Lead frame device

Abstract

The utility model discloses a lead frame device, and relates to the technical field of semiconductor chip packaging. Comprising a first-class mounting plate and a third-class mounting plate, and the first-class mounting plate and the third-class mounting plate are mounted at the two ends respectively. A first-class mounting plate and a third-class mounting plate are arranged at the two ends of the mounting plate respectively, a plurality of second-class mounting plates are arranged between the first-class mounting plate and the third-class mounting plate, a plurality of evenly-distributed inserting grooves are formed in the sides, facing the third-class mounting plate, of the first-class mounting plate and the second-class mounting plates, and magnets are mounted in the inserting grooves. A plurality of evenly-distributed inserting columns are fixedly connected to the sides, facing the first-class installation plate, of the third-class installation plate and the second-class installation plate, the first-class installation plate, the second-class installation plate and the third-class installation plate are attracted and fixed through the magnets and the inserting columns, and therefore the length of the installation plates can be adjusted, and the requirement for installation of leads of different lengths is met.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip packaging, in particular to a lead frame device. Background Art

[0002] As the demand for miniaturization, lightness and multi-functionality of electronic components increases, the density of semiconductor packaging continues to increase, so the package size and the area occupied during packaging must be reduced. Among the technologies developed to meet the above needs, multi-chip semiconductor packaging technology plays an indicative role in the overall cost, performance and reliability of packaged chips. In the process of packaging semiconductor chips, a lead frame is required to electrically connect the semiconductor chip to an external circuit to provide the external circuit with the functions performed by the semiconductor chip. The lead frame can also physically support the semiconductor chip.

[0003] The lead frame device with publication number CN207743222U has the following defects during use:

[0004] During use, the above device cannot adjust the length of the lead frame according to different lead lengths, so it cannot meet actual production needs during lead packaging. Therefore, a lead frame device with adjustable length is urgently needed to meet actual production needs. Utility Model Content

[0005] The purpose of the utility model is to provide a lead frame device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a lead frame device, comprising a first-class mounting plate and a third-class mounting plate, wherein the first-class mounting plate and the third-class mounting plate are respectively provided with a single one and installed at both ends, and the second-class mounting plate is provided with a plurality of ones and respectively installed between the first-class mounting plate and the third-class mounting plate, and the first-class mounting plate, the second-class mounting plate and the third-class mounting plate are spliced ​​into one by a splicing assembly, and the splicing assembly comprises a plug-in slot, wherein the plug-in slot is provided with a plurality of ones and respectively opened on the side of the first-class mounting plate and the second-class mounting plate facing the third-class mounting plate, and the first-class mounting plate and the second-class mounting plate are installed with matching magnets through the plug-in slot, and the third-class mounting plate and the second-class mounting plate are fixedly connected with a plurality of evenly distributed plug-in columns on the side facing the first-class mounting plate, and the plug-in columns are matched with the plug-in slots, and the first-class mounting plate, the second-class mounting plate and the third-class mounting plate are fixed by adsorption of the magnets and the plug-in columns.

[0007] Preferably, adhesive gaskets are adhered to the bottoms of the first, second and third mounting plates, a plurality of evenly distributed arc grooves are provided on the tops of the first, second and third mounting plates, placement grooves are respectively provided at the middle ends of the arc grooves on the tops of the first, second and third mounting plates, and placement mechanisms are installed on the first, second and third mounting plates through the placement grooves.

[0008] Preferably, the placement mechanism includes a lower arc plate, which is a "concave" shaped iron block, and the protrusions at both ends of the lower arc plate are adapted to the placement groove. The lower arc plate is provided with mounting grooves at the top of the protrusions at both ends, and a spring is installed inside the mounting groove of the lower arc plate. The upper arc tile is fixedly connected to the top of the spring located inside the mounting groove of the lower arc plate.

[0009] Preferably, handles are fixedly connected to both ends of the top of the outer wall of the upper arc-shaped tile, and a matching protective gasket is pasted to the inner wall of the lower arc-shaped plate.

[0010] Preferably, a fixing mechanism is installed inside the upper arc-shaped tile, and the fixing mechanism includes a threaded column, the threaded column is threadedly connected to the middle of the outer wall of the upper arc-shaped tile, and the top end of the outer wall of the threaded column is fixedly connected to a rotating disk.

[0011] Preferably, a bearing is installed at the bottom end of the outer wall of the threaded column, the inner wall of the inner ring of the bearing is fixed to the bottom end of the outer wall of the threaded column, and the bottom end of the bearing is fixedly connected with an arc-shaped fixing plate.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The lead frame device is provided with a first-class mounting plate and a third-class mounting plate at two ends, a plurality of second-class mounting plates are provided between the first-class mounting plate and the third-class mounting plate, a plurality of evenly distributed plug-in slots are provided on the side of the first-class mounting plate and the second-class mounting plate facing the third-class mounting plate, magnets are installed inside the plug-in slots, a plurality of evenly distributed plug-in columns are fixedly connected on the side of the third-class mounting plate and the second-class mounting plate facing the first-class mounting plate, the first-class mounting plate, the second-class mounting plate and the third-class mounting plate are fixed by adsorption of the magnets and the plug-in columns, so that the length of the mounting plate can be adjusted to meet the installation requirements of leads of different lengths. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the axial side of the lead frame device of the utility model;

[0015] Figure 2 It is a structural schematic diagram of the splicing assembly of the lead frame device of the utility model;

[0016] Figure 3 It is a structural schematic diagram of the placement mechanism of the lead frame device of the utility model;

[0017] Figure 4 It is a structural schematic diagram of the fixing mechanism of the lead frame device of the utility model.

[0018] In the figure: 1. Type I mounting plate; 2. Type II mounting plate; 3. Type III mounting plate; 4. Placing mechanism; 401. Lower arc plate; 402. Protective gasket; 403. Spring; 404. Upper arc tile; 405. Handle; 5. Fixing mechanism; 501. Threaded column; 502. Rotating disk; 503. Bearing; 504. Arc fixing plate; 6. Arc groove; 7. Placing groove; 8. Adhesive gasket; 9. Plug-in groove; 10. Plug-in column; 11. Magnet. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] As the demand for miniaturization, lightness and multi-functionality of electronic components increases, the density of semiconductor packaging continues to increase, so the package size and the area occupied by the package must be reduced. Among the technologies developed to meet the above needs, multi-chip semiconductor packaging technology plays an indicative role in the overall cost, performance and reliability of the packaged chips. In the process of packaging semiconductor chips, a lead frame is required to electrically connect the semiconductor chip to an external circuit to provide the external circuit with the function performed by the semiconductor chip. The lead frame can also physically support the semiconductor chip. The present application arranges a type I mounting plate and a type III mounting plate at both ends, and arranges a number of type II mounting plates between the type I mounting plate and the type III mounting plate. A number of evenly distributed plug-in slots are opened on the side of the type I mounting plate and the type II mounting plate facing the type III mounting plate, and magnets are installed inside the plug-in slots. A number of evenly distributed plug-in columns are fixedly connected to the side of the type III mounting plate and the type II mounting plate facing the type I mounting plate. The type I mounting plate, the type II mounting plate and the type III mounting plate are fixed by adsorption of magnets and plug-in columns. In this way, the length of the mounting plate can be adjusted to meet the installation requirements of leads of different lengths. The upper arc tile is moved by pulling the handle, and the leads can be placed by the upper arc tile and the lower arc plate. The threaded column is rotated by rotating the rotating disk, thereby driving the arc fixing plate to move, and the leads are fixed by moving the arc fixing plate.

[0021] like Figure 1-Figure 4As shown, the utility model provides a technical solution: a lead frame device, including a first-class mounting plate 1 and a third-class mounting plate 3, the first-class mounting plate 1 and the third-class mounting plate 3 are respectively provided with a single one and installed at both ends, the second-class mounting plate 2 is provided with a plurality of ones and are respectively installed between the first-class mounting plate 1 and the third-class mounting plate 3, the first-class mounting plate 1, the second-class mounting plate 2 and the third-class mounting plate 3 are spliced ​​into one through a splicing component, the splicing component includes a plug-in slot 9, the plug-in slot 9 is provided with a plurality of ones and are respectively opened on the side of the first-class mounting plate 1 and the second-class mounting plate 2 facing the third-class mounting plate 3, the first-class mounting plate 1 and the second-class mounting plate 2 are installed with matching magnets 11 through the plug-in slot 9, and the third-class mounting plate 3 and the second-class mounting plate 2 are fixedly connected with a plurality of evenly distributed plug-in columns 10 on the side facing the first-class mounting plate 1, and the plug-in columns 1 0 is adapted to the plug-in slot 9, the first type of mounting plate 1, the second type of mounting plate 2 and the third type of mounting plate 3 are fixed by adsorption of magnets 11 and plug-in columns 10, by respectively arranging the first type of mounting plate 1 and the third type of mounting plate 3 at both ends, arranging a number of second type of mounting plates 2 between the first type of mounting plate 1 and the third type of mounting plate 3, opening a number of evenly distributed plug-in slots 9 on the side of the first type of mounting plate 1 and the second type of mounting plate 2 facing the third type of mounting plate 3, installing magnets 11 inside the plug-in slots 9, and fixing a number of evenly distributed plug-in columns 10 on the side of the third type of mounting plate 3 and the second type of mounting plate 2 facing the first type of mounting plate 1, the first type of mounting plate 1, the second type of mounting plate 2 and the third type of mounting plate 3 are fixed by adsorption of magnets 11 and the plug-in columns 10, so that the length of the mounting plate can be adjusted to meet the installation of leads of different lengths.

[0022] The bottoms of the first-class mounting plates 1, the second-class mounting plates 2 and the third-class mounting plates 3 are all adhered with adhesive gaskets 8, the tops of the first-class mounting plates 1, the second-class mounting plates 2 and the third-class mounting plates 3 are provided with a plurality of evenly distributed arc grooves 6, the tops of the first-class mounting plates 1, the second-class mounting plates 2 and the third-class mounting plates 3 are respectively provided with placement grooves 7 at both ends of the middle of the arc grooves 6, and the first-class mounting plates 1, the second-class mounting plates 2 and the third-class mounting plates 3 are installed with placement mechanisms 4 through the placement grooves 7.

[0023] The placement mechanism 4 includes a lower arc plate 401, which is a "concave" iron block. The protrusions at both ends of the lower arc plate 401 are adapted to the placement groove 7. The lower arc plate 401 is provided with mounting grooves at the top of the protrusions at both ends. The lower arc plate 401 is provided with a spring 403 installed inside the mounting groove. The top of the spring 403 inside the mounting groove of the lower arc plate 401 is fixedly connected with an upper arc tile 404. The upper arc tile 404 is moved by pulling the handle 405, and the lead can be placed through the upper arc tile 404 and the lower arc plate 401.

[0024] Handles 405 are fixedly connected to the top ends of the outer wall of the upper arc-shaped tile 404 , and a matching protective gasket 402 is pasted to the inner wall of the lower arc-shaped plate 401 .

[0025] A fixing mechanism 5 is installed inside the upper arc-shaped tile 404 . The fixing mechanism 5 includes a threaded column 501 . The threaded column 501 is threadedly connected to the middle of the outer wall of the upper arc-shaped tile 404 . A rotating disk 502 is fixedly connected to the top of the outer wall of the threaded column 501 .

[0026] A bearing 503 is installed at the bottom end of the outer wall of the threaded column 501. The inner wall of the inner ring of the bearing 503 is fixed to the bottom end of the outer wall of the threaded column 501. The bottom end of the bearing 503 is fixedly connected to an arc-shaped fixing plate 504. The threaded column 501 is driven to rotate by rotating the rotating disk 502, thereby driving the arc-shaped fixing plate 504 to move, and the lead is fixed by the movement of the arc-shaped fixing plate 504.

[0027] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is limited by the attached embodiments and their equivalents.

Claims

1. A lead frame device, comprising a first-type mounting plate (1), a second-type mounting plate (2) and a third-type mounting plate (3), Features: The first-class mounting plate (1) and the third-class mounting plate (3) are each provided with a single one and installed at both ends; the second-class mounting plate (2) is provided with a plurality of ones and installed respectively between the first-class mounting plate (1) and the third-class mounting plate (3); the first-class mounting plate (1), the second-class mounting plate (2) and the third-class mounting plate (3) are spliced ​​together into one piece by a splicing assembly; the splicing assembly comprises a plug-in slot (9); the plug-in slot (9) is provided with a plurality of ones and is respectively opened on the first-class mounting plate (1) and the second-class mounting plate (2) facing the third-class mounting plate The first and second mounting plates (3) are mounted on one side of the first mounting plate (1) and the second mounting plate (2) with matching magnets (11) via plug-in slots (9); the third mounting plate (3) and the second mounting plate (2) are fixedly connected with a plurality of evenly distributed plug-in posts (10) on one side facing the first mounting plate (1); the plug-in posts (10) are matched with the plug-in slots (9); and the first mounting plate (1), the second mounting plate (2) and the third mounting plate (3) are fixed by adsorption of the magnets (11) and the plug-in posts (10).

2. A lead frame device according to claim 1, Features: The bottoms of the first-class mounting plates (1), the second-class mounting plates (2) and the third-class mounting plates (3) are all adhered with adhesive gaskets (8); the tops of the first-class mounting plates (1), the second-class mounting plates (2) and the third-class mounting plates (3) are provided with a plurality of evenly distributed arc grooves (6); the tops of the first-class mounting plates (1), the second-class mounting plates (2) and the third-class mounting plates (3) are respectively provided with placement grooves (7) at both ends of the middle of the arc grooves (6); and the first-class mounting plates (1), the second-class mounting plates (2) and the third-class mounting plates (3) are provided with placement mechanisms (4) via the placement grooves (7).

3. A lead frame device according to claim 2, Features: The placement mechanism (4) comprises a lower arc plate (401), the lower arc plate (401) is a "concave" iron block, the protrusions at both ends of the lower arc plate (401) are adapted to the placement groove (7), the tops of the protrusions at both ends of the lower arc plate (401) are respectively provided with mounting grooves, the lower arc plate (401) is provided with springs (403) installed inside the mounting grooves, and the tops of the springs (403) located inside the mounting grooves of the lower arc plate (401) are fixedly connected to the upper arc tile (404).

4. A lead frame device according to claim 3, Features: Handles (405) are fixedly connected to the top ends of the outer wall of the upper arc-shaped tile (404), and a matching protective gasket (402) is adhered to the inner wall of the lower arc-shaped plate (401).

5. A lead frame device according to claim 4, Features: A fixing mechanism (5) is installed inside the upper arc-shaped tile (404), and the fixing mechanism (5) comprises a threaded column (501). The threaded column (501) is threadedly connected to the middle of the outer wall of the upper arc-shaped tile (404), and a rotating disk (502) is fixedly connected to the top end of the outer wall of the threaded column (501).

6. A lead frame device according to claim 5, Features: A bearing (503) is installed at the bottom end of the outer wall of the threaded column (501); the inner wall of the inner ring of the bearing (503) is fixed to the bottom end of the outer wall of the threaded column (501); and the bottom end of the bearing (503) is fixedly connected to an arc-shaped fixing plate (504).

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