Corrosion-resistant silver paste circuit PAD structure for TFT module

Abstract

The utility model discloses an anti-corrosion silver paste circuit PAD structure used for a TFT module, comprising a color film substrate and an array substrate, the surface of the color film substrate is provided with an anti-static film, the edge of the array substrate is provided with a silver paste PAD and a metal ground wire, the silver paste PAD is electrically connected with the metal ground wire, and the metal ground wire is electrically connected with the anti-static film. A positioning mark is arranged on the silver paste PAD, and silver paste is arranged on the silver paste PAD. When dispensing is carried out on silver paste, a silver paste dripper is aligned with the cross-shaped positioning mark, the silver paste spreads in the silver paste PAD area under the action of gravity, due to the limitation of the silver paste PAD area, the silver paste cannot spread to the metal ground wire by utilizing the isolation distance D between the right side edge of the silver paste and the metal ground wire, the silver paste is thoroughly prevented from corroding the adjacent metal ground wire, and the service life of the silver paste is prolonged. And the metal ground wiring failure is prevented. Meanwhile, the silver paste PAD is the ITO pattern layer, and the impedance of the silver paste PAD is two orders of magnitude higher than that of the metal ground wire, so that the corrosion problem caused by ionization of the silver paste is avoided.

Description

Technical Field

[0001] The utility model relates to a TFT module, more specifically, to an anti-corrosion silver paste circuit PAD structure used for the TFT module. Background Art

[0002] The traditional silver paste PAD design of TFT modules is generally to directly connect the metal traces on the large TFT glass to the ground wire, and the silver paste is directly applied to the junction of the upper glass and the lower glass. Most of the silver paste will be connected to the metal at the silver paste PAD position of the lower glass. In this design, the silver ions in the silver paste are directly connected to the metal at the PAD position. The contact between the two different metals will form ionization due to the difference in the difficulty of ion migration. The migration of silver ions can easily cause corrosion and failure to the metal traces of the circuit or the polarizer in contact with the silver paste.

[0003] Chinese invention patent document CN108877540A discloses a transparent LED glass display screen, which mainly includes transparent conductive glass, silver paste circuit, LED, terminal block, lead wire, PVB film, and tempered glass. The silver paste circuit is sintered on the surface of the transparent conductive glass, LED is welded on the silver paste circuit, the silver paste circuit leads out the terminal block and lead wire at the edge of the transparent conductive glass to connect with the external controller and power supply, and the tempered glass covers the transparent conductive glass. PVB film is filled between the transparent conductive glass and the tempered glass through the laminating process to form a transparent adhesive layer to encapsulate the LED and bond the transparent conductive glass and the tempered glass into one. The silver paste circuit is printed on the surface of the transparent conductive glass according to the designed circuit diagram through the silk screen printing process and the printing process, and the silver paste circuit is sintered on the transparent conductive glass while the transparent conductive glass is physically tempered. The adhesive layer of the PVB film can also be formed by a wet glue filling process. The adhesive layer of the film can also be hollowed out. The transparent conductive glass and the tempered glass are bonded to the two sides of the aluminum alloy frame containing the desiccant using a high-strength and high-airtightness composite adhesive. The LED is encapsulated in the sealed space formed in the middle and is evacuated or filled with gas through the suction hole. The tempered glass is a tempered glass coated with a specific performance film layer. The filling gas is a dry gas, an inert gas and a color gas. The LED unit is a single-color or RGB multi-color SMD LED.

[0004] Obviously, the patent involves the defects of conventional LED display screens, such as the reliability of the ITO film circuit, etc. These structures cannot solve the silver paste corrosion problem of existing TFT modules.

[0005] Chinese utility model patent document CN215376288U discloses a new type of printed mutual capacitance touch circuit, including a PET film, on which are printed several 0.12mm wide X-axis silver paste circuits, on which are printed an insulating ink layer, on which are printed several 0.12mm wide Y-axis silver paste circuits, and on which are printed several 0.12mm wide X-axis silver paste circuits and Y-axis silver paste circuits, and the several X-axis silver paste circuits and Y-axis silver paste circuits are arranged equidistantly. The X-axis silver paste circuits and the Y-axis silver paste circuits are arranged perpendicular to each other. The spacing of each node where the X-axis circuit and the Y-axis circuit intersect is more stable, and each node where the X-axis circuit and the Y-axis circuit intersect constitutes a structure of two conductors and an intermediate medium with the PET substrate, that is, a tiny capacitor is formed, and the capacitance value is not easy to change, which improves stability compared to the metal grid capacitor film. The distance between two adjacent X-axis silver paste circuits is equal to the distance between two adjacent Y-axis silver paste circuits. The distance between two adjacent X-axis silver paste circuits and the distance between two adjacent Y-axis silver paste circuits have a tolerance of less than ±0.1mm. The above beneficial effect is that it is conducive to better ensuring that the capacitance values ​​of the tiny capacitors formed by the intersection of each X-axis silver paste circuit and the Y-axis silver paste circuit are equal. The tail of the X-axis silver paste circuit is formed with an X-axis convergence tail. The above beneficial effect is that the X-axis convergence tail is used to connect the capacitor main control board, and is used to detect the capacitance change at any position in the touch area, thereby realizing the touch function. The X-axis convergence tail is swung out from the left and then converges vertically to the Y-axis direction. The above beneficial effect is that it is convenient to carry out processing better, converge in one direction, and is the same as the convergence direction of the Y-axis convergence tail, which is convenient for better connection to the capacitor main control board. The tail of the Y-axis silver paste circuit is formed with a Y-axis convergence tail. The above beneficial effect is that the Y-axis convergence tail is used to connect the capacitor main control board, and is used to detect the capacitance change at any position in the touch area, thereby realizing the touch function. The Y-axis convergence tail is vertically bent inward and converges to the Y-axis direction. The beneficial effect of the above is that it is convenient to carry out processing better, converge in one direction, and is the same as the X-axis convergence tail convergence direction, which facilitates better connection of the capacitor main control board.

[0006] Obviously, the patent prints the Y-axis silver paste circuit on the insulating ink layer, which can well ensure the insulation between the Y-axis silver paste circuit and the X-axis silver paste circuit to avoid mutual influence. The Y-axis silver paste circuit and the X-axis silver paste circuit are then connected to the capacitor main control board through the X-axis convergence tail and the Y-axis convergence tail. The tiny capacitor formed by the intersection of each X-axis silver paste circuit and the Y-axis silver paste circuit can be used more accurately to detect the capacitance change at any position in the touch area, thereby better realizing the touch function. This structure can only solve the multi-touch problem of the capacitive screen, but cannot solve the silver paste corrosion problem of the existing TFT module. Utility Model Content

[0007] Based on this, it is necessary to provide a corrosion-resistant silver paste circuit PAD structure for TFT modules in response to the above technical problems. The corrosion-resistant silver paste circuit PAD structure for TFT modules includes a color film substrate and an array substrate. The surface of the color film substrate is provided with an antistatic film. The edge of the array substrate is provided with a silver paste PAD and a metal ground trace. The right edge of the silver paste PAD is in contact with the left edge of the metal ground trace, and the silver paste PAD is electrically connected to the metal ground trace. A positioning mark is provided on the silver paste PAD. The silver paste is provided on the silver paste PAD. The silver paste covers the lower edge of the antistatic film. When dispensing the silver paste, align the silver paste dripper with the cross-shaped positioning mark. The silver paste spreads in the silver paste PAD area under the action of gravity. Due to the limitation of the silver paste PAD area, the silver paste will not spread to the metal ground trace by utilizing the isolation distance D between the right edge of the silver paste and the metal ground trace, thus completely preventing the silver paste from corroding the adjacent metal ground trace and preventing the metal ground trace from failing. At the same time, since the silver paste PAD is an ITO pattern layer, its impedance is two orders of magnitude higher than the impedance of the metal ground trace, thus avoiding corrosion problems caused by the ionization of the silver paste.

[0008] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0009] A corrosion-resistant silver paste circuit PAD structure for a TFT module, characterized in that the corrosion-resistant silver paste circuit PAD structure for a TFT module comprises a color film substrate and an array substrate, the surface of the color film substrate is provided with an antistatic film, the edge of the array substrate is provided with a silver paste PAD and a metal ground trace, the right edge of the silver paste PAD is in contact with the left edge of the metal ground trace, and the silver paste PAD is electrically connected to the metal ground trace, a positioning mark is provided on the silver paste PAD, and silver paste is provided on the silver paste PAD, and the silver paste covers the lower edge of the antistatic film.

[0010] As a preferred implementation of the corrosion-resistant silver paste circuit PAD structure for TFT modules provided by the utility model, the upper edge of the silver paste PAD is in contact with the lower edge of the color film substrate.

[0011] As a preferred implementation of the corrosion-resistant silver paste circuit PAD structure for TFT modules provided by the utility model, the right edge of the silver paste is separated from the metal ground trace by a preset isolation distance.

[0012] As a preferred implementation of the corrosion-resistant silver paste circuit PAD structure for TFT modules provided by the utility model, the silver paste is obtained by a dispensing process.

[0013] As a preferred implementation of the corrosion-resistant silver paste circuit PAD structure for a TFT module provided by the utility model, the extension direction of the positioning mark is consistent with the extension direction of the array substrate.

[0014] As a preferred implementation of the corrosion-resistant silver paste circuit PAD structure for TFT modules provided by the utility model, the silver paste PAD is an ITO pattern layer.

[0015] As a preferred implementation of the corrosion-resistant silver paste circuit PAD structure for TFT modules provided by the utility model, the positioning mark and the silver paste PAD are formed by synchronous deposition and etching of ITO.

[0016] As a preferred implementation of the corrosion-resistant silver paste circuit PAD structure for TFT modules provided by the utility model, the positioning mark is in a cross shape.

[0017] As a preferred implementation of the corrosion-resistant silver paste circuit PAD structure for TFT modules provided by the utility model, the positioning mark is in a cross shape.

[0018] As a preferred implementation of the corrosion-resistant silver paste circuit PAD structure for TFT modules provided by the utility model, the depth of the positioning mark is greater than half of the thickness of the silver paste PAD.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] The utility model provides a corrosion-resistant silver paste circuit PAD structure for TFT modules. When dispensing silver paste, the silver paste dripper is aligned with a cross-shaped positioning mark, and the silver paste spreads in the silver paste PAD area under the action of gravity. Due to the limitation of the silver paste PAD area, the silver paste will not spread to the metal ground line by utilizing the isolation distance D between the right edge of the silver paste and the metal ground line, and the silver paste is completely prevented from corroding the adjacent metal ground line, and the metal ground line is prevented from failing. At the same time, since the silver paste PAD is an ITO pattern layer, its impedance is two orders of magnitude higher than the impedance value of the metal ground line, avoiding the corrosion problem caused by the ionization of the silver paste.

[0021] In addition, the positioning mark can be made into a cross shape. The cross-shaped positioning mark can further facilitate the alignment of the silver paste dripper and further improve the accuracy of silver paste dripping.

[0022] In addition, the depth of the positioning mark can be made greater than half of the thickness of the silver paste PAD.

[0023] Since the depth of the positioning mark is greater than half of the thickness of the silver paste PAD, the connection strength between the silver paste and the silver paste PAD can be effectively improved, further improving the reliability of the TFT module. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the scheme in the utility model, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 This is a schematic structural diagram of the anti-corrosion silver paste circuit PAD structure used for TFT modules of the utility model;

[0026] Figure 2 for Figure 1 A detailed enlarged schematic diagram of area A of the structural schematic diagram of the anti-corrosion silver paste circuit PAD structure for TFT module;

[0027] Figure 3 for Figure 2 A cross-sectional view of the silver paste circuit PAD structure along line BB;

[0028] Figure 4 It is a three-dimensional structural schematic diagram of another embodiment of the corrosion-resistant silver paste circuit PAD structure for TFT module of the utility model;

[0029] The markings in the figure are explained as follows: 1. Color film substrate; 11. Antistatic film; 2. Array substrate; 3. Silver paste PAD; 31. Positioning mark; 4. Silver paste; 5. Metal ground wiring; D. Isolation distance. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0031] As described in the background technology, in the prior art, for traditional TFT modules, the silver paste PAD design is generally to directly connect the metal wiring on the large TFT glass to the ground wire, and the silver paste is directly applied to the junction of the upper glass and the lower glass. Most of the silver paste will be connected to the metal at the silver paste PAD position of the lower glass. In this design, the silver ions in the silver paste are directly connected to the metal at the PAD position. The contact between the two different metals will form ionization due to the difference in the difficulty of ion migration. The migration of silver ions can easily cause corrosion and failure to the metal wiring of the circuit or the polarizer in contact with the silver paste.

[0032] In order to solve this technical problem, the utility model provides an anti-corrosion silver paste circuit PAD structure package for TFT module, comprising a color filter substrate 1 and an array substrate 2, the surface of the color filter substrate 1 is provided with an antistatic film 11, the edge of the array substrate 2 is provided with a silver paste PAD3 and a metal ground trace 5, the right edge of the silver paste PAD3 is in contact with the left edge of the metal ground trace 5, and the silver paste PAD3 is electrically connected to the metal ground trace 5, a positioning mark 31 is provided on the silver paste PAD3, and a silver paste 4 is provided on the silver paste PAD3, and the silver paste 4 covers the lower edge of the antistatic film 11. The upper edge of the silver paste PAD3 is in contact with the lower edge of the color filter substrate 1.

[0033] Through the above structural design, when the silver paste 4 is dispensed, the silver paste dripper is aligned with the cross-shaped positioning mark 31, and the silver paste 4 spreads in the silver paste PAD area 3 under the action of gravity. Due to the limitation of the silver paste PAD area, the silver paste 4 will not spread to the metal ground trace 5 by utilizing the isolation distance D between the right edge of the silver paste 4 and the metal ground trace 5, which completely prevents the silver paste from corroding the adjacent metal ground trace 5 and prevents the metal ground trace 5 from being damaged. At the same time, since the silver paste PAD3 is an ITO pattern layer, its impedance is two orders of magnitude higher than the impedance value of the metal ground trace 5, which avoids the corrosion problem caused by the ionization of the silver paste.

[0034] In order to enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0035] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0037] Example 1

[0038] like Figure 1 and Figure 2 As shown, the anti-corrosion silver paste circuit PAD structure for the TFT module includes a color film substrate 1 and an array substrate 2, the surface of the color film substrate 1 is provided with an antistatic film 11, the edge of the array substrate 2 is provided with a silver paste PAD3 and a metal ground trace 5, the right edge of the silver paste PAD3 is in contact with the left edge of the metal ground trace 5, and the silver paste PAD3 is electrically connected to the metal ground trace 5, a positioning mark 31 is provided on the silver paste PAD3, and a silver paste 4 is provided on the silver paste PAD3, and the silver paste 4 covers the lower edge of the antistatic film 11.

[0039] It should be noted that the upper edge of the silver paste PAD3 is in contact with the lower edge of the color filter substrate 1 .

[0040] In addition, the right edge of the silver paste 4 is separated from the metal ground trace 5 by a preset isolation distance D. The silver paste 4 is obtained by a dispensing process.

[0041] In addition, the extending direction of the positioning mark 31 is consistent with the extending direction of the array substrate 2 .

[0042] It should be noted that the silver paste PAD3 is an ITO pattern layer. The positioning mark 31 and the silver paste PAD3 are formed by synchronously depositing and etching ITO.

[0043] The positioning mark 31 is in a cross shape.

[0044] The working mode of this embodiment is described below.

[0045] like Figure 2 and Figure 3 As shown, when the silver paste 4 is dispensed, the silver paste dripper is aligned with the cross-shaped positioning mark 31, and the silver paste 4 spreads in the silver paste PAD area 3 under the action of gravity. Due to the limitation of the silver paste PAD area, the silver paste 4 will not spread to the metal ground trace 5 by utilizing the isolation distance D between the right edge of the silver paste 4 and the metal ground trace 5, which completely prevents the silver paste from corroding the adjacent metal ground trace 5 and prevents the metal ground trace 5 from being damaged. At the same time, since the silver paste PAD3 is an ITO pattern layer, its impedance is two orders of magnitude higher than the impedance value of the metal ground trace 5, which avoids the corrosion problem caused by the ionization of the silver paste.

[0046] Example 2

[0047] like Figure 4 As shown, the anti-corrosion silver paste circuit PAD structure for the TFT module provided in Example 1 is further optimized. Specifically, the positioning mark 31 is in the shape of a cross.

[0048] The working mode of this embodiment is described below.

[0049] The cross-shaped positioning mark 31 can further facilitate the alignment of the silver paste dripper and further improve the accuracy of silver paste dripping.

[0050] Example 3

[0051] The anti-corrosion silver paste circuit PAD structure for the TFT module provided in Example 1 or 2 is further optimized. Specifically, the depth of the positioning mark 31 is greater than half of the thickness of the silver paste PAD3.

[0052] The working mode of this embodiment is described below.

[0053] Since the depth of the positioning mark 31 is greater than half of the thickness of the silver paste PAD3, the connection strength between the silver paste 4 and the silver paste PAD3 can be effectively improved, further improving the reliability of the TFT module.

[0054] The terms "coupling" and "coupling" involved in the embodiments of the present application should be understood in a broad sense. For example, they may refer to a direct physical connection, or an indirect connection achieved through electronic devices, such as a connection achieved through resistors, inductors, capacitors or other electronic devices.

[0055] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A corrosion-resistant silver paste circuit PAD structure for a TFT module, characterized in that: The anti-corrosion silver paste circuit PAD structure for a TFT module comprises a color film substrate (1) and an array substrate (2); an antistatic film (11) is provided on the surface of the color film substrate (1); a silver paste PAD (3) and a metal ground trace (5) are provided on the edge of the array substrate (2); the right edge of the silver paste PAD (3) is in contact with the left edge of the metal ground trace (5), and the silver paste PAD (3) and the metal ground trace (5) are electrically connected; a positioning mark (31) is provided on the silver paste PAD (3); a silver paste (4) is provided on the silver paste PAD (3); and the silver paste (4) covers the lower edge of the antistatic film (11).

2. The anti-corrosion silver paste circuit PAD structure for TFT module according to claim 1, characterized in that: The upper edge of the silver paste PAD (3) is in contact with the lower edge of the color filter substrate (1).

3. The anti-corrosion silver paste circuit PAD structure for TFT module according to claim 1, characterized in that: The right edge of the silver paste (4) is separated from the metal ground trace (5) by a preset isolation distance (D).

4. The anti-corrosion silver paste circuit PAD structure for TFT module according to claim 1, characterized in that: The silver paste (4) is obtained through a dispensing process.

5. The anti-corrosion silver paste circuit PAD structure for TFT module according to claim 1, characterized in that: The extending direction of the positioning mark (31) is consistent with the extending direction of the array substrate (2).

6. The anti-corrosion silver paste circuit PAD structure for TFT module according to claim 1, characterized in that: The silver paste PAD (3) is an ITO pattern layer.

7. The anti-corrosion silver paste circuit PAD structure for TFT module according to claim 1, characterized in that: The positioning mark (31) and the silver paste PAD (3) are formed by synchronously depositing and etching ITO.

8. The anti-corrosion silver paste circuit PAD structure for TFT module according to claim 1, characterized in that: The positioning mark (31) is in the shape of a cross.

9. The anti-corrosion silver paste circuit PAD structure for TFT module according to claim 1, characterized in that: The positioning mark (31) is in the shape of a cross.

10. The anti-corrosion silver paste circuit PAD structure for TFT module according to claim 1, characterized in that: The depth of the positioning mark (31) is greater than half the thickness of the silver paste PAD (3).

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