Warping degree correcting device for integrated circuit thick mold product

Abstract

The utility model discloses a warping degree correcting device for an integrated circuit thick mold product, and relates to the technical field of integrated circuit processing and manufacturing. Comprising a bottom plate, a correction mechanism is arranged at the top of the bottom plate, the correction mechanism comprises a workbench, a heating table is fixedly connected to one side of the top of the workbench, and a cooling table is fixedly connected to the side, away from the heating table, of the top of the workbench. In the using process, firstly, a material strip is placed in the heating table, then the heating cover is manually pressed down under the action of the first hinge, meanwhile, the heating rod is started to heat the material strip, the heated material strip is conveyed into the cooling table through the carrying mechanism, meanwhile, the cooling cover is manually pressed down under the action of the second hinge, and the material strip is cooled. And finally, the control button is manually pressed to drive the press-fit air cylinder to apply pressure to the cooling cover to correct the material strip, the device is simple in structure, correction of the integrated circuit thick mold product is achieved in a semi-automatic mode, and the requirement for manual operation is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit processing and manufacturing, in particular to a device for correcting the warpage of integrated circuit thick-mold products. Background Art

[0002] The power module is integrated with a single or multiple power components, which are usually composed of passive components, IC, FC chips, and huge inductors. The overall thickness is often greater than 4mm. These materials have different thermal expansion coefficients. When the entire package undergoes temperature changes, such as from the high temperature of each packaging process to room temperature, the thermal expansion coefficients of various materials are different and the expansion and contraction are inconsistent, which causes the package to warp. There is a close relationship between product thickness and bending resistance. The thicker the product, the greater its bending strength. The product needs to be kept flat when cutting. The bending strength of thick mold products far exceeds the vacuum suction force. The product warping needs to be corrected to a reasonable state before cutting. Therefore, the integrated circuit thick mold product warping correction device is required.

[0003] However, before cutting the product, common equipment requires manually placing the product on the heating table, manually moving it out of the heating zone, and quickly stacking iron blocks to press the product to cool it down. This method makes the material strips flat. Manual operations are inefficient and pose safety hazards due to excessive stacking. Therefore, in response to this situation, we propose a more convenient and practical correction device that meets usage needs. Utility Model Content

[0004] The utility model aims to provide a device for correcting the warpage of a thick mold product of an integrated circuit, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a device for correcting the warpage of an integrated circuit thick mold product, comprising a base plate, a correction mechanism is arranged on the top of the base plate, the correction mechanism includes a workbench, a heating platform is fixedly connected to one side of the top of the workbench, and a cooling platform is fixedly connected to the side of the top of the workbench away from the heating platform.

[0006] Furthermore, a conveying mechanism is provided on one side of the correction mechanism, and the conveying mechanism includes a mounting plate, and the bottom of the mounting plate is connected to the workbench.

[0007] Furthermore, a first hinge is hinged on one side of the heating platform, and a heating cover is hinged on one end of the first hinge.

[0008] Furthermore, a heating rod is installed on the inner wall of the heating platform.

[0009] Furthermore, a cooling water pipe is fixedly connected to the inner wall of the cooling platform, a second hinge is hinged on one side of the cooling platform, and a cooling cover is hinged on one side of the second hinge.

[0010] Furthermore, pressing cylinders are installed on both sides of the top of the cooling table, and a control button is electrically connected to one side of the top of the workbench.

[0011] Furthermore, a heating temperature controller is electrically connected to the bottom of the heating platform, and a heating timing alarm is installed on one side of the heating temperature controller.

[0012] The bottom of the pressing cylinder is electrically connected to a cylinder pressure controller, and a leveling timing alarm is installed on one side of the cylinder pressure controller.

[0013] Furthermore, a support arm is rotatably connected to the center of the top of the mounting plate, a through hole is opened at one end of the support arm, an electric telescopic rod is installed in the through hole, one end of the electric telescopic rod is rotatably connected to a connecting plate, and suction cups are fixedly connected to the four corners at the bottom of the connecting plate.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The device for correcting the warpage of integrated circuit thick mold products is provided with a correction mechanism and a conveying mechanism. During use, the material strip is first placed on the heating table, and then the heating cover is manually pressed down under the action of the first hinge, and the heating rod is started to heat the material strip. After the heating is completed, the material strip is sent to the cooling table through the conveying mechanism, and at the same time, the cooling cover is manually pressed down under the action of the second hinge, and the material strip is cooled through the cooling water pipe. Finally, the control button is manually pressed to drive the pressing cylinder to apply pressure to the cooling cover to correct the material strip. The device has a relatively simple structure, and semi-automatic correction of integrated circuit thick mold products is achieved, which reduces the need for manual operation and reduces safety hazards. It is highly practical and suitable for promotion.

[0016] At the same time, the design of the transport mechanism makes the placement and removal of integrated circuit thick mold products more convenient and quick, improves the efficiency of operation, and ensures the stability of the integrated circuit thick mold products during the calibration process, avoiding errors caused by unstable movement. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the correction mechanism structure of the utility model;

[0019] Figure 3 It is a schematic diagram of the structure of the transport mechanism of the utility model.

[0020] In the figure: 1. bottom plate; 2. correction mechanism; 201. workbench; 202. heating table; 203. heating rod; 204. first hinge; 205. heating cover; 206. cooling table; 207. cooling water pipe; 208. second hinge; 209. cooling cover; 210. pressing cylinder; 211. control button; 3. transport mechanism; 301. mounting plate; 302. support arm; 303. electric telescopic rod; 304. connecting plate; 305. suction cup; 4. heating temperature controller; 5. heating timing alarm; 6. cylinder pressure controller; 7. leveling timing alarm. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] In the process of integrated circuit production and manufacturing, calibration equipment is needed. The calibration equipment provided by the utility model is specially used for calibration operations in the process of integrated circuit production and manufacturing. When using this equipment, it should be noted that first of all, according to the requirements of different integrated circuit thick mold products, the heating temperature, cooling water flow, the pressure of the pressing cylinder 210 and other parameters should be correctly set. Before use, the calibration device should be checked to ensure that the equipment is in good condition, all components are operating normally, and there is no damage or looseness.

[0023] like Figure 1 - Figure 3 As shown, the utility model provides a technical solution: a warpage correction device for integrated circuit thick mold products, including a base plate 1, a correction mechanism 2 is arranged on the top of the base plate 1, the correction mechanism 2 includes a workbench 201, a heating platform 202 is fixedly connected to one side of the top of the workbench 201, a cooling platform 206 is fixedly connected to the side of the top of the workbench 201 away from the heating platform 202, a heating temperature controller 4 is electrically connected to the bottom of the heating platform 202, and a heating timing alarm 5 is installed on one side of the heating temperature controller 4.

[0024] like Figure 2As shown, a first hinge 204 is hinged on one side of the heating table 202, a heating cover 205 is hinged on one end of the first hinge 204, a heating rod 203 is installed on the inner wall of the heating table 202, a cooling water pipe 207 is fixedly connected to the inner wall of the cooling table 206, a second hinge 208 is hinged on one side of the cooling table 206, a cooling cover 209 is hinged on one side of the second hinge 208, pressing cylinders 210 are installed on both sides of the top of the cooling table 206, a control button 211 is electrically connected to one side of the top of the workbench 201, a cylinder pressure controller 6 is electrically connected to the bottom of the pressing cylinder 210, and a leveling timing alarm 7 is installed on one side of the cylinder pressure controller 6.

[0025] It should be noted that during use, the material strip is first placed on the heating table 202, and then the heating cover 205 is manually pressed down under the action of the first hinge 204, and at the same time the heating rod 203 is started to heat the material strip, and the heating temperature controller 4 controls the temperature of the heating rod 203. When the temperature is too high, the heating timing alarm 5 sounds an alarm to take out the material strip, and the heated material strip is sent to the cooling table 206 through the conveying mechanism 3. At the same time, the cooling cover 209 is manually pressed down under the action of the second hinge 208, and the temperature is cooled through the cooling water pipe 207. Finally, the control button 211 is manually pressed to control the cylinder pressure controller 6 to apply pressure to the cooling cover 209 by the pressing cylinder 210 to correct the material strip, and an alarm is sounded through the leveling timing alarm 7. The correction mechanism 2 is very easy to operate, and the operator can flexibly control the leveling force and speed as needed.

[0026] like Figure 3 As shown, a transport mechanism 3 is provided on one side of the correction mechanism 2, and the transport mechanism 3 includes a mounting plate 301, and the bottom of the mounting plate 301 is connected to the workbench 201, and a support arm 302 is rotatably connected to the center of the top of the mounting plate 301, and a through hole is opened at one end of the support arm 302, and an electric telescopic rod 303 is installed in the through hole, and one end of the electric telescopic rod 303 is rotatably connected to a connecting plate 304, and suction cups 305 are fixedly connected to the four corners at the bottom of the connecting plate 304.

[0027] It should be noted that during use, after the material strip is heated in the heating table 202, the support arm 302 is first manually rotated to a suitable position, and then the electric telescopic rod 303 drives the connecting plate 304 to move, and finally the material strip is adsorbed and moved to the cooling table 206 through the suction cup 305. The design of the conveying mechanism 3 makes the placement and removal of integrated circuit thick mold products more convenient and quick, thereby improving the efficiency of the operation.

[0028] During use, the material strip is first placed on the heating table 202, and then the heating cover 205 is manually pressed down under the action of the first hinge 204, and the heating rod 203 starts to heat the material strip. After the heating is completed, the support arm 302 is manually rotated to a suitable position, and then the electric telescopic rod 303 drives the connecting plate 304 to move, and finally the material strip is adsorbed by the suction cup 305 and moved to the cooling table 206, and the pressing cylinder 210 applies pressure to the cooling cover 209 to correct the material strip. The device has a relatively simple structure and uses semi-automation to realize the correction of integrated circuit thick mold products, which reduces the need for manual operation and reduces safety hazards.

[0029] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is limited by the attached embodiments and their equivalents.

Claims

1. An integrated circuit thick mold product warpage correction device, comprising a base plate (1), characterized in that: A correction mechanism (2) is arranged on the top of the bottom plate (1), and the correction mechanism (2) comprises a workbench (201), a heating platform (202) is fixedly connected to one side of the top of the workbench (201), and a cooling platform (206) is fixedly connected to the side of the top of the workbench (201) away from the heating platform (202).

2. The device for correcting warpage of integrated circuit thick mold products according to claim 1, characterized in that: A transport mechanism (3) is provided on one side of the correction mechanism (2), and the transport mechanism (3) comprises a mounting plate (301), and the bottom of the mounting plate (301) is connected to the workbench (201).

3. The device for correcting warpage of integrated circuit thick mold products according to claim 1, characterized in that: A first hinge (204) is hingedly connected to one side of the heating platform (202), and a heating cover (205) is hingedly connected to one end of the first hinge (204).

4. The device for correcting warpage of integrated circuit thick mold products according to claim 1, characterized in that: A heating rod (203) is installed on the inner wall of the heating platform (202).

5. The device for correcting warpage of integrated circuit thick mold products according to claim 1, characterized in that: A cooling water pipe (207) is fixedly connected to the inner wall of the cooling platform (206), a second hinge (208) is hinged on one side of the cooling platform (206), and a cooling cover (209) is hinged on one side of the second hinge (208).

6. The device for correcting warpage of integrated circuit thick mold products according to claim 4, characterized in that: Pressing cylinders (210) are installed on both sides of the top of the cooling table (206), and a control button (211) is electrically connected to one side of the top of the working table (201).

7. The device for correcting warpage of integrated circuit thick mold products according to claim 1, characterized in that: The bottom of the heating platform (202) is electrically connected to a heating temperature controller (4), and a heating timing alarm (5) is installed on one side of the heating temperature controller (4).

8. The device for correcting warpage of a thick mold product of an integrated circuit according to claim 6, characterized in that: The bottom of the pressing cylinder (210) is electrically connected to a cylinder pressure controller (6), and a leveling timing alarm (7) is installed on one side of the cylinder pressure controller (6).

9. The device for correcting warpage of a thick mold product of an integrated circuit according to claim 2, characterized in that: A support arm (302) is rotatably connected to the center of the top of the mounting plate (301); a through hole is provided at one end of the support arm (302); an electric telescopic rod (303) is installed in the through hole; one end of the electric telescopic rod (303) is rotatably connected to a connecting plate (304); and suction cups (305) are fixedly connected to the four corners at the bottom of the connecting plate (304).

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