Metal material electroplating device
By introducing structures such as electrolytic box, anti-fall frame and water tank into the metal material electroplating device, the problem of regularization of the device and the increase in the concentration of the electroplating solution is solved, and the usability and operation efficiency of the device are improved.
Patent Information
- Application Number
- CN202420932249.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-04-30
AI Technical Summary
When used, the existing metal material electroplating device is not convenient to take out the dropped parts. The moisture in the electroplating solution will evaporate during the electroplating process, causing the concentration of the electroplating solution to increase, and the device circuit is not convenient to be regular.
A metal material electroplating device including electrolytic box, anti-fall frame, water tank and water baffle is designed. The connecting wire is snapped and fixed through the electrolytic box, the parts are threaded when the anti-fall frame is fixed, and the water tank and water baffle are plated. The liquid was diluted, which solved the problem of increased part extraction and electroplating solution concentration.
It realizes the convenience of regulating the device circuit, the convenience of taking out drop parts and preventing the increase in the concentration of the electroplating solution, and improves the usability and operating efficiency of the device.
Smart Images

Figure CN222182502U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of electroplating, in particular to a metal material electroplating device. Background Art
[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to adhere a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation, improving wear resistance, conductivity, reflectivity, corrosion resistance and enhancing aesthetics. Therefore, a metal material electroplating device is needed.
[0003] The existing patent document with the technical disclosure number CN215887275U provides a metal material electroplating device, including an electroplating pool, the outer surface of the electroplating pool is fixedly connected to a mounting seat, the inner wall of the mounting seat is fixedly connected to a support column, the top of the support column is fixedly connected to a support plate, and the bottom of the support plate is fixedly connected to a bracket. The utility model has the following advantages and effects: by arranging a mounting seat, a support column, a support plate, a bracket, a rotating shaft, a wire twisting roller, a coupling, a driving motor, a cable, a lifting plate and a hook, when in use, the metal material to be processed is hung on the hook, and the driving motor drives the rotating shaft to rotate when working, thereby driving the wire twisting roller to retract and release the cable, and the cable drives the hook on the lifting plate to move up and down when retracting and releasing, so that the loading and unloading process of the metal material during electroplating can be completed, avoiding the trouble of manual loading and unloading, and achieving the effect that the device can automatically load and unload the metal material. However, when the CN215887275U technology is in operation, it is not convenient to remove the fallen parts, and the moisture in the electroplating solution will evaporate during the electroplating process, resulting in an increase in the concentration of the electroplating solution, which is not convenient for regularizing the device circuit. Therefore, a metal material electroplating device is urgently needed. Utility Model Content
[0004] Based on this, the purpose of the utility model is to provide a metal material electroplating device to solve the problem that the existing metal material electroplating device is not convenient to remove fallen parts during use, the moisture in the plating solution will evaporate during the electroplating process, resulting in an increase in the concentration of the plating solution, and it is not convenient to regularize the device circuit.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a metal material electroplating device, comprising a mounting seat, a battery is mounted on the upper end of the mounting seat, the upper end of the battery is electrically connected to a connecting wire, a connecting head is mounted on the inner wall of the connecting wire, a guide rod is mounted on the inner wall of the connecting head, hooks are mounted on the outer walls of the guide rods, rubber sleeves are mounted on both ends of the guide rods, support frames are mounted on the outer walls of the guide rods, positioning rods are fixedly connected to the inner walls of the support frames, and an electrolytic box is fixedly connected to the outer walls of the positioning rods.
[0006] The inner wall of the electrolytic box is installed with an anti-drop frame, the inner wall of the anti-drop frame is fixedly connected with a fixing rod, the outer wall of the fixing rod is fixedly connected with a fixing sleeve, the outer wall of the fixing rod is installed with a connecting frame, and the inner wall of the connecting frame is installed with a pull rod.
[0007] A water tank is installed at the upper end of the electrolytic box, and a water baffle is installed on the inner wall of the water tank.
[0008] Preferably, the connecting head is snap-connected to the guide rod, and the connecting head is symmetrically arranged with respect to the central axis of the guide rod.
[0009] Preferably, the inner wall of the rubber sleeve is tightly fitted with the outer wall of the guide rod, and the rubber sleeve is symmetrically arranged with respect to the central axis of the guide rod.
[0010] Preferably, the electrolytic box is snap-connected to the connecting wire, and the connecting wire is symmetrically arranged with respect to the central axis of the electrolytic box.
[0011] Preferably, the anti-drop frame is threadedly connected to the fixing rod, and the inner wall of the anti-drop frame is of an open-hole design.
[0012] Preferably, the fixing sleeve is movably connected to the connecting frame, and the connecting frame is symmetrically arranged with respect to the central axis of the fixing sleeve.
[0013] Preferably, the inner wall of the water tank is tightly fitted with the outer wall of the water baffle, and the inner wall of the water tank is of a grooved design.
[0014] Compared with the prior art, the beneficial effects of the utility model are:
[0015] 1. The utility model plays a role of clamping and fixing the connecting wire by setting the electrolytic box. When the device is used, the setting of the electrolytic box and the connecting wire facilitates the regularization of the device circuit, thereby increasing the usability of the device;
[0016] 2. The utility model provides a fixing rod to screw the anti-drop frame. When the device is used, the anti-drop frame is convenient for taking out the dropped parts, which increases the usability of the device.
[0017] 3. The utility model has a water tank to play a role of locking and fixing the water baffle. When the device is in use, the arrangement of the water tank and the water baffle makes it easy to add water to the device, preventing the concentration of the electroplating solution from increasing, thereby increasing the usability of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 This is a vertical appearance diagram of the utility model;
[0019] Figure 2 This is a schematic structural diagram of the utility model's anti-drop frame, fixing rod, fixing sleeve and connecting frame parts combination;
[0020] Figure 3 This is a structural schematic diagram of the assembly of the mounting base and the electrolytic box parts of the utility model;
[0021] Figure 4 For this utility model Figure 1 Schematic diagram of the structure with the A part in the middle enlarged.
[0022] In the figure: 1. mounting base; 2. battery; 3. connecting wire; 4. connector; 5. guide rod; 6. hook; 7. rubber sleeve; 8. support frame; 9. positioning rod; 10. electrolytic box; 11. anti-drop frame; 12. fixing rod; 13. fixing sleeve; 14. connecting frame; 15. pull rod; 16. water tank; 17. water baffle. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.
[0024] The following describes an embodiment of the utility model based on its overall structure.
[0025] See also Figure 1-4 A metal material electroplating device comprises a mounting seat 1, a battery 2 is mounted on the upper end of the mounting seat 1, a connecting wire 3 is electrically connected to the upper end of the battery 2, a connector 4 is mounted on the inner wall of the connecting wire 3, a guide rod 5 is mounted on the inner wall of the connector 4, the connector 4 is engaged with the guide rod 5, and the connector 4 is symmetrically arranged with the central axis of the guide rod 5, hooks 6 are mounted on the outer wall of the guide rod 5, rubber sleeves 7 are mounted on both ends of the guide rod 5, the inner wall of the rubber sleeve 7 is tightly fitted with the outer wall of the guide rod 5, and the rubber sleeve 7 The guide rod 5 is symmetrically arranged with the central axis, and the outer wall of the guide rod 5 is installed with a support frame 8, the inner wall of the support frame 8 is fixedly connected with a positioning rod 9, the outer wall of the positioning rod 9 is fixedly connected with an electrolytic box 10, the electrolytic box 10 is snap-connected with the connecting line 3, and the connecting line 3 is symmetrically arranged with the central axis of the electrolytic box 10. The electrolytic box 10 is arranged to fix the connecting line 3. When the device is in use, the arrangement of the electrolytic box 10 and the connecting line 3 facilitates the regularization of the device line, thereby increasing the usability of the device.
[0026] See also Figure 1-4A metal material electroplating device, an anti-drop frame 11 is installed on the inner wall of an electrolytic box 10, and a fixing rod 12 is fixedly connected to the inner wall of the anti-drop frame 11, the anti-drop frame 11 and the fixing rod 12 are threadedly connected, and the inner wall of the anti-drop frame 11 is an open-hole design, and a fixing sleeve 13 is fixedly connected to the outer wall of the fixing rod 12, and a connecting frame 14 is installed on the outer wall of the fixing rod 12, the fixing sleeve 13 and the connecting frame 14 are movably connected, and the connecting frame 14 is symmetrically arranged with the central axis of the fixing sleeve 13, and a pull rod 15 is installed on the inner wall of the connecting frame 14, and the fixing rod 12 is arranged to threadably fix the anti-drop frame 11. When the device is used, the setting of the anti-drop frame 11 facilitates the removal of dropped parts, thereby increasing the usability of the device.
[0027] See also Figure 1-4 A metal material electroplating device, a water tank 16 is installed at the upper end of the electrolytic box 10, and the inner wall of the water tank 16 is installed with a water baffle 17. The inner wall of the water tank 16 is tightly fitted with the outer wall of the water baffle 17, and the inner wall of the water tank 16 is a grooved design. The water tank 16 is provided to fix the water baffle 17. When the device is used, the setting of the water tank 16 and the water baffle 17 facilitates the addition of water to the device to prevent the concentration of the electroplating solution from increasing, thereby increasing the usability of the device.
[0028] After the metal is removed from the water tank 16, the metal is put into the water tank 10, and the metal is put into the water tank 16. After the metal is removed from the water tank 16, the water tank 16 is screwed in place and the metal is put into the water tank 10. After the metal is removed from the water tank 16, the metal is put into the water tank 10, and the water tank 16 is screwed in place and the metal is put into the water tank 10. After the metal is removed from the water tank 16, the metal is put into the water tank 10, and the metal is put into the water tank 10. After the metal is removed from the water tank 16, the metal is put into the water tank 10, and the water tank 16 is screwed in place and the metal is put into the water tank 10.
[0029] The directions or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the directions or positional relationships shown in the accompanying drawings. They are merely simplified descriptions for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the protection content of the present invention.
[0030] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. A metal material electroplating device, comprising a mounting seat (1), characterized in that: A battery (2) is mounted on the upper end of the mounting seat (1), the upper end of the battery (2) is electrically connected to a connecting wire (3), a connector (4) is mounted on the inner wall of the connecting wire (3), a guide rod (5) is mounted on the inner wall of the connector (4), a hook (6) is mounted on the outer wall of the guide rod (5), rubber sleeves (7) are mounted on both ends of the guide rod (5), a support frame (8) is mounted on the outer wall of the guide rod (5), a positioning rod (9) is fixedly connected to the inner wall of the support frame (8), and an electrolytic box (10) is fixedly connected to the outer wall of the positioning rod (9); The inner wall of the electrolytic box (10) is installed with an anti-drop frame (11), the inner wall of the anti-drop frame (11) is fixedly connected with a fixing rod (12), the outer wall of the fixing rod (12) is fixedly connected with a fixing sleeve (13), the outer wall of the fixing rod (12) is installed with a connecting frame (14), and the inner wall of the connecting frame (14) is installed with a pull rod (15); A water tank (16) is installed at the upper end of the electrolytic box (10), and a water baffle (17) is installed on the inner wall of the water tank (16).
2. A metal material electroplating device according to claim 1, characterized in that: The connecting head (4) is snap-connected with the guide rod (5), and the connecting head (4) is symmetrically arranged with respect to the central axis of the guide rod (5).
3. A metal material electroplating device according to claim 1, characterized in that: The inner wall of the rubber sleeve (7) is tightly fitted with the outer wall of the guide rod (5), and the rubber sleeve (7) is symmetrically arranged with respect to the central axis of the guide rod (5).
4. A metal material electroplating device according to claim 1, characterized in that: The electrolytic box (10) is snap-connected to the connecting wire (3), and the connecting wire (3) is symmetrically arranged with respect to the central axis of the electrolytic box (10).
5. The metal material electroplating device according to claim 1, characterized in that: The anti-drop frame (11) is threadedly connected to the fixing rod (12), and the inner wall of the anti-drop frame (11) is of open-hole design.
6. The metal material electroplating device according to claim 1, characterized in that: The fixing sleeve (13) is movably connected to the connecting frame (14), and the connecting frame (14) is symmetrically arranged with respect to the central axis of the fixing sleeve (13).
7. The metal material electroplating device according to claim 1, characterized in that: The inner wall of the water tank (16) is tightly fitted with the outer wall of the water baffle (17), and the inner wall of the water tank (16) is of a grooved design.
