Locking structure and compressor

Abstract

The embodiment of the utility model provides a locking structure and a compressor, and the locking structure comprises a semiconductor element which is provided with a first side and a second side, and the wall surface of the second side is provided with a plurality of pins; the first positioning piece comprises a main body part, one side wall of the main body part is provided with a pressing part in an extending manner, the main body part is connected with the back plate, and the pressing part abuts against the position near the first side of the semiconductor element and is used for enabling the semiconductor element and the wall surface of the back plate to be mutually extruded. The first positioning piece comprises a main body part, the main body part extends to form a pressing part, the pressing part abuts against the semiconductor element, the second positioning piece is provided with a plurality of limiting holes, the limiting holes are matched with a plurality of pins on the semiconductor element, and then the semiconductor element can be positioned and installed.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor components, and in particular, relates to a locking structure and a compressor. Background Art

[0002] In the prior art, IGBT (insulated gate bipolar transistor chip) is a composite fully controlled voltage-driven power semiconductor device composed of a bipolar transistor and an insulated gate field effect transistor. IGBT is very suitable for use in converter systems with a DC voltage of 600V or above, such as AC motors, inverters, switching power supplies, lighting circuits, traction drives, etc. GBT is the core device for energy conversion and transmission, commonly known as the "CPU" of power electronic devices. It is widely used in rail transportation, smart grids, aerospace, electric vehicles, and new energy equipment.

[0003] The IGBT module is a modular semiconductor product that is packaged by IGBT (insulated gate bipolar transistor chip) and FWD (freewheeling diode chip) through a circuit bridge. The packaged IGBT module is directly used in inverters, UPS uninterruptible power supplies and other equipment.

[0004] The high-voltage IGBT component cannot be directly fixed by bolts, but can only be fixed by setting a stopper on the side. The first stopper plate of the first positioning member in the prior art is only provided with one mounting hole, and the mounting stability is poor. The second positioning member is a plate body pressed on the IGBT component, which lacks the fixing and guiding of the pins on the IGBT component.

[0005] To address the above problems, no effective solution has been proposed yet.

[0006] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the utility model and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology section of the utility model. Utility Model Content

[0007] The purpose of this application is to provide a locking structure and a compressor to solve the above problems.

[0008] The present application provides a locking structure, comprising:

[0009] A semiconductor element, the semiconductor element having a first side and a second side, a wall surface of the second side being provided with a plurality of pins;

[0010] A first positioning member, the first positioning member includes a main body, a side wall of the main body is extended to be provided with a pressing portion, the main body is connected to the back plate, and the pressing portion is in contact with the vicinity of the first side of the semiconductor element, so as to make the semiconductor element and the back plate wall squeeze each other;

[0011] A second positioning member, the second positioning member is fixedly connected to the back plate, the second positioning member is provided with a plurality of limiting holes at the second side close to the semiconductor element, and the plurality of pins are inserted into the plurality of limiting holes;

[0012] Among them, a guide sleeve is inserted into any of the limiting holes, the outer wall of the guide sleeve is fixedly connected to the inner wall of the limiting hole, and the shape of the inner wall of the guide sleeve imitates the shape of the outer wall of the pin, which is used to position and fix the pin.

[0013] Preferably, the distance between any one of the guide sleeves and the adjacent guide sleeve is greater than or equal to 8 mm.

[0014] Preferably, the main body portion in the first positioning member is extended to form a connecting portion, the connecting portion is extended to form the pressing portion, and the plane where the connecting portion is located is perpendicular to the plane where the main body portion is located.

[0015] Preferably, a positioning column is installed on the main body, a positioning hole is installed on the back plate, and the positioning column is inserted into the inner wall of the positioning hole to position the first positioning member.

[0016] Preferably, the first positioning member and the back plate are fixed by bolts.

[0017] Preferably, the second positioning member protrudes in a direction away from the position of the back plate to form a raised portion, and a plurality of limiting holes are formed on the raised portion.

[0018] Preferably, mounting portions are provided at two opposite ends of the second positioning member in a direction parallel to the first positioning member, the two mounting portions are centrally symmetrical, and the two mounting portions are connected to the back plate via fixing bolts.

[0019] Preferably, the second positioning member is provided with a first row portion and a second row portion, and the first row portion and the second row portion are both provided with a plurality of limiting holes for respectively connecting with pins on the two semiconductor elements.

[0020] Preferably, the first row of portions and the second row of portions are arranged in parallel, and the first row of portions and the second row of portions are both parallel to the first positioning member.

[0021] A compressor is characterized in that it comprises a back plate and a plurality of semiconductor chips, and any of the semiconductor chips is mounted on the back plate through a locking structure.

[0022] Compared with the prior art, the beneficial effects of the utility model are:

[0023] 1. The utility model sets a first positioning member and a second positioning member, wherein the first positioning member includes a main body portion, the main body portion extends to form a clamping portion, the clamping portion is set in contact with the semiconductor element, and the second positioning member is provided with a plurality of limiting holes, the plurality of limiting holes cooperate with a plurality of pins on the semiconductor element, and thus the semiconductor element can be positioned and installed.

[0024] 2. The utility model sets a first positioning member in which the main body extends to form a connecting portion, and the connecting portion extends to form a clamping portion. The plane where the connecting portion is located is perpendicular to the plane where the main body is located. Therefore, the semiconductor element can be positioned through an integrated structure, making the positioning of the semiconductor element more accurate and stable.

[0025] 3. The utility model provides a first row portion and a second row portion on the second positioning member, and a plurality of limiting holes are provided on the first row portion and the second row portion for respectively connecting with the pins on the two semiconductor components, thereby forming a structure in which a second positioning member is used to position the two semiconductor components, so that the installation space of the semiconductor components is more reasonable.

[0026] 4. The utility model provides a guide sleeve in any limiting hole, the outer wall of the guide sleeve is fixedly connected to the inner wall of the limiting hole, and the shape of the inner wall of the guide sleeve imitates the shape of the outer wall of the pin, so that the pin can be more accurate and stable during installation.

[0027] 5. The utility model sets the distance between any guide sleeve and the adjacent guide sleeve to be greater than or equal to 8 mm, thereby avoiding electric sparks caused by close distance between pins, thereby avoiding damage to semiconductor components. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] Figure 1 It is a locking structure and an overall structural diagram of a compressor provided in an embodiment of the present application;

[0030] Figure 2It is a locking structure provided in an embodiment of the present application and a structural diagram of the back plate installation cavity of the compressor;

[0031] Figure 3 It is a bottom view of a locking structure and a back plate mounting cavity of a compressor provided in an embodiment of the present application;

[0032] Figure 4 It is a structural diagram of a locking structure and a first positioning member of a compressor provided in an embodiment of the present application;

[0033] Figure 5 It is a locking structure and a limiting hole structure diagram of a compressor provided in an embodiment of the present application;

[0034] Figure 6 This is a structural diagram of a locking structure and a guide sleeve of a compressor provided in an embodiment of the present application.

[0035] In the figure: 1, semiconductor element; 11, first side; 12, second side; 2, first positioning member; 21, main body; 211, positioning column; 22, pressing portion; 23, connecting portion; 3, second positioning member; 31, limiting hole; 32, mounting portion; 33, first row; 34, second row; 4, back plate; 5, guide sleeve. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.

[0037] In the description of the present utility model, it should be noted that the terms "upper", "middle", "lower", "inner", "outer", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model. The terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. The following describes the implementation method of the present utility model based on its overall structure.

[0038] Reference Figure 1 As shown, an embodiment of the present application provides a locking structure, including:

[0039] A semiconductor element 1, wherein the semiconductor element 1 has a first side 11 and a second side 12, and a plurality of pins are disposed on a wall surface of the second side 12;

[0040] The first positioning member 2 includes a main body 21, a side wall of the main body 21 is extended with a pressing portion 22, the main body 21 is connected to the back plate 4, and the pressing portion 22 is in contact with the first side 11 of the semiconductor element 1, so as to make the semiconductor element 1 and the wall of the back plate 4 squeeze each other;

[0041] The second positioning member 3 is fixedly connected to the back plate 4 . The second positioning member 3 is provided with a plurality of limiting holes 31 at the second side 12 close to the semiconductor element 1 . The plurality of pins are passed through and installed in the plurality of limiting holes 31 .

[0042] Among them, a guide sleeve 5 is inserted into any limiting hole 31, and the outer wall of the guide sleeve 5 is fixedly connected to the inner wall of the limiting hole 31. The shape of the inner wall of the guide sleeve 5 imitates the shape of the outer wall of the pin, which is used to position and fix the pin.

[0043] according to Figure 1 Those skilled in the art can install the semiconductor element 1 on the back plate 4. Specifically, the back plate 4 can be provided with a mounting cavity, and then the semiconductor element 1 and the first positioning member 2 and the second positioning member 3 can be installed.

[0044] In a specific implementation process, a person skilled in the art may install the first positioning member 2 in the installation cavity on the back plate 4. The first positioning member 2 may be installed near the first side 11 of the semiconductor element 1. The first positioning member 2 includes a main body 21. The main body 21 extends toward the first side 11 to form a pressing portion 22. The pressing portion 22 extends to a position near the first side 11 of the semiconductor element 1, and the pressing portion contacts and presses the semiconductor element 1.

[0045] Furthermore, those skilled in the art may also set a second positioning member 3. The second positioning member 3 is installed in the installation cavity of the back plate 4. Specifically, the second positioning member 3 is arranged close to the second side 12 of the semiconductor element 1. Among them, a plurality of limiting holes 31 are provided on the second positioning member 3. It can be understood that a plurality of pins are provided at the second side 12 of the semiconductor element 1. The plurality of limiting holes 31 on the second positioning member 3 cooperate with the plurality of pins. That is, the plurality of pins are respectively inserted into the plurality of limiting holes 31.

[0046] In the above embodiment, the first positioning member 2 and the second positioning member 3 are mounted on the wall surface of the mounting cavity in the back plate 4. Moreover, the semiconductor element 1 can be mounted on the back plate 4 through the pressing portion 22 of the first positioning member 2 and the limiting hole 31 of the second positioning member 3.

[0047] It is understandable that the cooperation between the limiting hole 31 on the second positioning member 3 and the pin can position the semiconductor element 1. The pressing part 22 on the first positioning member 2 resists the semiconductor element 1, so that the relative position of the semiconductor element 1 can be fixed.

[0048] In summary, the first positioning member 2 and the second positioning member 3 can fix and position the first side 11 and the second side 12 of the semiconductor element 1 , thereby completing the installation of the semiconductor element 1 .

[0049] Those skilled in the art may further arrange that a guide sleeve 5 is inserted into any limiting hole 31 , the outer wall of the guide sleeve 5 is fixedly connected to the inner wall of the limiting hole 31 , and the shape of the inner wall of the guide sleeve 5 imitates the shape of the outer wall of the pin.

[0050] By means of the above structure, a guide sleeve 5 is provided in any limiting hole 31, so that during the installation of the pin, the pin can be directly installed in the guide sleeve 5. It can be understood that the outer wall of the guide sleeve 5 is fixedly connected to the inner wall of the limiting hole 31, so that the guide sleeve 5 can be prevented from falling off during the installation of the pin. Those skilled in the art set the shape of the outer wall of the guide sleeve 5 to imitate the shape of the outer wall of the pin, so that the pin can be pressed against the inner wall of the guide sleeve 5 after installation.

[0051] It is understandable that the above-mentioned setting structure and installation process position and limit the installation of the pin, thereby avoiding the pin from breaking or bending during the installation process. At the same time, the pin can be shaped by the guide sleeve 5, thereby making the installation structure of the pin more stable.

[0052] Preferably, the distance between any guide sleeve 5 and the adjacent guide sleeve 5 is greater than or equal to 8 mm. It is understandable that in order to prevent the distance between two adjacent pins from being less than the creepage distance, the distance between the two pins is set to be greater than or equal to the creepage distance. In this embodiment, the distance between the two pins can be set to be greater than or equal to 8 mm. That is, the distance between any guide sleeve 5 and the adjacent guide sleeve 5 is set to be greater than or equal to 8 mm. Or, the distance between any limiting hole 31 and the adjacent limiting hole 31 can be set to be greater than or equal to 8 mm.

[0053] The above arrangement can make the distance between two adjacent pins greater than or equal to the creepage distance, thereby avoiding the generation of electric sparks between adjacent pins, thereby improving the service life of the semiconductor element 1 and the reliability during use.

[0054] In one embodiment, a person skilled in the art can configure the first positioning member 2. In the above embodiment, the main body 21 of the first positioning member 2 is extended to form a clamping portion 22. Preferably, the main body 21 of the first positioning member 2 is extended to form a connecting portion 23, and the connecting portion 23 is extended to form the clamping portion 22, and the plane where the connecting portion 23 is located is perpendicular to the plane where the main body 21 is located.

[0055] With the above structure, a connecting portion 23 is provided between the main body 21 and the pressing portion 22. Moreover, the main body 21, the connecting portion 23 and the pressing portion 22 are an integrated structure, thereby making the structure of the first positioning member 2 more stable, and further making the installation of the semiconductor element 1 more stable.

[0056] It can be understood that, in this embodiment, the plane where the connecting portion 23 is located is perpendicular to the plane where the main body portion 21 is located. And the connecting portion 23 extends toward the semiconductor element 1. In the structure where the pressing portion 22 presses the semiconductor element 1, the main body portion 21 is fixed on the inner wall of the back plate 4, and the pressing force toward the semiconductor element 1 can be applied to the pressing portion 22 through the connecting portion 23. In this way, the first positioning member 2 can fix the semiconductor element 1 more stably.

[0057] In the above embodiment, the first positioning member 2 is installed on the inner wall of the back plate 4. Preferably, a positioning column 211 is installed on the main body 21, and a positioning hole is installed on the back plate 4. The positioning column 211 is inserted into the inner wall of the positioning hole to position the first positioning member 2.

[0058] That is, during the installation of the first positioning member 2, the positioning column 211 on the first positioning member 2 cooperates with the positioning hole on the back plate 4. Then, the installation of the first positioning column 2 can be positioned. Preferably, the first positioning member 2 and the back plate 4 are fixed by bolts. That is, those skilled in the art can fix the first positioning member 2 by bolts, and position the first positioning member 2 by the cooperation of the positioning hole and the positioning column 211. Then, the first positioning member 2 can be stably installed and positioned on the semiconductor element 1.

[0059] In the above-mentioned embodiment, a plurality of limiting holes are provided on the second positioning member 3, and the pins can be installed through the limiting holes. Preferably, the second positioning member 3 protrudes in a direction away from the position of the back plate to form a raised portion, and a plurality of limiting holes are provided on the raised portion. That is, in this embodiment, those skilled in the art can provide a raised portion on the second positioning member 3 according to the needs of installation, and a plurality of limiting holes are provided on the raised portion.

[0060] With the above structure, the second positioning member 3 can be applied to structures for fixing and installing more types of semiconductor components 1 .

[0061] In the above embodiment, the second positioning member 3 is fixedly mounted on the inner wall of the back plate 4. Preferably, the second positioning member 3 is provided with mounting portions 31 at two opposite ends in a direction parallel to the first positioning member 1, the two mounting portions 31 are centrally symmetrical, and the two mounting portions 31 are connected to the back plate 4 by fixing bolts.

[0062] By means of the above structure, two mounting portions 31 are provided to be connected to the back plate 4 by fixing bolts, so that the second positioning member 3 can be installed. In this embodiment, the two mounting portions 31 are centrally symmetrical, so that the installation space of the second positioning member 3 can be made more reasonable and stable.

[0063] In one embodiment, a person skilled in the art may arrange to mount a plurality of semiconductor elements 1 on the back plate 4. Any semiconductor element 1 is positioned and mounted by the first positioning member 2 and the second positioning member 3. According to actual structural requirements, a plurality of semiconductor elements 1 may be mounted in an array. At the same time, the first positioning member 2 and the second positioning member 3 are installed in the same manner.

[0064] That is, the structure after the first positioning member 2, the second positioning member 3 and the semiconductor element 1 are installed can be set as an installation group. In this embodiment, multiple installation groups can be set for array installation. It can be understood that two adjacent installation groups can be set so that the two second positioning members 3 are adjacent to each other, or the second positioning member 3 can be set close to the first positioning member 2 of the adjacent installation group.

[0065] Furthermore, in one embodiment, two oppositely disposed semiconductor components 1 can be installed by a second positioning member 3. Preferably, the second positioning member 3 is provided with a first row portion 33 and a second row portion 34, and the first row portion 33 and the second row portion 34 are both provided with a plurality of limiting holes 31 for connecting with the pins on the two semiconductor components 1 respectively.

[0066] That is, in the process of setting the second positioning member 3, those skilled in the art can set the second positioning member 3 to have a first row portion 33 and a second row portion 34. The limiting holes 31 are provided on both the first row portion 33 and the second row portion 34. Then, the pins can continue to be installed through the limiting holes 31 in this embodiment.

[0067] It is worth noting that the first row 33 and the second row 34 are both provided with limiting holes 31, and two semiconductor components 1 can be installed through the first row 33 and the second row 34, respectively, thereby greatly saving the installation space of the semiconductor components 1.

[0068] More preferably, the first row 33 and the second row 34 are arranged in parallel, and the first row 33 and the second row 34 are parallel to the first positioning member 2. That is, in this embodiment, those skilled in the art can arrange the first row 33, the second row 34 and the first positioning member 2 to be parallel to each other. This can further achieve a more reasonable installation of the second positioning member 3 and the first positioning member 2.

[0069] The present application also provides a compressor, which includes a back plate 4 and a plurality of semiconductor chips 1, and any semiconductor chip 1 is mounted on the back plate 4 through a locking structure. It is understandable that in the specific setting of those skilled in the art, the compressor can be configured to include a back plate 4 and a plurality of semiconductor chips 1. The plurality of semiconductor chips 1 are mounted through the locking structure in the above embodiment. This can make the internal structure of the compressor more stable.

[0070] Although different specific embodiments are mentioned in the content of this application, this application is not limited to the situations described in the industry standards or embodiments, etc. Some industry standards or slightly modified implementation plans based on the implementation of the custom methods or embodiments can also achieve the same, equivalent or similar, or predictable implementation effects after deformation of the above embodiments. The embodiments of data acquisition, processing, output, judgment methods, etc. after these modifications or deformations can still fall within the scope of the optional implementation plans of this application.

[0071] Although the present application has been described through embodiments, those skilled in the art will appreciate that there are many modifications and changes to the present application without departing from the spirit of the present application. It is intended that the attached embodiments include these modifications and changes without departing from the present application.

Claims

1. A locking structure, characterized in that: include: A semiconductor element, the semiconductor element having a first side and a second side, a wall surface of the second side being provided with a plurality of pins; A first positioning member, the first positioning member includes a main body, a side wall of the main body is extended to be provided with a pressing portion, the main body is connected to the back plate, and the pressing portion is in contact with the vicinity of the first side of the semiconductor element, so as to make the semiconductor element and the back plate wall squeeze each other; A second positioning member, the second positioning member is fixedly connected to the back plate, the second positioning member is provided with a plurality of limiting holes at the second side close to the semiconductor element, and the plurality of pins are inserted into the plurality of limiting holes; Among them, a guide sleeve is inserted into any of the limiting holes, the outer wall of the guide sleeve is fixedly connected to the inner wall of the limiting hole, and the shape of the inner wall of the guide sleeve imitates the shape of the outer wall of the pin, which is used to position and fix the pin.

2. The locking structure according to claim 1, characterized in that: The distance between any one of the guide sleeves and an adjacent one of the guide sleeves is greater than or equal to 8 mm.

3. The locking structure according to claim 1, characterized in that: The main body of the first positioning member is extended to form a connecting portion, and the connecting portion is extended to form the pressing portion. The plane where the connecting portion is located is perpendicular to the plane where the main body is located.

4. The locking structure according to claim 1, characterized in that: A positioning column is installed on the main body, a positioning hole is provided on the back plate, and the positioning column passes through the positioning hole to position the first positioning member.

5. The locking structure according to claim 1, characterized in that: The first positioning member and the back plate are fixed by bolts.

6. The locking structure according to claim 1, characterized in that: The second positioning member protrudes in a direction away from the position of the back plate to form a raised portion, and a plurality of limiting holes are formed on the raised portion.

7. The locking structure according to claim 1, characterized in that: Mounting parts are provided at two opposite ends of the second positioning member in a direction parallel to the first positioning member, the two mounting parts are centrally symmetrical, and the two mounting parts are connected to the back plate by fixing bolts.

8. The locking structure according to claim 1, characterized in that: The second positioning member is provided with a first row portion and a second row portion, and the first row portion and the second row portion are both provided with a plurality of limiting holes for respectively connecting with pins on the two semiconductor elements.

9. The locking structure according to claim 8, characterized in that: The first row of parts and the second row of parts are arranged in parallel, and the first row of parts and the second row of parts are both parallel to the first positioning member.

10. A compressor, characterized in that: The compressor includes a back plate and a plurality of semiconductor chips, and any of the semiconductor chips is mounted on the back plate via a locking structure as described in any one of claims 1-9.

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