Loading mechanism and CMP equipment
By using the combination of bearing components, detection components and driving components in semiconductor manufacturing equipment, the existence of wafers is detected by using wafer gravity, which solves the damage and detection accuracy of the wafer circuit layer by the water pressure sensor, and achieves the further development Accurate wafer loading and unloading processes.
CN222155154UActive Publication Date: 2024-12-13吉姆西半导体科技(无锡)股份有限公司
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Patent Information
- Application Number
- CN202420784849.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-16
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-04-16
Smart Images
Figure CN222155154U_ABST
Abstract
The utility model relates to a loading mechanism and CMP equipment. The loading mechanism comprises a bearing assembly which is provided with a bearing surface for bearing a wafer; the detection assembly comprises a detector and a movable part which are arranged on the bearing surface, the movable part can move relative to the detector under the pressing action of the wafer to generate position change, and the detector is used for detecting the position change of the movable part; the driving assembly is in driving connection with the bearing assembly so as to drive the side, provided with the bearing face, of the bearing assembly to be in butt joint with or separated from the polishing head. Compared with the prior art, the loading mechanism has the advantages that a water pressure sensor is prevented from being used for detecting whether the wafer exists or not, so that a water column is prevented from damaging a circuit layer with copper on the wafer, and meanwhile, the phenomenon that the detection accuracy is reduced due to buckling deformation of the wafer is also avoided.
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