Heat sealing device for chip packaging
By designing a moving mechanism and a heat sealing mechanism in the chip packaging device, and using components such as motors, sprockets, thermal insulation pads and cylinders to achieve automatic clamping and movement of the chip, the problem of manual chip placement in traditional devices is solved, and the problem of traditional devices is improved. Processing rate and stability reduce costs.
Patent Information
- Application Number
- CN202420107305.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-16
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-01-16
AI Technical Summary
The heat sealing device for traditional chip packaging requires manual placement of the chip, resulting in low processing rate and high cost, and the clamping mechanism is fixed to the chip size, which makes it poorly applicable.
A heat sealing device for chip packaging is designed, including a moving mechanism and a heat sealing mechanism. The moving mechanism uses motor, sprocket, thermal insulation pads, cylinders and balls to realize automatic movement of the chip through the coordinated work of the chain and cylinder. and clamping, improving machining rate and stability.
Through the automated moving mechanism and clamping mechanism, the stability and processing rate of chip heat seal are improved, manual production costs are reduced, and the applicability of the device is enhanced.
Smart Images
Figure CN222190638U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip packaging equipment, in particular to a heat sealing device for chip packaging. Background Art
[0002] In the chip production process, heat sealing packaging treatment is often required, so a heat sealing device for chip packaging is needed.
[0003] For example, a chip packaging machine with patent publication number CN217507277U can connect four electric push rods to the same controller to enable the four electric push rods to work synchronously, thereby further ensuring the clamping stability of the chip and thus ensuring the subsequent packaging effect.
[0004] However, in actual use of the above-mentioned heat sealing device, workers are required to continuously put chips into four electric push rods, which reduces the chip processing rate and increases the cost of manual production. Therefore, the applicant proposes a heat sealing device for chip packaging. Utility Model Content
[0005] The purpose of the utility model is to provide a heat sealing device for chip packaging to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat sealing device for chip packaging, comprising a collecting box, a moving mechanism fixed at one end of the collecting box, the moving mechanism comprising a base frame, two motors are respectively fixed on both sides of the inner wall of the base frame, a main sprocket is fixed on the output end of the motor, two secondary sprockets are rotatably connected on both sides of the inner wall of the base frame, the teeth of the two main sprockets and the secondary sprockets are jointly meshed with a chain, a plurality of fixing frames are respectively fixed on the opposite surfaces of the two chains, thermal insulation pads are respectively fixed on the opposite surfaces of two adjacent groups of the fixing frames, a plurality of oblique blocks are fixed on the top of the thermal insulation pads, a heat sealing pad is fixed between the two adjacent groups of the thermal insulation pads, a plurality of first cylinders are respectively fixed on both sides of the inner wall of the base frame, the output ends of the two groups of the first cylinders are respectively located inside the two chains and do not interfere with the two groups of the main sprockets and the secondary sprockets, and a moving plate is commonly fixed to the output ends of the plurality of the first cylinders.
[0007] Preferably, a heat sealing mechanism is fixed on the top of the movable mechanism, and the center position of the bottom of the heat sealing mechanism is symmetrical to the center position of the top of the movable mechanism.
[0008] Preferably, a plurality of ball bearings are movably connected to the tops of the two movable plates, and the two groups of ball bearings are in contact with the bottoms of the two groups of thermal insulation pads respectively. Inclined plates are fixed at both ends of the two movable plates, and a plurality of fixed rods are commonly fixed on both sides of the inner wall of the base frame. One side of the plurality of fixed rods is slidably connected to the bottoms of the two movable plates, and the plurality of fixed rods are located inside the two chains and do not interfere with the two groups of main sprockets and secondary sprockets and the two groups of first cylinders.
[0009] Preferably, the horizontal inclination of the oblique clamping block is between 10-40°, and the sum of the longitudinal heights of the two groups of the fixing frames, the longitudinal heights of the two movable plates and the longitudinal heights of the plurality of fixing rods is less than or equal to one half of the longitudinal height of the chain.
[0010] Preferably, the heat sealing mechanism includes a stabilizing frame, the tops of the two brackets of the stabilizing frame are fixed to the top of the base frame in the moving mechanism, second cylinders are fixed on both sides of the inner wall of the stabilizing frame, a moving block is fixed to the output ends of the two second cylinders, the top of the moving block and the bottom of the inner wall of the stabilizing frame are slidably connected to each other, a third cylinder is fixed to the bottom of the moving block, and a hot air gun is fixed to the output end of the third cylinder.
[0011] Preferably, the motor, the first cylinder, the second cylinder, the third cylinder and the hot air gun are electrically connected in sequence, and the four share a control terminal.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] The heat sealing device for chip packaging has a movable mechanism with thermal insulation pads and chains added therein. When the chip is heat-sealed, the thermal insulation pad can clamp both sides of the chip well due to its own flexibility, thereby improving the stability of the chip during heat sealing. The chain can move the chip according to the heat sealing time of the chip during heat sealing, thereby improving the chip processing rate and reducing the cost of manual production.
[0014] At the same time, a moving plate and a ball bearing are also installed in the moving mechanism. The moving plate can clamp the chip well according to the size of the chip. The ball bearing can protect the thermal insulation pad when the chip moves. Due to its own rotation, the chip can move more smoothly, which improves the stability of the device, further increases the chip processing rate, and reduces the cost of manual production. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the top structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the bottom structure of the utility model;
[0017] Figure 3 This is a schematic diagram of the structure of the mobile mechanism of the utility model;
[0018] Figure 4 for Figure 3 A partial enlarged view of part A;
[0019] Figure 5 It is a schematic diagram of the heat sealing mechanism structure of the utility model.
[0020] In the figure: 1. collecting box; 2. moving mechanism; 201. base frame; 202. motor; 203. main sprocket; 204. secondary sprocket; 205. chain; 206. fixed frame; 207. thermal insulation pad; 208. oblique clamping block; 209. heat sealing pad; 210. first cylinder; 211. moving plate; 212. ball bearing; 213. inclined plate; 214. fixed rod; 3. heat sealing mechanism; 301. stabilizing frame; 302. second cylinder; 303. moving block; 304. third cylinder; 305. hot air gun. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] With the continuous development of science and technology, the chip industry is also gradually updating. When producing and processing chips, the chips need to be heat-sealed and packaged to ensure the stability and safety of the chips. Therefore, a heat-sealing device for chip packaging is needed. In the actual use of most traditional heat-sealing devices, there are often a large number of chips that need to be heat-sealed. Most of the devices can only be placed manually to achieve heat-sealing treatment of the chips. Moreover, because the clamping mechanism itself is relatively fixed, it can only clamp chips of a certain size, which reduces the applicability of the device and also reduces the heat-sealing rate of the chip. For this reason, the applicant proposes a heat-sealing device for chip packaging.
[0023] like Figure 1-Figure 5As shown, the utility model provides a technical solution: a heat sealing device for chip packaging, comprising a collection box 1, a moving mechanism 2 is fixed at one end of the collection box 1, the moving mechanism 2 comprises a base frame 201, two motors 202 are fixed on both sides of the inner wall of the base frame 201, a main sprocket 203 is fixed on the output end of the motor 202, two auxiliary sprockets 204 are rotatably connected on both sides of the inner wall of the base frame 201, the teeth of the two main sprockets 203 and the auxiliary sprockets 204 are meshed with a chain 205, and a plurality of fixed frames 20 are fixed on the opposite sides of the two chains 205. 6, the opposite surfaces of the two adjacent fixed frames 206 are respectively fixed with heat insulation pads 207, a plurality of oblique blocks 208 are fixed on the top of the heat insulation pads 207, a heat sealing pad 209 is fixed between the two adjacent heat insulation pads 207, a plurality of first cylinders 210 are respectively fixed on both sides of the inner wall of the bottom frame 201, the output ends of the two groups of first cylinders 210 are respectively located inside the two chains 205, and do not interfere with the two groups of main sprockets 203 and the secondary sprockets 204, a moving plate 211 is commonly fixed on the output ends of the plurality of first cylinders 210, and the top of the moving mechanism 2 A heat sealing mechanism 3 is fixed to the bottom, and the center position of the bottom of the heat sealing mechanism 3 is symmetrical to the center position of the top of the moving mechanism 2. A plurality of balls 212 are movably connected to the tops of the two moving plates 211, and the two groups of balls 212 are in contact with the bottoms of the two groups of heat insulation cushions 207, respectively. Inclined plates 213 are fixed to both ends of the two moving plates 211, and a plurality of fixed rods 214 are fixed to both sides of the inner wall of the bottom frame 201. One side of the plurality of fixed rods 214 is slidably connected to the bottoms of the two moving plates 211, and the plurality of fixed rods 214 are located on two chains. 205, and does not interfere with the two sets of main sprockets 203 and the secondary sprockets 204 and the two sets of first cylinders 210. The horizontal inclination of the oblique block 208 is between 10-40°. The sum of the longitudinal heights of the two sets of fixed frames 206, the longitudinal heights of the two movable plates 211 and the longitudinal heights of the plurality of fixed rods 214 is less than or equal to half of the longitudinal height of the chain 205. The motor 202, the first cylinder 210, the second cylinder 302, the third cylinder 304 and the hot air gun 305 are electrically connected in sequence, and the four share a control terminal.
[0024] It should be noted that: when heat-sealing and packaging the chip, the worker first needs to adjust the two groups of first cylinders 210 through the terminal so that the distance between the two movable plates 211 meets the size of the chip to be heat-sealed. Because the horizontal height of the two movable plates 211 is greater than the horizontal height of the two groups of thermal insulation pads 207, the two groups of thermal insulation pads 207 will change with the movement of the two movable plates 211. At this time, the worker puts the chip on the heat-sealing pad 209. Because a number of inclined blocks 208 are fixed on the two groups of thermal insulation pads 207, the inclined surface of the inclined blocks 208 can enable the chip to smoothly contact with the heat-sealing pad 209. The side of the block 208 can clamp the chip to ensure the stability of the chip during heat sealing. Then the worker starts the two groups of first cylinders 210. The rotation rate of the first cylinder 210 needs to be matched according to the time the chip needs to be heat sealed. At this time, the movement of the chain 205 can drive the two groups of fixed frames 206 to move. At the same time, the chip will also start to move. For the heat-sealed chips, when the thermal insulation pad 207 moves to the inclined plate 213 at one end, the thermal insulation pad 207 will recover due to its own flexibility. Then, under the continuous drive of the chain 205, the chip will fall into the collection box 1 for collection after losing the clamping.
[0025] like Figure 5 As shown, the utility model provides a technical solution: a heat sealing device for chip packaging, comprising a heat sealing mechanism 3, the heat sealing mechanism 3 comprises a stabilizing frame 301, the tops of two brackets of the stabilizing frame 301 are fixed to the top of the bottom frame 201 in the moving mechanism 2, second cylinders 302 are fixed on both sides of the inner wall of the stabilizing frame 301, a moving block 303 is fixed to the output ends of the two second cylinders 302, the top of the moving block 303 is slidably connected to the bottom of the inner wall of the stabilizing frame 301, a third cylinder 304 is fixed to the bottom of the moving block 303, and a hot air gun 305 is fixed to the output end of the third cylinder 304.
[0026] It should be noted that: when the chip is heat-sealed and packaged, the third cylinder 304 will be started first, driving the hot air gun 305 to descend to the corresponding height, and then the chip will be heat-sealed. For chips with a wider width, the two second cylinders 302 will drive the moving block 303 to move, so as to complete the heat-sealing of the chip.
[0027] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is limited by the attached embodiments and their equivalents.
Claims
1. A heat sealing device for chip packaging, comprising a collecting box (1), characterized in that: A moving mechanism (2) is fixed at one end of the collection box (1), and the moving mechanism (2) comprises a base frame (201), two motors (202) are respectively fixed on both sides of the inner wall of the base frame (201), a main sprocket (203) is fixed to the output end of the motor (202), two secondary sprockets (204) are rotatably connected to the two sides of the inner wall of the base frame (201), the teeth of the two main sprockets (203) and the secondary sprockets (204) are meshed with a chain (205), and a plurality of fixed frames (206) are respectively fixed on the opposite surfaces of the two chains (205), and two groups of adjacent fixed frames (206) are connected to each other. 06), respectively fixed with heat insulating pads (207) on opposite sides thereof, a plurality of inclined blocks (208) being fixed on the top of the heat insulating pads (207), a heat sealing pad (209) being fixed between two groups of adjacent heat insulating pads (207), a plurality of first cylinders (210) being fixed on both sides of the inner wall of the base frame (201), the output ends of the two groups of the first cylinders (210) being respectively located inside the two chains (205) and not interfering with the two groups of main sprockets (203) and secondary sprockets (204), and a movable plate (211) being fixed to the output ends of the plurality of the first cylinders (210).
2. A heat sealing device for chip packaging according to claim 1, characterized in that: A heat sealing mechanism (3) is fixed on the top of the moving mechanism (2), and the center position of the bottom of the heat sealing mechanism (3) is symmetrical to the center position of the top of the moving mechanism (2).
3. A heat sealing device for chip packaging according to claim 1, characterized in that: A plurality of balls (212) are movably connected to the tops of the two movable plates (211), and the two groups of balls (212) are in contact with the bottoms of the two groups of thermal insulation pads (207) respectively. Inclined plates (213) are fixed to both ends of the two movable plates (211), and a plurality of fixed rods (214) are fixed to both sides of the inner wall of the base frame (201). One side of the plurality of fixed rods (214) is slidably connected to the bottoms of the two movable plates (211), and the plurality of fixed rods (214) are located inside the two chains (205) and do not interfere with the two groups of main sprockets (203) and secondary sprockets (204) and the two groups of first cylinders (210).
4. The heat sealing device for chip packaging according to claim 1, characterized in that: The horizontal inclination of the oblique clamping block (208) is between 10 and 40 degrees, and the sum of the longitudinal heights of the two sets of the fixing frames (206), the longitudinal heights of the two moving plates (211), and the longitudinal heights of the plurality of fixing rods (214) is less than or equal to half of the longitudinal height of the chain (205).
5. The heat sealing device for chip packaging according to claim 2, characterized in that: The heat sealing mechanism (3) comprises a stabilizing frame (301), the tops of two brackets of the stabilizing frame (301) are fixed to the top of a bottom frame (201) in the moving mechanism (2), second cylinders (302) are fixed to both sides of the inner wall of the stabilizing frame (301), a moving block (303) is fixed to the output ends of the two second cylinders (302), the top of the moving block (303) and the bottom of the inner wall of the stabilizing frame (301) are slidably connected to each other, a third cylinder (304) is fixed to the bottom of the moving block (303), and a hot air gun (305) is fixed to the output end of the third cylinder (304).
6. The heat sealing device for chip packaging according to claim 1, characterized in that: The motor (202), the first cylinder (210), the second cylinder (302), the third cylinder (304) and the hot air gun (305) are electrically connected in sequence, and the four share a control terminal.