Porous microcrystal heat dissipation plate

Abstract

The utility model relates to the technical field of surface treatment, in particular to a porous microcrystal heat dissipation plate which comprises a substrate, the substrate is of a rectangular structure, a conductive electrode layer is arranged on the surface of the substrate, the conductive electrode layer is coated on one side of the substrate, a heating layer is covered on the other side of the conductive electrode layer, and the heating layer is coated on the surface of the substrate. One side of the heating layer is adhered to the surface of the substrate through the conductive electrode layer, the other side of the heating layer is covered with the insulating layer, the insulating layer is printed on the surface of the heating layer, a plurality of heat dissipation holes are formed in the surface of the insulating layer, and the heat dissipation holes sequentially penetrate through the interior of the substrate, the interior of the conductive electrode layer, the interior of the heating layer and the interior of the heat conduction plate. And the heat dissipation holes are distributed in a staggered manner. According to the whole heat dissipation plate structure, the first layer is the microcrystal glass and is coated with the heating layer made of the carbon-based heating material, convection heat is increased through multiple holes, heat dissipation is even, the energy efficiency is improved, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of surface treatment, in particular to a porous microcrystalline heat dissipation plate. Background Art

[0002] Surface treatment refers to a technical method for processing, treating and modifying the surface of materials. Its purpose is to improve the performance of the material surface, such as improving surface hardness, wear resistance, corrosion resistance, oxidation resistance, etc., to meet the needs of different application fields. Surface treatment technology can be divided into three categories: physical method, chemical method and mechanical method.

[0003] Physical methods: Use physical means to change the structure and properties of the material surface. Common physical methods include heat treatment, cladding, spraying, physical vapor deposition (PVD), chemical vapor deposition (CVD), etc.

[0004] Chemical method: using chemical reactions to change the composition and structure of the material surface. Common chemical methods include chemical plating, electroplating, oxidation, phosphating, passivation, etc.

[0005] Mechanical method: Change the morphology and roughness of the material surface by mechanical means. Common mechanical methods include grinding, polishing, brushing, sand blasting, etc.

[0006] Surface treatment technology is widely used in many fields, such as aerospace, automobile, construction, electronics, biomedicine, etc. For example, in the aerospace field, surface treatment technology can improve the high temperature resistance of engine blades. In the automotive field, surface treatment technology can improve the wear resistance and corrosion resistance of automotive parts. In the electronics field, surface treatment technology can improve the conductivity and oxidation resistance of integrated circuit chips.

[0007] At present, for some baking equipment used for surface treatment, since the equipment is a heating machine, it is easy to cause excessive temperature in the shell space, thereby affecting the service life of some equipment components. In order to facilitate heat dissipation, a heat sink structure is added to the inner wall of the space. However, conventional heat sinks cannot gather heat and only rely on air circulation for heat dissipation, which greatly reduces the heat dissipation effect. Utility Model Content

[0008] The utility model aims to solve the above-mentioned shortcomings in the prior art and proposes a porous microcrystalline heat dissipation plate.

[0009] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0010] A porous microcrystalline heat dissipation plate is designed, comprising a substrate, wherein the substrate is a rectangular structure, a conductive electrode layer is provided on the surface of the substrate, and the conductive electrode layer is coated on one side of the substrate, the other side of the conductive electrode layer is covered with a heating layer, and one side of the heating layer is bonded to the surface of the substrate through the conductive electrode layer, the other side of the heating layer is covered with an insulating layer, and the insulating layer is printed on the surface of the heating layer, a plurality of heat dissipation holes are opened on the surface of the insulating layer, and the heat dissipation holes sequentially penetrate the interior of the substrate, the interior of the conductive electrode layer, the interior of the heating layer and the interior of the heat-conducting plate, and the heat dissipation holes are distributed in a staggered manner.

[0011] In detail, the substrate is made of microcrystalline glass material, which is a glass material with a micron-level crystal structure. It is a composite material composed of a glass matrix and tiny crystals, and has unique physical and chemical properties. The performance of microcrystalline glass depends on its crystal structure, crystal size and crystal composition. Microcrystalline glass has high mechanical strength and is more wear-resistant and impact-resistant than ordinary glass. Microcrystalline glass has good chemical stability, acid and alkali resistance and corrosion resistance, and is suitable for various harsh environments. Microcrystalline glass has good thermal stability and thermal conductivity, and can be used for high and low temperature applications. Microcrystalline glass has a low thermal expansion coefficient and has good dimensional stability and thermal shock resistance.

[0012] In detail, the heating layer is made of carbon-based heating coating material. Carbon-based materials (such as carbon nanotubes and graphene) have extremely high conductivity, which can effectively improve the heating efficiency. Carbon-based materials have high thermal stability and thermal conductivity, can withstand high temperatures, and are suitable for various high-temperature applications. The carbon-based heating coating can be made into a thin and soft film structure, which is suitable for heating elements with various curved surfaces and complex shapes. The carbon-based heating coating has a high electrothermal conversion efficiency, which can effectively save energy and reduce environmental pollution. The carbon-based heating coating can be prepared by solution treatment, spraying, printing and other methods, which is easy to achieve large-scale production and integration. The carbon-based material has good chemical stability, acid and alkali resistance and corrosion resistance, and is suitable for various harsh environments. The carbon-based heating coating can adjust its heating performance, thickness and shape as needed to meet different application requirements.

[0013] In detail, the heat conducting plate is made of silica coating material. Silica is a good insulating material with high insulation performance and low electrical conductivity. It can be used in various electronic equipment and power equipment. Silica has good chemical stability, acid and alkali resistance and corrosion resistance, and is suitable for various harsh environments. Silica has high thermal stability and high temperature resistance, and can remain stable in high temperature environments.

[0014] In detail, the conductive electrode layer is coated with a silver paste material. Silver is the most conductive metal in nature, so the silver paste has extremely high conductivity and can effectively improve the conductive efficiency of the circuit. The silver paste can be coated on various substrates by printing, spraying, screen printing and other methods. The process is simple and easy to achieve large-scale production. The silver paste has high thermal stability and thermal conductivity, can withstand high temperatures, and is suitable for various high-temperature applications. Silver has good chemical stability, acid and alkali resistance and corrosion resistance, and is suitable for various harsh environments.

[0015] The design scheme proposed by the utility model has the following beneficial effects during application:

[0016] 1. The entire heat sink structure has a first layer of microcrystalline glass, which is coated with a heating layer of carbon-based heating material. It is perforated with holes to increase convection heat, dissipate heat evenly, improve energy efficiency, and extend service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 It is an overall oblique schematic diagram of the utility model;

[0019] Figure 3 It is a schematic diagram of the top view structure of the utility model;

[0020] Figure 4 It is a side structural schematic diagram of the utility model.

[0021] In the figure: 10, substrate; 11, heating layer; 12, insulating layer; 13, heat dissipation holes; 14, conductive electrode layer. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] Reference Figure 1-Figure 4A porous microcrystalline heat dissipation plate includes a substrate 10, which is a rectangular structure. A conductive electrode layer 14 is provided on the surface of the substrate 10, and the conductive electrode layer 14 is coated on one side of the substrate 10. The other side of the conductive electrode layer 14 is covered with a heating layer 11, and one side of the heating layer 11 is bonded to the surface of the substrate 10 through the conductive electrode layer 14. The other side of the heating layer 11 is covered with an insulating layer 12, and the insulating layer 12 is printed on the surface of the heating layer 11. A plurality of heat dissipation holes 13 are opened on the surface of the insulating layer 12, and the heat dissipation holes 13 sequentially penetrate the interior of the substrate 10, the interior of the conductive electrode layer 14, the interior of the heating layer 11 and the interior of the insulating layer 12, and the heat dissipation holes 13 are distributed in a staggered distribution.

[0024] It should be further explained that the substrate 10 is made of microcrystalline glass material, which is a glass material with a micron-level crystal structure. It is a composite material composed of a glass matrix and tiny crystals, and has unique physical and chemical properties. The performance of microcrystalline glass depends on its crystal structure, crystal size and crystal composition. Microcrystalline glass has high mechanical strength and is more wear-resistant and impact-resistant than ordinary glass. Microcrystalline glass has good chemical stability, acid and alkali resistance and corrosion resistance, and is suitable for various harsh environments. Microcrystalline glass has good thermal stability and thermal conductivity and can be used for high and low temperature applications. Microcrystalline glass has a low thermal expansion coefficient and has good dimensional stability and thermal shock resistance.

[0025] It should be further explained that the heating layer 11 is made of carbon-based heating coating materials. Carbon-based materials (such as carbon nanotubes and graphene) have extremely high conductivity, which can effectively improve the heating efficiency. Carbon-based materials have high thermal stability and thermal conductivity, can withstand high temperatures, and are suitable for various high-temperature applications. The carbon-based heating coating can be made into a thin and soft film structure, which is suitable for heating elements with various curved surfaces and complex shapes. The carbon-based heating coating has a high electrothermal conversion efficiency, which can effectively save energy and reduce environmental pollution. The carbon-based heating coating can be prepared by solution treatment, spraying, printing and other methods, which is easy to achieve large-scale production and integration. The carbon-based material has good chemical stability, acid and alkali resistance and corrosion resistance, and is suitable for various harsh environments. The carbon-based heating coating can adjust its heating performance, thickness and shape as needed to meet different application requirements.

[0026] The heating layer 11 can also be a tungsten-based heating coating, an aluminum-based heating coating, a molybdenum-based heating coating and a tin oxide heating coating. The tungsten-based heating coating is a heating coating material with tungsten as the base material. Tungsten is a metal element with high melting point, high hardness and high density, and has good thermal stability and corrosion resistance. The aluminum-based heating coating is a heating coating with aluminum as the base material and prepared on its surface through a special process. This coating material has high electrothermal conversion efficiency, good thermal conductivity and corrosion resistance. The tin oxide heating coating is a heating coating material with tin oxide as the main component. Tin oxide is a semiconductor material with good thermal stability and electrothermal conversion efficiency. The molybdenum-based heating coating is a heating coating with molybdenum as the main component, and has the characteristics of high melting point, high temperature strength, good antioxidant and corrosion resistance.

[0027] It should be further explained that the insulating layer 12 is made of a silica coating material. Silica is a good insulating material with high insulation performance and low electrical conductivity. It can be used in various electronic equipment and power equipment. Silica has good chemical stability, acid and alkali resistance and corrosion resistance, and is suitable for various harsh environments. Silica has high thermal stability and high temperature resistance, and can remain stable in high temperature environments.

[0028] It should be further explained that the conductive electrode layer 14 is coated with a silver paste material. Silver is the most conductive metal in nature, so the silver paste has extremely high conductivity and can effectively improve the conductive efficiency of the circuit. The silver paste can be coated on various substrates by printing, spraying, screen printing and other methods. The process is simple and easy to achieve large-scale production. The silver paste has high thermal stability and thermal conductivity, can withstand high temperatures, and is suitable for various high-temperature applications. Silver has good chemical stability, acid and alkali resistance and corrosion resistance, and is suitable for various harsh environments.

[0029] Working method: The first layer of the entire heat sink structure is microcrystalline glass, coated with a heating layer 11 of carbon-based heating material, which is perforated with multiple holes to increase convection heat, dissipate heat evenly, improve energy efficiency, and extend service life.

[0030] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A porous microcrystalline heat dissipation plate, comprising a substrate (10), characterized in that: The substrate (10) is a rectangular structure, a conductive electrode layer (14) is provided on the surface of the substrate (10), and the conductive electrode layer (14) is coated on one side of the substrate (10), the other side of the conductive electrode layer (14) is covered with a heating layer (11), and one side of the heating layer (11) is bonded to the surface of the substrate (10) through the conductive electrode layer (14), the other side of the heating layer (11) is covered with an insulating layer (12), and the insulating layer (12) is printed on the surface of the heating layer (11), a plurality of heat dissipation holes (13) are opened on the surface of the insulating layer (12), and the heat dissipation holes (13) sequentially penetrate the interior of the substrate (10), the interior of the conductive electrode layer (14), the interior of the heating layer (11) and the interior of the insulating layer (12), and the heat dissipation holes (13) are distributed in a staggered distribution.

2. The porous microcrystalline heat dissipation plate according to claim 1, characterized in that: The substrate (10) is made of microcrystalline glass material.

3. The porous microcrystalline heat dissipation plate according to claim 1, characterized in that: The heating layer (11) is made of a carbon-based heating coating material.

4. The porous microcrystalline heat dissipation plate according to claim 1, characterized in that: The insulating layer (12) is made of silicon dioxide coating material.

5. The porous microcrystalline heat dissipation plate according to claim 1, characterized in that: The conductive electrode layer (14) is formed by coating a silver paste material.

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