the heat dissipation fin is connected to an inlet fan, and the right side of the heat dissipation fin is connected to an exhaust fan.

[0010] In a possible implementation manner, a pair of first mounting plates are connected to both sides of the first heat conducting plate.

[0011] In a possible implementation manner, a pair of second mounting plates are connected to both sides of the second heat conducting plate.

[0012] In a possible implementation manner, the first heat-conducting copper tube is configured to be in a serpentine shape.

[0013] In a possible implementation manner, the third heat-conducting copper tube is configured to be in a serpentine shape.

[0014] In the above technical solution, the technical effects and advantages provided by the utility model are:

[0015] The top surface of the first heat conducting plate is attached to the back of the motherboard, and the bottom surface of the second heat conducting plate is attached to the surface of the CPU. Silicone grease is applied to the top surface of the first heat conducting plate and the bottom surface of the second heat conducting plate to facilitate the heat from the back of the motherboard to be exported to the first heat conducting plate, and the heat from the front of the motherboard to be exported to the second heat conducting plate. The DC water pump is turned on to introduce the low-temperature coolant inside the third heat conducting copper tube into the first heat conducting copper tube through the first hose, and then into the first shunt tube and the second heat conducting copper tube through the second hose, and finally reintroduced into the third heat conducting copper tube through the third hose. The low-temperature coolant is used to dissipate heat from the back of the motherboard and the surface of the CPU. At the same time, the inlet fan and the exhaust fan are turned on to accelerate the heat dissipation of the cooling fins and the coolant in the third heat conducting copper tube, so as to achieve the effect of circulating heat dissipation and cooling, thereby facilitating heat dissipation and cooling of both sides of the computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is a rear view of the utility model;

[0019] Figure 3 It is a cross-sectional view of the first heat conducting plate of the utility model.

[0020] Description of reference numerals:

[0021] 1. Exhaust fan; 2. Heat sink fins; 3. Inlet fan; 4. First hose; 5. First mounting plate; 6. First heat conduction plate; 7. Second hose; 8. First heat conduction copper tube; 9. First shunt tube; 10. Second heat conduction plate; 11. Second mounting plate; 12. Second heat conduction copper tube; 13. Third hose; 14. Second shunt tube; 15. Third heat conduction copper tube; 16. Coolant; 17. DC water pump. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0023] The embodiments of the present application solve the problems in the prior art by providing a double-sided heat dissipation device for a computer motherboard.

[0024] The technical solution in the embodiment of the present application is to solve the above problems, and the overall idea is as follows:

[0025] Embodiment 1:

[0026] The specific structure of this embodiment is as follows: Figure 1-Figure 3 As shown, a double-sided heat dissipation device for a computer motherboard comprises:

[0027] A first heat conducting plate 6, the interior of which is penetrated by a first heat conducting copper tube 8, a coolant 16 is added to the interior of the first heat conducting copper tube 8, one end of the first heat conducting copper tube 8 is connected to a first hose 4, one end of the first hose 4 is provided with a heat dissipation mechanism, the inlet fan 3 and the exhaust fan 1 are turned on to accelerate the heat dissipation of the coolant 16 in the heat dissipation fins 2 and the third heat conducting copper tube 15, so as to achieve the effect of circulating heat dissipation and cooling;

[0028] A third hose 13 is connected to one end of the heat dissipation mechanism, one end of the third hose 13 is connected to a second shunt pipe 14, five second heat-conducting copper tubes 12 are connected to the outside of the second shunt pipe 14, the outside of the five second heat-conducting copper tubes 12 is connected to a second heat-conducting plate 10, and one end of the five second heat-conducting copper tubes 12 extends to the outside of the second heat-conducting plate 10 and is connected to the first shunt pipe 9, the outside of the first shunt pipe 9 is connected to a second hose 7, one end of the second hose 7 is fixedly connected to the first heat-conducting copper tube 8, the top surface of the first heat-conducting plate 6 is attached to the back of the motherboard, and the bottom surface of the second heat-conducting plate 10 is attached to the surface of the CPU, the top surface of the first heat-conducting plate 6 and the bottom surface of the second heat-conducting plate 10 are coated with silicone grease, so as to facilitate the heat from the back of the motherboard to be exported to the first heat-conducting plate 6, and the heat from the front of the motherboard to be exported to the second heat-conducting plate 10, and heat exchange is performed through the heat dissipation mechanism to achieve the effect of double-sided heat dissipation and cooling.

[0029] In some examples, the heat dissipation mechanism includes a third heat-conducting copper tube 15 connected to one end of the first hose 4, the outer side of the third heat-conducting copper tube 15 is connected to the heat dissipation fin 2, and one end of the third heat-conducting copper tube 15 extends to the outer side of the heat dissipation fin 2 and is connected to a DC water pump 17, one end of the water inlet of the DC water pump 17 is fixedly connected to the third hose 13, the DC water pump 17 is turned on, and the low-temperature coolant 16 inside the third heat-conducting copper tube 15 is introduced into the first heat-conducting copper tube 8 through the first hose 4, and then introduced into the first shunt tube 9 and the second heat-conducting copper tube 12 through the second hose 7, and finally re-introduced into the third heat-conducting copper tube 15 through the third hose 13, and the low-temperature coolant 16 is used to facilitate heat dissipation of the back of the motherboard and the surface of the CPU;

[0030] The left side of the heat sink 2 is connected to an inlet fan 3, and the right side of the heat sink 2 is connected to an exhaust fan 1. Turn on the inlet fan 3 and the exhaust fan 1 to accelerate the heat dissipation of the heat sink 2 and the coolant 16 in the third thermal copper tube 15 to achieve the effect of circulating heat dissipation and cooling. Fix the inlet fan 3 and the exhaust fan 1 at the air outlet position of the chassis.

[0031] In some examples, a pair of first mounting plates 5 are connected to both sides of the first heat conducting plate 6, and bolts are inserted into the first mounting plates 5 and the reserved holes of the chassis to facilitate fixing the first heat conducting plate 6 to the chassis.

[0032] In some examples, a pair of second mounting plates 11 are connected to both sides of the second heat conducting plate 10, and bolts are inserted into the second mounting plates 11 and the reserved holes of the chassis to facilitate fixing the second heat conducting plate 10 to the chassis.

[0033] In some examples, the first heat-conducting copper tube 8 is configured to be in a serpentine shape, which is beneficial to increase the contact area between the first heat-conducting copper tube 8 and the first heat-conducting plate 6 and improve the heat dissipation effect.

[0034] In some examples, the third heat-conducting copper tube 15 is configured in a serpentine shape, which is beneficial to increase the contact area between the third heat-conducting copper tube 15 and the heat dissipation fins 2 and improve the heat dissipation effect.

[0035] By adopting the above technical solution:

[0036] The top surface of the first heat conducting plate 6 is attached to the back of the mainboard, and the bottom surface of the second heat conducting plate 10 is attached to the surface of the CPU. The top surface of the first heat conducting plate 6 and the bottom surface of the second heat conducting plate 10 are both coated with silicone grease, so that the heat on the back of the mainboard is conveniently exported to the first heat conducting plate 6, and the heat in front of the mainboard is exported to the second heat conducting plate 10. The DC water pump 17 is turned on to introduce the low-temperature coolant 16 inside the third heat conducting copper tube 15 into the first heat conducting copper tube 8 through the first hose 4, and then introduced into the first shunt pipe 9 and the second heat conducting copper tube 12 through the second hose 7, and finally re-introduced into the third heat conducting copper tube 15 through the third hose 13. The low-temperature coolant 16 is used to conveniently dissipate heat from the back of the mainboard and the surface of the CPU. At the same time, the inlet fan 3 and the exhaust fan 1 are turned on to accelerate the heat dissipation of the coolant 16 in the heat sink fins 2 and the third heat conducting copper tube 15, so as to achieve the effect of circulating heat dissipation and cooling, thereby facilitating heat dissipation and cooling of both sides of the computer.

[0037] The above only describes some exemplary embodiments of the present invention by way of illustration. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A double-sided heat dissipation device for a computer motherboard, characterized in that: include: A first heat-conducting plate (6), wherein a first heat-conducting copper tube (8) is connected to the interior of the first heat-conducting plate (6), a cooling liquid (16) is added to the interior of the first heat-conducting copper tube (8), one end of the first heat-conducting copper tube (8) is connected to a first hose (4), and one end of the first hose (4) is provided with a heat dissipation mechanism; One end of the heat dissipation mechanism is connected to a third hose (13), one end of the third hose (13) is connected to a second shunt pipe (14), the outer side of the second shunt pipe (14) is connected to five second heat-conducting copper pipes (12), the outer sides of the five second heat-conducting copper pipes (12) are connected to a second heat-conducting plate (10), and one end of the five second heat-conducting copper pipes (12) extends to the outer side of the second heat-conducting plate (10) and is connected to a first shunt pipe (9), the outer side of the first shunt pipe (9) is connected to a second hose (7), and one end of the second hose (7) is fixedly connected to the first heat-conducting copper pipe (8).

2. A double-sided heat dissipation device for a computer motherboard according to claim 1, characterized in that: The heat dissipation mechanism comprises a third heat-conducting copper tube (15) connected to one end of the first hose (4); the outer side of the third heat-conducting copper tube (15) is connected to a heat dissipation fin (2); one end of the third heat-conducting copper tube (15) extends to the outer side of the heat dissipation fin (2) and is connected to a DC water pump (17); one end of the water inlet of the DC water pump (17) is fixedly connected to the third hose (13); The left side of the heat dissipation fin (2) is connected to an inlet fan (3), and the right side of the heat dissipation fin (2) is connected to an exhaust fan (1).

3. A double-sided heat sink for a computer motherboard according to claim 1, characterized in that: A pair of first mounting plates (5) are connected to both sides of the first heat conducting plate (6).

4. A double-sided heat sink for a computer motherboard according to claim 1, characterized in that: A pair of second mounting plates (11) are connected to both sides of the second heat conducting plate (10).

5. A double-sided heat dissipation device for a computer motherboard according to claim 1, characterized in that: The first heat-conducting copper tube (8) is configured in a serpentine shape.

6. A double-sided heat dissipation device for a computer motherboard according to claim 2, characterized in that: The third heat-conducting copper tube (15) is configured in a serpentine shape.

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