LED backlight module and display device

Abstract

The utility model relates to the technical field of display equipment, in particular to an LED backlight module and a display device.The LED backlight module comprises a substrate, a light-emitting component and a driving component, the light-emitting component and the driving component are arranged on the same side face of the substrate, wire copper is arranged on the substrate, the surface of the wire copper is covered with a solder mask layer, a window is formed in the solder mask layer in the upper part area of the wire copper, and the wire copper is arranged in the window. A light reflecting component or a driving component is arranged at the window; one side, far away from the substrate, of the solder mask layer is provided with a reflecting layer covering the solder mask layer and the driving element, the reflecting layer is provided with a light-emitting hole corresponding to the light-emitting element, the reflecting layer is directly attached to the driving element, the manufacturing steps and the manufacturing cost are reduced, the production efficiency is improved, the stability is very high, and baking or other processes are not needed.

Description

[Technical field]

[0001] The utility model relates to the technical field of display equipment, in particular to an LED backlight module and a display device. [Background technology]

[0002] In recent years, LED light sources have been increasingly used in the fields of lighting and backlighting. As the basis for manufacturing LED light sources, LED packaging technology has also become increasingly mature. However, in order to achieve a good consumer experience, the light-emitting units on LED light-emitting panels are getting smaller and smaller, and the backlight modules are becoming increasingly thinner. In order to achieve the effect of thinner thickness, the solution of coplanar light-emitting components and driving components has been born. However, since the packaging substrate used by the driving component is a light-absorbing material that easily absorbs the blue light emitted by the LED, it is easy to cause shadow problems when used directly on the backlight module, thereby affecting the uniform light effect of the LED panel. To solve this problem, the industry usually uses white glue on the top of the driving component to shield the light-absorbing material with high-reflectivity white glue to achieve visual optimization. However, the glue dispensing process is inefficient and the process stability is poor, so other covering methods need to be considered. [Contents of the utility model]

[0003] In order to solve the problem of low process efficiency of using white glue to shield driving components in the existing lamp-driven coplanar backlight module, the utility model provides an LED backlight module and a display device.

[0004] The solution to the technical problem of the utility model is to provide an LED backlight module, including a substrate, and a light-emitting component and a driving component arranged on the same side of the substrate, wherein a copper wire is provided on the substrate, and the surface of the copper wire is covered with a solder resist layer, and a window is opened in a partial area of ​​the solder resist layer on the copper wire, and the reflective component or the driving component is arranged at the window; a reflective layer covering the solder resist layer and the driving component is provided on the side of the solder resist layer away from the substrate, and the reflective layer has a light-emitting opening corresponding to the light-emitting component.

[0005] Preferably, the reflective layer forms an inclined angle with the driving element on the side of the driving element.

[0006] Preferably, the inclination angle formed by the reflective layer on the side of the driving element and the driving element is in the range of 30°-60°.

[0007] Preferably, the light-emitting components and the driving components are placed on the substrate in an array, and there are gaps between the light-emitting components and the driving components.

[0008] Preferably, a connecting adhesive layer exists between the reflective layer and the solder resist layer.

[0009] Preferably, a protective adhesive layer is provided on a side of the light-emitting component away from the substrate, and the protective adhesive layer wraps the light-emitting component and the driving element.

[0010] Preferably, a reflective optical element is arranged outside the protective adhesive layer at a position corresponding to the light-emitting component.

[0011] Preferably, the reflective layer has a thickness of 50-200 um.

[0012] Preferably, a height of the light-emitting component relative to the substrate is smaller than a height of the driving element relative to the substrate.

[0013] In order to solve the above technical problems, the present invention provides another technical solution as follows: a display device comprises a carrying device and an LED backlight module as described above, which is arranged on the carrying device.

[0014] Compared with the prior art, the LED backlight module and display device provided by the utility model have the following advantages:

[0015] 1. In the LED backlight module provided in the embodiment of the present invention, the substrate is the main body of the LED backlight module, providing a platform for supporting and connecting various components. The copper wire is a conductive line on the substrate, which is used to connect the light-emitting components and the driving elements. The solder resist layer is a layer covering the surface of the copper wire to prevent the solder from penetrating into the area where soldering is not required, and at the same time plays a role in protecting the copper wire. The window is a window opened in the solder resist layer in a part of the area on the copper wire, which is used to place reflective components or driving elements, and provides space for placing light-emitting components and driving elements. The light-emitting openings opened in the area corresponding to the light-emitting components on the reflective layer ensure that light can be reflected by the reflective layer and transmitted to the display surface to achieve a display effect.

[0016] 2. In the LED backlight module provided in the embodiment of the utility model, the reflective layer forms an inclined angle on the side of the driving element, which not only wraps the driving element in the reflective layer, but also can well reflect the light so that the light is reflected at a more favorable angle. By adjusting the size of the inclination angle of the reflective layer, the incident angle of the light in the reflection process can be optimized and the reflection efficiency can be improved. At the same time, the reflective layer inclined to the side of the driving element avoids more direct contact between the reflective layer and the driving element. The triangular space formed by the inclination gives the driving element more heat dissipation space and avoids collision loss that changes the direction of light propagation.

[0017] 3. The LED backlight module provided in the embodiment of the utility model has an array-like arrangement method that helps to improve the uniformity of lighting and brightness distribution, thereby improving the overall performance of the LED backlight module. A certain gap between components provides better air circulation and helps dissipate heat. There is often electromagnetic interference between light-emitting components and driving elements. Setting a gap can reduce the mutual influence between components and improve the stability of the circuit. When the temperature changes, different materials may expand or contract at different rates. The gap between the light-emitting components and the solder mask layer can provide space for such changes, reduce thermal stress, and help dissipate heat, making the LED module more flexible when the temperature changes. It can also avoid the light-emitting components and the solder mask layer directly contacting the solder mask layer to cause damage to the LED chip, etc.

[0018] 4. In the LED backlight module provided in the embodiment of the utility model, the connecting glue layer between the reflective layer and the solder resist layer can provide mechanical support for the reflective layer and the solder resist layer, fix the two so as not to shift, fill the gap between the reflective layer and the solder resist layer, and reduce the refractive index difference between the media. The connecting glue layer can also provide additional protection to prevent dust, moisture or other contaminants from entering the interior of the LED module, thereby protecting the performance of the reflective layer and the solder resist layer.

[0019] 5. The LED backlight module provided in the embodiment of the utility model has a protective adhesive layer that provides mechanical protection to prevent the light-emitting components and driving components from physical damage, such as vibration, impact or mechanical stress, thereby ensuring the stability and durability of the LED module. The protective adhesive layer forms a closed shell to prevent pollutants from entering the space between the light-emitting components and the driving components. The protective adhesive layer also has electrical insulation properties, which can prevent electrical problems caused by environmental conditions such as humidity, thereby maintaining the stability and safety of the LED module.

[0020] 6. The LED backlight module provided in the embodiment of the utility model has a reflective optical element that plays a role in uniform light, so that the light emitted from the front of the LED is converted into side light after reflection to increase the light propagation efficiency, ensure that more light is guided to the required area, and turn the point light source into a surface light source, thereby controlling the directionality of the light and making the light more concentrated or more widely irradiated on the display surface.

[0021] 7. For the LED backlight module provided in the embodiment of the present invention, the selection of the thickness of the reflective layer needs to take into account the specific design requirements and application scenarios. Different thicknesses affect its reflection characteristics for light of different wavelengths. A thick reflective layer can reduce the absorption of light when passing through the reflective layer, thereby reducing light loss. A thin reflective layer can reduce manufacturing costs and reduce the overall thickness of the LED backlight module.

[0022] 8. In the LED backlight module provided in the embodiment of the utility model, the height of the light-emitting element relative to the substrate is smaller than the height of the driving element relative to the substrate, so that it is closer to the surface of the substrate, which is helpful for heat dissipation, reduces the chance of dust and other particles entering the LED module, reduces the impact on the optical surface, reduces the frequency of cleaning, and stabilizes the entire structure.

[0023] 9. A display device is also provided in an embodiment of the utility model, comprising a carrying device and an LED backlight module as described above, which is arranged on the carrying device and has the same beneficial effects as the LED backlight module, and will not be described in detail here.

Brief Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 It is a cross-sectional schematic diagram of the LED backlight module provided by the first embodiment of the utility model;

[0026] Figure 2 This is a schematic diagram of the light path in the LED backlight module provided by the first embodiment of the utility model;

[0027] Figure 3 It is a schematic diagram of a reflective layer of an LED backlight module structure provided by the first embodiment of the utility model;

[0028] Figure 4 It is a schematic diagram of a display device provided by the second embodiment of the utility model.

[0029] Description of the accompanying drawings:

[0030] 1. LED backlight module; 2. Display device

[0031] 10. Substrate; 11. Wire copper; 12. Solder mask; 13. Reflective layer; 14. Protective adhesive layer; 20. Carrying device;

[0032] 101. Light-emitting component; 102. Driving element; 121. Window; 122. Connecting adhesive layer; 131. Light-emitting opening; 132. Seam-line through hole; 141. Reflective optical element. [Specific implementation method]

[0033] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0034] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0035] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0036] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0037] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0038] Please combine Figure 1-Figure 3The first embodiment of the utility model provides an LED backlight module 1, including a substrate 10, and a light-emitting component 101 and a driving component 102 arranged on the same side of the substrate 10, a copper wire 11 is provided on the substrate 10, and the surface of the copper wire 11 is covered with a solder resist layer 12, and a window 121 is opened in the solder resist layer 12 in a partial area on the copper wire 11, and the light-emitting component 101 or the driving component 102 is arranged at the window 121; a reflective layer 13 covering the solder resist layer 12 and the driving component 102 is provided on the side of the solder resist layer 12 away from the substrate 10, and the reflective layer 13 is opened with a light-emitting opening 131 corresponding to the light-emitting component 101.

[0039] It can be understood that the substrate 10 is a thin and strong material made of glass fiber or metal material. Its size and shape are adapted to the overall design of the LED backlight module 1 and provide sufficient support space for the arrangement of the copper wire 11. The copper wire 11 is a conductive material that transfers current to the driving element 102 or the light-emitting component 101. The surface of the copper wire 11 is covered with a solder resist layer 12 to isolate the circuit and prevent circuit short circuit and corrosion. A high-temperature, insulating material is used, and the window 121 on the solder resist layer 12 fixes and positions the driving element 102 or the light-emitting component 101.

[0040] Specifically, the driving element 102 is usually 0.1-0.25 mm thick and usually has a size of 0.5*0.5~2.0*2.0 mm. The light-emitting opening 131 opened in the reflective layer 13 corresponding to the light-emitting component 101 exposes the light-emitting component 101, so that the light on the light-emitting component 101 can be effectively transmitted out of the LED backlight module 1. The reflective layer 13 has a shielding effect on the driving element 102, reflects the light transmitted from the light-emitting component 101 to the driving element 102, and seals the driving element 102.

[0041] Furthermore, the geometric center of the light-emitting opening 131 coincides with the geometric center of the light-emitting component 101, and the reflective layer 13 is disposed on the side of the solder resist layer 12 away from the substrate 10, covering the solder resist layer 12 and the driving element 102, and includes two or more light-emitting openings 131, and the light-emitting openings 131 correspond to the light-emitting components 101 one by one, allowing the light of the light-emitting components 101 to be transmitted to the outside of the reflective layer 13.

[0042] Specifically, the size and shape of the driving element 102 and the light-emitting component 101 depend on the purpose and type of the LED backlight module 1, and may include square, circular or other shapes. The reflective layer 13 covers the driving element 102, and the light-emitting opening 131 on the reflective layer 13 exposes the light-emitting component 101, and its size and shape need to be set accordingly. The projection shape of the light-emitting opening 131 of the reflective layer 13 can be arbitrarily changed, and can be circular, elliptical, rectangular or other irregular shapes.

[0043] Furthermore, the reflective layer 13 forms an inclination angle α with the driving element 102 on the side of the driving element 102 (eg Figure 2 α in .

[0044] It can be understood that the reflective layer 13 is inclined at the side of the driving element 102 to form an inclination angle α (eg Figure 2 α in the figure is used to optimize the incident angle of light during the reflection process, improve the reflection efficiency and change the direction of light propagation. More light will be guided outside the reflective layer 13 or to other target areas, thereby improving the light utilization efficiency of the LED backlight module 1.

[0045] Furthermore, the reflective layer 13 forms an inclination angle α (eg, Figure 2 The range of α) is 30°-60°.

[0046] It can be understood that the inclination angle α (such as Figure 2 The light incident angle is better when α) is set within the range of 30°-60°, which can maximize the reflection efficiency, improve the overall brightness of the LED backlight module, and reduce optical energy loss.

[0047] Specifically, the side surface is used to distinguish the bottom surface where the driving element 102 is connected to the copper wire 11 and the front surface away from the bottom surface. The actual side surface is the four surfaces surrounding the driving element 102. Therefore, the inclination angle α (such as Figure 2 There are also four α) in .

[0048] Furthermore, the light emitting components 101 and the driving components 102 are placed on the substrate 10 in an array, and there are gaps between the light emitting components 101 and the driving components 102 .

[0049] It can be understood that the array structure is a compact arrangement to maximize the use of the surface area of ​​the substrate 10. It has a regular layout in the horizontal and vertical directions to achieve uniform light distribution. The arrangement pattern of the driving element 102 matches the arrangement pattern of the light-emitting component 101, and the arrangement is staggered. Sufficient space is reserved in the gap. When the light-emitting component 101 is placed on the solder resist layer 12, the light-emitting component 101 is prevented from directly contacting the solder resist layer 12 and causing damage to the light-emitting component 101.

[0050] Specifically, see Figure 3 , a driving element 102 is placed between four light-emitting components 101, and the two are arranged in arrays with different densities.

[0051] Furthermore, a connection adhesive layer 122 exists between the reflective layer 13 and the solder resist layer 12 .

[0052] Specifically, the connecting adhesive layer 122 can be a thin film uniformly coated on the entire surface of the reflective layer 13 or the solder mask layer 12, or it can be distributed in the form of dots, lines, grids, etc. The layer has a sticky substance, and silicone, epoxy resin, polyurethane, etc. are suitable choices. The thickness of the connecting adhesive layer 122 is in the micron level, which helps to maintain a small gap and reduce the optical distortion between the light-emitting components 101.

[0053] Furthermore, a protective adhesive layer 14 is provided on a side of the light emitting component 101 away from the substrate 10 , and the protective adhesive layer 14 wraps the light emitting component 101 and the driving element 102 .

[0054] It is understandable that the protective adhesive layer 14 will completely wrap the light-emitting components 101 and the driving components 102 to form a package to ensure that they are not easily affected by the external environment during manufacturing and use. The material is usually silicone, polyurethane or other durable and high-performance plastics with good optical transparency. If the LED module is in a high-temperature environment, the protective adhesive layer 14 has good high-temperature resistance and electrical insulation performance, which can protect the components from temperature and prevent short circuits between components.

[0055] Furthermore, a reflective optical element 141 is disposed outside the protective adhesive layer 14 at a position corresponding to the light-emitting component 101 .

[0056] It can be understood that the reflective optical element 141 has a certain transmittance, reflects the light that is not directly irradiated to the display panel, and redirects it to the display panel to achieve more uniform light distribution, improve light utilization efficiency, and reduce optical losses during light transmission.

[0057] Optionally, the reflective optical element 141 is intended to improve light efficiency and improve light distribution, so a layer of transparent reflective material, such as a transparent reflective coating or film, may be coated on the outside of the protective adhesive layer 14 to achieve a certain degree of light reflection and improve light efficiency; or a secondary optical element, such as a transparent reflective prism or a reflector, may be arranged around the light-emitting component 101 to optimize the propagation direction of light and improve light efficiency.

[0058] Furthermore, there are gaps between the light emitting component 101 and the solder resist layer 12 , and between the driving component 102 and the solder resist layer 12 .

[0059] It can be understood that the gap allows the light-emitting component 101 and the driving component 102 to be better connected to the copper wire 11. When the temperature changes, different electronic components may expand or contract at different rates. The gap provides space for such changes and helps dissipate heat.

[0060] Furthermore, the thickness of the reflective layer 13 is 50-200 um.

[0061] Specifically, the reflectivity of the reflective layer 13 in the visible light band is usually 80% to 96%, and the corresponding high reflective layer materials include but are not limited to white film, white oil, metal, Bragg reflection layer, etc., which can provide a medium for light reflection.

[0062] Specifically, see Figure 2 , light is emitted from the light emitting component 101, the protective rubber layer 14 wraps the light emitting component 101 and the driving component 102, and part of the light is directly emitted through the protective rubber layer 14; due to the height difference between the driving component 102 and the light emitting component 101, the reflective layer 13 covers the driving component 102, and part of the light is emitted from the protective rubber layer 14 to the side of the driving component 102 covered by the reflective layer 13, and the reflective layer 13 on the side has an inclination angle α (such as Figure 2 In the figure, the light is reflected by the reflective layer 13 and changes direction before being emitted to the protective rubber layer 14; a part of the light will be refracted due to the difference between the inner and outer media when emitting the protective rubber layer 14, and the light refracted back into the protective rubber layer 14 will be emitted to the reflective layer 13, and the light will be reflected by the reflective layer 13 and change direction before being transmitted to the interface outside the protective rubber layer 14 again.

[0063] Furthermore, the light emitted from the protective rubber layer 14 is homogenized by the reflective optical element 141 , so that more light is reflected and propagated toward the side of the LED backlight module 1 .

[0064] For further information, see Figure 1 , the height h of the light emitting element 101 relative to the substrate 10 (e.g. Figure 1 h) is smaller than the height H of the driving element 102 relative to the substrate 10 (e.g. Figure 1 H in.

[0065] Specifically, due to the height difference between the driving element 102 and the substrate 10, a gap is formed at the bottom of the driving element 102. After the reflective paper is attached, air is easily trapped in the gap at the bottom of the driving element 102 to form bubbles, which reduces the reflection effect and affects the combination of the reflective layer 13 and the solder resist layer 12.

[0066] Preferably, a seam-jointing through hole 132 can be added on the area of ​​the reflective layer 13 corresponding to the driving element 102 of the substrate 10, and the air can be discharged through the seam-jointing through hole 132, and the protective colloid in the protective adhesive layer 14 can be filled into the bottom gap of the driving element 102 through the seam-jointing through hole 132, thereby enhancing the fitting effect and process stability.

[0067] Furthermore, the diameter, spacing and number of the seam through holes 132 are set according to the arrangement of the driving elements 102 to ensure sufficient air passages. The shapes can be circular, elliptical, square, etc., and air guide grooves can be added to the seam through holes 132 to increase the air circulation path and prevent the protective colloid from overflowing.

[0068] See also Figure 3 As an optional implementation, a seam through hole 132 is added and the light-emitting opening 131 is circular.

[0069] See also Figure 4 The second embodiment of the utility model further provides a display device 2, including a carrying device 20 and an LED backlight module 1 as in the first embodiment, which is arranged on the carrying device 20.

[0070] Optionally, the display device 2 can be applied to 3C electronic products and their accessories such as mobile phones and mobile phone cases, or to the surface of home appliances, automobiles and other products, or to smart pens and smart wearable products; according to different application scenarios, the setting method and setting quantity of the LED backlight module 1 on the supporting device 20 may not be limited.

[0071] Compared with the prior art, the LED backlight module and display device provided by the utility model have the following advantages:

[0072] 1. In the LED backlight module provided in the embodiment of the present invention, the substrate is the main body of the LED backlight module, providing a platform for supporting and connecting various components. The copper wire is a conductive line on the substrate, which is used to connect the light-emitting components and the driving elements. The solder resist layer is a layer covering the surface of the copper wire to prevent the solder from penetrating into the area where soldering is not required, and at the same time plays a role in protecting the copper wire. The window is a window opened in the solder resist layer in a part of the area on the copper wire, which is used to place reflective components or driving elements, and provides space for placing light-emitting components and driving elements. The light-emitting openings opened in the area corresponding to the light-emitting components on the reflective layer ensure that light can be reflected by the reflective layer and transmitted to the display surface to achieve a display effect.

[0073] 2. In the LED backlight module provided in the embodiment of the utility model, the reflective layer forms an inclined angle on the side of the driving element, which not only wraps the driving element in the reflective layer, but also can well reflect the light so that the light is reflected at a more favorable angle. By adjusting the inclination angle of the reflective layer, the incident angle of the light in the reflection process can be optimized and the reflection efficiency can be improved. At the same time, the reflective layer inclined to the side of the driving element avoids more direct contact between the reflective layer and the driving element. The triangular space formed by the inclination gives the driving element more heat dissipation space and avoids collision loss that changes the direction of light propagation.

[0074] 3. The LED backlight module provided in the embodiment of the utility model has an array-like arrangement method that helps to improve the uniformity of lighting and brightness distribution, thereby improving the overall performance of the LED backlight module. A certain gap between components provides better air circulation and helps dissipate heat. There is often electromagnetic interference between light-emitting components and driving elements. Setting a gap can reduce the mutual influence between components and improve the stability of the circuit. When the temperature changes, different materials may expand or contract at different rates. The gap between the light-emitting components and the solder mask layer can provide space for such changes, reduce thermal stress, and help dissipate heat, making the LED module more flexible when the temperature changes. It can also avoid the light-emitting components and the solder mask layer directly contacting the solder mask layer to cause damage to the LED chip, etc.

[0075] 4. In the LED backlight module provided in the embodiment of the utility model, the connecting adhesive layer between the reflective layer and the solder resist layer can provide mechanical support for the reflective layer and the solder resist layer, fix the two so as not to shift, fill the gap between the reflective layer and the solder resist layer, and reduce the refractive index difference between the media. The connecting adhesive layer can also provide additional protection to prevent dust, moisture or other contaminants from entering the interior of the LED module, thereby protecting the performance of the reflective layer and the solder resist layer.

[0076] 5. The LED backlight module provided in the embodiment of the utility model has a protective adhesive layer that provides mechanical protection to prevent the light-emitting components and driving components from physical damage, such as vibration, impact or mechanical stress, thereby ensuring the stability and durability of the LED module. The protective adhesive layer forms a closed shell to prevent pollutants from entering the space between the light-emitting components and the driving components. The protective adhesive layer also has electrical insulation properties, which can prevent electrical problems caused by environmental conditions such as humidity, thereby maintaining the stability and safety of the LED module.

[0077] 6. The LED backlight module provided in the embodiment of the utility model has a reflective optical element that plays a role in uniform light, so that the light emitted from the front of the LED is converted into side light after reflection to increase the light propagation efficiency, ensure that more light is guided to the required area, and turn the point light source into a surface light source, thereby controlling the directionality of the light and making the light more concentrated or more widely irradiated on the display surface.

[0078] 7. For the LED backlight module provided in the embodiment of the present invention, the selection of the thickness of the reflective layer needs to take into account the specific design requirements and application scenarios. Different thicknesses affect its reflection characteristics for light of different wavelengths. A thick reflective layer can reduce the absorption of light when passing through the reflective layer, thereby reducing light loss. A thin reflective layer can reduce manufacturing costs and reduce the overall thickness of the LED backlight module.

[0079] 8. In the LED backlight module provided in the embodiment of the utility model, the height of the light-emitting element relative to the substrate is smaller than the height of the driving element relative to the substrate, so that it is closer to the surface of the substrate, which is helpful for heat dissipation, reduces the chance of dust and other particles entering the LED module, reduces the impact on the optical surface, reduces the frequency of cleaning, and stabilizes the entire structure.

[0080] 9. A display device is also provided in an embodiment of the utility model, comprising a carrying device and an LED backlight module as described above, which is arranged on the carrying device and has the same beneficial effects as the LED backlight module, and will not be described in detail here.

[0081] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED backlight module, characterized in that: It includes a substrate, and a light-emitting component and a driving element arranged on the same side of the substrate, wherein the substrate is provided with copper wire, the surface of the copper wire is covered with a solder resist layer, the solder resist layer is provided with a window, and the light-emitting component or the driving element is arranged at the window; a reflective layer covering the solder resist layer and the driving element is provided on the side of the solder resist layer away from the substrate, and the reflective layer is provided with a light-emitting opening corresponding to the light-emitting component.

2. The LED backlight module according to claim 1, characterized in that: The reflective layer forms an inclined angle with the driving element at a side surface of the driving element.

3. The LED backlight module according to claim 2, characterized in that: The inclination angle formed by the reflective layer on the side of the driving element and the driving element is in the range of 30°-60°.

4. The LED backlight module according to claim 1, wherein: The light-emitting components and the driving components are placed on a substrate in an array, with gaps between the light-emitting components and the driving components.

5. The LED backlight module according to claim 1, characterized in that: A connecting adhesive layer exists between the reflective layer and the solder resist layer.

6. The LED backlight module according to claim 1, characterized in that: A protective adhesive layer is arranged on a side of the light emitting component away from the substrate, and the protective adhesive layer wraps the light emitting component and the driving element.

7. The LED backlight module according to claim 6, characterized in that: A reflective optical element is arranged outside the protective adhesive layer at a position corresponding to the light-emitting component.

8. The LED backlight module according to claim 1, wherein: The thickness of the reflective layer is 50-200 um.

9. The LED backlight module according to claim 1, wherein: The height of the light emitting component relative to the substrate is smaller than the height of the driving element relative to the substrate.

10. A display device, characterized in that: It comprises a carrying device and an LED backlight module as claimed in any one of claims 1 to 9 arranged on the carrying device.

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