Loading platform device

Abstract

The utility model relates to the technical field of circuit board substrate loading, in particular to a loading table device which comprises a loading frame and a clamping device. The loading frame is used for bearing a substrate. The clamping device is fixedly installed on the loading frame and used for clamping the edge of the substrate. The substrate is loaded through the loading frame, so that the substrate is loaded and fixed. The clamping device is used for clamping the edge of the substrate, so that the substrate is prevented from loosening in the loading frame, light rays are prevented from irradiating the surface of the substrate, and a good photoetching effect is further ensured. Therefore, the substrate is effectively loaded and fixed, and the quality of the circuit board meets the expected requirement.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board substrate loading, and in particular to a loading platform device. Background Art

[0002] In daily production and life, the electrification technology of various equipment is becoming more and more mature. As an indispensable component in equipment control, the production process of circuit boards is also constantly improving so that the functions and quality of circuit boards can meet the expected requirements of users.

[0003] In the production process of circuit boards, the circuit board substrate needs to be loaded and fixed to facilitate the transportation, storage, positioning and processing of the circuit board substrate. In the exposure or photolithography process of the circuit board, a loading table device is used to load and fix the circuit board substrate. In order to allow the light that forms the circuit on the circuit board substrate to irradiate the substrate, a transparent pressing plate is usually used to flatten the circuit board substrate. On the one hand, the circuit board substrate has a higher flatness, and on the other hand, the light can smoothly pass through the transparent pressing plate, thereby realizing the exposure or photolithography of the circuit board substrate.

[0004] However, since the transparent pressure plate has a certain refractive index, it will have different degrees of influence on the light, and due to the difference in uniformity of various parts of the transparent pressure plate, the effect and yield of photolithography or exposure are difficult to meet the expected requirements.

[0005] It can be seen that how to effectively load and fix the substrate and make the quality of the circuit board meet the expected requirements is a technical problem that needs to be solved urgently. Utility Model Content

[0006] The present application provides a loading platform device, which aims to solve the technical problem in the prior art of how to effectively load and fix a substrate and make the quality of the circuit board meet the expected requirements.

[0007] The present application provides a loading platform device, comprising:

[0008] A loading frame, used for carrying a substrate;

[0009] A clamping device is fixedly mounted on the loading frame and is used to clamp the edge of the substrate.

[0010] Furthermore, the loading frame is provided with a limiting groove, and the contour of the limiting groove matches the contour of the substrate.

[0011] Furthermore, at least one of the clamping devices is installed near each side of the limiting groove.

[0012] Furthermore, at least three of the clamping devices are installed near each side of the limiting groove.

[0013] Furthermore, the distances between adjacent clamping devices on each side of the limiting groove are equal.

[0014] Furthermore, the clamping device is a quick-action clamp.

[0015] Furthermore, guide blocks are arranged on both sides of the bottom of the loading frame.

[0016] Furthermore, a positioning hole is formed laterally on the guide block.

[0017] Furthermore, the positioning hole includes a first hole and a second hole, and a diameter of the first hole is smaller than a diameter of the second hole.

[0018] Furthermore, the clamping portion of the clamping device is provided with a buffer pad.

[0019] The beneficial effects achieved by this application are:

[0020] The present application proposes a loading table device, which carries a substrate through a loading frame so as to load and fix the substrate. The edge of the substrate is clamped by a clamping device to prevent the substrate from loosening in the loading frame and not to block the light from irradiating the surface of the substrate, thereby ensuring a good photolithography effect. In this way, the substrate is effectively loaded and fixed, and the quality of the circuit board meets the expected requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of a substrate loaded on a loading platform device in an embodiment of the utility model;

[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of the loading platform device in the embodiment of the utility model;

[0023] Figure 3 It is a three-dimensional structural schematic diagram of the clamping device in the embodiment of the utility model.

[0024] Description of main component symbols:

[0025] 10. Loading table device; 20. Loading frame; 21. Limiting groove; 22. Guide block; 23. Positioning hole; 24. First hole; 25. Second hole; 30. Clamping device; 31. Clamping part; 32. Buffer pad; 40. Base plate. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model. In addition, it should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model.

[0027] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present invention.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0029] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the utility model. In addition, the utility model can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and / or settings discussed in itself. In addition, the utility model provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0032] See also Figure 1 In some embodiments of the present application, a loading platform device 10 proposed in the present application includes: a loading frame 20 and a clamping device 30. The loading frame 20 is used to carry a substrate 40. The clamping device 30 is fixedly installed on the loading frame 20, and the clamping device 30 is used to clamp the edge of the substrate 40.

[0033] The substrate 40 is carried by the loading frame 20 so as to be loaded and fixed. The edge of the substrate 40 is clamped by the clamping device 30 to prevent the substrate 40 from being loose in the loading frame 20 and not to block the light from irradiating the surface of the substrate 40, thereby ensuring a good photolithography effect. In this way, the substrate 40 is effectively loaded and fixed, and the quality of the circuit board meets the expected requirements.

[0034] See also Figure 1 to Figure 2 In some embodiments of the present application, the loading frame 20 is provided with a limiting groove 21 , and the contour of the limiting groove 21 matches the contour of the substrate 40 .

[0035] During the process of loading the substrate 40, the loading frame 20 places the substrate 40 into the limiting groove 21, and limits the substrate 40 by the side of the limiting groove 21, thereby preventing the substrate 40 from shifting in the horizontal direction. In addition, the positioning accuracy of the substrate 40 in the loading frame 20 is improved by the limiting of the limiting groove 21, thereby further improving the lithography effect.

[0036] In some embodiments of the present application, at least one clamping device 30 is installed near each side surface of the limiting groove 21 .

[0037] By fixing the edge of the substrate 40 by at least one clamping device 30 at each side of the limiting groove 21, the deformation degree of the substrate 40 such as warping or twisting during the fixing process is reduced, thereby ensuring the flatness of the substrate 40 and improving the lithography effect.

[0038] In some embodiments of the present application, at least three clamping devices 30 are installed near each side of the limiting groove 21 .

[0039] At least three clamping devices 30 are used to fix the edge of the substrate 40 on each side of the limiting groove 21, so that the force on the substrate 40 is more uniform, the flatness of the substrate 40 is further improved, and the photolithography effect is further improved.

[0040] Since the substrate 40 is more susceptible to deformation at both ends and in the middle of the side, a clamping device 30 may be provided at both ends and in the middle of each side of the substrate 40, thereby further reducing the degree of deformation such as warping or twisting that occurs during the fixing process of the substrate 40, thereby ensuring the flatness of the substrate 40 and improving the photolithography effect.

[0041] In some embodiments of the present application, the distances between adjacent clamping devices 30 on each side of the limiting groove 21 are equal.

[0042] By equidistantly arranging the clamping devices 30 on each side, the force applied to the substrate 40 is more uniform during the process of the clamping devices 30 fixing the substrate 40 , thereby further improving the flatness of the substrate 40 and the photolithography effect.

[0043] In some embodiments of the present application, the clamping device 30 is a quick-action clamp.

[0044] The substrate 40 is clamped on the loading frame 20 by the quick clamp, and the substrate 40 is fixed. The quick clamp can provide sufficient clamping force and reduce damage to the substrate 40. The operation is convenient and fast, and the production cost is low. Therefore, the loading platform device 10 can quickly load the substrate 40 while improving the clamping effect of the substrate 40.

[0045] In some embodiments of the present application, guide blocks 22 are provided on both sides of the bottom of the loading frame 20 .

[0046] During the process of conveying the loading frame 20 loaded with the circuit board substrate 40 , the loading frame 20 is guided by the guide block 22 , thereby improving the position accuracy of the loading frame 20 in the production equipment and improving the photolithography effect.

[0047] In some embodiments of the present application, a positioning hole 23 is formed laterally on the guide block 22 .

[0048] During the process of transporting the loading platform device 10, the transport mechanism grabs the loading platform device 10 by inserting the grabbing structure into the positioning hole 23, which improves the reliability of the transport mechanism grabbing the loading platform device 10 on the one hand, and improves the repeatable position accuracy of the loading platform device 10 during the transport process on the other hand. When the loading platform device 10 reaches the processing station or the loading and unloading station, the positioning mechanism in the production equipment inserts the positioning pin into the positioning hole 23, thereby improving the position accuracy of the loading platform device 10 and improving the photolithography effect.

[0049] In some embodiments of the present application, the positioning hole 23 includes a first hole 24 and a second hole 25 , and the diameter of the first hole 24 is smaller than the diameter of the second hole 25 .

[0050] The loading stage device 10 is positioned by positioning holes 23 of different diameters so that the positioning of the loading stage device 10 has directionality. If the loading stage device 10 is installed upside down, the positioning pins in the production equipment cannot be smoothly inserted into the positioning holes 23, thereby preventing the loading stage device 10 from being installed upside down, and further preventing the circuit diagram being etched on the substrate 40 from being in the wrong direction, thereby improving the yield rate of the circuit board.

[0051] See also Figures 1 to 3 In some embodiments of the present application, the clamping portion 31 of the clamping device 30 is provided with a buffer pad 32 .

[0052] By providing a buffer pad 32 on the clamping portion 31 of the clamping device 30 , the clamping device 30 is prevented from hard contact with the substrate 40 , thereby reducing damage to the substrate 40 caused by the clamping device 30 and improving the yield rate of the circuit board.

[0053] In the description of this specification, the description with reference to the terms "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0054] In addition, the above description is only a preferred embodiment of the utility model, and is not intended to limit the utility model. Any modifications, equivalent replacements and improvements made within the spirit and principle of the utility model shall be included in the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.

Claims

1. A loading platform device, characterized in that: include: A loading frame, used for carrying a substrate; A clamping device, fixedly mounted on the loading frame, for clamping the edge of the substrate; The loading frame is provided with a limiting groove, and the contour of the limiting groove matches the contour of the substrate; At least one of the clamping devices is installed near each side of the limiting groove.

2. The loading platform device according to claim 1, characterized in that: At least three clamping devices are installed near each side of the limiting groove.

3. The loading platform device according to claim 2, characterized in that: The distances between adjacent clamping devices on each side of the limiting groove are equal.

4. The loading platform device according to claim 1, characterized in that: The clamping device is a quick-action clamp.

5. The loading platform device according to claim 1, characterized in that: Guide blocks are arranged on both sides of the bottom of the loading frame.

6. The loading platform device according to claim 5, characterized in that: The guide block is laterally provided with a positioning hole.

7. The loading platform device according to claim 6, characterized in that: The positioning hole includes a first hole and a second hole, and a diameter of the first hole is smaller than a diameter of the second hole.

8. The loading platform device according to claim 1, characterized in that: The clamping portion of the clamping device is provided with a buffer pad.

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