Vacuum plasma reaction chamber device
By using the design of the insulating frame and electrode plate structure, the high energy consumption of the vacuum plasma reaction chamber, the insulation problems and inconvenient electrode switching are solved, and more efficient energy utilization and convenience of electrode direction switching are achieved.
Patent Information
- Application Number
- CN202420058960.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-10
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2034-01-10
AI Technical Summary
The vacuum plasma reaction chambers on the market have problems such as aluminum alloy cavity causing high energy consumption, Teflon insulation does not meet customer requirements, easy leakage in cooling methods, and inconvenient switching of positive and negative electrodes.
The insulating frame, the first electrode plate structure and the second electrode plate structure are surrounded to form a reaction chamber, and a quartz or ceramic insulating material is made of, with a heat dissipation runner to prevent water leakage, and the electrode direction is switched through the matcher.
It reduces energy consumption, meets customer's fluorine-free requirements, prevents water and air leakage, simplifies electrode direction switching, and improves energy utilization and uniformity.
Smart Images
Figure CN222214112U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a field technology, in particular to a vacuum plasma reaction chamber device. Background Art
[0002] The empty plasma reaction chambers on the market currently have the following problems:
[0003] 1. The small vacuum plasma chambers on the market now use aluminum alloy chambers, which means that in addition to the positive and negative electrodes, the surrounding areas are also metal. Because the aluminum alloy gold chamber acts as the negative electrode during RF discharge, some energy will be consumed around the chamber at this time, and higher power is required when the same effect is required.
[0004] 2. The insulation method of the electrodes inside some cavities on the market is generally Teflon insulation. Some customers require that the cavity should not contain fluorine for product reasons, so this method cannot be used.
[0005] 3. The cavity cooling method on the market is basically cooling on the vacuum electrode plate. At this time, the welding is not done well, there is a great risk of water leakage, and a slight vacuum cannot be drawn, which may cause a short circuit in severe cases.
[0006] 4. It is very inconvenient to switch between positive and negative electrodes on the market. Basically, after the design is completed, if you want to change the direction of the electrode, you need to make major changes, which is time-consuming and laborious. Utility Model Content
[0007] In view of this, the present invention aims to solve the deficiencies in the prior art, and its main purpose is to provide a vacuum plasma reaction chamber device, which solves the above four problems.
[0008] To achieve the above purpose, the utility model adopts the following technical solution: a vacuum plasma reaction chamber device, comprising:
[0009] an insulating frame having four walls connected end to end;
[0010] A first electrode plate structure, a sealing cover is opened at one side of the insulating frame, an air outlet is opened on the first electrode plate structure, and a first heat dissipation channel which is not connected to the reaction chamber is provided on the first electrode plate structure; and
[0011] A second electrode plate structure, a sealing cover is opened on the other side of the insulating frame, and an air inlet is provided on the second electrode plate structure; a reaction chamber is formed between the first electrode plate structure, the second electrode plate structure and the insulating frame; the first electrode plate structure and the second electrode plate structure are both conductively connected to the matcher, and a second heat dissipation channel which is not connected to the reaction chamber is provided on the second electrode plate structure.
[0012] In one embodiment, the insulating frame is an insulating frame made of quartz or ceramic insulation or other materials.
[0013] In one embodiment, the first heat dissipation channel is an air cooling channel or a water cooling channel.
[0014] In one embodiment, the second heat dissipation channel is an air cooling channel or a water cooling channel.
[0015] In one embodiment, the first electrode plate structure includes an upper electrode plate, an upper diverter plate and an upper heat dissipation plate stacked in sequence from bottom to top; the edge of the upper diverter plate is sealed and connected to the upper edge of the insulating frame, the upper electrode plate is located in the reaction chamber, and the upper electrode plate is provided with a plurality of air nozzles connected to the reaction chamber, and the plurality of air nozzles are also connected to the outlet flow channel on the upper diverter plate; the first heat dissipation channel is located in the upper heat dissipation plate.
[0016] In one embodiment, a conductive voltage strip is provided on the back side of the upper heat sink, and the conductive voltage strip is connected to the matcher through an electrode conductive mechanism.
[0017] In one embodiment, the second electrode plate structure includes a lower electrode plate, a lower diverter plate and a lower heat dissipation plate stacked in sequence from top to bottom; the lower electrode plate is located in the reaction chamber; the edge of the lower diverter plate is sealed with the lower edge of the insulating frame, and an inlet air flow channel is provided on the lower diverter plate, and the outlet end of the inlet air flow channel is connected to the reaction chamber; the second heat dissipation channel is located in the lower heat dissipation plate.
[0018] In one embodiment, the inlet flow channel includes two main grooves in an "X" shape, four branch grooves connected to the two ends of the two main grooves, and an outlet groove connected to the branch grooves. There are four outlet grooves, which are respectively connected to the corresponding branch grooves. The four outlet grooves are in the shape of a "mouth" and are connected from end to end, and each outlet groove is connected to the reaction chamber.
[0019] In one embodiment, a protective frame is provided outside the insulating frame, the first electrode plate structure and the second electrode plate structure.
[0020] In one embodiment, the protection frame and the insulation frame are provided with insulation strips, and insulation pads are provided between the protection frame and the first electrode plate structure and the second electrode plate structure.
[0021] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:
[0022] The reaction chamber is formed by using an insulating frame, a first electrode plate structure and a second electrode plate structure. Compared with the traditional aluminum alloy cavity, energy consumption can be reduced. The insulating frame replaces the traditional Teflon coating insulation to meet customer needs. The first heat dissipation channel on the first electrode plate structure and the second heat dissipation channel on the second electrode plate structure do not enter the vacuum interior, effectively preventing the risk of water leakage and air leakage.
[0023] By switching the connection mode between the matcher and the first electrode plate structure and the second electrode plate structure, the first electrode plate structure and the second electrode plate structure can be used as positive and negative electrodes, thereby being compatible with positive and negative electrode switching and being more convenient to use.
[0024] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 It is a three-dimensional diagram of a reaction chamber device provided in an embodiment of the utility model;
[0026] Figure 2 is a cross-sectional view of a reaction chamber device provided in an embodiment of the utility model;
[0027] Figure 3 This is an exploded view from the first perspective of the reaction chamber device provided by the embodiment of the utility model;
[0028] Figure 4 This is a second perspective exploded view of the reaction chamber device provided by an embodiment of the utility model;
[0029] Figure 5 It is a partial first exploded view provided by an embodiment of the utility model;
[0030] Figure 6 It is a partial second exploded view provided by an embodiment of the utility model;
[0031] Figure 7 is a cross-sectional view of an upper heat dissipation plate provided by an embodiment of the utility model;
[0032] Figure 8 It is a cross-sectional view of a lower heat dissipation plate provided by an embodiment of the utility model.
[0033] Reference numerals:
[0034] 10. Insulation frame 11. Wall
[0035] 101, reaction chamber 20, first electrode plate structure
[0036] 21. Upper electrode plate 22. Upper shunt plate
[0037] 23. Upper heat sink 24. Air nozzle
[0038] 201, first heat dissipation channel 202, outlet channel
[0039] 30. Second electrode plate structure 31. Lower electrode plate
[0040] 32. Lower manifold 33. Lower heat sink
[0041] 301, second heat dissipation channel 302, intake channel
[0042] 321, main flow channel 322, branch flow channel
[0043] 323, air outlet 40, matching device
[0044] 51. Conductive voltage bar 52. Electrode conductive mechanism
[0045] 61. Protection framework
[0046] 62. Insulation strip 63. Insulation pad. DETAILED DESCRIPTION
[0047] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0048] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0049] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0050] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0051] See also Figures 1 to 8As shown, the present application provides a vacuum plasma reaction chamber device, including an insulating frame 10 having four walls 11 connected end to end, and the insulating frame 10 replaces the traditional Teflon coating insulation to meet the needs of customers. A first electrode plate structure 20, a sealing cover is opened on one side of the insulating frame 10, and an air outlet is opened on the first electrode plate structure 20 for the flow of process gas, and a first heat dissipation channel 201 that is not connected to the reaction chamber 101 is provided on the first electrode plate structure 20.
[0052] The second electrode plate structure 30 has a sealing cover that opens on the other side of the insulating frame 10. An air inlet is provided on the second electrode plate structure 30 for process gas to enter the reaction chamber 101. The first electrode plate structure 20, the second electrode plate structure 30 and the insulating frame 10 enclose the reaction chamber 101. By using the insulating frame, the first electrode plate structure and the second electrode plate structure to enclose the reaction chamber, compared with the traditional use of an aluminum alloy chamber, energy consumption can be reduced. Moreover, since the chamber has only upper and lower electrodes and no other metals (currently insulating materials) around it, there is only one direction when the electrode discharges. At this time, the energy utilization rate is increased, and there is no interference from the discharge direction around it, and the uniformity is increased, and the effect is enhanced. The front of the first electrode plate structure 20 and the second electrode plate structure 30 are in the vacuum (reaction chamber), and the back is in the atmosphere, which is conducive to heat dissipation.
[0053] The first electrode plate structure 20 and the second electrode plate structure 30 are both conductively connected to the matcher 40. By switching the connection method between the matcher 40 and the first electrode plate structure 20 and the second electrode plate structure 30, the first electrode plate structure 20 and the second electrode plate structure 30 can be used as positive and negative electrodes, thereby being compatible with positive and negative electrode switching and being more convenient to use.
[0054] The second electrode plate structure 30 is provided with a second heat dissipation channel 301 which is not connected to the reaction chamber 101. The first heat dissipation channel 201 and the second heat dissipation channel 301 do not enter the reaction chamber, which effectively prevents the risk of water leakage and air leakage. In addition, the reaction chamber of this structure has fewer threaded holes than the traditional reaction chamber, and plasma is not easy to gather, avoiding affecting the uniformity.
[0055] In one embodiment, the insulating frame 10 is an insulating frame 10 made of quartz or ceramic insulating material. Using an insulating frame made of quartz or ceramic material to replace the Teflon coating makes the cavity free of Teflon insulating material and can meet all customer requirements.
[0056] In one embodiment, the first heat dissipation channel 201 is an air cooling channel or a water cooling channel. The second heat dissipation channel 301 is an air cooling channel or a water cooling channel. By circulating cold air or cold water in the first heat dissipation channel 201 and the second heat dissipation channel 301, the heat on the first electrode plate structure 20 and the second electrode plate structure 30 is taken away to ensure the working environment.
[0057] In one embodiment, the first electrode plate structure 20 includes an upper electrode plate 21, an upper diverter plate 22 and an upper heat sink 23 stacked in sequence from bottom to top; the edge of the upper diverter plate 22 is sealed to the upper edge of the insulating frame 10, and optionally, a sealing ring is provided at the connection between the two to ensure air tightness.
[0058] The upper electrode plate 21 is located in the reaction chamber 101, and is provided with a plurality of gas nozzles 24 connected to the reaction chamber 101. The plurality of gas nozzles 24 are also connected to the outlet flow channel 202 on the upper diverter plate 22. The process gas in the reaction chamber 101 enters the outlet flow channel 202 through the plurality of gas nozzles 24, thereby effectively ensuring the uniformity of the process gas flow in the reaction chamber. The process gas entering the outlet flow channel 202 is then discharged through the gas pipe joint to form a gas cycle. The first heat dissipation channel 201 is located in the upper heat dissipation plate 23.
[0059] In one embodiment, a conductive voltage bar 51 is disposed on the back of the upper heat dissipation plate 23 , and the conductive voltage bar 51 is connected to the matcher 40 via an electrode conductive mechanism 52 .
[0060] In one embodiment, the second electrode plate structure 30 includes a lower electrode plate 31, a lower diverter plate 32, and a lower heat sink 33 stacked in sequence from top to bottom; the lower electrode plate 31 is located in the reaction chamber 101; the edge of the lower diverter plate 32 is sealed and connected to the lower edge of the insulating frame 10, and an inlet flow channel 302 is provided on the lower diverter plate 32, and the outlet end of the inlet flow channel 302 is connected to the reaction chamber 101, and the inlet flow channel 302 evenly diverts the process gas to ensure that the process gas enters the reaction chamber more evenly. The second heat sink 301 is located in the lower heat sink 33.
[0061] In one embodiment, the inlet flow channel 302 includes two main flow channels 321 in an "X" shape, four branch flow channels 322 connected to both ends of the two main flow channels 321, and gas outlet channels 323 connected to the branch flow channels 322. There are four gas outlet channels 323, which are connected to the corresponding branch flow channels 322 respectively. The four gas outlet channels 323 are in the shape of a "mouth" and are connected from end to end, and each gas outlet channel 323 is connected to the reaction chamber 101. The inlet flow channel 302 with this structure makes the flow of process gas very uniform and can ensure that the gas can enter the reaction chamber sufficiently.
[0062] In one embodiment, a protective frame 61 is provided outside the insulating frame 10, the first electrode plate structure 20 and the second electrode plate structure 30. The protective frame 61 and the insulating frame 10 are provided with an insulating strip 62, and optionally, the insulating strip 62 is a quartz strip; an insulating pad 63 is provided between the protective frame 61 and the first electrode plate structure 20 and the second electrode plate structure 30 to ensure insulation between the components.
[0063] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A vacuum plasma reaction chamber device, characterized in that: include, an insulating frame having four walls connected end to end; A first electrode plate structure, a sealing cover is opened at one side of the insulating frame, an air outlet is opened on the first electrode plate structure, and a first heat dissipation channel which is not connected to the reaction chamber is provided on the first electrode plate structure; and A second electrode plate structure, a sealing cover is opened on the other side of the insulating frame, and an air inlet is provided on the second electrode plate structure; a reaction chamber is formed between the first electrode plate structure, the second electrode plate structure and the insulating frame; the first electrode plate structure and the second electrode plate structure are both conductively connected to the matcher, and a second heat dissipation channel which is not connected to the reaction chamber is provided on the second electrode plate structure.
2. The vacuum plasma reaction chamber device according to claim 1, characterized in that: The insulating frame is made of quartz or ceramic insulating material.
3. The vacuum plasma reaction chamber device according to claim 1, characterized in that: The first heat dissipation channel is an air cooling channel or a water cooling channel.
4. The vacuum plasma reaction chamber device according to claim 1, characterized in that: The second heat dissipation channel is an air cooling channel or a water cooling channel.
5. The vacuum plasma reaction chamber device according to claim 1, characterized in that: The first electrode plate structure includes an upper electrode plate, an upper diverter plate and an upper heat dissipation plate stacked in sequence from bottom to top; the edge of the upper diverter plate is sealed and connected to the upper edge of the insulating frame, the upper electrode plate is located in the reaction chamber, and the upper electrode plate is provided with a plurality of air nozzles connected to the reaction chamber, and the plurality of air nozzles are also connected to the outlet air flow channel on the upper diverter plate; the first heat dissipation channel is located in the upper heat dissipation plate.
6. The vacuum plasma reaction chamber device according to claim 5, characterized in that: A conductive voltage strip is provided on the back of the upper heat sink, and the conductive voltage strip is connected to the matcher through an electrode conductive mechanism.
7. The vacuum plasma reaction chamber device according to claim 1, characterized in that: The second electrode plate structure includes a lower electrode plate, a lower diverter plate and a lower heat dissipation plate stacked in sequence from top to bottom; the lower electrode plate is located in the reaction chamber; the edge of the lower diverter plate is sealed with the lower edge of the insulating frame, and an inlet flow channel is provided on the lower diverter plate, and the outlet end of the inlet flow channel is connected to the reaction chamber; the second heat dissipation channel is located in the lower heat dissipation plate.
8. The vacuum plasma reaction chamber device according to claim 7, characterized in that: The inlet flow channel includes two main grooves in an "X" shape, four branch grooves connected to the two ends of the two main grooves, and an outlet groove connected to the branch grooves. There are four outlet grooves, which are respectively connected to the corresponding branch grooves. The four outlet grooves are in the shape of a "mouth" and are connected from end to end, and each outlet groove is connected to the reaction chamber.
9. The vacuum plasma reaction chamber device according to claim 1, characterized in that: A protective frame is disposed outside the insulating frame, the first electrode plate structure and the second electrode plate structure.
10. The vacuum plasma reaction chamber device according to claim 9, characterized in that: The protection frame and the insulation frame are provided with insulation strips, and insulation pads are provided between the protection frame and the first electrode plate structure and the second electrode plate structure.