Wafer carrying disc horizontal adjusting base

Abstract

The utility model designs a wafer carrying disc horizontal adjusting base. The wafer carrying disc horizontal adjusting base comprises a wafer carrying disc main body, an adjusting bolt and a positioning base point fixing screw, the wafer carrying disc main body comprises an upper disc and a lower disc; the upper disc and the lower disc are fixed through adjusting bolts and positioning base point fixing screws. The number of the adjusting bolts is two. The number of the positioning base point fixing screw is one. The adjusting bolts and the positioning base point fixing screws are located on the outer ring of the wafer carrying disc body and are distributed in a trisection mode. A bolt hole is formed in the side face, close to the adjusting bolt, of the upper disc, and a non-floating screw is arranged in the bolt hole. Through the above design, the distance between the upper disc and the lower disc can be controlled through the adjusting bolt only by controlling the non-floating screw to loosen, thereby ensuring the overall level of the wafer carrying disc main body.

Description

Technical Field

[0001] The utility model belongs to the field of wafer carriers, and in particular relates to a wafer carrier level adjustment base. Background Art

[0002] The wafer carrier is one of the important equipment in the semiconductor production line. Its size has a very important impact on the stability and efficiency of wafer processing. Reasonable selection of the size of the wafer carrier can improve the efficiency and quality of wafer processing, while a carrier that is too large or too small will affect the processing.

[0003] Firstly, if the carrier disc is too small, the wafer will become unstable. The wafer needs to be fixed on the carrier disc during the processing. If the radius of the carrier disc is too small, it will be difficult to fix the wafer stably, causing jitter and wafer misalignment, affecting the processing accuracy and stability.

[0004] Secondly, a too large carrier disc is not conducive to wafer processing. The larger the diameter of the carrier disc, the more difficult it is to accurately locate the relative position of the wafer. Moreover, a too large carrier disc will cause the ink printing area to become smaller or even impossible to print, and will also cause the ink spray to spread excessively, reducing the dye concentration in the edge area.

[0005] In addition to the size of the wafer carrier disc affecting wafer processing, the levelness of the wafer carrier disc also has a huge impact on wafer processing. However, the height of the current wafer carrier disc is difficult to achieve overall levelness in the preparation process. Utility Model Content

[0006] In order to solve the problem of uneven height of existing wafer carriers, the present application designs a wafer carrier level adjustment base to achieve the overall level of the wafer carrier by adjusting the height at different points.

[0007] A wafer carrier horizontal adjustment base, comprising a wafer carrier body, an adjustment bolt and a positioning base point fixing screw;

[0008] The wafer carrier body comprises an upper disc and a lower disc;

[0009] The upper disc and the lower disc are fixed by adjusting bolts and positioning base point fixing screws;

[0010] The number of the adjusting bolts is 2;

[0011] The number of the positioning base point fixing screws is 1;

[0012] The adjusting bolts and the positioning base point fixing screws are located on the outer circle of the wafer carrier body and are distributed in three equal parts.

[0013] Preferably, a bolt hole is provided on the side of the upper disc close to the adjusting bolt, and a floating stop screw is provided in the screw hole.

[0014] Preferably, the adjusting bolt comprises a nut and a bottom bolt;

[0015] The nut is located in the nut hole on the upper disc;

[0016] The bottom bolt passes through the lower disc and the upper disc in sequence from the bottom of the lower disc, and then is connected with the nut.

[0017] Preferably, the positioning base point fixing screw passes through the upper disc and the lower disc from the top of the upper disc to form a threaded connection.

[0018] Preferably, an auxiliary bolt is provided on each of the left and right sides of the adjusting bolt, and the auxiliary bolt passes through the upper disk and the lower disk from the top of the upper disk to be threadedly connected.

[0019] Preferably, holes of equal size are symmetrically distributed on the upper disc and the lower disc.

[0020] Preferably, the size of the upper disc and the lower disc is 5 inches to 13 inches.

[0021] Preferably, the size of the upper disc and the lower disc is 8 inches.

[0022] Preferably, the diameter of the wafer carrier body is 220-280 mm.

[0023] The advantages and effects of this application are as follows:

[0024] The present application designs a wafer carrier horizontal adjustment base, including a wafer carrier body, an adjustment bolt and a positioning base point fixing screw; the wafer carrier body includes an upper disc and a lower disc; the upper disc and the lower disc are fixed by adjusting bolts and positioning base point fixing screws; the number of the adjusting bolts is 2; the number of the positioning base point fixing screws is 1; the adjusting bolts and the positioning base point fixing screws are located on the outer ring of the wafer carrier body and are distributed in three equal parts; a bolt hole is provided on the side of the upper disc close to the adjustment bolt, and a stop screw is provided in the screw hole. Through the above design, it is only necessary to control the loosening of the stop screw, and the distance between the upper disc and the lower disc can be controlled by the adjusting bolt, thereby ensuring the overall level of the wafer carrier body.

[0025] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application so that it can be implemented in accordance with the contents of the specification, and to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings as follows.

[0026] Based on the detailed description of the specific embodiments of the present application in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other objects, advantages and features of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0028] Figure 1 A structural breakdown diagram of a wafer carrier level adjustment base designed for this application;

[0029] Figure 2 A top view of a wafer carrier level adjustment base designed for this application;

[0030] Figure 3 A bottom view of a wafer carrier level adjustment base designed for this application;

[0031] Reference numerals:

[0032] 1. Adjusting bolt; 2. Positioning base point fixing screw; 3. Upper disc; 4. Lower disc; 5. Anti-floating screw; 6. Auxiliary bolt. DETAILED DESCRIPTION

[0033] To make the purpose, technical scheme and advantages of the embodiment of the present application clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the present application. Obviously, the described embodiment is a part of the embodiment of the present application, rather than all of the embodiments. In the following description, specific details such as specific configuration and components are provided only to help fully understand the embodiments of the present application. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. In addition, for clarity and brevity, the description of known functions and structures is omitted in the embodiment.

[0034] It should be understood that the references to "one embodiment" or "this embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present application. Therefore, the references to "one embodiment" or "this embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0035] In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0036] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist at the same time. The term " / and" in this article describes another type of association object relationship, indicating that there can be two relationships. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship.

[0037] The term "at least one" in this article is merely a description of the association relationship of associated objects, indicating that there may be three relationships. For example, at least one of A and B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0038] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusions.

[0039] Example 1

[0040] Please refer to Figures 1 to 3 , This embodiment mainly introduces a basic design of a wafer carrier horizontal adjustment base, including a wafer carrier body, an adjustment bolt 1 and a positioning base point fixing screw 2;

[0041] The wafer carrier body includes an upper disc 3 and a lower disc 4;

[0042] The upper disc 3 and the lower disc 4 are fixed by adjusting bolts 1 and positioning base point fixing screws 2;

[0043] The number of the adjusting bolts 1 is 2;

[0044] The number of the positioning base point fixing screw 2 is 1;

[0045] The adjusting bolts 1 and the positioning base point fixing screws 2 are located on the outer ring of the wafer carrier body and are distributed in three equal parts. The three-part distribution will be more uniform and the wafer carrier body will be more stable.

[0046] Furthermore, a bolt hole is provided on the side of the upper disc 3 close to the adjusting bolt 1 , and a floating stop screw 5 is provided in the screw hole for fixing the adjusting bolt 1 .

[0047] Further, the adjusting bolt 1 includes a nut and a bottom bolt;

[0048] The nut is located in the nut hole on the upper disc 3;

[0049] The bottom bolt passes through the lower disc 4 and the upper disc 3 in sequence from the bottom of the lower disc 4, and then is connected with the nut.

[0050] Furthermore, the positioning base point fixing screw 2 passes through the upper disc 3 and the lower disc 4 from the top of the upper disc 3 to be threadedly connected.

[0051] Furthermore, an auxiliary bolt 6 is provided on each of the left and right sides of the adjusting bolt 1 , and the auxiliary bolt 6 passes through the upper disk 3 and the lower disk 4 from the top of the upper disk 3 to be threadedly connected.

[0052] Furthermore, holes of equal size are symmetrically distributed on the upper disc 3 and the lower disc 4 .

[0053] Furthermore, the size of the upper disc 3 and the lower disc 4 is 5 inches to 13 inches.

[0054] Furthermore, the size of the upper disc 3 and the lower disc 4 is 8 inches.

[0055] Furthermore, the diameter of the wafer carrier body is 220-280 mm.

[0056] The present application designs a wafer carrier horizontal adjustment base, including a wafer carrier body, an adjustment bolt and a positioning base point fixing screw; the wafer carrier body includes an upper disc and a lower disc; the upper disc and the lower disc are fixed by adjusting bolts and positioning base point fixing screws; the number of the adjusting bolts is 2; the number of the positioning base point fixing screws is 1; the adjusting bolts and the positioning base point fixing screws are located on the outer ring of the wafer carrier body and are distributed in three equal parts; a bolt hole is provided on the side of the upper disc close to the adjustment bolt, and a stop screw is provided in the screw hole. Through the above design, it is only necessary to control the loosening of the stop screw, and the distance between the upper disc and the lower disc can be controlled by the adjusting bolt, thereby ensuring the overall level of the wafer carrier body.

[0057] The above description is only the preferred embodiment of the utility model, which does not limit the protection scope of the utility model. For those skilled in the art, the utility model can be modified and varied in various ways. Any changes, modifications, substitutions, integrations and parameter changes to these embodiments within the spirit and principle of the utility model through conventional substitutions or capable of achieving the same functions without departing from the principles and spirit of the utility model shall fall within the protection scope of the utility model.

Claims

1. A wafer carrier level adjustment base, characterized in that: It comprises a wafer carrier body, an adjusting bolt (1) and a positioning base point fixing screw (2); The wafer carrier body comprises an upper disc (3) and a lower disc (4); The upper disc (3) and the lower disc (4) are fixed by means of adjusting bolts (1) and positioning base point fixing screws (2); The number of the adjusting bolts (1) is 2; The number of the positioning base point fixing screw (2) is 1; The adjusting bolts (1) and the positioning base point fixing screws (2) are located on the outer ring of the wafer carrier body and are distributed in three equal parts.

2. The wafer carrier level adjustment base according to claim 1, characterized in that: A bolt hole is arranged on the side of the upper disc (3) close to the adjusting bolt (1), and a floating stop screw (5) is arranged in the screw hole.

3. A wafer carrier level adjustment base according to any one of claims 1 or 2, characterized in that: The adjusting bolt (1) comprises a nut and a bottom bolt; The nut is located in a nut hole on the upper disc (3); The bottom bolt passes through the lower disc (4) and the upper disc (3) in sequence from the bottom of the lower disc (4) and is then connected with a nut.

4. A wafer carrier level adjustment base according to any one of claims 1 or 2, characterized in that: The positioning base point fixing screw (2) passes through the upper disc (3) and the lower disc (4) from the top of the upper disc (3) to form a threaded connection.

5. The wafer carrier level adjustment base according to claim 1, characterized in that: An auxiliary bolt (6) is also provided on each of the left and right sides of the adjusting bolt (1), and the auxiliary bolt (6) passes through the upper disc (3) and the lower disc (4) from the top of the upper disc (3) to form a threaded connection.

6. The wafer carrier level adjustment base according to claim 1, characterized in that: The upper disc (3) and the lower disc (4) are symmetrically provided with holes of the same size.

7. The wafer carrier level adjustment base according to claim 1, characterized in that: The sizes of the upper disc (3) and the lower disc (4) are 5 inches to 13 inches.

8. The wafer carrier level adjustment base according to claim 1, characterized in that: The size of the upper disc (3) and the lower disc (4) is 8 inches.

9. The wafer carrier level adjustment base according to claim 1, characterized in that: The diameter of the wafer carrier body is 220-280 mm.

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