Accurate control slicing equipment for compound semiconductor processing

By using inclined screening plates and vibrating motors in semiconductor slice processing equipment, and evenly collecting slices with reducer motors and material separation mechanisms, the problems of debris doping and stacking in existing equipment are solved, and efficient slices are achieved Collection and space utilization.

CN222201165UActive Publication Date: 2024-12-20WUXI SHANGJI AUTOMATION
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Patent Information

Application Number
CN202323448835.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-18
Publication Date
2024-12-20
Estimated Expiration
2033-12-18

AI Technical Summary

Technical Problem

The existing semiconductor slice processing equipment cannot effectively absorb and remove debris during the cutting process, resulting in the mixing of debris with slices, affecting product quality, and the accumulation of slices leads to low space utilization of the collecting box.

Method used

A precisely controlled slice device including inclined screen plate, vibration motor, collection tank body, reducer motor, rotating shaft, cam and material distribution mechanism is designed. Debris are screened through screen plate and vibration motor, and the speed reduction motor and material distribution mechanism are collected evenly. Slice to avoid debris doping and stacking.

Benefits of technology

Effectively separate and collect semiconductor slices and debris, prevent doping from affecting product quality, and improve the space utilization of the collection box, ensuring accurate control and efficient collection of slices.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses precise control slicing equipment for compound semiconductor processing. The precise control slicing equipment comprises a slicing equipment body and a cutting mechanism arranged at one end of the slicing equipment body. A treatment box corresponding to the cutting mechanism is arranged at one end of the slicing equipment body, a screening mechanism is arranged on the treatment box and comprises a screening plate obliquely arranged at the upper end of the inner side of the treatment box, and transverse plates connected with the inner wall of the treatment box are arranged at the two ends of the bottom of the screening plate correspondingly; the four corners of the bottom of the sieve plate are provided with stand columns corresponding to the transverse plates, the stand columns are sleeved with first springs, and the bottom of the sieve plate is provided with a vibration motor. According to the precise control slicing equipment for compound semiconductor processing, the inclined sieve plate is arranged in the processing box, semiconductor slices and chippings generated by cutting can be conveniently screened through the arrangement of a transverse plate, a stand column, a first spring and a vibration motor, the chipping removal effect is good, and the situation that the chippings are doped in the semiconductor slices to affect follow-up work is avoided.
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Description

Technical Field

[0001] The utility model relates to the field of semiconductor processing, in particular to a precision control slicing device for compound semiconductor processing. Background Art

[0002] Semiconductor refers to a material whose electrical conductivity is between that of a conductor and an insulator at room temperature. Semiconductors are widely used in radios, televisions, and temperature measurement. Semiconductor materials can be classified from different perspectives. For example, according to their performance, they can be divided into high-temperature semiconductors, magnetic semiconductors, and thermoelectric semiconductors; according to their crystal structure, they can be divided into diamond-type, sphalerite-type, wurtzite-type, and chalcopyrite-type semiconductors; according to their degree of crystallization, they can be divided into crystalline semiconductors, amorphous semiconductors, and microcrystalline semiconductors. However, the more common and comprehensive classification is based on their chemical composition, which can be divided into three categories: elemental semiconductors, compound semiconductors, and solid solution semiconductors. In the production process of semiconductors, especially for compound semiconductors, they need to be sliced. In the rectangular semiconductor slices, most of them are cut manually, which consumes a lot of labor and has low work efficiency.

[0003] A slicing device for semiconductor production is disclosed in Chinese utility model patent application No.: 202021137708.9, which includes a base, vertical plates are fixedly connected on both sides of the top outer wall of the base, and a guide rail is provided on one side outer wall of the vertical plate, a first slider is slidably connected to the inner wall of the guide rail, and a connecting rod is fixedly connected to the top outer wall of the first slider, one end of the connecting rod is fixedly connected to the second slider, and the second slider forms a sliding fit with the guide rail, a spring is sleeved on the outer surface of the connecting rod, and a connecting plate is fixedly connected to one side outer wall of the second slider.

[0004] The solution in the above-mentioned prior art sets up structures such as guide rails to ensure precise control of semiconductor processing, but the above-mentioned prior art absorbs the debris generated by cutting through a vacuum cleaner and a vacuum head. This method can only absorb the debris in the area near the vacuum head, and the debris in other areas cannot be effectively absorbed. The debris that cannot be absorbed will fall into the material collection box and mix with the semiconductor slices, thereby affecting product quality and causing inconvenience to subsequent work. Moreover, the semiconductor slices will fall freely and accumulate in one place in the material collection box, causing premature overflow and resulting in poor space utilization of the material collection box.

[0005] Therefore, it is necessary to propose a precision-controlled slicing device for compound semiconductor processing to solve the above problems. Utility Model Content

[0006] The main purpose of the utility model is to provide a precision-controlled slicing device for compound semiconductor processing, which can effectively solve the problems in the background technology.

[0007] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0008] A precision control slicing device for compound semiconductor processing, comprising a slicing device body and a cutting mechanism arranged at one end of the slicing device body;

[0009] A processing box corresponding to the cutting mechanism is arranged at one end of the slicing device body, and a screening mechanism is arranged on the processing box. The screening mechanism includes a sieve plate obliquely arranged at the upper end of the inner side of the processing box, and both ends of the bottom of the sieve plate are provided with cross plates connected to the inner wall of the processing box, and columns corresponding to the cross plates are arranged at the four corners of the bottom of the sieve plate, and a first spring is sleeved on the outer side of the column, and a vibration motor is arranged at the bottom of the sieve plate.

[0010] Preferably, a first collecting trough body is movably arranged directly below the sieve plate, and there is a gap between the lower end of the sieve plate and the end of the inner cavity of the processing box. A second collecting trough body is arranged below the gap, and both the first collecting trough body and the second collecting trough body are movably inserted from one side of the processing box.

[0011] Preferably, the lower end of the column extends to the bottom of the transverse plate, and the column and the transverse plate are movably connected via a guide sleeve, and the first spring is located between the transverse plate and the screen plate.

[0012] Preferably, a limiting bottom block having a diameter larger than that of the column is provided at the bottom of the column.

[0013] Preferably, a material distribution mechanism is provided at one end of the processing box close to the second collecting trough body, and the material distribution mechanism includes a mounting bracket arranged on the side wall of one end of the processing box close to the second collecting trough body, a reduction motor is fixedly installed on one side of the mounting bracket, and a rotating shaft driven to rotate by the reduction motor is arranged on the other side of the mounting bracket, and a cam is arranged on the rotating shaft, and a through groove is provided at one end of the processing box close to the second collecting trough body, and a sliding rod is provided on the inner side of the through groove along the length of the through groove, and an L-shaped connecting arm is movably connected to the inner side of the through groove, and a second spring is sleeved on the end of the sliding rod away from the mounting bracket, one end of the L-shaped connecting arm extends to the inner side of the processing box and is provided with a material distribution plate, and the other end of the L-shaped connecting arm extends to the outer side of the processing box and is provided with a connecting rod, and the end of the connecting rod away from the L-shaped connecting arm is provided with a vertical plate corresponding to the cam.

[0014] Preferably, the dividing plate is located above the second collecting trough body and corresponds to the lower end of the screen plate, the part of the L-shaped connecting arm located on the inner side of the through slot is movably connected to the slide rod, and the second spring is located on the side of the L-shaped connecting arm away from the mounting frame.

[0015] Beneficial Effects

[0016] Compared with the prior art, the utility model provides a precision control slicing device for compound semiconductor processing, which has the following beneficial effects:

[0017] 1. The precision control slicing equipment for compound semiconductor processing can conveniently screen semiconductor slices and debris generated by cutting by setting an inclined sieve plate in the processing box, cooperating with the settings of a horizontal plate, a column, a first spring, and a vibration motor. The debris falls through the sieve plate and is collected by a first collecting trough body, and the semiconductor slices slide and are collected by a second collecting trough body, thereby avoiding the debris being mixed in the semiconductor slices and affecting subsequent work.

[0018] 2. The precision-controlled slicing equipment for compound semiconductor processing can facilitate the falling semiconductor slices to fall evenly into the second collecting tank body through the cooperation of the reduction motor, rotating shaft, cam, dividing plate, L-shaped connecting arm, connecting rod, vertical plate, sliding rod and second spring, thereby avoiding accumulation that affects the space utilization of the second collecting tank body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the utility model;

[0020] Figure 2 It is a structural schematic diagram of the processing box of the utility model;

[0021] Figure 3 It is a structural schematic diagram of the processing box of the utility model from another perspective;

[0022] Figure 4 It is a schematic diagram of the cross-sectional structure of the processing box of the utility model;

[0023] Figure 5 This utility model Figure 3 Enlarged view of point A in the middle;

[0024] Figure 6 It is a schematic diagram of the overall structure of the L-shaped connecting arm and the material dividing plate of the utility model.

[0025] In the figure: 1. Slicing equipment body; 2. Cutting mechanism; 3. Processing box; 4. Screen plate; 5. First collecting trough body; 6. Second collecting trough body; 7. Mounting frame; 8. Speed ​​reduction motor; 9. Cam; 10. Vertical plate; 11. Vibration motor; 12. Horizontal plate; 13. Column; 14. First spring; 15. Limiting bottom block; 16. Dividing plate; 17. Rotating shaft; 18. Through slot; 19. Sliding rod; 20. L-shaped connecting arm; 21. Connecting rod; 22. Second spring. DETAILED DESCRIPTION

[0026] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0027] Example

[0028] like Figure 1-Figure 6 As shown, in this embodiment, a precision control slicing device for compound semiconductor processing includes a slicing device body 1 and a cutting mechanism 2 arranged at one end of the slicing device body 1. The difference from the prior art is that the cutting mechanism 2 is a wire cutting machine, which is suitable for cutting brittle compound semiconductor materials and has a better cutting effect. The wire cutting machine is a conventional electric spark wire cutting machine (the prior art, no more details are given), and a processing box 3 corresponding to the cutting mechanism 2 is arranged at one end of the slicing device body 1. There is a screening mechanism, which includes a sieve plate 4 obliquely arranged at the upper end of the inner side of the processing box 3, both ends of the bottom of the sieve plate 4 are provided with horizontal plates 12 connected to the inner wall of the processing box 3, and four corners of the bottom of the sieve plate 4 are provided with columns 13 corresponding to the horizontal plates 12, and the outer side of the column 13 is sleeved with a first spring 14, the lower end of the column 13 extends to the bottom of the horizontal plate 12, and the column 13 and the horizontal plate 12 are movably connected through a guide sleeve, the first spring 14 is located between the horizontal plate 12 and the sieve plate 4, and a vibration motor 11 is provided at the bottom of the sieve plate 4.

[0029] In order to play a limiting role, a limiting bottom block 15 with a diameter larger than the column 13 is provided at the bottom of the column 13;

[0030] Furthermore, a first collecting trough body 5 is movably arranged directly below the sieve plate 4, and there is a gap between the lower end of the sieve plate 4 and the end of the inner cavity of the processing box 3. A second collecting trough body 6 is arranged below the gap, and both the first collecting trough body 5 and the second collecting trough body 6 are movably inserted from one side of the processing box 3.

[0031] Furthermore, in order to collect the semiconductor slices uniformly, a material distribution mechanism is provided at one end of the processing box 3 close to the second collection tank body 6, and the material distribution mechanism includes a mounting frame 7 arranged on the side wall of one end of the processing box 3 close to the second collection tank body 6, a reduction motor 8 is fixedly installed on one side of the mounting frame 7, and a rotating shaft 17 driven to rotate by the reduction motor 8 is provided on the other side of the mounting frame 7, and a cam 9 is provided on the rotating shaft 17, and a through groove 18 is provided at one end of the processing box 3 close to the second collection tank body 6, and a sliding rod 19 is provided on the inner side of the through groove 18 along the length of the through groove 18, and an L-shaped connecting arm is movably connected to the inner side of the through groove 18 20, the part of the L-shaped connecting arm 20 located on the inner side of the through groove 18 is movably connected with the slide rod 19, and the end of the slide rod 19 away from the mounting frame 7 is sleeved with a second spring 22, and the second spring 22 is located on the side of the L-shaped connecting arm 20 away from the mounting frame 7. One end of the L-shaped connecting arm 20 extends to the inner side of the processing box 3 and is provided with a dividing plate 16. The dividing plate 16 is located above the second collecting trough body 6 and corresponds to the lower end of the sieve plate 4. The other end of the L-shaped connecting arm 20 extends to the outside of the processing box 3 and is provided with a connecting rod 21. The end of the connecting rod 21 away from the L-shaped connecting arm 20 is provided with a vertical plate 10 corresponding to the cam 9.

[0032] Working principle: when in use, the semiconductor slices cut by the cutting mechanism 2 and the debris generated by cutting fall to the top of the screen plate 4. During this period, the vibration motor 11 vibrates, and the screen plate 4 vibrates continuously under the action of the first spring 14, the column 13, and the cross plate 12, and then the debris falls and is collected by the first collecting trough 5, and the semiconductor slices slide down. During this period, the reduction motor 8 drives the cam 9 to rotate through the rotating shaft 17, and the cam 9 continuously conflicts and separates from the vertical plate 10. When conflicting, the vertical plate 10 drives the L-shaped connecting arm 20 to move and compress the second spring 22 through the connecting rod 21, and then the dividing plate 16 moves to one side to push away the semiconductor slices that slide down. After the cam 9 separates from the vertical plate 10, the second spring 22 resets, and then the L-shaped connecting arm 20 drives the dividing plate 16 to reset. During the resetting process, the semiconductor slices that slide down can be pushed away, and then the semiconductor slices will not accumulate, thereby improving the space utilization rate.

[0033] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A precision control slicing device for compound semiconductor processing, comprising a slicing device body (1) and a cutting mechanism (2) arranged at one end of the slicing device body (1); Features: A processing box (3) corresponding to the cutting mechanism (2) is arranged at one end of the slicing device body (1), and a screening mechanism is arranged on the processing box (3), and the screening mechanism comprises a sieve plate (4) obliquely arranged at the upper end of the inner side of the processing box (3), and both ends of the bottom of the sieve plate (4) are provided with a horizontal plate (12) connected to the inner wall of the processing box (3), and the four corners of the bottom of the sieve plate (4) are provided with a column (13) corresponding to the horizontal plate (12), and the outer side of the column (13) is provided with a first spring (14), and a vibration motor (11) is arranged at the bottom of the sieve plate (4).

2. The precision control slicing device for compound semiconductor processing according to claim 1, characterized in that: A first collecting trough body (5) is movably arranged directly below the sieve plate (4), a gap is provided between the lower end of the sieve plate (4) and the end of the inner cavity of the processing box (3), a second collecting trough body (6) is arranged below the gap, and both the first collecting trough body (5) and the second collecting trough body (6) are movably inserted from one side of the processing box (3).

3. The precision control slicing device for compound semiconductor processing according to claim 2, characterized in that: The lower end of the column (13) extends to the bottom of the transverse plate (12), and the column (13) and the transverse plate (12) are movably connected via a guide sleeve, and the first spring (14) is located between the transverse plate (12) and the screen plate (4).

4. The precision control slicing device for compound semiconductor processing according to claim 3, characterized in that: The bottom of the column (13) is provided with a limiting bottom block (15) having a diameter larger than that of the column (13).

5. The precision control slicing device for compound semiconductor processing according to claim 4, characterized in that: A material distribution mechanism is provided at one end of the processing box (3) close to the second collecting tank body (6), and the material distribution mechanism comprises a mounting frame (7) arranged on a side wall of one end of the processing box (3) close to the second collecting tank body (6), a reduction motor (8) is fixedly mounted on one side of the mounting frame (7), and a rotating shaft (17) driven to rotate by the reduction motor (8) is provided on the other side of the mounting frame (7), and a cam (9) is provided on the rotating shaft (17), and a through groove (18) is provided at one end of the processing box (3) close to the second collecting tank body (6), and the inner side of the through groove (18) is along A sliding rod (19) is provided in a rectangular shape on the length of the through slot (18), and an L-shaped connecting arm (20) is movably connected to the inner side of the through slot (18). A second spring (22) is sleeved on the end of the sliding rod (19) away from the mounting frame (7). One end of the L-shaped connecting arm (20) extends to the inner side of the processing box (3) and is provided with a material dividing plate (16). The other end of the L-shaped connecting arm (20) extends to the outer side of the processing box (3) and is provided with a connecting rod (21). The end of the connecting rod (21) away from the L-shaped connecting arm (20) is provided with a vertical plate (10) corresponding to the cam (9).

6. The precision control slicing device for compound semiconductor processing according to claim 5, characterized in that: The dividing plate (16) is located above the second collecting tank body (6) and corresponds to the lower end of the screen plate (4); the portion of the L-shaped connecting arm (20) located inside the through groove (18) is movably connected to the slide rod (19); and the second spring (22) is located on the side of the L-shaped connecting arm (20) away from the mounting frame (7).