Anti-reflux device for electroplating equipment

Abstract

The utility model relates to an anti-reflux device for electroplating equipment, which is characterized in that a drainage plate is arranged between an overflow wall and a conductive cathode roller of an electroplating bath in the anti-reflux device, the top of the drainage plate is not lower than the top of the overflow wall, an anode is arranged in the electroplating bath, and the anode and the conductive cathode roller are communicated with an anode and a cathode of an electroplating power supply; the electroplating bath is connected with the liquid inlet pipe, the liquid inlet pipe is connected with the liquid supply equipment, and the liquid supply equipment pumps electroplating liquid into the electroplating bath through the liquid inlet pipe. According to the utility model, electroplating liquid is prevented from flowing to the conductive cathode roller, so that electroplating on the surface of the conductive cathode roller can be avoided, and the electroplating quality is improved. And meanwhile, the electrolyte overflows uniformly by arranging the overflow notch, so that the electroplating thickness of the bottom surface of the substrate is enough and uniform, and the electroplating effect of the substrate is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of horizontal electroplating equipment and relates to a backflow prevention device used in electroplating equipment. Background Art

[0002] Generating metal electrodes on the surface of solar cell substrates is a key step in the production process of solar cells. Electroplating is one of the methods to generate metal electrodes on the surface of solar cell substrates. Compared with the physical metal deposition process or screen printing process, electroplating is not only simple, but also has the advantage of selective metal deposition. Therefore, the production cost of electroplating can be controlled very low, which can greatly reduce the cost of producing crystalline silicon solar cells.

[0003] Patent CN117758347A discloses an integrated horizontal electroplating device and an integrated horizontal electroplating method. The integrated horizontal electroplating device includes an electroplating tank. A recovery tank is arranged at intervals in the electroplating tank. Non-conductive rollers and conductive cathode rollers are respectively arranged in the electroplating tank and the recovery tank. The electroplating liquid is sprayed into the electroplating tank through a liquid supply device. Since all parts of the electroplating tank are connected, the liquid levels of the electroplating liquid in the electroplating tank are level, ensuring that the electroplating thickness of the bottom surface of the substrate is sufficient and the electroplating thickness is uniform, thereby improving the electroplating effect of the substrate.

[0004] However, in this method, the electroplating solution in the electroplating tank is transferred to the conductive cathode roller as the substrate moves, thereby generating an unnecessary electroplating layer on the conductive cathode roller, affecting the electroplating effect of the substrate. Summary of the invention

[0005] The utility model aims to provide a backflow prevention device for electroplating equipment, which can solve the above-mentioned problem and avoid the generation of unnecessary electroplating layer on the conductive cathode roller.

[0006] According to the technical solution provided by the utility model: a backflow prevention device for electroplating solar cell equipment, a drain plate is provided between the overflow wall of the electroplating tank and the conductive cathode roller in the backflow prevention device, and the top height of the drain plate is not lower than the top height of the overflow wall.

[0007] As a further improvement of the utility model, an anode is provided in the electroplating tank, and the anode and the conductive cathode roller are connected to the positive and negative poles of the electroplating power supply; the electroplating tank is connected to a liquid inlet pipe, the liquid inlet pipe is connected to a liquid supply device, and the liquid supply device pumps the plating liquid into the electroplating tank through the liquid inlet pipe.

[0008] As a further improvement of the utility model, the height of the top of the overflow wall is not higher than the highest point of the conductive cathode roller.

[0009] As a further improvement of the utility model, the drain plate is vertically arranged, and the height of the top of the drain plate is not higher than the highest point of the conductive cathode roller.

[0010] As a further improvement of the utility model, the device also includes a rotating non-conductive roller, which is rotatably arranged in the electroplating tank; the top heights of the non-conductive roller and the conductive cathode roller are flush.

[0011] As a further improvement of the utility model, overflow notches are evenly distributed on the top of the side of the electroplating tank.

[0012] As a further improvement of the present invention, the overflow notch may be a V-shaped notch or an arc notch.

[0013] The positive effects of this application are:

[0014] The utility model can prevent the electroplating solution from flowing to the conductive cathode roller, avoid electroplating on the conductive cathode roller, improve the electroplating quality of the substrate, and make the electrolyte overflow evenly by arranging the overflow notch, thereby ensuring that the electroplating thickness of the bottom surface of the substrate is sufficient and even, thereby improving the electroplating effect of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of the first embodiment of the present utility model.

[0016] Figure 2 It is a structural schematic diagram of the electroplating unit of the utility model.

[0017] Figure 3 It is a structural schematic diagram of an electroplating tank provided with a V-shaped overflow notch in the utility model.

[0018] Figure 4 The utility model is a schematic diagram of the structure of the electroplating tank with an arc-shaped overflow notch.

[0019] Figure 5 This is a schematic diagram of the structure of the second embodiment of the present utility model.

[0020] Figure 1-Figure 5 The electroplating tank 100 includes an overflow wall 110, an overflow gap 120, a conductive cathode roller 200, a drain plate 300, a substrate 400, a non-conductive roller 500, an anode 600, a recovery tank 700, and the like. DETAILED DESCRIPTION

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] In order to enable those skilled in the art to better understand the solution of the utility model, the following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so as to describe the embodiments of the utility model described herein. In addition, similar terms such as "including" and "having" mean that in addition to those contents already listed in "including" and "having", other contents that have not been listed can also be "included" and "having"; for example, a process, method, system, product or device that can include a series of steps or units is not necessarily limited to those steps or units that have been clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0024] Due to the angle of the drawing, some components may not be drawn, but their positions and connection relationships can be partially understood based on the text expression.

[0025] The utility model relates to a backflow prevention device used in electroplating equipment.

[0026] Embodiment 1, as Figure 1 As shown in the figure, the device consists of several electroplating units arranged in parallel. Figure 2 As shown, the electroplating unit includes an electroplating tank 100, the electroplating tank 100 has an overflow wall 110, a conductive cathode roller 200 is arranged outside the electroplating tank 100, a drain plate 300 is arranged between the overflow wall 110 of the electroplating tank 100 and the conductive cathode roller 200, and the top height of the drain plate 300 is not lower than the top height of the overflow wall 110.

[0027] An anode 600 is disposed in the electroplating tank 100 , and the anode 600 and the conductive cathode roller 200 are connected to the positive and negative electrodes of the electroplating power supply.

[0028] The conductive cathode roller 200 is driven to rotate by a driving motor. The liquid level of the plating solution in the electroplating tank 100 is controlled not to be higher than the conductive cathode roller 200. Since the liquid level of the plating solution in the electroplating tank 100 is determined by the top height of the overflow wall 110, the top height of the overflow wall 110 is not higher than the conductive cathode roller 200. In this embodiment, the top height of the overflow wall 110 is between 1 and 5 mm below the highest point of the conductive cathode roller 200.

[0029] Since the liquid level of the plating solution in the plating tank 100 is lower than the conductive cathode roller 200, the lower surface of the substrate 400 may not contact the plating solution. In order to make the lower surface of the substrate 400 contact the plating solution, the plating solution can be made to gush under the substrate 400, or the vibration generated by the vibration of the plating tank 100 itself can be used to make the plating solution contact the lower surface of the substrate 400. In this embodiment, the plating tank 100 is connected to the liquid inlet pipe, and the liquid inlet pipe is connected to the liquid supply device. The liquid supply device pumps the plating solution into the plating tank 100 through the liquid inlet pipe, so that the plating solution wets the lower surface of the substrate 400 and overflows the plating tank 100.

[0030] The drain plate 300 is vertically arranged. In this embodiment, the top height of the overflow wall 110 is between 1 and 5 mm below the top height of the drain plate 300 . Therefore, the liquid level of the plating solution in the plating tank 100 is between 1 and 5 mm below the top height of the drain plate 300 .

[0031] A backflow prevention method for electroplating equipment, the method using the above device, comprising the following steps:

[0032] Step 1: The substrate 400 moves toward the electroplating tank 100 driven by the conductive cathode roller 200. The lower surface of the substrate 400 first contacts the surface of the conductive cathode roller 200. Under the action of the negative electrode of the electroplating power supply, the lower surface of the substrate 400 relative to the anode 600 is the cathode surface in the electroplating process. When the substrate 400 continues to move to the right, a part of the substrate 400 enters the far end of the electroplating tank 100. The liquid supply device transports the plating liquid into the electroplating tank 100 through the liquid inlet pipe, so that the plating liquid overflows the electroplating tank 100 and contacts the lower surface of the substrate 400. Once the plating liquid contacts the lower surface of the substrate 400, the plating liquid will quickly wet the lower surface of the substrate 400 above the electroplating tank 100 under the action of the surface tension of the plating liquid.

[0033] Step 2: After the electroplating solution contacts the lower surface of the substrate 400, under the action of the electroplating power source, the metal ions in the electroplating solution obtain electrons on the conductive area on the lower surface of the substrate 400 to generate solid metal, which is deposited on the conductive area on the lower surface of the substrate 400. On the other hand, the anode 600 in the electroplating tank 100 loses electrons and dissolves in the electroplating solution, thereby completing a complete redox reaction of the electroplating process in the system.

[0034] Step 3: The plating solution in the plating tank 100 overflows along the lower surface of the substrate 400 to the conductive cathode rollers 200 on both sides of the plating tank 100 under the action of surface tension. After the overflowing plating solution encounters the drain plate 300, it flows downward along the drain plate 300 under the guidance of the drain plate 300, thereby preventing the plating solution from flowing to the conductive cathode roller 200.

[0035] like Figure 1 As shown, in order to improve the stability of the substrate 400, the device further includes a rotating non-conductive roller 500, which is rotatably disposed in the electroplating tank 100. The non-conductive roller 500 is driven to rotate by a driving motor. The tops of the non-conductive roller 500 and the conductive cathode roller 200 are flush with each other. Accordingly, after the device with the non-conductive roller 500 is adopted, in the anti-backflow method used by the electroplating equipment, the non-conductive roller 500 and the conductive cathode roller 200 jointly drive the substrate 400 from Figure 1 Move from the left side to the right side.

[0036] Specifically, the output end of the driving motor drives the driving rod to rotate, and a plurality of driving gears are sleeved on the driving rod. The ends of the conductive cathode roller 200 and the non-conductive roller 500 are respectively installed with driven gears, and the driven gears are meshed with the driving gears.

[0037] The liquid level of the plating solution in the plating tank 100 is controlled not to be higher than the non-conductive roller 500. In this embodiment, the liquid level of the plating solution in the plating tank 100 is between 1 and 5 mm below the highest point of the non-conductive roller 500.

[0038] like Figure 3-Figure 4 As shown, in order to make the electrolyte overflow uniformly, overflow notches 120 are evenly distributed on the top of the side of the electroplating tank 100. The overflow notches 120 can be V-shaped notches or arc notches.

[0039] Embodiment 2, as Figure 5 As shown. The device in the second embodiment is different from the device in the first embodiment in that a recovery tank 700 is provided between the electroplating tanks 100 in the several electroplating units. One of the features of the second embodiment is that the side wall of the recovery tank 700 is also the overflow wall 110 of the electroplating tank 100. Further, the device in the second embodiment also includes that the cathode roller 200 and the drain plate 300 are installed in the recovery tank 700, the electroplating tanks 100 in the several electroplating units are connected, and the several electroplating tanks 100 can share an anode 600. The recovery tank 700 is connected to the liquid supply device through the return pipe, and the electrolyte introduced into the recovery tank 700 through the drain plate 300 is transported to the liquid supply device.

[0040] Figure 5 The structure can be understood as three electroplating tanks 100 being connected, and the three electroplating tanks 100 and two recovery tanks 700 are arranged at intervals.

[0041] In the device of this embodiment, in step three of the backflow prevention method used by the corresponding electroplating equipment, after the overflowing plating liquid encounters the drain plate 300, it flows downward along the drain plate 300 under the guidance of the drain plate 300 and falls into the recovery tank 700. The recovery tank 700 then transports the plating liquid to the liquid supply equipment through the return pipe.

[0042] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A backflow prevention device for electroplating equipment, characterized in that: A drainage plate (300) is provided between the overflow wall (110) of the electroplating tank (100) and the conductive cathode roller (200) in the backflow prevention device, and the top height of the drainage plate (300) is not lower than the top height of the overflow wall (110).

2. The backflow prevention device for electroplating equipment according to claim 1, characterized in that: An anode (600) is provided in the electroplating tank (100), and the anode (600) and the conductive cathode roller (200) are connected to the positive and negative electrodes of the electroplating power supply; the electroplating tank (100) is connected to a liquid inlet pipe, and the liquid inlet pipe is connected to a liquid supply device, and the liquid supply device pumps the electroplating liquid into the electroplating tank (100) through the liquid inlet pipe.

3. The backflow prevention device for electroplating equipment according to claim 1, characterized in that: The top height of the overflow wall (110) is not higher than the highest point of the conductive cathode roller (200).

4. The backflow prevention device for electroplating equipment according to claim 1, characterized in that: The drainage plate (300) is arranged vertically, and the height of the top of the drainage plate (300) is not higher than the highest point of the conductive cathode roller (200).

5. The backflow prevention device for electroplating equipment according to claim 1, characterized in that: The device further comprises a rotating non-conductive roller (500), which is rotatably arranged in the electroplating tank (100); the tops of the non-conductive roller (500) and the conductive cathode roller (200) are flush with each other.

6. The backflow prevention device for electroplating equipment according to claim 1, characterized in that: Overflow notches (120) are evenly distributed on the top of the side of the electroplating tank (100).

7. The backflow prevention device for electroplating equipment according to claim 1, characterized in that: The overflow notch (120) may be a V-shaped notch or an arc notch.

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