Heat dissipation type multilayer printed circuit board
By introducing distance-adjusting heat dissipation devices and buffer lighting devices into the multi-layer printed circuit board, the problems of inconvenience in installation and insufficient shock resistance are solved, the working ability and practicality of the circuit board are improved, and the functions of flexible adjustment and heat dissipation assisted lighting are realized.
Patent Information
- Application Number
- CN202420577933.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-25
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-03-25
AI Technical Summary
The existing multi-layer printed circuit boards are not convenient enough when installed, and are prone to affecting their working ability and practicality due to overheating and external vibration. They cannot adjust the distance of the assembly rod according to different situations and lack auxiliary lighting.
A heat-dissipating multi-layer printed circuit board is designed, using a distance-adjusting heat dissipation device and a buffer lighting device, adjust the distance of the assembly rod through the screw and the mobile station, dissipate heat by using a ventilation net and a fan, and passes through an elastic rubber cylinder and a small damper. Buffer vibration and provide lighting.
It improves the working ability and practicality of the circuit board, enhances installation convenience and earthquake resistance, avoids overheating damage and external interference, and meets the working needs in different situations.
Smart Images

Figure CN222170239U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of printed circuit boards, and in particular relates to a heat dissipation type multilayer printed circuit board. Background Art
[0002] A printed circuit board is an insulating board that is cut into a certain size and has at least one conductive pattern and holes. It is used to replace the chassis on which electronic components are installed in the past and to achieve interconnection between electronic components.
[0003] Chinese patent application No. 202223512975.1 discloses a multilayer printed circuit board, including a shell, a board body is placed above the shell, the upper surface of the board body is provided with a mounting hole connected to the lower surface, an assembly rod is inserted into the mounting hole, the bottom end of the assembly rod is fixedly connected to the upper surface of the shell, the upper surface of the shell is fixedly connected with a fixing rod, the surface of the fixing rod is sleeved with a movable ring, and the right side of the movable ring is fixedly connected with a cross bar. The multilayer printed circuit board, through the mutual cooperation between the assembly rod, the mounting hole, the fixing rod, the fastening cap, the cross bar, the fixing block, the spring and the movable ring, is convenient for the installation of the multilayer printed circuit board, provides convenience for the installation of the circuit board, and solves the problem that the current multilayer printed circuit board is not convenient enough during installation, thereby affecting the convenience of the installation of the circuit board.
[0004] 1. The above-mentioned disclosed patent has the problem that the distance between the two assembly rods and other structures cannot be adjusted according to the needs of different situations and is prone to overheating and damage, thereby reducing the working ability of the circuit board; 2. The above-mentioned disclosed patent has the problem that it is easily affected by external vibrations and cannot provide auxiliary lighting when needed, thereby reducing the practicality of the circuit board. Utility Model Content
[0005] In order to solve the problems raised in the above background technology, the utility model provides a heat dissipation type multilayer printed circuit board, which has the characteristics of high working ability and strong practicality.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat-dissipating multilayer printed circuit board, comprising a mounting plate, a plurality of mounting holes being opened at the edge of the mounting plate, two assembly rod assemblies being arranged above the mounting plate, a plate body being arranged on the outer sides of the two assembly rod assemblies, connecting assemblies being arranged on both sides of the plate body, a fastening cap being installed on the connecting assemblies and at a position outside the top of the assembly rod assemblies, a distance-adjustable heat dissipation device being installed on one side of the mounting plate close to the two assembly rod assemblies, and the two assembly rod assemblies and the distance-adjustable heat dissipation device being connected via two buffer lighting devices.
[0007] Preferably, the adjustable distance heat dissipation device includes a vertical plate, a heat dissipation component, a screw rod, a movable platform and a rotating block. Two vertical plates are installed on the side of the mounting plate close to the two assembly rod components, a rotating block is arranged between the two vertical plates, and movable platforms are arranged on both sides of the two vertical plates. Screw rods are installed on both sides of the rotating block and at positions located on the inner side of the movable platform, and a heat dissipation component is installed on the side of the movable platform close to the assembly rod component.
[0008] Preferably, the heat dissipation assembly includes a ventilation net, a connection box and a fan, a connection box is installed on a side of the mobile platform close to the assembly rod assembly, a fan is installed on the inner side of the connection box, and a ventilation net is installed on the top of the connection box.
[0009] Preferably, the heat dissipation assembly further comprises a filter, and filters are installed on both sides of the two connection boxes that are away from each other.
[0010] Preferably, the buffer lighting device includes an elastic rubber tube, a small damper and a transparent shell, the transparent shell is installed on the side of the assembly rod assembly and the connecting assembly close to the connecting box, the elastic rubber tube is installed between the transparent shell and the connecting box, and the small damper is installed between the transparent shell and the connecting box and at a position inside the elastic rubber tube.
[0011] Preferably, the buffer lighting device further comprises a lighting lamp, and a plurality of lighting lamps are installed on the inner side of the transparent shell.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] 1. The utility model provides a distance-adjustable heat dissipation device, so that the staff can adjust the distance between the two assembly rod components and other structures by the cooperation of the screw rod and the moving platform when necessary, so as to better meet the work needs in different situations, and the circuit board can dissipate the heat of the board body by the cooperation of the ventilation net and the fan when necessary, thereby improving the working capacity of the circuit board.
[0014] 2. The utility model provides a buffer lighting device so that the circuit board can buffer external vibrations to a certain extent through the cooperation of the elastic rubber tube and the small damper, thereby reducing the possibility of the board being adversely affected, and the circuit board can be assisted by a lighting lamp when needed, thereby improving the practicality of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a three-dimensional diagram of the utility model;
[0016] Figure 2 It is a three-dimensional cutaway view of the utility model;
[0017] Figure 3 It is a three-dimensional cutaway view of the adjustable distance heat dissipation device of the utility model;
[0018] Figure 4 It is a three-dimensional cutaway view of the buffer lighting device of the utility model.
[0019] In the figure: 1. mounting plate; 2. adjustable heat dissipation device; 21. vertical plate; 22. heat dissipation assembly; 221. ventilation net; 222. connection box; 223. filter; 224. fan; 23. screw rod; 24. moving table; 25. rotating block; 3. assembly rod assembly; 4. buffer lighting device; 41. elastic rubber tube; 42. small damper; 43. lighting lamp; 44. transparent shell; 5. mounting hole; 6. connection assembly; 7. fastening cap; 8. plate body. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] Example 1
[0022] See also Figure 1-4 The utility model provides the following technical solutions: a heat dissipation type multilayer printed circuit board, comprising a mounting plate 1, a plurality of mounting holes 5 are opened at the edge of the mounting plate 1, two assembly rod assemblies 3 are arranged above the mounting plate 1, a plate body 8 is arranged on the outer side of the two assembly rod assemblies 3, connecting assemblies 6 are arranged on both sides of the plate body 8, a fastening cap 7 is installed on the connecting assemblies 6 and at a position outside the top of the assembly rod assemblies 3, a distance-adjustable heat dissipation device 2 is installed on one side of the mounting plate 1 close to the two assembly rod assemblies 3, and the two assembly rod assemblies 3 are connected to the distance-adjustable heat dissipation device 2 through two buffer lighting devices 4.
[0023] Specifically, the adjustable distance heat dissipation device 2 includes a vertical plate 21, a heat dissipation component 22, a screw rod 23, a movable platform 24 and a rotating block 25. Two vertical plates 21 are installed on the side of the mounting plate 1 close to the two assembly rod components 3, a rotating block 25 is arranged between the two vertical plates 21, and movable platforms 24 are arranged on both sides of the two vertical plates 21. Screw rods 23 are installed on both sides of the rotating block 25 and at positions located on the inner side of the movable platform 24, and a heat dissipation component 22 is installed on the side of the movable platform 24 close to the assembly rod component 3.
[0024] By adopting the above technical solution, the staff can adjust the distance between the two assembly rod assemblies 3 and other structures by cooperating with the screw rod 23 and the moving platform 24 when necessary, so as to better meet the working needs in different situations.
[0025] Specifically, the heat dissipation assembly 22 includes a ventilation net 221, a connection box 222 and a fan 224. The connection box 222 is installed on the side of the mobile platform 24 close to the assembly rod assembly 3, the fan 224 is installed on the inner side of the connection box 222, and the ventilation net 221 is installed on the top of the connection box 222.
[0026] By adopting the above technical solution, the circuit board can dissipate heat to the board body 8 to a certain extent through the cooperation of structures such as the ventilation net 221 and the fan 224 when needed, thereby reducing the possibility of overheating and damage to the board body 8.
[0027] Specifically, the heat dissipation assembly 22 further includes a filter 223 , and the filter 223 is installed on both sides of the two connection boxes 222 that are away from each other.
[0028] By adopting the above technical solution, the circuit board can prevent external impurities from entering the inner side of the connection box 222 through the filter 223, thereby reducing the possibility of accidental damage to structures such as the fan 224, thereby ensuring normal operation.
[0029] When the present embodiment is used, when it is necessary to use a multilayer printed circuit board, the mounting plate 1 is fixed in the working position by means of screws and mounting holes 5, and then the staff rotates the rotating block 25 between the two vertical plates 21 in the adjustable heat dissipation device 2, thereby driving the two screw rods 23 to rotate. The screw rods 23 are threadedly connected to the movable platform 24, and the movable platform 24 is close to the mounting plate 1, so the two screw rods 23 drive the two movable platforms 24 to move, thereby adjusting the distance between the two assembly rod assemblies 3 and other structures, and then the board body 8 is put on the two assembly rod assemblies 3, and then the two connection assemblies 6 are manipulated to make the two fastening caps 7 cooperate with the two assembly rod assemblies 3 to fix the position of the board body 8, and then the fans 224 in the two heat dissipation assemblies 22 are started. Under the action of the two fans 224, the outside air enters the two connection boxes 222 after being filtered by the two filter screens 223, and then blows from the two ventilation nets 221 to the board body 8, thereby dissipating the heat of the board body 8, and then it can be used.
[0030] Example 2
[0031] The difference between this embodiment and embodiment 1 is that the buffer lighting device 4 includes an elastic rubber tube 41, a small damper 42 and a transparent shell 44, the transparent shell 44 is installed on the side of the assembly rod assembly 3 and the connecting assembly 6 close to the connecting box 222, the elastic rubber tube 41 is installed between the transparent shell 44 and the connecting box 222, and the small damper 42 is installed between the transparent shell 44 and the connecting box 222 and at a position located on the inner side of the elastic rubber tube 41.
[0032] By adopting the above technical solution, the circuit board can buffer external vibration to a certain extent through the cooperation of the elastic rubber tube 41 and the small damper 42, thereby reducing the possibility of the board body 8 being adversely affected and ensuring normal operation.
[0033] Specifically, the buffer lighting device 4 further includes a lighting lamp 43 , and a plurality of lighting lamps 43 are installed inside the transparent shell 44 .
[0034] By adopting the above technical solution, the circuit board can be provided with a certain amount of auxiliary lighting by the lighting lamp 43 when needed, thereby better meeting the working needs in different situations and ensuring the normal progress of the work.
[0035] When this embodiment is used, during use, the staff can start the various lighting lamps 43 in the transparent shell 44 of the buffer lighting device 4 for auxiliary lighting, and the elastic rubber tube 41 can cooperate with the small damper 42 to buffer external vibration.
[0036] The structure and principle of the assembly rod assembly 3 composed of an assembly rod and a rubber ring, the connecting assembly 6 composed of a fixed rod, a cross bar, a fixed block, a spring and a movable ring, the fastening cap 7, and the plate body 8 and the structure thereon in the utility model have been disclosed in a multilayer printed circuit board disclosed in Chinese patent application No. 202223512975.1, and its working principle is to cover the mounting hole opened on the plate body on the surface of the assembly rod, and when the plate body contacts the surface of the mounting hole, the fastening cap is then pulled upward and the movable ring is driven to squeeze the spring, and the fastening cap is rotated so that the fastening cap is located directly above the assembly rod. At this time, the fastening cap is released, so that the spring pushes the movable ring to move downward, and the movable ring will push the fastening cap downward through the cross bar and get stuck on the surface of the assembly rod to fix the plate body.
[0037] The structure and principle of the small and medium-sized damper 42 of the utility model have been disclosed in a micro-box device for computer network security disclosed in Chinese Patent Application No. 202020567163.9. Its working principle consists of a piston and an oil tank, which is filled with oil. When the object moves, the piston moves in the oil, thereby consuming energy and slowing down the movement of the object.
[0038] The working principle and use process of the utility model are as follows: when a multi-layer printed circuit board is needed, the mounting plate 1 is fixed at the working position by screws and mounting holes 5, and then the staff rotates the rotating block 25 between the two vertical plates 21 in the adjustable heat dissipation device 2, thereby driving the two screw rods 23 to rotate, and the screw rods 23 are threadedly connected with the moving platform 24, and the moving platform 24 is close to the mounting plate 1, so the two screw rods 23 drive the two moving platforms 24 to move, thereby adjusting the distance between the two assembly rod components 3 and other structures, and then the plate body 8 is put on the two assembly rod components 3, and then the two connecting components 6 are manipulated. The two fastening caps 7 are made to cooperate with the two assembly rod assemblies 3 to fix the position of the plate body 8, and then the fans 224 in the two heat dissipation assemblies 22 are started. Under the action of the two fans 224, the outside air enters the two connection boxes 222 after being filtered by the two filter screens 223, and then blows onto the plate body 8 from the two ventilation nets 221, so as to dissipate the heat of the plate body 8, so that it can be used; during use, the staff can start the various lighting lamps 43 in the transparent shell 44 of the buffer lighting device 4 for auxiliary lighting, and the elastic rubber tube 41 can cooperate with the small damper 42 to buffer the external vibration.
[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation multilayer printed circuit board, comprising a mounting plate, characterized in that: The mounting plate is provided with a plurality of mounting holes near the edge, two assembly rod assemblies are arranged above the mounting plate, a plate body is arranged on the outer sides of the two assembly rod assemblies, connecting assemblies are arranged on both sides of the plate body, fastening caps are installed on the connecting assemblies and at positions outside the tops of the assembly rod assemblies, a distance-adjustable heat dissipation device is installed on one side of the mounting plate close to the two assembly rod assemblies, and the two assembly rod assemblies and the distance-adjustable heat dissipation device are connected via two buffer lighting devices.
2. A heat dissipation multilayer printed circuit board according to claim 1, characterized in that: The adjustable distance heat dissipation device comprises a vertical plate, a heat dissipation component, a screw rod, a movable platform and a rotating block. Two vertical plates are installed on one side of the mounting plate close to the two assembly rod components, a rotating block is arranged between the two vertical plates, movable platforms are arranged on both sides of the two vertical plates, screw rods are installed on both sides of the rotating block and at positions located inside the movable platform, and a heat dissipation component is installed on one side of the movable platform close to the assembly rod component.
3. A heat dissipation multilayer printed circuit board according to claim 2, characterized in that: The heat dissipation assembly comprises a ventilation net, a connection box and a fan. A connection box is installed on one side of the mobile platform close to the assembly rod assembly, a fan is installed inside the connection box, and a ventilation net is installed on the top of the connection box.
4. A heat dissipation multilayer printed circuit board according to claim 3, characterized in that: The heat dissipation component also includes a filter, and the filter is installed on both sides of the two connection boxes that are away from each other.
5. The heat dissipation multilayer printed circuit board according to claim 3, characterized in that: The buffer lighting device includes an elastic rubber tube, a small damper and a transparent shell. The transparent shell is installed on the side of the assembly rod assembly and the connection assembly close to the connection box, the elastic rubber tube is installed between the transparent shell and the connection box, and the small damper is installed between the transparent shell and the connection box and at a position inside the elastic rubber tube.
6. The heat dissipation multilayer printed circuit board according to claim 5, characterized in that: The buffer lighting device also includes lighting lamps, and a plurality of lighting lamps are installed inside the transparent shell.
