Electronic component mounting structure and electronic product
By adopting the electronic component installation structure in automotive electronic products, the deformation buffers are used to absorb shock and disperse impact energy, the vibration failure problem caused by dispensing deviation is solved, the cost is reduced and the product miniaturization is supported.
Patent Information
- Application Number
- CN202420235896.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-31
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-01-31
AI Technical Summary
In automotive electronic products, dispensing materials are prone to deviations during the installation of electronic components, resulting in increased component modulus and vibration failure. In addition, white glue has a cloth restriction requirement for the layout space, which increases cost and equipment investment. Not conducive to product miniaturization.
Using an electronic component installation structure including mechanism parts, circuit board components and deformation buffers, by cushioning between the electronic component and mechanism parts, shock absorption and dispersion of impact energy, reducing the impact of impact on electronic components, and The stability and installation accuracy of the buffer parts are ensured through structures such as adhesive layers and limiting grooves.
It effectively reduces the direct impact of impact on electronic components, avoids vibration failure, reduces the limitation on PCB layout space, reduces costs, and supports product miniaturization.
Smart Images
Figure CN222192829U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic product protection, in particular to an electronic component installation structure and an electronic product. Background Art
[0002] In automotive electronic products, external dispensing is used to protect electronic components from vibration during the installation process of electronic components. Specifically, it refers to applying dispensing materials to predetermined locations around or on the bottom of electronic components. The dispensing process must ensure that the dispensing materials evenly cover and adhere to the electronic components and substrates. After dispensing, proper curing and hardening treatment is performed to ensure that the dispensing materials have the required strength and stability to fix the electronic components and substrates, provide additional mechanical support and shock absorption, thereby reducing the impact of vibration on electronic components and reducing the risk of damage and failure caused by vibration.
[0003] However, when the dispensing position deviates, the modulus of the electronic components will increase, causing the response of the electronic components to become larger, thereby causing vibration failure. In addition, the dispensing of white glue has prohibitive requirements for surrounding electronic components, which increases the PCB layout space and is not conducive to product miniaturization. At the same time, the dispensing of white glue process increases the investment in white glue and equipment, and the cost advantage is low. Utility Model Content
[0004] The main purpose of the utility model is to provide an electronic component installation structure and an electronic product, aiming to provide an electronic component installation structure which can disperse the impact energy into the buffer and reduce the direct impact of the impact on the electronic components.
[0005] In order to achieve the above-mentioned purpose, the utility model proposes an electronic component installation structure, which includes:
[0006] Mechanism components;
[0007] a circuit board assembly, spaced apart from the mechanism component, the circuit board assembly comprising a substrate and electronic components, the electronic components being mounted on a side of the substrate facing the mechanism component; and,
[0008] The buffer part is deformable and is located between the electronic component and the mechanical component.
[0009] Optionally, the buffer element includes a foam block, a silicone block or a rubber block; and / or,
[0010] The mechanism comprises an upper cover of the box, a middle cover of the box or a lower cover of the box; and / or,
[0011] The electronic components include electrolytic capacitors, transformers or inductors.
[0012] Optionally, the buffer is sandwiched between the electronic component and the mechanical component.
[0013] Optionally, the buffer component is bonded to the mechanism component.
[0014] Optionally, the electronic component mounting structure further includes an adhesive layer, wherein the adhesive layer is disposed on a side of the buffer component facing the mechanism component, and the buffer component is bonded to the mechanism component via the adhesive layer.
[0015] Optionally, an identification portion is provided on the mechanical component and / or the electronic component, and the identification portion is used to identify an installation area corresponding to the buffer component.
[0016] Optionally, a surface of a region of the mechanism component facing the buffer component has a concave-convex structure.
[0017] Optionally, a limiting groove is recessed on one side of the mechanism component facing the buffer component, and the buffer component is installed in the limiting groove.
[0018] Optionally, a receiving groove is recessed on a side of the buffer member facing the electronic component, and the receiving groove is used to receive the electronic component.
[0019] The utility model also provides an electronic product, the electronic product comprises the above-mentioned electronic component mounting structure, the electronic component mounting structure comprises:
[0020] Mechanism components;
[0021] a circuit board assembly, spaced apart from the mechanism component, the circuit board assembly comprising a substrate and electronic components, the electronic components being mounted on a side of the substrate facing the mechanism component; and,
[0022] The buffer part is deformable and is located between the electronic component and the mechanical component.
[0023] Optionally, the electronic product includes an integrated power supply or a motor controller.
[0024] In the technical solution provided by the utility model, the electronic component mounting structure includes a mechanism component, a circuit board assembly and a buffer component, the circuit board assembly includes a substrate and electronic components, the electronic components are mounted on the side of the substrate facing the mechanism component, the buffer component can be deformed, and the buffer component is padded between the electronic component and the mechanism component. When the electronic component mounting structure is impacted and vibrates, the buffer component can absorb shock, absorb and disperse the vibration energy generated by the impact, and disperse the impact energy into the buffer component, which can reduce the direct impact on the electronic components. The response of the electronic components becomes larger and vibration failure is avoided. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0026] Figure 1 A side view schematic diagram of an embodiment of an electronic component installation structure provided by the utility model;
[0027] Figure 2 for Figure 1 A side view of an electronic component mounting structure with an adhesive layer provided therein;
[0028] Figure 3 A side view of an electronic component installation structure provided with a limiting groove;
[0029] Figure 4 A cross-sectional schematic diagram of another embodiment of an electronic component mounting structure provided with a limiting groove;
[0030] Figure 5 for Figure 1 A cross-sectional schematic diagram of an electronic component mounting structure in which a middle buffer is provided with an adhesive layer.
[0031] Description of Figure Numbers:
[0032] Label name Label name 100 Electronic components installation structure 22 Electronic components 1 Mechanism 3 Buffer 1a Limit slot 3a Receiving slot 2 Circuit Board Assembly 4 Adhesive layer 21 substrate
[0033] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0036] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0037] In automotive electronic products, during the installation of electronic components, external glue dispensing is used to protect electronic components from vibration. Specifically, it refers to applying glue dispensing materials at predetermined positions around or on the bottom of electronic components. The glue dispensing process must ensure that the glue dispensing material evenly covers and adheres to the electronic components and substrates to form a protective layer. After the glue dispensing is completed, proper curing and hardening treatment is carried out to ensure that the glue dispensing material has the required strength and stability to fix the electronic components and substrates, provide additional mechanical support and shock absorption effects, thereby reducing the impact of vibration on electronic components and reducing the damage and failure risks caused by vibration. However, when the glue dispensing position deviates, the modulus of the electronic components will increase, causing the response of the electronic components to become larger, resulting in vibration failure, and the white glue dispensing has a prohibition requirement for the surrounding electronic components, which increases the PCB layout space, which is not conducive to product miniaturization. At the same time, the white glue dispensing process increases the investment in white glue and equipment, and the cost advantage is low.
[0038] In order to solve the above problems, the utility model provides an electronic component installation structure. Figure 1 A side view schematic diagram of an embodiment of an electronic component installation structure provided by the utility model; Figure 2 for Figure 1 A side view of an electronic component mounting structure with an adhesive layer provided therein; Figure 3 A side view of an electronic component installation structure provided with a limiting groove; Figure 4 A cross-sectional schematic diagram of another embodiment of an electronic component mounting structure provided with a limiting groove; Figure 5 for Figure 1 A cross-sectional schematic diagram of an electronic component mounting structure in which a middle buffer is provided with an adhesive layer.
[0039] See also Figure 1The electronic component mounting structure 100 includes a mechanism component 1, a circuit board assembly 2 and a buffer component 3. The circuit board assembly 2 is spaced apart from the mechanism component 1. The circuit board assembly 2 includes a substrate 21 and an electronic component 22. The electronic component 22 is mounted on a side of the substrate 21 facing the mechanism component 1. The buffer component 3 can be deformably arranged and is located between the electronic component 22 and the mechanism component 1.
[0040] It should be noted that the mechanism 1 refers to the parts or elements that constitute mechanical, electronic, instrumentation and other equipment. They are usually designed and manufactured to achieve specific functions, and can be mechanical structures, circuit boards, sensors, motors, valves, etc. The mechanism 1 can also refer to a housing set near the electronic components 22, etc. The mechanism 1 is not limited to the above examples. Under the inspiration of the technical essence of the embodiments of this specification, technicians in the relevant field may make other changes, but as long as the functions and effects achieved are the same or similar to the embodiments of this specification, they should be covered within the protection scope of the embodiments of this specification.
[0041] It should also be noted that in the prior art, when the electronic component 22 is installed on the PCBA, when the dispensing position deviates from the design requirements, the dispensing material may enter the gap of the electronic component 22, or apply too much pressure during the installation process. This may cause the modulus of the electronic component 22 to increase, that is, the elastic modulus or stiffness to increase. The increased modulus will change the natural vibration frequency and vibration mode of the electronic component 22, making its response larger. And when the dispensing position deviates, the coupling characteristics between the mechanism 1 and the electronic component 22 may change. The vibration of the mechanism 1 is transmitted to the electronic component 22, which may cause the electronic component 22 to be subjected to greater stress and deformation in a vibration environment, thereby increasing the risk of vibration failure. If the hardness of the dispensing material is high, it will limit the vibration freedom of the electronic component 22, resulting in an increase in its vibration response. Therefore, the hardness and rigidity of the dispensing material will also affect the vibration response of the electronic component 22.
[0042] Therefore, the material of the buffer 3 is set to have good flexibility, and when the shape of the electronic component 22 is irregular, the contact area between the electronic component 22 and the buffer 3 is maximized, rather than just a single point or partial contact. The compression rebound rate of the buffer 3 needs to meet product requirements to prevent the buffer 3 from being unable to rebound after being compressed by the electronic component 22, to avoid virtual contact between the buffer 3 and the electronic component 22, and to prevent the electronic component 22 from being unable to provide sufficient support, thereby losing the ability to buffer and damp, resulting in the failure of the electronic component 22 during vibration.
[0043] In the technical solution provided by the utility model, the electronic component mounting structure 100 includes a mechanism component 1, a circuit board assembly 2 and a buffer 3. The circuit board assembly 2 includes a substrate 21 and an electronic component 22. The electronic component 22 is mounted on the side of the substrate 21 facing the mechanism component 1. The buffer 3 can be deformed. By arranging the buffer 3 between the electronic component 22 and the mechanism component 1, when the electronic component mounting structure 100 is impacted and vibrates, the buffer 3 can absorb shock, absorb and disperse the vibration energy generated by the impact, and disperse the impact energy into the buffer 3, which can reduce the direct impact on the electronic component 22. The direct impact, avoid the electronic component 22 The response becomes larger and causes vibration failure.
[0044] Specifically, in order to ensure that the safety insulation capability of the electronic component mounting structure 100 meets the standard, in this embodiment, the buffer 3 is made of insulating material. In order to avoid static electricity generated when using electronic products, thereby causing the electronic components 22 to be protected to fail, in this embodiment, the material of the buffer 3 is set to be anti-static material.
[0045] In order to prevent the electronic components 22 to be protected from failure due to the moisture absorption of the buffer 3 to a certain extent during the use of the electronic product, the material of the buffer 3 is set to have a low moisture absorption capacity or a non-hygroscopic material. In addition, the hardness of the buffer 3 needs to be reasonable, and the electronic components 22 should not be scratched, worn or crushed by the buffer 3 after the buffer 3 and the electronic components 22 come into contact.
[0046] The buffer 3 needs to have a high density to ensure that the buffer 3 and the electronic components 22 will not be worn or chipped during contact use, which would cause cleanliness problems in the product. The tear resistance of the buffer 3 should meet the requirements to ensure that the buffer 3 and the electronic components 22 will not be compressed and torn during contact use, thereby losing the ability to buffer and damp, causing the electronic components 22 to fail during vibration.
[0047] The thermal conductivity of the buffer 3 is set to be greater than or equal to the thermal conductivity of air to prevent the new problem of heat dissipation of the electronic components 22 caused by the application of the buffer 3. If there is a strong demand for heat dissipation, a buffer 3 with both heat dissipation and shock absorption performance can be selected.
[0048] In summary, the material of the buffer 3 needs to meet relevant reliability requirements such as vibration, high temperature durability, high temperature and high humidity, corrosion resistance and salt spray resistance. The specific capabilities need to be selected according to product requirements to avoid product failure due to selection problems.
[0049] In some specific embodiments, the buffer 3 includes a foam block, a silicone block or a rubber block. Preferably, the buffer 3 is set as a foam block, because the foam material has the above-mentioned vibration, high temperature durability, high temperature and high humidity and other related performance requirements, so it meets the selection requirements, of course, other possible material settings can also be used, and the specific can be determined according to actual conditions, and this specification embodiment does not limit this.
[0050] Since the electronic components 22 are generally arranged inside the box, for the scenario in which the electronic components 22 are used, in this embodiment, the mechanism 1 includes an upper cover of the box, a middle cover of the box or a lower cover of the box. Of course, the mechanism 1 is not limited to the above examples, and can also be internal structural ribs of the box, internal retaining walls of the box, etc., which are not described in detail here.
[0051] The electronic components 22 include electrolytic capacitors, transformers or inductors. The electronic components 22 that need to be seismic-resistant can also be film capacitors, horn capacitors, etc. Of course, other electronic components 22 that can adopt the electronic component mounting structure 100 can be specifically determined according to actual conditions, and the embodiments of this specification do not limit this.
[0052] Of course, on the basis that the material meets the performance requirements, the height of the buffer 3 needs to be defined according to the design height and the recommended compression range of the buffer 3 to avoid selecting a buffer 3 that is too thin or too thick. If it is too thin, the buffer 3 will not be in contact with the electronic components 22; if it is too thick, the buffer 3 will be compressed too much, which will cause the buffer 3 to be damaged and unable to rebound due to the high compression rate, and on the other hand, the high compression rate will bring greater stress, thereby causing the electronic components 22 to fail to be protected.
[0053] In one embodiment, the buffer 3 is set to be larger than the distance between the electronic component 22 and the mechanical component 1, and the buffer 3 is clamped between the electronic component 22 and the mechanical component 1. The buffer 3 is positioned and fixed by relying on the elastic force of the electronic component 22 and the mechanical component 1 reacting to the deformation of the buffer 3.
[0054] In another embodiment, the buffer member 3 is bonded to the mechanism member 1. Thus, the buffer member 3 can be fixed to the mechanism member 1 by bonding, and the stability of the buffer member 3 can be ensured when the electronic product is subjected to external impact and vibration.
[0055] In another embodiment, the buffer member 3 may also be configured to be bonded to the electronic component 22. Of course, this method is more suitable for the situation where the bonding surface of the electronic component 22 is relatively flat, while the outer surface of the mechanical component 1 is too uneven.
[0056] See also Figure 2In the present embodiment, the electronic component mounting structure 100 further includes an adhesive layer 4, and the adhesive layer 4 is arranged on the side of the buffer 3 facing the mechanism component 1, and the buffer 3 is bonded to the mechanism component 1 through the adhesive layer 4. In this way, when installing the buffer 3, the buffer 3 can be directly bonded to the mechanism component 1 through the adhesive layer 4, without the need to set up a dispensing device and add a dispensing bonding process. It is understandable that the adhesive layer 4 can be a back glue, and of course it can also be set in other possible forms, which can be determined according to actual conditions, and the embodiments of this specification do not limit this. It should be noted that the material of the buffer 3 and the back glue material need to meet the aforementioned product selection and reliability requirements. It should be noted that the buffer 3 should do a good job of cleanliness control during the pasting process to avoid other foreign matter introduced during the pasting process, resulting in product cleanliness problems, thereby causing product functional failure.
[0057] Furthermore, the mechanism 1 or the electronic component 22 is provided with an identification portion, which is used to identify the installation area corresponding to the buffer 3, so as to facilitate the subsequent pasting and inspection of the buffer 3. The position after the buffer 3 is pasted needs to be CCD inspected to confirm that the pasting position is at the position required by the design, so as to avoid position deviation and ultimately fail to protect the required electronic component 22, thereby causing the electronic component 22 to vibrate and fail during use.
[0058] In this embodiment, the surface of the region of the mechanism 1 facing the buffer 3 has a concave-convex structure. The concave-convex structure can generally be set as a frosted surface, and the roughness of the frosted surface needs to meet the design requirements to ensure that the adhesive-backed buffer 3 meets the requirements of adhesion after pasting.
[0059] See also Figure 3 In this embodiment, a limiting groove 1a is recessed on one side of the mechanism component 1 facing the buffer component 3, and the buffer component 3 is installed in the limiting groove 1a.
[0060] It should be noted that the cross section of the buffer 3 is set to be slightly smaller than the slot of the limiting slot 1a, so that when the buffer 3 is installed in the limiting slot 1a, it is limited by the inner side wall of the limiting slot 1a, making the installation of the buffer 3 more stable. In particular, when the buffer 3 is sandwiched between the mechanism 1 and the electronic component 22, a more stable restraining effect is provided for the buffer 3.
[0061] See also Figure 4 When the cross-section of the buffer 3 is set to be larger than the slot opening of the limiting slot 1a, when the middle part of the buffer 3 is installed in the limiting slot 1a, the outer part of the buffer 3 is outside the slot opening of the limiting slot 1a. When the buffer 3 is in contact with the electronic component 22, the buffer 3 can wrap the top and the surrounding side of the electronic component 22 to protect the electronic component 22.
[0062] See also Figure 5In another embodiment, a receiving groove 3a is concavely provided on one side of the buffer 3 facing the electronic component 22, and the receiving groove 3a is used to receive the electronic component 22. In this way, when the bonding surface of the mechanism 1 is a plane, the receiving groove 3a can be directly concavely provided on the buffer 3, so that the inner wall of the receiving groove 3a can wrap the top and the surrounding side of the electronic component 22, and can also protect the electronic component 22.
[0063] The utility model also provides an electronic product, which includes an engine control unit, a brake control unit, or a vehicle safety system, etc. The electronic product includes the above-mentioned electronic component mounting structure 100. Since the electronic product includes the electronic component mounting structure 100, the specific structure of the electronic component mounting structure 100 refers to the above-mentioned embodiment. Since the electronic component mounting structure 100 of the electronic product adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.
[0064] Specifically, because the car is in working condition, due to the vibration of the engine and the bumps of the driving road, there are many automotive electronic products involving the electronic component installation structure 100. In this embodiment, the electronic products generally include automotive electronic products, such as integrated power supplies (OBC, DC / DC, PDU, etc.) or motor controllers, and the embodiments of this specification are not limited to this.
[0065] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. An electronic component installation structure, characterized in that: include: Mechanism components; a circuit board assembly, spaced apart from the mechanism component, the circuit board assembly comprising a substrate and electronic components, the electronic components being mounted on a side of the substrate facing the mechanism component; and, A buffer, which can be deformed and is located between the electronic component and the mechanical component; A limiting groove is concavely provided on one side of the mechanism component facing the buffer component, and the buffer component is installed in the limiting groove.
2. The electronic component mounting structure according to claim 1, characterized in that: The buffer member includes a foam block, a silicone block or a rubber block; and / or, The mechanism comprises an upper cover of the box, a middle cover of the box or a lower cover of the box; and / or, The electronic components include electrolytic capacitors, transformers or inductors.
3. The electronic component mounting structure according to claim 1, characterized in that: The buffer is sandwiched between the electronic component and the mechanical component.
4. The electronic component mounting structure according to claim 1, characterized in that: The buffer component is bonded to the mechanism component.
5. The electronic component mounting structure according to claim 4, characterized in that: The electronic component mounting structure further includes an adhesive layer, which is arranged on a side of the buffer component facing the mechanism component, and the buffer component is bonded to the mechanism component through the adhesive layer.
6. The electronic component mounting structure according to claim 5, characterized in that: The mechanical component and / or the electronic component is provided with an identification portion, and the identification portion is used to identify the installation area corresponding to the buffer component.
7. The electronic component mounting structure according to claim 4, characterized in that: The surface of the mechanism component facing the buffer component has a concave-convex structure.
8. The electronic component mounting structure according to claim 1, characterized in that: A receiving groove is concavely formed on one side of the buffer member facing the electronic component, and the receiving groove is used to receive the electronic component.
9. An electronic product, characterized in that: The electronic component mounting structure comprises the electronic component mounting structure as claimed in any one of claims 1 to 8.
10. The electronic product according to claim 9, characterized in that: The electronic product includes an integrated power supply or a motor controller.