Golden finger punching die of flexible circuit board
By introducing electric push rods, limiting components and material extraction components into the gold finger punching die, the problem of expansion and contraction of flexible circuit boards affecting accuracy during the punching and cutting process is solved, and convenient material discharge operation is achieved, improving the overall Processing efficiency and accuracy.
Patent Information
- Application Number
- CN202421062357.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-05-16
AI Technical Summary
During the processing process of existing flexible circuit board gold finger punching die, the cutting accuracy is affected by the shrinkage phenomenon of flexible circuit boards, and the lack of effective discharge components leads to inconvenience in material extraction.
A gold finger punching die is designed including an electric push rod, an upper mold assembly and a lower mold assembly. The flexible circuit board is prevented from expanding and shrinking through the limiting assembly and a flattening assembly, and a material pickup assembly is provided in the lower mold assembly so as to On discharge.
It improves the accuracy of punching and cutting of gold fingers and the convenience of material removal, ensuring the accuracy of the processing process and the convenience of material discharge.
Smart Images

Figure CN222200753U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of flexible circuit boards, in particular to a gold finger punching die for a flexible circuit board. Background Art
[0002] Flexible circuit boards are a type of thin-film circuit boards that consist of a flexible substrate and conductive copper foil. Compared with traditional rigid circuit boards, flexible circuit boards have better flexibility and bending properties and are suitable for applications that require bending, folding or bending. Flexible circuit boards are commonly used in mobile phones, tablets, cameras, automotive electronics and other products to achieve a more compact and lightweight design. Their advantages include light weight, small size, easy installation and maintenance, etc.
[0003] Gold finger punching die is a tool used to manufacture the connector part of flexible circuit boards. Gold fingers are a connector structure on flexible circuit boards, which are used to connect circuit boards with other devices or electronic components. Gold finger punching die processes the gold finger part of flexible circuit boards into the required shape and size through cutting, stamping and other processes. These molds are usually made of high-hardness alloy steel or special materials, with high precision and wear resistance, which can ensure the accuracy and quality of gold finger processing. Gold finger punching die plays a key role in the production process of flexible circuit boards and affects the performance and reliability of connectors.
[0004] Some existing traditional punching dies for gold fingers of flexible circuit boards fix and punch the gold fingers of flexible circuit boards by pressing between upper and lower dies. However, during the process of the dies moving up and down and during the punching process, the flexible circuit board may expand and shrink during the punching process due to its easy expansion and contraction, which affects the accuracy of gold finger punching. In addition, some existing traditional punching tools for gold fingers of flexible circuit boards are only provided with an upper stripper plate to prevent materials from being adsorbed on the upper template, but the lower template lacks a discharge component, which causes the flexible circuit board to sink into the lower mold groove, making it inconvenient to take out materials. Therefore, a punching die for gold fingers of flexible circuit boards is proposed to solve the above problems. Utility Model Content
[0005] In order to make up for the above shortcomings, the utility model provides a gold finger punching die for a flexible circuit board, aiming to improve the problem in the prior art that the flexible circuit board is prone to expansion and contraction during gold finger punching, which affects its cutting accuracy.
[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a gold finger punching mold for a flexible circuit board, comprising a body, an electric push rod fixedly connected to the top of the inner wall of the body, a top plate fixedly connected to the bottom of the electric push rod, an upper mold assembly is arranged on the bottom surface of the top plate, a bottom plate is fixedly connected to the lower part of the inner wall of the body, a lower mold assembly is arranged on the top of the bottom plate, the upper mold assembly comprises an upper mold plate, and the upper mold plate is fixedly connected to the top plate.
[0007] As a further description of the above technical solution:
[0008] The upper mold assembly also includes a plurality of leveling assemblies. A limiting assembly is disposed on the left side of the leveling assembly. A punching knife is disposed on the left side of the limiting assembly and is fixedly connected to the upper mold plate.
[0009] As a further description of the above technical solution:
[0010] A connecting groove matched with the leveling component is provided on the bottom surface of the upper template, and a mounting groove matched with the limiting component is provided on the left side of the connecting groove.
[0011] As a further description of the above technical solution:
[0012] The limiting assembly includes an empty rod, the empty rod is fixedly connected to the installation groove, the inner wall of the empty rod is slidably connected with a sliding rod, and a No. 1 spring is fixedly connected between the sliding rod and the empty rod.
[0013] As a further description of the above technical solution:
[0014] The leveling assembly includes a connecting block, which is fixedly connected to the top of the inner wall of the connecting groove, and the bottom of the connecting block is fixedly connected to a connecting column, and installation cavities are opened on the front and rear sides of the connecting column, and sliding columns are penetrated and slidably connected on the front and rear sides of the connecting column, and the sliding column is slidably connected to the installation cavity, and a No. 2 spring is fixedly connected between the sliding column and the installation cavity, and one end of the sliding column away from the connecting block is movably connected to a connecting piece, and a side of the connecting piece away from the connecting block is fixedly connected to a support rod, and the support rod is movably connected to the connecting groove, and the lower part of the support rod is rotatably connected to a roller.
[0015] As a further description of the above technical solution:
[0016] The lower mold assembly comprises a lower mold plate, the lower mold plate is fixedly connected to the bottom plate, and a material taking assembly is arranged in the middle of the lower mold plate.
[0017] As a further description of the above technical solution:
[0018] The material picking assembly includes two mounting rods, the left and right parts of the mounting rods are fixedly connected with push blocks, the left and right ends of the mounting rods are fixedly connected with push plates, the tops of the two mounting rods are commonly fixedly connected with an auxiliary plate, and the tops of the auxiliary plates are fixedly connected with a push plate.
[0019] As a further description of the above technical solution:
[0020] The top of the lower template is provided with a plurality of placement grooves, the lower left portion of the placement groove is provided with a material guide port, the lower portion of the placement groove is provided with a material pushing port, the pushing plate is movably connected with the material pushing port, the bottom of the material pushing port is provided with an auxiliary port, the auxiliary plate is slidably connected with the auxiliary port, the front and rear sides of the auxiliary port are provided with a pushing cavity, the mounting rod is slidably connected with the auxiliary port, the left and right portions of the pushing cavity are provided with a pushing groove, the pushing block is slidably connected with the pushing block, and a No. 3 spring is fixedly connected between the pushing block and the pushing groove.
[0021] The utility model has the following beneficial effects:
[0022] 1. In the utility model, by setting the cooperation between the limit component, the placement groove and the flattening component, the device can push the flexible circuit board to both sides to flatten it and limit it when processing the flexible circuit board to prevent it from expanding and shrinking, thereby ensuring its cutting accuracy and being more practical.
[0023] 2. In the utility model, by setting the mutual cooperation between the lower template and the pusher assembly, the gold finger of the flexible circuit board can be pushed out of the placement slot by the pusher plate after the punching is completed, making it more convenient to take out the material of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 This is an overall three-dimensional schematic diagram of a gold finger punching mold for a flexible circuit board proposed by the utility model;
[0025] Figure 2 This is a three-dimensional schematic diagram of the entire upper die assembly of a gold finger punching die for a flexible circuit board proposed by the utility model;
[0026] Figure 3 This is a disassembled three-dimensional schematic diagram of a limit assembly of a gold finger punching die for a flexible circuit board proposed by the utility model;
[0027] Figure 4 This is a three-dimensional schematic diagram of the overall flattening component of a gold finger punching die for a flexible circuit board proposed by the utility model;
[0028] Figure 5 It is a partial cross-sectional three-dimensional schematic diagram of a flat component of a gold finger punching die for a flexible circuit board proposed by the utility model;
[0029] Figure 6 This is a disassembled three-dimensional schematic diagram of a lower die assembly of a gold finger punching die for a flexible circuit board proposed by the utility model;
[0030] Figure 7 The utility model is a three-dimensional schematic diagram of the cross-section of the lower template of a gold finger punching mold for a flexible circuit board.
[0031] Legend:
[0032] 1. Machine body; 2. Electric push rod; 3. Top plate; 4. Upper mold assembly; 5. Lower mold assembly; 6. Bottom plate; 41. Upper mold plate; 42. Leveling assembly; 43. Limit assembly; 44. Punching knife; 411. Connecting groove; 412. Mounting groove; 431. Empty rod; 432. Sliding rod; 433. No. 1 spring; 421. Connecting block; 422. Connecting column; 423. Mounting cavity; 424. Sliding column; 42 5. Spring No. 2; 426. Connector; 427. Support rod; 428. Roller; 51. Lower template; 52. Material taking assembly; 521. Mounting rod; 522. Push block; 523. Spring No. 3; 524. Push plate; 525. Auxiliary plate; 526. Push plate; 511. Placement slot; 512. Material guide port; 513. Push port; 514. Auxiliary port; 515. Push cavity; 516. Push slot. DETAILED DESCRIPTION
[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0034] Reference Figure 1 The utility model provides an embodiment: a gold finger punching die for a flexible circuit board, comprising a body 1 for connecting various components, an electric push rod 2 is fixedly connected to the top of the inner wall of the body 1 for pushing the upper die assembly 4, a top plate 3 is fixedly connected to the bottom of the electric push rod 2 for connecting the upper die assembly 4, an upper die assembly 4 is arranged on the bottom surface of the top plate 3 for limiting and punching the flexible circuit board, a bottom plate 6 is fixedly connected to the lower part of the inner wall of the body 1 for connecting the lower die assembly 5, a lower die assembly 5 is arranged on the top of the bottom plate 6 for placing the flexible circuit board and cooperating with the upper die assembly 4.
[0035] like Figure 2As shown, the upper mold assembly 4 includes an upper mold plate 41 for connecting various components. The upper mold plate 41 is fixedly connected to the top plate 3. The upper mold assembly 4 also includes a plurality of leveling components 42 for preventing the flexible circuit board from expanding and contracting. A limiting component 43 is arranged on the left side of the leveling component 42 for fixing the gold finger connection of the flexible circuit board to make the punching more precise. A punching knife 44 is arranged on the left side of the limiting component 43 for punching the gold finger, which is fixedly connected to the upper mold plate 41.
[0036] Furthermore, a connecting groove 411 adapted to the leveling component 42 is provided on the bottom surface of the upper template 41 for connecting the leveling component 42 , and a mounting groove 412 adapted to the limiting component 43 is provided on the left side of the connecting groove 411 for connecting the limiting component 43 .
[0037] See also Figure 3 The limit assembly 43 includes a hollow rod 431 for connecting various components. The hollow rod 431 is fixedly connected to the mounting groove 412. The inner wall of the hollow rod 431 is slidably connected with a slide rod 432 for cooperating with the downward pressure of the upper template 41, and can be completely received in the hollow rod 431. A spring 433 is fixedly connected between the slide rod 432 and the hollow rod 431 for cooperating with the movement and reset of the slide rod 432.
[0038] like Figure 4 - Figure 5 As shown, the leveling assembly 42 includes a connecting block 421 for connecting with the connecting groove 411, the connecting block 421 is fixedly connected to the top of the inner wall of the connecting groove 411, the bottom of the connecting block 421 is fixedly connected with a connecting column 422 for connecting various components, the front and rear sides of the connecting column 422 are provided with a mounting cavity 423 for connecting with a sliding column 424, the front and rear sides of the connecting column 422 are penetrated and slidably connected with a sliding column 424 for connecting a support rod 427, the sliding column 424 is slidably connected to the mounting cavity 423, and the sliding column 424 and the mounting cavity 423 are connected. A No. 2 spring 425 is fixedly connected together for cooperating with the movement and connection of the sliding column 424. A connecting piece 426 is movably connected to one end of the sliding column 424 away from the connecting block 421 for cooperating with the connection between the sliding column 424 and the support rod 427. A support rod 427 is fixedly connected to the side of the connecting piece 426 away from the connecting block 421, which can be fully retracted into the connecting groove 411. The support rod 427 is movably connected to the connecting groove 411. The lower part of the support rod 427 is rotatably connected with a roller 428 for flattening the flexible circuit board, which can be fully retracted into the connecting groove 411.
[0039] See also Figure 5 - Figure 6The lower mold assembly 5 includes a lower mold plate 51 for matching with the upper mold plate 41. The lower mold plate 51 is fixedly connected to the bottom plate 6. A material picking assembly 52 is arranged in the middle of the lower mold plate 51 for assisting in picking. The material picking assembly 52 includes two mounting rods 521 for connecting various components. The left and right parts of the mounting rods 521 are fixedly connected with push blocks 522 for connecting the third spring 523. The left and right ends of the mounting rods 521 are fixedly connected with push plates 524 for pushing the assembly. The tops of the two mounting rods 521 are fixedly connected with an auxiliary plate 525. The tops of the auxiliary plates 525 are fixedly connected with a push plate 526, the tops of which are flush with the placement grooves 511 for pushing out the flexible circuit board. The tops of the lower mold plate 51 are provided with placement grooves 511 in multiple numbers for placing the flexible circuit board. The plate has a shape that matches the flexible circuit board. A material guide port 512 is provided at the lower left side of the placement slot 511 for guiding out waste generated during punching. A material push port 513 is provided at the lower part of the placement slot 511 for use with a material push plate 526, which is movably connected to the material push plate 526. An auxiliary port 514 is provided at the bottom of the material push port 513 for use with an auxiliary plate 525, which is slidably connected to the auxiliary plate 525. A push cavity 515 is provided at the front and rear sides of the auxiliary port 514 for use with a mounting rod 521, which is slidably connected to the mounting rod 521. A push groove 516 is provided at the left and right parts of the push cavity 515, which is slidably connected to the push block 522. A No. 3 spring 523 is fixedly connected between the push block 522 and the push groove 516 for assisting component resetting.
[0040] Working principle: When in use, the flexible circuit board to be processed is placed in the placement groove 511, and then the electric push rod 2 is turned on to push the top plate 3 and the upper mold assembly 4 to move downward. When the roller 428 contacts the flexible circuit board, due to the continuous downward pressure of the upper mold plate 41, the two support rods 427 will be stretched to both sides and push the roller 428 to assist in flattening the flexible circuit board. When the support rod 427 moves, the connecting piece 426 connected thereto will pull the sliding column 424 to move, and the sliding column 424 will squeeze the second spring 425, and at the same time, the sliding rod 432 will contact the connection of the gold finger of the flexible circuit board The upper mold plate 41 is pressed down continuously, and the slide bar 432 will slide into the empty rod 431 and squeeze the No. 1 spring 433. Then the punching knife 44 will punch the gold finger, and the waste material punched out will be discharged through the material guide port 512. After the punching is completed, the electric push rod 2 will drive the upper mold assembly 4 to recycle. Due to the loss of the pressure applied by it, the No. 1 spring 433 will push the slide bar 432 to reset. At the same time, the No. 2 spring 425 will push the slide column 424 to reset, and drive the connecting piece 426, the support rod 427 and the roller 428 connected thereto to reset.
[0041] When it is necessary to take materials, push the push plate 524 upward, which will drive the mounting rod 521 connected thereto to move, and the push block 522 will squeeze the No. 3 spring 523. At the same time, the auxiliary plate 525 connected to the mounting rod 521 will be pushed upward, and the push plate 526 will be pushed out of the push port 513, so that the flexible circuit board in the placement groove 511 is pushed out of the placement groove 511. After the material is taken, release the push plate 524, and the No. 3 spring 523 will push the push block 522, the mounting rod 521, the auxiliary plate 525, and the push plate 526 to reset.
[0042] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A gold finger punching die for a flexible circuit board, comprising a body (1), Features: An electric push rod (2) is fixedly connected to the top of the inner wall of the machine body (1), a top plate (3) is fixedly connected to the bottom of the electric push rod (2), an upper mold assembly (4) is arranged on the bottom surface of the top plate (3), a bottom plate (6) is fixedly connected to the lower part of the inner wall of the machine body (1), a lower mold assembly (5) is arranged on the top of the bottom plate (6), and the upper mold assembly (4) includes an upper mold plate (41), and the upper mold plate (41) is fixedly connected to the top plate (3).
2. A gold finger punching die for a flexible circuit board according to claim 1, Features: The upper mold assembly (4) also includes a plurality of leveling assemblies (42), a limiting assembly (43) is arranged on the left side of the leveling assembly (42), and a punching knife (44) is arranged on the left side of the limiting assembly (43), which is fixedly connected to the upper mold plate (41).
3. A gold finger punching die for a flexible circuit board according to claim 2, Features: A connecting groove (411) adapted to the leveling component (42) is provided on the bottom surface of the upper template (41), and a mounting groove (412) adapted to the limiting component (43) is provided on the left side of the connecting groove (411).
4. The gold finger punching die for a flexible circuit board according to claim 3, Features: The limiting assembly (43) comprises an empty rod (431), the empty rod (431) is fixedly connected to the mounting groove (412), the inner wall of the empty rod (431) is slidably connected to a sliding rod (432), and a No. 1 spring (433) is fixedly connected between the sliding rod (432) and the empty rod (431).
5. The gold finger punching die for a flexible circuit board according to claim 3, Features: The leveling assembly (42) comprises a connecting block (421), wherein the connecting block (421) is fixedly connected to the top of the inner wall of the connecting groove (411), and a connecting column (422) is fixedly connected to the bottom of the connecting block (421), and a mounting cavity (423) is provided on the front and rear sides of the connecting column (422), and a sliding column (424) is penetrated and slidably connected to the front and rear sides of the connecting column (422), and the sliding column (424) is slidably connected to the mounting cavity (423). A No. 2 spring (425) is fixedly connected between the sliding column (424) and the installation cavity (423); one end of the sliding column (424) away from the connecting block (421) is movably connected to a connecting piece (426); a side of the connecting piece (426) away from the connecting block (421) is fixedly connected to a support rod (427); the support rod (427) is movably connected to the connecting groove (411); and the lower part of the support rod (427) is rotatably connected to a roller (428).
6. The gold finger punching die for a flexible circuit board according to claim 1, Features: The lower mold assembly (5) comprises a lower mold plate (51), the lower mold plate (51) is fixedly connected to the bottom plate (6), and a material taking assembly (52) is arranged in the middle of the lower mold plate (51).
7. The gold finger punching die for a flexible circuit board according to claim 6, Features: The material picking assembly (52) includes two mounting rods (521), the left and right parts of the mounting rods (521) are fixedly connected with push blocks (522), the left and right ends of the mounting rods (521) are fixedly connected with push plates (524), the tops of the two mounting rods (521) are fixedly connected with an auxiliary plate (525), and the tops of the auxiliary plates (525) are fixedly connected with a material pushing plate (526).
8. The gold finger punching die for a flexible circuit board according to claim 7, Features: The top of the lower template (51) is provided with a plurality of placement grooves (511), the lower left portion of the placement groove (511) is provided with a material guide port (512), the lower portion of the placement groove (511) is provided with a material push port (513), the material push plate (526) is movably connected to the material push port (513), the bottom of the material push port (513) is provided with an auxiliary port (514), the auxiliary plate (525) is slidably connected to the auxiliary port (513), the front and rear sides of the auxiliary port (514) are provided with a push cavity (515), the mounting rod (521) is slidably connected to the auxiliary port (514), the left and right portions of the push cavity (515) are provided with a push groove (516), the push block (522) is slidably connected to the push groove (516), and a No. 3 spring (523) is fixedly connected between the push block (522) and the push groove (516).
