Electronic device, electronic equipment and vehicle

Abstract

The utility model provides an electronic device, electronic equipment and a vehicle. The electronic device comprises a shell, a chip and a connecting piece. The shell comprises a mounting surface and is provided with a containing groove, and the containing groove is formed by sinking the mounting surface. The chip comprises a packaging substrate and a function part, and the function part and the packaging substrate are both located in the containing groove. The connecting piece comprises an edge part and a middle part, the edge part is connected to the periphery of the middle part, the edge part is connected to the mounting surface, the middle part is connected to the packaging substrate, and a difference value of thermal expansion coefficients of the shell and the packaging substrate is greater than or equal to a preset threshold value; a thermal expansion coefficient of the connector is between a thermal expansion coefficient of the housing and a thermal expansion coefficient of the package substrate. According to the embodiment of the invention, the structure of the electronic device can be adjusted, so that the electronic device can be stably connected with chips in various different packaging modes.

Description

Technical Field

[0001] The present application relates to the field of chip installation, and in particular to an electronic device, an electronic device and a vehicle. Background Art

[0002] At present, the chips in the equipment that needs to install the optical machine are generally packaged in plastic, metal or ceramic. Among them, the connection between the plastic packaging structure or metal packaging structure of the chip and the mounting shell is relatively stable and not easy to loosen. However, the connection strength between the ceramic packaging structure of the chip and the mounting shell is weak, which makes the chip easy to loosen during use and unable to work stably. Therefore, how to adjust the structure of the electronic device so that the electronic device can have a high connection strength with chips of various packaging structures to ensure the stable operation of the chip is a problem that needs to be solved urgently. Utility Model Content

[0003] The embodiments of the present application provide an electronic device, an electronic device and a vehicle, which can adjust the structure of the electronic device so that the electronic device can be stably connected to chips of various different packaging methods.

[0004] In a first aspect, the present application provides an electronic device, including a housing, a chip, and a connector. The housing includes a mounting surface, the housing is provided with a receiving groove, and the receiving groove is recessed by the mounting surface. The chip includes a packaging substrate and a functional portion, and the functional portion and the packaging substrate are both located in the receiving groove. The connector includes an edge portion and a middle portion, the edge portion is connected to the periphery of the middle portion, the edge portion is connected to the mounting surface, and the middle portion is connected to the packaging substrate, the difference in thermal expansion coefficient between the housing and the packaging substrate is greater than or equal to a preset threshold, and the thermal expansion coefficient of the connector is between the thermal expansion coefficient of the housing and the thermal expansion coefficient of the packaging substrate.

[0005] At present, when the thermal expansion coefficient of the chip packaging substrate and the thermal expansion coefficient of the shell are greatly different, during the temperature change process, the packaging substrate and the shell will produce relative displacement due to different expansion or contraction degrees. This relative displacement will cause stress concentration at the connection between the packaging substrate and the shell, which may cause the chip packaging substrate to deform, resulting in damage to the chip structure and failure to work normally.

[0006] In this embodiment, the housing can be connected to the chip through a connector, and the housing does not need to be in direct contact with the chip packaging substrate. Therefore, during temperature changes, the deformation of the housing and the chip packaging substrate will not affect the structural stability of each other.

[0007] Since the thermal expansion coefficient of the connector is between the thermal expansion coefficient of the shell and the thermal expansion coefficient of the package substrate, the connector can be used as a buffer between the shell and the package substrate. The difference between the thermal expansion coefficient of the connector and the thermal expansion coefficient of the shell is relatively small (compared with the difference between the thermal expansion coefficient of the shell and the thermal expansion coefficient of the package substrate). During the temperature change, the deformation degree of the connector and the shell is relatively close. Therefore, the stress at the connection between the connector and the shell is relatively small, and the deformation degree of the connector and the shell is relatively close. Therefore, the connector and the shell can ensure a certain degree of connection strength so that the connector will not fall off the shell.

[0008] Furthermore, since the difference between the connector and the chip packaging substrate is relatively small (compared with the difference between the thermal expansion coefficient of the housing and the thermal expansion coefficient of the packaging substrate), the deformation degree of the connector and the packaging substrate is relatively close during the temperature change process. Therefore, the stress at the connection between the connector and the chip is relatively small, the connection between the connector and the chip packaging substrate is relatively stable, and the chip will not be structurally damaged due to deformation during the temperature change process, thereby maintaining the integrity of the structure, which is conducive to the stable operation of the chip.

[0009] In a possible implementation manner, the preset threshold is greater than or equal to 30*10 -6 / °C.

[0010] In this embodiment, when the thermal expansion coefficient of the housing differs greatly from the thermal expansion coefficient of the package substrate (more than 30*10 -6 / °C), in daily use of electronic devices, when the temperature changes, the direct connection stability between the shell and the packaging substrate is weak. Indirectly connecting the shell and the packaging substrate through a connector can keep the relative position of the shell and the chip basically unchanged, so that the chip can be stably installed in the shell.

[0011] In a possible implementation manner, the difference between the thermal expansion coefficient of the connector and the thermal expansion coefficient of the housing is within 12*10 -6 / °C-18*10 -6 / °C.

[0012] In this embodiment, the difference between the connector and the housing is maintained at 12*10 -6 / °C-18*10 -6 / °C range. When the temperature changes, the degree of deformation of the housing and the connector is relatively small, and the connection between the housing and the connector is not easy to be disconnected. In addition, the difference between the thermal expansion coefficient of the connector and the thermal expansion coefficient of the chip packaging substrate is also relatively small, and the connection between the connector and the chip packaging substrate is also relatively stable, avoiding damage to the connection between the connector and the housing and / or the chip.

[0013] In a possible implementation, the electronic device further includes a first colloid and a second colloid, the first colloid is connected between the middle portion and the packaging substrate, the second colloid is connected between the edge portion and the mounting surface, and the first colloid and the second colloid are spaced apart.

[0014] In this embodiment, the first colloid can fix the middle part of the connector to the package substrate, and the second colloid can fix the edge of the connector to the housing, so that the housing and the chip are in a stable relative position, preventing the chip from shaking relative to the housing and affecting the normal operation of the chip.

[0015] In a possible implementation manner, the connector includes a first connecting surface, the first connecting surface faces the packaging substrate, a connecting groove is recessed in a middle portion of the first connecting surface, and the first colloid is connected between the connecting groove and the packaging substrate.

[0016] In this embodiment, the connection groove can accommodate the first colloid and prevent the first colloid from overflowing from between the middle portion of the connection member and the ceramic substrate before solidification.

[0017] In a possible implementation manner, the connector is provided with a buffer groove, and an orthographic projection of the buffer groove onto the packaging substrate is located between the first colloid and the second colloid.

[0018] In this embodiment, the buffer groove can be spaced between the middle part and the edge part of the connector. The edge part of the connector will be subject to stress caused by the thermal expansion and contraction of the shell, and the middle part of the connector will be subject to stress caused by the thermal expansion and contraction of the chip packaging substrate. The buffer groove can prevent the force on the edge part of the connector from being transmitted to the middle part, and at the same time prevent the force on the middle part of the connector from being transmitted to the edge position. The chip and the shell will not directly produce stress differences due to the mismatch of thermal expansion coefficients, so that the connector can better absorb the stress and deformation caused by the thermal expansion and contraction of the shell and the chip packaging substrate, making the relative position of the chip and the shell more stable.

[0019] In a possible implementation, the electronic device further includes a third colloid and a fourth colloid, the third colloid is connected between the middle portion and the packaging substrate, and is spaced apart from the first colloid, the fourth colloid is connected between the edge portion and the mounting surface, and is spaced apart from the second colloid.

[0020] The material of the third colloid and the material of the fourth colloid are light-curing materials.

[0021] In this embodiment, the third colloid can be pre-positioned between the edge of the connector and the housing. The fourth colloid can be pre-positioned between the middle of the connector and the chip. The third colloid and the fourth colloid can relatively fix the positions of the connector, the housing, and the chip when the first colloid and the second colloid are not yet solidified, so that the first colloid and the second colloid can stably connect the three according to the predetermined position under high temperature baking.

[0022] In a possible embodiment, the electronic device also includes a heating body, and the connecting member also includes a second connecting surface. In the thickness direction of the connecting member, the second connecting surface is opposite to the first connecting surface. The heating body is connected to the second connecting surface. The heating body is used to heat the working environment temperature of the chip when the ambient temperature of the electronic device is lower than or equal to a preset temperature threshold.

[0023] In this embodiment, the heating body can heat the ambient temperature of the chip when the ambient temperature is low, so that the chip can work at a suitable ambient temperature, ensuring that the chip can operate normally and stably.

[0024] In a possible embodiment, the heating body includes a main body and an electrical connection line, the main body is connected to the second connection surface, one end of the electrical connection line is electrically connected to the main body, and the other end is used to be electrically connected to the controller. When the ambient temperature is lower than or equal to a preset temperature threshold, the controller is used to control the temperature rise of the main body through the electrical connection line.

[0025] In one possible embodiment, the connecting member is provided with a limit body, which includes a first section and a second section, one end of the first section is bent and connected to the second section, and the other end is connected to the second connecting surface, there is a gap between the second section and the second connecting surface, and part of the electrical connecting line is located between the second section and the second connecting surface.

[0026] In this embodiment, the limiting body can provide support and limiting for the electrical connection line, so as to prevent the electrical connection line from moving to other positions and affecting the operation of other components.

[0027] In a possible implementation manner, the electronic device further includes a heat conductor, which is connected between the packaging substrate and the middle portion of the connector, and the heat conductor is spaced apart from the first colloid.

[0028] In this embodiment, the heat conductor can transfer the heat of the chip to the connector in time, and then transfer the heat from the connector to the environment, thereby completing the heat dissipation of the chip and avoiding heat accumulation of the chip, which causes the chip to be overheated and unable to work normally.

[0029] In a possible implementation, the electronic device further includes a light source, and the housing is provided with a light-transmitting channel, which is connected to the receiving groove. The functional part includes a light-transmitting plate and a liquid crystal layer, the light-transmitting plate and the packaging substrate are stacked to form a receiving space, the liquid crystal layer is located in the receiving space, and the light-transmitting plate is connected to the bottom wall of the receiving groove. The light source is used to emit light, and after entering the housing, the light can pass through the light-transmitting channel and the light-transmitting plate and be reflected on the surface of the liquid crystal layer.

[0030] In this embodiment, the electronic device can be a part of the optical machine in the head-up display system, and the chip can be a reflective liquid crystal chip. In this embodiment of the application, the chip and the housing are stably connected by a connector, so that the position of the chip and the housing can be relatively fixed, and the chip is prevented from shaking when reflecting light, so that the optical path of the light emitted by the optical machine is more stable, which is convenient for the head-up display system to present stable images.

[0031] In a possible implementation manner, the connecting member and the housing form a housing structure of the electronic device.

[0032] In a second aspect, the present application provides an electronic device, including a controller, a sensor and the electronic device as described above, wherein the controller is electrically connected to the electronic device, and the controller can identify the temperature signal of the sensor and issue a working instruction to the heating body of the electronic device.

[0033] In a third aspect, the present application also provides a vehicle, comprising a main body and the electronic device as described above, wherein the electronic device is mounted on the main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution of the present application, the drawings required for use in the implementation manner will be briefly introduced below. Obviously, the drawings described below are only some implementation manners of the present application. For ordinary technicians in this field, other drawings can be obtained like these drawings without paying any creative work.

[0035] Figure 1 is a schematic diagram of the structure of a vehicle provided in an embodiment of the present application;

[0036] Figure 2 yes Figure 1 A schematic diagram of the structure of the electronic device shown;

[0037] Figure 3 yes Figure 2 An exploded schematic diagram of the electronic device shown;

[0038] Figure 4 yes Figure 3 An enlarged schematic diagram of portion A of the electronic device shown;

[0039] Figure 5 yes Figure 3A schematic diagram of the structure of the housing shown;

[0040] Figure 6 yes Figure 3 A schematic diagram of the structure of the chip;

[0041] Figure 7 yes Figure 3 A schematic diagram of the structure of the connecting member shown;

[0042] Figure 8 yes Figure 7 The connecting piece shown is provided with a schematic diagram of the structure of the colloid.

[0043] Reference numerals:

[0044] 100-vehicle; 10-body; 20-electronic device; 21-controller; 22-sensor; 23-electronic device; 231-housing; 232-chip; 233-connector; 234-heating body; 2311-light-transmitting channel; 2312-mounting surface; 2313-line outlet surface; 2314-receiving groove; 2315-connecting groove; 2316-connecting groove; 2317-first glue groove; 2318-second glue groove; 2321-packaging substrate; 2322-functional part; 2323-light-transmitting plate; 2331-first Connecting surface; 2332-second connecting surface; 2333-edge part; 2334-middle part; 2335-first connecting groove; 2336-second connecting groove; 2337-third connecting groove; 2338-first ring platform; 2339-second ring platform; 2330-buffer groove; 235-limiting body; 2351-first section; 2352-second section; 236-first colloid; 237-second colloid; 238-third colloid; 239-fourth colloid; 240-heat conductor; 2341-main body; 2342-electrical connecting line. DETAILED DESCRIPTION

[0045] The specific embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can also be implemented in other ways different from those described herein, and therefore, the present application is not limited to the following embodiments.

[0046] For ease of understanding, the terms involved in the embodiments of the present application are first explained.

[0047] Multiple: refers to two or more than two.

[0048] Connection: should be understood in a broad sense. For example, A and B are connected, which can be either direct or indirect through an intermediary.

[0049] The specific implementation of the present application will be clearly described below in conjunction with the accompanying drawings.

[0050] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of a vehicle 100 provided in an embodiment of the present application. The vehicle 100 may be any type of vehicle that requires a head-up display device or an image projection device. The following text and the accompanying drawings illustrate the vehicle 100 as a vehicle, but it should be understood that the vehicle 100 is not limited to a vehicle.

[0051] The vehicle 100 includes a body 10 and an electronic device 20. The body 10 may be a vehicle body. The electronic device 20 may be a head-up display (HUD) or an image projection device required on the vehicle.

[0052] Among them, HUD can map key driving information, such as vehicle speed and navigation instructions, onto the vehicle's front windshield or a specially designed holographic half mirror. In this way, the driver can easily obtain this information without lowering his head during driving, which significantly enhances driving safety.

[0053] The image projection device can project entertainment content such as movies, TV programs, sports events, etc. onto a large screen inside the vehicle, such as the windshield, roof, or a specially set projection screen. In this way, the driver and passengers can enjoy a private cinema-like viewing experience in the car without being restricted by the size and function of the screen, making long-distance travel or daily commuting more interesting and comfortable.

[0054] Please continue reading Figure 1 The electronic device 20 includes a controller 21, a sensor 22 and an electronic device 23. The controller 21, the sensor 22 and the electronic device 23 can all be installed on the body 10 of the vehicle 100. The controller 21 is electrically connected to the heating body in the electronic device 23. The controller 21 can identify the temperature signal of the sensor 22. When the controller 21 identifies that the temperature signal is lower than a preset temperature threshold. The controller 21 can control the heating body to heat up, thereby increasing the ambient temperature of the electronic device 23, to prevent the electronic device 23 from failing to start and work normally under low temperature conditions.

[0055] The controller 21 generally refers to a series of electronic devices used to manage and control various systems and components of the vehicle. These controllers 21 receive signals from sensors 22 and other input devices, and then process and analyze these signals according to predetermined programs and algorithms, thereby achieving precise control of various functions of the vehicle.

[0056] The sensor 22 may be a temperature sensor that can sense the temperature of its environment and convert the sensed temperature information into an electrical signal or other required form of information output according to a certain rule to meet the requirements of information transmission, processing, storage, display, recording and control.

[0057] The electronic device 23 may be any device whose housing structure requires a chip to be mounted. The following description will be made by taking the electronic device 23 as an example of a projection optical machine of a vehicle, wherein the projection optical machine can project an image to be projected into a projection screen.

[0058] At present, chips in electronic devices generally adopt plastic packaging, metal packaging or ceramic packaging, etc. Among them, the connection between the plastic packaging structure or metal packaging structure of the chip and the mounting shell is relatively stable and not easy to loosen. However, the connection strength between the ceramic packaging structure of the chip and the mounting shell is weak, which causes the chip to loosen easily during use and cannot work stably. Therefore, how to adjust the shell structure of the electronic device so that the electronic device can have a high connection strength with chips of various packaging structures to ensure the stable operation of the chip is a problem that needs to be solved urgently.

[0059] Based on this, please refer to Figure 2 and Figure 3 , Figure 2 yes Figure 1 A schematic structural diagram of the electronic device 23 is shown. Figure 3 yes Figure 2 The exploded schematic diagram of the electronic device 23 is shown. The embodiment of the present application adjusts the structure of the electronic device 23 so that the shell structure (not shown) of the electronic device 23 can be stably connected to the packaging substrates of various chips, so that the chip can be stably installed in the shell structure, and the relative position of the chip and the shell structure is stable, so that the chip can stably process light and avoid shaking of the projected image.

[0060] The electronic device 23 includes a housing 231, a chip 232, a connector 233 and a heater 234. The chip 232 and the connector 233 are both mounted on the housing 231. The electronic device 23 may also include a light source (not shown), which can emit light, and the light is transmitted to the chip 232 for generating an image.

[0061] It should be noted that Figure 2The purpose is only to schematically describe the connection relationship between the housing 231, the chip 232, the connector 233 and the heater 234, and it does not specifically limit the connection position, specific structure and quantity of each device. The structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 23. In other embodiments of the present application, the electronic device 23 may include more or fewer components than shown in the figure, or combine certain components, or split certain components, or arrange the components differently. The illustrated components can be implemented in hardware, software, or a combination of software and hardware.

[0062] In this embodiment, the electronic device 23 may be an optical machine in a head-up display system of a vehicle, and the chip 232 may be a reflective liquid crystal chip. In this embodiment of the application, the chip 232 is stably connected to the housing 231 through the connector 233, so that the positions of the chip 232 and the housing 231 can be relatively fixed, and the chip 232 is prevented from shaking when reflecting light, thereby making the optical path of the light emitted by the optical machine more stable, which is convenient for the head-up display system to present stable images.

[0063] See also Figure 5 , Figure 5 yes Figure 3 The structural schematic diagram of the shell 231 shown. The shell 231 is provided with a light-transmitting channel 2311. The light-transmitting channel 2311 runs through the shell 231. The hole wall of the light-transmitting channel 2311 can be the inner surface of the shell 231. Among them, the cavity shape of the light-transmitting channel 2311 can be a straight through hole or a curved through hole. The light-transmitting channel 2311 can be arranged in a serpentine shape inside the shell 231. The present application does not limit the specific shape of the light-transmitting channel 2311.

[0064] The housing 231 may include a mounting surface 2312 and a wire outlet surface 2313. The mounting surface 2312 may be a portion of the outer surface of the housing 231. The mounting surface 2312 may be a curved surface, a stepped surface, or a flat surface. The present application does not limit the specific shape of the mounting surface 2312. The wire outlet surface 2313 is bent and connected to the edge of the mounting surface 2312. The wire outlet surface 2313 is the surface from which the electrical connection wires of the chip 232 are led out of the receiving groove.

[0065] The housing 231 is provided with a receiving groove 2314, a connecting groove 2315 and a connecting groove 2316. The receiving groove 2314 is recessed from the mounting surface 2312. The receiving groove 2314 also penetrates the outlet surface 2313. The connecting groove 2315 penetrates the middle part of the groove bottom wall of the receiving groove 2314 and the hole wall of the light-transmitting channel 2311. The connecting groove 2315 connects the receiving groove 2314 with the light-transmitting channel 2311. The connecting groove 2316 is recessed from the groove bottom wall of the receiving groove 2314. The connecting groove 2316 is arranged around the connecting groove 2315 and is spaced from the connecting groove 2315.

[0066] The housing 231 may further include a first adhesive groove 2317 and a second adhesive groove 2318. The first adhesive groove 2317 and the second adhesive groove 2318 are both recessed from the mounting surface 2312 and are located at opposite sides of the receiving groove 2314. The first adhesive groove 2317 and the second adhesive groove 2318 may both be connected to the receiving groove 2314.

[0067] The light source (not shown) can be connected to the housing 231 through a back plate (not shown). The light source can emit light into the light-transmitting channel 2311. Exemplarily, the light source can include a laser light source, an LED light source, a fluorescent light source, and the like.

[0068] The chip 232 may be a spatial light modulator. The spatial light modulator may be a digital micromirror device (DMD), a liquid crystal display (LCD), a liquid crystal on silicon (LCOS), etc. The spatial light modulator is used to modulate the light of a light source to generate image light. The following description takes the chip 232 as an LCOS chip as an example.

[0069] See also Figure 6 , Figure 6 yes Figure 3 The schematic diagram of the structure of the chip 232. The chip 232 includes a packaging substrate 2321 and a functional part 2322. The packaging substrate 2321 can be a metal substrate, a plastic substrate or a ceramic substrate.

[0070] The housing 231 of the optical machine for projection is generally made of plastic due to its complex structure. The thermal expansion coefficients of plastic housings made of different materials are different. For example, the thermal expansion coefficient of polyvinyl chloride (PVC) is approximately 37*10 -6 / ℃. The thermal expansion coefficient of polypropylene (PP) is approximately 30.6*10 -6 / ℃. The thermal expansion coefficient of ceramic materials is generally less than 10*10 -6 / °C.

[0071] The functional portion 2322 and the packaging substrate 2321 are both located in the receiving groove 2314 .

[0072] At present, due to the large difference in thermal expansion coefficients between the ceramic substrate and the shell, if the ceramic substrate is directly connected to the plastic shell, when the temperature changes, the ceramic substrate and the plastic shell will deform to different degrees, which may easily cause stress at the connection between the ceramic substrate and the plastic shell, affecting the connection stability between the ceramic substrate and the plastic shell.

[0073] Therefore, the present application indirectly connects the package substrate 2321 and the housing 231 through the connector 233 to avoid direct contact between the package substrate 2321 and the housing 231. This avoids generating large stress at the connection when the package substrate 2321 and the housing 231 are deformed to different degrees, thereby preventing the problem of instability at the connection between the package substrate 2321 and the housing 231.

[0074] The electronic device 23 provided in the embodiment of the present application can apply a ceramic packaging substrate 2321. Since the packaging cost of the chip 232 packaged in a ceramic package is lower than the packaging cost of the chip 232 packaged in metal or other materials, the electronic device 23 provided in the embodiment of the present application can also use the chip 232 with a lower packaging cost, thereby reducing the production cost of the overall electronic device 23.

[0075] Specifically, the packaging substrate 2321 of the chip 232 is provided with a receiving groove (not shown), which is recessed along a surface of the packaging substrate 2321 in a thickness direction and penetrates a peripheral side surface of the packaging substrate 2321 .

[0076] The functional part 2322 includes a light-transmitting plate 2323 and a liquid crystal layer (not shown). The light-transmitting plate 2323 and the packaging substrate 2321 are stacked to form a receiving space, and the liquid crystal layer is located in the receiving space.

[0077] The light-transmitting plate 2323 may be a glass panel, and the light-transmitting plate 2323 allows light to pass through, so that the light can irradiate the liquid crystal layer.

[0078] An opening is provided between the light-transmitting plate 2323 and one side edge of the packaging substrate 2321, and the opening is connected to the receiving groove of the packaging substrate 2321. The opening is used for the circuit wiring of the liquid crystal layer to pass through. The side of the light-transmitting plate 2323 facing away from the liquid crystal layer is connected to the connection groove 2316 through a connecting colloid.

[0079] A surface of the packaging substrate 2321 of the chip 232 that is away from the liquid crystal layer may be disposed on the same side as the mounting surface 2312 of the housing 231 .

[0080] In this embodiment, there is a difference between the thermal expansion coefficient of the package substrate 2321 of the chip 232 and the thermal expansion coefficient of the housing 231, and the difference is not 0. The difference between the thermal expansion coefficient of the package substrate 2321 of the chip 232 and the thermal expansion coefficient of the housing 231 is defined as a preset threshold. Exemplarily, when the material of the housing 231 is a plastic material and the material of the package substrate 2321 is a ceramic material, the preset threshold is greater than or equal to 30*10 -6 / °C.

[0081] In this embodiment, when the thermal expansion coefficient of the housing 231 differs greatly from the thermal expansion coefficient of the packaging substrate 2321 (more than 30*10 -6 / °C), in daily use of the electronic device 23, when the temperature changes, the direct connection stability between the shell 231 and the packaging substrate 2321 is weak. By indirectly connecting the shell 231 and the packaging substrate 2321 through the connector 233, the relative position of the shell 231 and the chip 232 can be kept basically unchanged, so that the chip 232 can be stably installed in the shell 231.

[0082] In some other embodiments, the material of the housing 231 may be a plastic material, and the material of the package substrate 2321 of the chip 232 may be a metal material. The preset threshold may be in the range of 0-30 (including the endpoint value 30).

[0083] In this embodiment, the electronic device 23 can use a chip 232 packaged in a ceramic substrate. In other usage scenarios, the electronic device 23 can also use a chip 232 packaged in a plastic package or a chip 232 packaged in a metal package. In the process of continuous updating and iteration of the electronic device 20, the types of chips 232 are also constantly changing. The electronic device 23 provided in the embodiment of the present application can be stably installed for chips 232 of any common packaging method.

[0084] The light source is used to emit light. After entering the housing 231, the light can pass through the light-transmitting channel 2311 and the light-transmitting plate 2323 and be reflected on the surface of the liquid crystal layer. Under the action of the electrical signal, the liquid crystal layer can change the arrangement of the liquid crystal molecules, thereby changing the polarization state of the light and reflecting the light. The reflected light can be amplified and projected onto the screen to form an image.

[0085] See also Figure 7 , Figure 7 yes Figure 3 The structural schematic diagram of the connector 233 is shown. The connector 233 includes a first connecting surface 2331 and a second connecting surface 2332. The first connecting surface 2331 and the second connecting surface 2332 are arranged opposite to each other along the thickness direction of the connector 233. The first connecting surface 2331 is used to face the package substrate 2321 of the chip 232. The second connecting surface 2332 is used to face away from the package substrate 2321 of the chip 232.

[0086] The first connection surface 2331 of the connector 233 includes an edge portion 2333 and a middle portion 2334, wherein the edge portion 2333 is connected to the periphery of the middle portion 2334. The edge portion 2333 is connected to the mounting surface 2312, and the middle portion 2334 is connected to the package substrate 2321. The connector 233 and the housing 231 form a shell structure of the electronic device 23, and the shell structure can mount the chip 232 therein. The thermal expansion coefficient of the connector 233 is between the thermal expansion coefficient of the housing 231 and the thermal expansion coefficient of the package substrate 2321.

[0087] At present, when the thermal expansion coefficient of the package substrate 2321 of the chip 232 is greatly different from that of the shell 231, during the temperature change, the package substrate 2321 and the shell 231 will produce relative displacement due to different expansion or contraction degrees. This relative displacement will cause stress concentration at the connection between the package substrate 2321 and the shell 231, which may cause the package substrate 2321 of the chip 232 to deform, resulting in damage to the structure of the chip 232 and failure to work normally.

[0088] In this embodiment, the housing 231 can be connected to the chip 232 through the connector 233, and the housing 231 does not need to be in direct contact with the package substrate 2321 of the chip 232. Therefore, during the temperature change, the deformation of the housing 231 and the deformation of the package substrate 2321 of the chip 232 will not affect the structural stability of each other.

[0089] Since the thermal expansion coefficient of the connector 233 is between the thermal expansion coefficient of the housing 231 and the thermal expansion coefficient of the package substrate 2321, the connector 233 can buffer between the housing 231 and the package substrate 2321. The difference between the thermal expansion coefficient of the connector 233 and the housing 231 is relatively small (compared with the difference between the thermal expansion coefficient of the housing 231 and the thermal expansion coefficient of the package substrate 2321). During the temperature change, the deformation degree of the connector 233 and the housing 231 is relatively close. Therefore, the stress at the connection between the connector 233 and the housing 231 is relatively small, and the deformation degree of the connector 233 and the housing 231 is relatively close. Therefore, the connector 233 and the housing 231 can ensure a certain degree of connection strength, so that the connector 233 will not fall off the housing 231.

[0090] Furthermore, since the difference between the connector 233 and the package substrate 2321 of the chip 232 is relatively small (compared with the difference between the thermal expansion coefficient of the housing 231 and the thermal expansion coefficient of the package substrate 2321), the connector 233 and the package substrate 2321 are deformed to a similar degree during temperature changes. Therefore, the stress at the connection between the connector 233 and the chip 232 is relatively small, the connection between the connector 233 and the package substrate 2321 of the chip 232 is relatively stable, and the chip 232 will not be structurally damaged due to deformation during temperature changes, thereby maintaining structural integrity, which is conducive to the stable operation of the chip 232.

[0091] In a possible implementation manner, the difference between the thermal expansion coefficient of the connector 233 and the thermal expansion coefficient of the housing 231 is within 12*10 -6 / °C-18*10 -6 / °C (including the endpoint value 12*10 -6 / °C and 18*10 -6 / °C).

[0092] In this embodiment, the difference between the connecting member 233 and the housing 231 is maintained at 12*10 -6 / °C-18*10 -6 / °C range. When the temperature changes, the degree of deformation of the housing 231 and the connector 233 is relatively small, and the connection between the housing 231 and the connector 233 is not easy to be disconnected. In addition, the difference between the thermal expansion coefficient of the connector 233 and the thermal expansion coefficient of the package substrate 2321 of the chip 232 is also relatively small, and the connection between the connector 233 and the package substrate 2321 of the chip 232 is also relatively stable, avoiding damage to the connection between the connector 233 and the housing 231 and / or the chip 232.

[0093] Specifically, there are two edge portions 2333 , and the two edge portions 2333 are respectively connected to both sides of the middle portion 2334 in the width direction.

[0094] The connecting member 233 is also provided with a plurality of connecting grooves (not marked in the figure). The plurality of connecting grooves are recessed in the middle portion 2334 of the first connecting surface 2331, and the plurality of connecting grooves are respectively a first connecting groove 2335, a second connecting groove 2336 and a third connecting groove 2337. Along the length direction of the middle portion 2334, the first connecting groove 2335, the second connecting groove 2336 and the third connecting groove 2337 are sequentially arranged and spaced apart.

[0095] The connecting member 233 is further provided with a first ring platform 2338 and a second ring platform 2339. The first ring platform 2338 and the second ring platform 2339 are both protruded from the middle portion 2334 of the first connecting member 233. The first ring platform 2338 surrounds the periphery of the first connecting groove 2335. The second ring platform 2339 surrounds the periphery of the third connecting groove 2337. The first ring platform 2338 and the second ring platform 2339 can abut against the packaging substrate 2321 of the chip 232 to form a closed cavity.

[0096] The connecting member 233 is further provided with two buffer grooves 2330. The buffer grooves 2330 penetrate the connecting member 233 along the thickness direction of the connecting member 233. The two buffer grooves 2330 are arranged opposite to each other along the width direction of the middle portion 2334. The two buffer grooves 2330 extend along the length direction of the middle portion 2334. The two buffer grooves 2330 are respectively located on opposite sides of the second connecting groove 2336 and the third connecting groove 2337.

[0097] In this embodiment, the buffer groove 2330 can be spaced between the connection between the middle part 2334 of the connector 233 and the chip 232 and the connection between the edge part 2333 and the housing 231. The edge part 2333 of the connector 233 will be subjected to stress caused by the thermal expansion and contraction of the housing 231, and the middle part 2334 of the connector 233 will be subjected to stress caused by the thermal expansion and contraction of the package substrate 2321 of the chip 232. The buffer groove 2330 can prevent the force on the edge part 2333 of the connector 233 from being transmitted to the middle part 2334, and at the same time prevent the force on the middle part 2334 of the connector 233 from being transmitted to the edge position. The chip 232 and the housing 231 will not directly generate stress differences due to the mismatch of thermal expansion coefficients, so that the connector 233 can better absorb the stress and deformation caused by the thermal expansion and contraction of the housing 231 and the package substrate 2321 of the chip 232, so that the relative position of the chip 232 and the housing 231 is more stable.

[0098] For some possible embodiments, please refer to Figure 3 and Figure 4 , Figure 4 yes Figure 3 The enlarged schematic diagram of the A part of the electronic device 23 shown in FIG. The connector 233 is also provided with a limiter 235. The limiter 235 may be L-shaped. The limiter 235 includes a first section 2351 and a second section 2352. One end of the first section 2351 is bent and connected to the second section 2352, and the other end is connected to the second connection surface 2332. There is a gap between the second section 2352 and the second connection surface 2332. The electrical connection line of part of the heating body 234 is located between the second section 2352 and the second connection surface 2332.

[0099] In this embodiment, the limiting body 235 can provide support and limit for the electrical connection line of the heating body 234, so as to prevent the electrical connection line of the heating body 234 from moving to other positions and affecting the operation of other components.

[0100] The present application also conducts simulation tests on the deformation amount of the connector 233 under extremely low temperatures. When the ambient temperature is -40°C, when the material of the connector 233 includes aluminum alloy. The degree of structural strain of the middle portion 2334 of the connector 233 is 2%. The degree of decoupling strand strain of the edge portion 2333 of the connector 233 is 1.1%. In the mechanical property test of the connector 233, it was found that when the strain of the connector 233 is less than 2.8%, the structure of the connector 233 will not break. Exemplarily, the connector 233 whose material includes aluminum alloy can be die-cast by a die-casting machine.

[0101] When the ambient temperature is -40°C, when the material of the connector 233 includes a copper alloy. The degree of structural strain of the middle portion 2334 of the connector 233 is 1.7%. The degree of decoupling strand strain of the edge portion 2333 of the connector 233 is 1.7%. In the mechanical property test of the connector 233, it was found that when the strain of the connector 233 is less than 2.8%, the structure of the connector 233 will not break. Exemplarily, the connector 233 whose material includes a copper alloy can be formed by forging machine processing or sheet metal stamping. Among them, the preparation cost of the connector 233 whose material is a copper alloy is higher than the preparation cost of the connector 233 whose material is an aluminum alloy.

[0102] Please refer to Figure 5 , Figure 7 and Figure 8 , Figure 8 yes Figure 7 The connecting member 233 shown is provided with a schematic diagram of the structure of the colloid. The electronic device 23 also includes a first colloid 236 and a second colloid 237. The number of the first colloid 236 is one, and the first colloid 236 is connected between the second connection groove 2336 of the middle part 2334 and the packaging substrate 2321. The number of the second colloid 237 is two, and one second colloid 237 is connected between the middle part 2334 of the first glue groove 2317 of one edge part 2333 and the mounting surface 2312. Another second colloid 237 is connected to the middle part 2334 of the second glue groove 2318 of another edge part 2333. The first colloid 236 and the second colloid 237 are arranged at intervals. The positive projection of the buffer groove 2330 to the packaging substrate 2321 is located between the first colloid 236 and the second colloid 237.

[0103] The elastic modulus of the first colloid 236 and the elastic modulus of the second colloid 237 may both be within the range of 2GPa-3GPa. The materials of the first colloid 236 and the second colloid 237 may be the same. The first colloid 236 and the second colloid 237 may be colloid materials that are cured under high temperature baking.

[0104] In this embodiment, the first colloid 236 can fix the middle portion 2334 of the connector 233 to the package substrate 2321. The second colloid 237 can fix the edge portion 2333 of the connector 233 to the housing 231, so that the housing 231 and the chip 232 are in a stable relative position, preventing the chip 232 from shaking relative to the housing 231 and affecting the normal operation of the chip 232.

[0105] In addition, the connection groove 2316 (second connection groove 2336 ) can accommodate the first glue 236 and prevent the first glue 236 from overflowing from between the middle portion 2334 of the connector 233 and the packaging substrate 2321 before being cured.

[0106] In some other possible embodiments, the electronic device 23 further includes a third colloid 238 and a fourth colloid 239. The material of the third colloid 238 and the material of the fourth colloid 239 are light-curable materials. For example, the third colloid 238 and the fourth colloid 239 can be cured under ultraviolet irradiation.

[0107] The third colloid 238 is connected between the middle portion 2334 and the packaging substrate 2321. Exemplarily, the number of the third colloid 238 can be two. The two third colloids 238 are respectively connected to the opposite sides of the second connection groove 2336. Part of the third colloid 238 can be located in the buffer groove 2330. The third colloid 238 is spaced apart from the first colloid 236.

[0108] The fourth colloid 239 is connected between the glue groove of the edge portion 2333 and the mounting surface 2312. Exemplarily, the number of the fourth colloids 239 can be four, two of the four fourth colloids 239 are connected to the two end portions of the first glue groove 2317 of one edge portion 2333, and the other two fourth colloids 239 are connected to the two end portions of the second glue groove 2318 of another edge portion 2333. The two fourth colloids 239 can be located on both sides of the length direction of one second colloid 237. The fourth colloid 239 is spaced apart from the second colloid 237.

[0109] In this embodiment, the third colloid 238 can be pre-positioned between the edge portion 2333 of the connector 233 and the housing 231. The fourth colloid 239 can be pre-positioned between the middle position of the connector 233 and the chip 232. The third colloid 238 and the fourth colloid 239 can relatively fix the positions of the connector 233, the housing 231 and the chip 232 when the first colloid 236 and the second colloid 237 are not yet solidified, so that the first colloid 236 and the second colloid 237 can be stably connected according to the predetermined position under high temperature baking.

[0110] The electronic device 23 further includes a heat conductor 240. There may be two heat conductors 240. One heat conductor 240 is connected between the package substrate 2321 and the first connection groove 2335 of the middle portion 2334 of the connector 233, and the heat conductor 240 is spaced apart from the first colloid 236. Another heat conductor 240 is connected between the package substrate 2321 and the third connection groove 2337 of the middle portion 2334 of the connector 233.

[0111] In this embodiment, the heat conductor 240 can transfer the heat of the chip 232 to the connector 233 in time, and then transfer the heat from the connector 233 to the environment, thereby completing the heat dissipation of the chip 232 and avoiding the heat accumulation of the chip 232, causing the chip 232 to be overheated and unable to work normally.

[0112] The heating body 234 is connected to the second connection surface 2332 of the connection member 233. The heating body 234 is used to heat the working environment temperature of the chip 232 when the environment temperature of the electronic device 23 is lower than or equal to a preset temperature threshold.

[0113] In this embodiment, the heating body 234 can heat the ambient temperature of the chip 232 when the ambient temperature is low, so that the chip 232 can work at a suitable ambient temperature, ensuring that the chip 232 can operate normally and stably.

[0114] For more details, please refer to Figure 3 The heating body 234 includes a main body 2341 and an electrical connection line 2342. The main body 2341 is connected to the second connection surface 2332. One end of the electrical connection line 2342 is electrically connected to the main body 2341, and the other end passes through the gap between the second section 2352 of the limiting body 235 and the second connection surface 2332 to be electrically connected to the controller 21.

[0115] The electronic device 20 may have a preset temperature threshold. The preset temperature threshold may be the lowest temperature at which the chip 232 operates normally. When the ambient temperature is higher than the preset temperature threshold, the chip 232 may start and operate normally. When the ambient temperature is lower than or equal to the preset temperature threshold, it is difficult for the chip 232 to start and operate at low temperatures.

[0116] The sensor 22 of the electronic device 20 can identify the ambient temperature. When the ambient temperature is lower than or equal to the preset temperature threshold, the sensor 22 can send a signal to the controller 21. The controller 21 can send a working instruction to the heating body 234 through the electrical connection line 2342 according to the signal of the sensor 22, and control the main body 2341 of the heating body 234 to increase the temperature. When the main body 2341 of the heating body 234 is heated, the ambient temperature where the chip 232 is located can be heated. In this way, the ambient temperature can be greater than or equal to the preset temperature threshold, so that the chip 232 can start working normally.

[0117] The above are exemplary embodiments of the present application. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made thereto without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: include: A housing, comprising a mounting surface, the housing being provided with a receiving groove, the receiving groove being recessed by the mounting surface; A chip, comprising a packaging substrate and a functional part, wherein both the functional part and the packaging substrate are located in the receiving groove; A connector, comprising an edge portion and a middle portion, wherein the edge portion is connected to the periphery of the middle portion, the edge portion is connected to the mounting surface, and the middle portion is connected to the packaging substrate, the difference in thermal expansion coefficient between the shell and the packaging substrate is greater than or equal to a preset threshold, and the thermal expansion coefficient of the connector is between the thermal expansion coefficient of the shell and the thermal expansion coefficient of the packaging substrate.

2. The electronic device according to claim 1, characterized in that The preset threshold is greater than or equal to 30*10 -6 / °C.

3. The electronic device according to claim 1 or 2, characterized in that: The difference between the thermal expansion coefficient of the connecting member and the thermal expansion coefficient of the housing is within 12*10 -6 / °C-18*10 -6 / °C.

4. The electronic device according to claim 3, characterized in that: The electronic device further comprises a first colloid and a second colloid, wherein the first colloid is connected between the middle portion and the packaging substrate, the second colloid is connected between the edge portion and the mounting surface, and the first colloid and the second colloid are spaced apart from each other.

5. The electronic device according to claim 4, characterized in that: The connecting member comprises a first connecting surface, the first connecting surface faces the packaging substrate, a connecting groove is recessed in the middle portion of the first connecting surface, and the first colloid is connected between the connecting groove and the packaging substrate.

6. The electronic device according to claim 4 or 5, characterized in that: The connecting member is provided with a buffer groove, and the positive projection of the buffer groove to the packaging substrate is located between the first colloid and the second colloid.

7. The electronic device according to claim 4 or 5, characterized in that: The electronic device also includes a third colloid and a fourth colloid, the third colloid is connected between the middle part and the packaging substrate, the third colloid is spaced apart from the first colloid, the fourth colloid is connected between the edge part and the mounting surface, and the fourth colloid is spaced apart from the second colloid.

8. The electronic device according to claim 5, characterized in that: The electronic device also includes a heating body, and the connecting member also includes a second connecting surface. In the thickness direction of the connecting member, the second connecting surface is opposite to the first connecting surface. The heating body is connected to the second connecting surface. The heating body is used to heat the working environment temperature of the chip when the ambient temperature of the electronic device is lower than or equal to a preset temperature threshold.

9. The electronic device according to claim 8, characterized in that: The heating body includes a main body and an electrical connection line, the main body is connected to the second connection surface, one end of the electrical connection line is electrically connected to the main body, and the other end is used to be electrically connected to a controller. When the ambient temperature is lower than or equal to the preset temperature threshold, the controller is used to control the temperature rise of the main body through the electrical connection line.

10. The electronic device according to claim 9, characterized in that: The connecting member is provided with a limiting body, which includes a first section and a second section. One end of the first section is bent and connected to the second section, and the other end is connected to the second connecting surface. There is a gap between the second section and the second connecting surface, and part of the electrical connecting line is located between the second section and the second connecting surface.

11. The electronic device according to claim 4 or 5, characterized in that: The electronic device further comprises a heat conductor, which is connected between the packaging substrate and a middle portion of the connector, and is spaced apart from the first colloid.

12. The electronic device according to claim 1 or 2, characterized in that: The electronic device further comprises a light source, the housing is provided with a light-transmitting channel, and the light-transmitting channel is communicated with the receiving groove; The functional part includes a light-transmitting plate and a liquid crystal layer, the light-transmitting plate is stacked with the packaging substrate to form a receiving space, the liquid crystal layer is located in the receiving space, and the light-transmitting plate is connected to the bottom wall of the receiving groove; The light source is used to emit light, and after entering the housing, the light can pass through the light-transmitting channel and the light-transmitting plate and be reflected on the surface of the liquid crystal layer.

13. The electronic device according to claim 1 or 2, characterized in that: The connecting member and the shell form a housing structure of the electronic device.

14. An electronic device, characterized in that: It comprises a controller, a sensor and the electronic device as described in any one of claims 1 to 13, wherein the controller is electrically connected to the electronic device, and the controller can identify the temperature signal of the sensor and issue a working instruction to the heating body of the electronic device.

15. A means of transport, characterized in that: The electronic device comprises a main body and the electronic device as claimed in claim 14, wherein the electronic device is mounted on the main body.

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