Inflation, refrigeration and oxygen production all-in-one machine

Abstract

The utility model relates to an air inflation, refrigeration and oxygen generation all-in-one machine. The oxygen generation assembly is arranged at the bottom in the box body side by side and used for supplying oxygen to an oxygen cabin, the air supply assembly is used for pressurizing the oxygen cabin, and the two supporting beams are arranged on the inner walls of the two sides of the box body and located above the oxygen generation assembly and the air supply assembly. The semiconductor cooling assembly is arranged on the top faces of the two supporting beams and used for cooling oxygen and air in the oxygen generation assembly and the air supply assembly, the two heat dissipation rows are arranged at the refrigeration end of the semiconductor cooling assembly, and the input ends of the two heat dissipation rows communicate with the output end of the oxygen generation assembly and the output end of the air supply assembly correspondingly. The two pipeline connectors are arranged on one of the two supporting beams, one end of each pipeline connector penetrates through the side wall of the box body, and the two pipeline connectors are used for enabling the output ends of the two heat dissipation rows to be in butt joint with an oxygen supply port and an air supply port of an external oxygen cabin; by means of the semiconductor cooling assembly, air in the radiator can be quickly refrigerated to achieve the required refrigeration effect, the refrigeration temperature is controllable, noise cannot be generated, and therefore a patient in the oxygen cabin cannot be affected.

Description

Technical Field

[0001] The utility model relates to the field of oxygen supply equipment for oxygen chambers, in particular to an integrated inflation, refrigeration and oxygen production machine. Background Art

[0002] There are two main ways to supply oxygen: liquid oxygen and high-pressure oxygen. Due to the rapid development of pressure swing adsorption (PSA) technology, under normal temperature and pressure conditions, PSA special molecular sieves are used to selectively adsorb impurities such as nitrogen, carbon dioxide and water in the air, thereby obtaining higher purity oxygen (93%±2).

[0003] The existing oxygen concentrators have poor cooling effects and cannot achieve the desired cooling effect, thus affecting patients in the oxygen chamber. For example, prior art 202222180601.8 discloses an oxygen concentrator for a micro-hyperbaric oxygen chamber, which uses a fan for cooling. Not only is the temperature difference uncontrollable, but the blades may also generate noise when rotating, affecting patients. Utility Model Content

[0004] The utility model aims to provide an air-charging, refrigerating and oxygen-generating integrated machine in order to overcome the deficiencies of the prior art.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an air-filled, refrigerated and oxygen-generating integrated machine, comprising a box body, an oxygen-generating assembly and an air-supply assembly for pressurizing the oxygen chamber, which are arranged side by side at the bottom of the box body, two support beams arranged on the inner walls on both sides of the box body and above the oxygen-generating assembly and the air-supply assembly, a semiconductor cooling assembly arranged on the top surfaces of the two support beams for cooling the oxygen and air in the oxygen-generating assembly and the air-supply assembly, two heat sinks arranged on the cooling end of the semiconductor cooling assembly and whose input ends are respectively connected to the output ends of the oxygen-generating assembly and the air-supply assembly, two pipe connectors arranged on one of the two support beams and one end of which passes through the side wall of the box body for connecting the output ends of the two heat sinks with the oxygen supply port and the air supply port of the external oxygen chamber, and a control panel for control arranged on the upper end of the end surface of one end of the box body.

[0006] Preferably, the semiconductor cooling assembly includes a fixing plate arranged on the top surfaces of the two support beams, and two semiconductor cooling fins arranged on the top surface of the fixing plate; the two heat sinks are arranged on one side of the cooling ends of the two semiconductor cooling fins.

[0007] Preferably, silicone sheets are directly provided on one side of the cooling ends of the two semiconductor cooling plates and on the two heat sinks.

[0008] Preferably, a plurality of heat dissipation openings are provided on the bottom surface and side walls of the box.

[0009] Preferably, pulleys are provided on the four corners of the bottom of the box.

[0010] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0011] The utility model uses a semiconductor cooling component, which can not only quickly cool the gas in the heat sink to achieve the required cooling effect, but also has a controllable cooling temperature and does not generate noise, thereby not affecting the patients in the oxygen chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The technical solution of the utility model is further described below in conjunction with the accompanying drawings:

[0013] Attached Figure 1 This is a schematic diagram of the overall structure of the gas-filled, refrigerated and oxygen-generating integrated machine described in the utility model;

[0014] Attached Figure 2 This is a schematic diagram of the internal structure of the gas-filled, refrigerated and oxygen-generating integrated machine of the utility model;

[0015] Attached Figure 3 It is a schematic diagram of the overall structure of the semiconductor cooling assembly of the gas-filled refrigeration oxygen generator described in the utility model;

[0016] Attached Figure 4 This is a schematic diagram of the back structure of the gas-filled, refrigerated and oxygen-generating integrated machine described in the utility model;

[0017] Attached Figure 5 It is a schematic diagram of the bottom structure of the inflation, refrigeration and oxygen production integrated machine described in the utility model.

[0018] Among them: 1. Box body; 2. Oxygen production component; 3. Air supply component; 4. Support beam; 5. Semiconductor cooling component; 51. Fixed plate; 52. Semiconductor cooling plate; 6. Heat sink; 7. Connector; 8. Control panel; 9. Silicone sheet; 10. Heat dissipation port; 11. Pulley. DETAILED DESCRIPTION

[0019] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0020] Attached Figure 1-5The utility model is a gas-filled, refrigerated and oxygen-generating integrated machine, comprising a box body 1, an oxygen-generating assembly 2 and an air supply assembly 3 for pressurizing the oxygen chamber, which are arranged side by side at the bottom of the box body 1, two support beams 4 arranged on the inner walls of both sides of the box body 1 and located above the oxygen-generating assembly 2 and the air supply assembly 3, a semiconductor cooling assembly 5 arranged on the top surface of the two support beams 4 for cooling the oxygen and air in the oxygen-generating assembly 2 and the air supply assembly 3, and a semiconductor cooling assembly 5 arranged on the cooling end of the semiconductor cooling assembly 5 and the input end of which is connected to the oxygen-generating assembly 2 and the air supply assembly 3. Two heat sinks 6 connected at the output ends, two pipe connectors 7 arranged on one of the two support beams 4 and one end of which passes through the side wall of the box 1 for connecting the output ends of the two heat sinks 6 with the oxygen supply port and the air supply port of the external oxygen chamber, and a control panel 8 for control arranged on the upper end of one end surface of the box 1; the semiconductor cooling assembly 5 includes a fixing plate 51 arranged on the top surface of the two support beams 4, and two semiconductor cooling fins 52 arranged on the top surface of the fixing plate 51; the two heat sinks 6 are fitted on one side of the cooling end of the two semiconductor cooling fins 52.

[0021] Furthermore, a silicone sheet 9 is directly provided on one side of the cooling end of the two semiconductor cooling sheets 52 and the two heat sinks 6, so that the semiconductor cooling sheets 52 are in soft contact with the heat sink 6, thereby increasing the contact area and improving the cooling effect.

[0022] Furthermore, a plurality of heat dissipation openings 10 are provided on the bottom surface and the side walls of the box 1 to prevent the temperature inside the box 1 from being too high and affecting the operation of the equipment.

[0023] Furthermore, pulleys 11 are provided on the four corners of the bottom of the box 1 to facilitate movement.

[0024] During use: when it is necessary to supply oxygen and pressurize the external oxygen chamber, first start the oxygen production component 2, the air supply component 3 and the semiconductor refrigeration component, and then the oxygen and air in the oxygen production component 2 and the air supply component 3 enter the two heat sinks 6 respectively through the output ends of the oxygen production component 2 and the air supply component 3. At the same time, the semiconductor refrigeration plate is completely cooled. Since the two heat sinks 6 and the two semiconductor refrigeration plates are fitted and connected to each other, the two semiconductor refrigeration plates cool the oxygen and air in the two heat sinks 6, and the cooling temperature can be adjusted as required. Then the cooled oxygen and air enter the external oxygen chamber through the output ends of the two heat sinks 6. Since the oxygen production component 2 and the oxygen supply component are existing equipment, they are not described in detail.

[0025] The above are only specific application examples of the utility model, and do not constitute any limitation on the protection scope of the utility model. Any technical solution formed by equivalent transformation or equivalent replacement falls within the protection scope of the utility model.

Claims

1. An integrated gas-filling, refrigerating and oxygen-generating machine, characterized in that: The utility model comprises a box body, an oxygen production component and an air supply component for pressurizing the oxygen chamber, which are arranged side by side at the bottom of the box body, two support beams arranged on the inner walls on both sides of the box body and located above the oxygen production component and the air supply component, a semiconductor cooling component arranged on the top surfaces of the two support beams for cooling the oxygen and air in the oxygen production component and the air supply component, two heat sinks arranged on the cooling end of the semiconductor cooling component and whose input ends are respectively connected to the output ends of the oxygen production component and the air supply component, two pipe connectors arranged on one of the two support beams and one end of which passes through the side wall of the box body and is used to connect the output ends of the two heat sinks with the oxygen supply port and the air supply port of the external oxygen chamber, and a control panel arranged on the upper part of the end surface of one end of the box body for control.

2. The gas-charging, refrigerating and oxygen-generating integrated machine according to claim 1, characterized in that: The semiconductor cooling assembly comprises a fixing plate arranged on the top surfaces of the two support beams, and two semiconductor cooling fins arranged on the top surfaces of the fixing plate; and two heat sinks are arranged on one side of the cooling ends of the two semiconductor cooling fins.

3. The gas-charging, refrigerating and oxygen-generating integrated machine according to claim 2, characterized in that: A silicone sheet is directly arranged on one side of the cooling end of the two semiconductor cooling sheets and on the two heat sinks.

4. The gas-charging, refrigerating and oxygen-generating integrated machine according to claim 1, characterized in that: A plurality of heat dissipation openings are arranged on the bottom surface and side walls of the box body.

5. The gas-charging, refrigerating and oxygen-generating integrated machine according to any one of claims 1 to 4, characterized in that: Pulleys are arranged on the four corners of the bottom of the box.

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