COG binding structure for improving light leakage of liquid crystal display screen

Abstract

The utility model discloses a COG binding structure for improving light leakage of a liquid crystal display screen, which comprises an IC and a liquid crystal substrate, the IC is bound with the liquid crystal substrate through an ACF layer, an IC binding layer is arranged on the lower surface of the IC, the IC binding layer comprises a small BUMP area and a large BUMP area, a reinforcing layer is arranged between the small BUMP area and the large BUMP area, and the reinforcing layer is arranged on the lower surface of the IC. A liquid crystal binding layer is arranged on the upper surface of the liquid crystal substrate, and the liquid crystal binding layer and the IC binding layer are bound through ACF gold balls in the ACF layer. By utilizing the reinforcing layer between the small BUMP region and the large BUMP region, when the IC is subjected to high temperature and pressure, the overall strength of the IC can be effectively improved, and the deformation of the IC can be reduced, so that the problem of light leakage at the two ends of the IC in the COG binding process is effectively solved, and the display quality of a liquid crystal display screen is improved.

Description

Technical Field

[0001] The utility model relates to a liquid crystal display screen, more specifically, to a COG binding structure for improving light leakage of the liquid crystal display screen. Background Art

[0002] like Figure 1 As shown in the figure, the LCD module is a commonly used mobile phone display screen. The COG (Chip on Glass) process is an indispensable part of its manufacturing process, which refers to binding the control chip IC of the LCD module to the LCD through ACF. The LCD is a "liquid crystal box" composed of the upper glass CF and the lower glass TFT bonded together by frame glue.

[0003] In order to completely solidify ACF300 and break the gold balls in ACF300 between the binding bumps to achieve the purpose of connection, a certain temperature (about 145°) and a certain pressure (about 300N) need to be applied to IC100 when binding. Due to the effects of temperature and pressure, the bottom temperature of the glass of the liquid crystal substrate 200 is different. After the binding is completed and the temperature is lowered, due to the different shrinkage amounts, the deformation of IC100 is larger, and the deformation of the glass of the liquid crystal substrate 200 is smaller, resulting in overall warping. Figure 2 The pulling effect after the warping causes the local box thickness near the two ends of IC100 to be different, and the transmittance to be different, forming bright and dark mura (light leakage), which affects the display effect of the display.

[0004] Chinese invention patent document CN115016163A discloses a side light leakage prevention structure for a liquid crystal display screen, comprising a display screen, a screen frame and a reflector, wherein the display screen is mounted in the screen frame, the reflector is mounted on the side of the display screen in the screen frame, and the reflective surface of the reflector faces the display screen. The reflector has an arc-shaped cross section, and double-sided tape is used to seal the two ends of the arc with the display screen. The reflector is made of glass, and a reflective layer of opaque material is provided on the reflective surface. The cross section of the double-sided tape is C-shaped and wrapped around the outer arc surface of the arc-shaped reflector and extends from the two ends of the arc to the edge of the reflective surface. The double-sided tape comprises a shading film and a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is evenly coated on both sides of the shading film with a pressure-sensitive adhesive; wherein the shading film is prepared by: adding PET polyester chips, titanate coupling agent, vinyl MQ silicone resin, black phosphorene, ultraviolet absorber and organic solvent in a weight ratio of 30:5:15:8:6:15 into a reaction device, and stirring evenly; heating to 110°C, and performing a reflux reaction for 4 hours; cooling and crystallizing, and taking out the crystals for drying; putting the dried crystals into a twin-screw machine for stirring and melting for 3 hours, and during stirring and melting, the speed of the twin-screw machine is controlled to be 600r / min, and the temperature is controlled to be 360°C; using an extruder to extrude and process into a sheet, and then forming a strip by biaxial stretching; and pressing The preparation method of the pressure-sensitive adhesive is as follows: polyetheretherketone powder and concentrated sulfuric acid are reacted at a weight ratio of 2:1 at 20°C for 0.5h, and then the reaction is continued at 20°C for 2h. After the reaction is completed, the reaction is washed to neutrality by filtering water, and then washed with ethanol and vacuum dried to obtain active polyetheretherketone; active polyetheretherketone, vinyl MQ silicone resin, polyhydroxy polysiloxane, silicone rubber, dimethyl polysiloxane and black paste are added to the reaction device at a weight ratio of 15:2:15:20:10:2 and stirred evenly, and 100ppm ethanol-modified chloroplatinic acid of half the weight of the black paste is slowly added at 135°C, and the temperature is kept for 10min. 3-methyl-1-pentene-3-ol of 1 / 10 weight of the black paste is added therein, and the pressure-sensitive adhesive is obtained by cooling to 20°C. The screen frame is provided with an arc groove for accommodating the reflector, and the inner surface of the arc groove is serrated. The inner side of the screen frame that is higher than the front end of the display screen is processed by a frosting process and is provided with a light-absorbing layer. The reflective layer includes a first film layer, a second film layer, a third film layer and a fourth film layer which are arranged on one surface of the glass from near to far; the first film layer is an oxidized stainless steel material, the second film layer, the third film layer and the fourth film layer are all titanium oxide film layers, the thickness of the second film layer is 50-55nm, the thickness of the third film layer is 35-45nm, and the thickness of the fourth film layer is 55-65nm.The first film layer, the second film layer, the third film layer and the fourth film layer are all coated by magnetron sputtering deposition process, and argon and oxygen are used as working gases during coating; among them, the working current of the first film layer coating is 70mA, and the control ratio of argon and oxygen is 5:1; the working current of the second film layer coating is 70mA, and the control ratio of argon and oxygen is 2:1; the working current of the third film layer coating is 75mA, and the control ratio of argon and oxygen is 2:1; the working current of the fourth film layer coating is 80mA, and the control ratio of argon and oxygen is 2:1. A surface coating is set on the side surface of the display screen, and the surface coating is made of opaque material.

[0005] Obviously, the patent sets a reflector on the side of the display screen in the screen frame, with the reflective surface of the reflector facing the display screen, so that the light emitted by the light source of the display screen and the part of the light that passes through the side of the display screen is reflected back to the display screen by the reflective surface of the reflector, thereby preventing light leakage from the side of the liquid crystal display screen. However, this structure is too complicated to solve the problem of thermal deformation of COG binding. Utility Model Content

[0006] Based on this, it is necessary to provide a COG binding structure for improving light leakage of liquid crystal display screens in response to the above technical problems. The COG binding structure for improving light leakage of liquid crystal display screens comprises an IC and a liquid crystal substrate. The IC is bound to the liquid crystal substrate through an ACF layer. An IC binding layer is provided on the lower surface of the IC. The IC binding layer comprises a small BUMP area and a large BUMP area. A reinforcing layer is provided between the small BUMP area and the large BUMP area. A liquid crystal binding layer is provided on the upper surface of the liquid crystal substrate. The liquid crystal binding layer and the IC binding layer are bound through the ACF gold balls in the ACF layer. By utilizing the reinforcing layer between the small BUMP area and the large BUMP area, when the IC is subjected to high temperature and pressure, the overall strength of the IC can be effectively improved and its deformation can be reduced, thereby effectively improving the light leakage problem at both ends of the IC during the COG binding process and improving the display quality of the liquid crystal display screen.

[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0008] A COG binding structure for improving light leakage of a liquid crystal display, characterized in that the COG binding structure for improving light leakage of a liquid crystal display comprises an IC and a liquid crystal substrate, wherein the IC is bound to the liquid crystal substrate through an ACF layer,

[0009] An IC binding layer is provided on the lower surface of the IC, the IC binding layer includes a small BUMP area and a large BUMP area, a reinforcement layer is provided between the small BUMP area and the large BUMP area, and a liquid crystal binding layer is provided on the upper surface of the liquid crystal substrate, and the liquid crystal binding layer and the IC binding layer are bound by the ACF gold balls in the ACF layer.

[0010] As a preferred implementation of the COG binding structure for improving light leakage of a liquid crystal display provided by the utility model, the height of the reinforcing layer is consistent with that of the IC binding layer.

[0011] As a preferred implementation of the COG binding structure for improving light leakage of a liquid crystal display provided by the utility model, the length of the reinforcement layer is consistent with the length of the IC.

[0012] As a preferred implementation of the COG binding structure for improving light leakage of a liquid crystal display screen provided by the utility model, the reinforcement layer is an injection molding structure.

[0013] As a preferred implementation of the COG binding structure for improving light leakage of a liquid crystal display screen provided by the utility model, the reinforcement layer is a coating structure.

[0014] As a preferred implementation of the COG binding structure for improving light leakage of a liquid crystal display screen provided by the utility model, the reinforcement layer is integrally formed with the packaging shell of the IC.

[0015] As a preferred implementation of the COG binding structure for improving light leakage of a liquid crystal display screen provided by the utility model, the cross section of the reinforcement layer is rectangular.

[0016] As a preferred implementation of the COG binding structure for improving light leakage of a liquid crystal display screen provided by the utility model, the cross section of the reinforcement layer is an isosceles trapezoid.

[0017] As a preferred implementation of the COG binding structure for improving light leakage of a liquid crystal display screen provided by the utility model, a plurality of heat dissipation holes arranged in parallel are provided inside the reinforcement layer.

[0018] As a preferred implementation of the COG binding structure for improving light leakage of a liquid crystal display screen provided by the utility model, a penetrating heat dissipation channel is provided at the bottom of the reinforcement layer.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] The utility model provides a COG binding structure for improving light leakage of a liquid crystal display screen. By utilizing the reinforcement layer between the small BUMP area and the large BUMP area, when the IC is subjected to high temperature and pressure, the overall strength of the IC can be effectively improved and its deformation can be reduced, thereby effectively improving the light leakage problem at both ends of the IC during the COG binding process and improving the display quality of the liquid crystal display screen.

[0021] In addition, the cross section of the reinforcement layer can be made into an isosceles trapezoid. The reinforcement layer is provided with a plurality of heat dissipation holes arranged in parallel. The heat dissipation holes inside the reinforcement layer can effectively improve the overall strength of the IC and reduce its deformation, and can also improve the heat dissipation performance of the IC, avoid heat accumulation, and improve the stability of the liquid crystal display.

[0022] In addition, the bottom of the reinforcement layer can be provided with a penetrating heat dissipation channel. The penetrating heat dissipation channel of the reinforcement layer can effectively improve the overall strength of the IC and reduce its deformation, and can further improve the heat dissipation performance of the IC, avoid heat accumulation, and further improve the stability of the liquid crystal display. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the scheme in the utility model, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a structural schematic diagram of the COG binding structure of an existing liquid crystal display;

[0025] Figure 2 for Figure 1 Schematic diagram of the COG binding structure in FIG. 1 , where the COG binding structure undergoes thermal deformation;

[0026] Figure 3 It is a structural schematic diagram of the COG binding structure for improving light leakage of a liquid crystal display screen according to the utility model;

[0027] Figure 4 for Figure 3 A schematic diagram of the structure of the COG binding structure IC binding layer;

[0028] Figure 5 for Figure 4 A schematic diagram of the IC binding layer of the COG binding structure in FIG. 1 , showing another perspective;

[0029] Figure 6 A schematic diagram of the three-dimensional structure of another embodiment of the IC binding layer of the COG binding structure for improving light leakage of a liquid crystal display screen according to the utility model;

[0030] Figure 7 A three-dimensional structural schematic diagram of another embodiment of the IC binding layer of the COG binding structure for improving light leakage of a liquid crystal display screen according to the utility model;

[0031] Figure 8 A three-dimensional structural schematic diagram of another embodiment of the IC binding layer of the COG binding structure for improving light leakage of a liquid crystal display screen according to the utility model;

[0032] The markings in the figure are as follows: 1. IC; 11. IC binding layer; 12. Small BUMP area; 13. Large BUMP area; 14. Strengthening layer; 141. Heat dissipation hole; 142. Heat dissipation channel; 2. Liquid crystal substrate; 21. Liquid crystal binding layer; 3. ACF layer; 4. ACF gold ball. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the solution of the utility model, the following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0034] As described in the background technology, the prior art is for liquid crystal display modules. Liquid crystal display modules are a commonly used mobile phone display screen. The COG (Chip on Glass) process is an indispensable part of its manufacturing process, which refers to the binding of the control chip IC of the liquid crystal display module to the liquid crystal display LCD through ACF. The liquid crystal display is a "liquid crystal box" bonded together by the upper glass CF and the lower glass TFT through frame glue. In order to make the ACF300 completely solidified and to break the gold ball in the ACF300 between the binding bumps to achieve the purpose of connection, it is necessary to apply a certain temperature (about 145°) and a certain pressure (about 300N) to it when IC100 is bound. Due to the effects of temperature and pressure, the bottom temperature of the glass of the liquid crystal substrate 200 is different. After the binding is completed and the temperature is lowered, the deformation of IC100 is large, and the deformation of the glass of the liquid crystal substrate 200 is small, forming an overall warping phenomenon. The pulling effect after this warping causes the local box thickness near the two ends of IC100 to be different, and the transmittance is different, forming bright and dark mura (light leakage), which affects the display effect of the display screen.

[0035] In order to solve this technical problem, the utility model provides a COG binding structure for improving light leakage of a liquid crystal display screen, comprising an IC1 and a liquid crystal substrate 2, wherein the IC1 is bound to the liquid crystal substrate 2 through an ACF layer 3. An IC binding layer 11 is provided on the lower surface of the IC1, wherein the IC binding layer 11 comprises a small BUMP area 12 and a large BUMP area 13, and a reinforcing layer 14 is provided between the small BUMP area 12 and the large BUMP area 13. A liquid crystal binding layer 21 is provided on the upper surface of the liquid crystal substrate 2, wherein the liquid crystal binding layer 21 is bound to the IC binding layer 11 through the ACF gold balls 4 in the ACF layer 3.

[0036] Through the above structural design, by utilizing the reinforcement layer 14 between the small BUMP area 12 and the large BUMP area 13, when IC1 is subjected to high temperature and pressure, the overall strength of IC1 can be effectively improved and its deformation can be reduced, thereby effectively improving the light leakage problem at both ends of the IC during the COG binding process and improving the display quality of the liquid crystal display.

[0037] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0038] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0040] Example 1

[0041] like Figure 3 , Figure 4 and Figure 5 As shown, the COG binding structure for improving light leakage of a liquid crystal display screen comprises an IC1 and a liquid crystal substrate 2 , and the IC1 is bound to the liquid crystal substrate 2 via an ACF layer 3 .

[0042] An IC binding layer 11 is disposed on the lower surface of the IC1 . The IC binding layer 11 includes a small BUMP area 12 and a large BUMP area 13 . A reinforcing layer 14 is disposed between the small BUMP area 12 and the large BUMP area 13 .

[0043] It should be noted that a liquid crystal binding layer 21 is provided on the upper surface of the liquid crystal substrate 2 , and the liquid crystal binding layer 21 is bound to the IC binding layer 11 via the ACF gold balls 4 in the ACF layer 3 .

[0044] In addition, the height of the reinforcing layer 14 is consistent with that of the IC binding layer 11. The length of the reinforcing layer 14 is consistent with that of the IC1.

[0045] In addition, the reinforcement layer 14 is an injection-molded structure. Alternatively, the reinforcement layer 14 is a coating structure.

[0046] In addition, the reinforcing layer 14 is integrally formed with the package shell of the IC 1. For example, the reinforcing layer 14 is made of resin material like the IC package material.

[0047] In addition, the reinforcing layer 14 has a rectangular cross section.

[0048] The working mode of this embodiment is described below.

[0049] By utilizing the reinforcing layer 14 between the small BUMP area 12 and the large BUMP area 13, when IC1 is subjected to high temperature and pressure, the overall strength of IC1 can be effectively improved and its deformation can be reduced, thereby effectively improving the light leakage problem at both ends of the IC during the COG binding process and improving the display quality of the liquid crystal display.

[0050] Example 2

[0051] like Figure 6 and Figure 7 As shown, the COG binding structure for improving light leakage of a liquid crystal display provided in Example 1 is further optimized. Specifically, the cross section of the reinforcement layer 14 is an isosceles trapezoid.

[0052] In addition, a plurality of heat dissipation holes 141 arranged in parallel may also be provided inside the reinforcement layer 14 .

[0053] The working mode of this embodiment is described below.

[0054] The heat dissipation holes 141 inside the reinforcing layer 14 can effectively enhance the overall strength of the IC1 and reduce its deformation, and can also improve the heat dissipation performance of the IC1, avoid heat accumulation, and enhance the stability of the liquid crystal display.

[0055] Example 3

[0056] like Figure 8 As shown, the COG binding structure for improving light leakage of a liquid crystal display provided in Embodiment 1 or 2 is further optimized. Specifically, a penetrating heat dissipation channel 142 is provided at the bottom of the reinforcing layer 14 .

[0057] The working mode of this embodiment is described below.

[0058] The heat dissipation channel 142 penetrating the reinforcing layer 14 can not only effectively enhance the overall strength of the IC1 and reduce its deformation, but also further improve the heat dissipation performance of the IC1, avoid heat accumulation, and further enhance the stability of the liquid crystal display.

[0059] The terms "coupling" and "coupling" involved in the embodiments of the present application should be understood in a broad sense. For example, they may refer to a direct physical connection, or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0060] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0061] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A COG bonding structure for improving light leakage of a liquid crystal display, characterized in that: The COG binding structure for improving light leakage of a liquid crystal display screen comprises an IC (1) and a liquid crystal substrate (2), wherein the IC (1) is bound to the liquid crystal substrate (2) via an ACF layer (3). An IC binding layer (11) is provided on the lower surface of the IC (1), wherein the IC binding layer (11) comprises a small BUMP area (12) and a large BUMP area (13), and a reinforcing layer (14) is provided between the small BUMP area (12) and the large BUMP area (13). A liquid crystal binding layer (21) is provided on the upper surface of the liquid crystal substrate (2), and the liquid crystal binding layer (21) and the IC binding layer (11) are bound together via the ACF gold balls (4) in the ACF layer (3).

2. The COG bonding structure for improving light leakage of a liquid crystal display according to claim 1, characterized in that: The height of the reinforcement layer (14) is consistent with that of the IC binding layer (11).

3. The COG bonding structure for improving light leakage of a liquid crystal display according to claim 1, characterized in that: The length of the reinforcement layer (14) is consistent with the length of the IC (1).

4. The COG bonding structure for improving light leakage of a liquid crystal display according to claim 1, characterized in that: The reinforcement layer (14) is an injection-molded structure.

5. The COG bonding structure for improving light leakage of a liquid crystal display according to claim 1, characterized in that: The reinforcement layer (14) is a coating structure.

6. The COG bonding structure for improving light leakage of a liquid crystal display according to claim 1, characterized in that: The reinforcement layer (14) is integrally formed with the packaging shell of the IC (1).

7. The COG bonding structure for improving light leakage of a liquid crystal display according to claim 1, characterized in that: The reinforcing layer (14) has a rectangular cross section.

8. The COG bonding structure for improving light leakage of a liquid crystal display according to claim 1, characterized in that: The cross section of the reinforcement layer (14) is an isosceles trapezoid.

9. The COG bonding structure for improving light leakage of a liquid crystal display according to claim 1, characterized in that: A plurality of heat dissipation holes (141) arranged in parallel are provided inside the reinforcement layer (14).

10. The COG bonding structure for improving light leakage of a liquid crystal display according to claim 1, characterized in that: The bottom of the reinforcement layer (14) is provided with a penetrating heat dissipation channel (142).

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