Semiconductor liquid supply device and semiconductor cleaning system

Abstract

According to the semiconductor liquid supply device and the semiconductor cleaning system, through the arrangement of the liquid supply device and the liquid mixing device, the mixing valve is used for mixing the solution so as to prepare the cleaning liquid needed for cleaning the semiconductor wafer, a large-size storage tank in the prior art is avoided, the space utilization rate is effectively increased, and the size of the semiconductor cleaning device is reduced; meanwhile, through the cooperative use of the mixing valve, the flow meter and the needle valve, online preparation of the cleaning fluid is achieved, the cleaning fluid can be flexibly and accurately prepared, the production cost and the time cost in the semiconductor wafer cleaning process are reduced, and the higher cleaning requirement is met.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor cleaning, and more particularly to a semiconductor cleaning system, and more particularly to a semiconductor liquid supply device and a semiconductor cleaning system. Background Art

[0002] In the semiconductor production process, in order to minimize the impact of impurities on chip yield, semiconductor wafer cleaning is very important. Wet cleaning is the use of various solutions to remove impurities or make them fall off through corrosion, dissolution, chemical reaction and other methods. At present, the market is dominated by wet cleaning, among which single-wafer and tank cleaning equipment are the mainstream cleaning equipment. Single-wafer cleaning is gradually replacing tank cleaning and becoming the mainstream of cleaning equipment because it is more thorough.

[0003] At present, the liquid supply systems of most single-wafer cleaning equipment on the market are to mix the liquid into a storage tank and then supply the liquid into the cavity. However, during the cleaning process, the cleaning liquid needs to be changed accordingly for different types of pollutants, and the existing liquid supply system can only provide a single solution with a fixed solution ratio, and cannot flexibly change the solution ratio, which is difficult to meet the actual market needs. In addition, the existing liquid supply system occupies a large space, which makes the current cleaning equipment production cost high, which is not conducive to the practical application of semiconductor wafer cleaning.

[0004] Therefore, how to reduce the volume of semiconductor cleaning equipment and change the solution ratio in real time is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a semiconductor liquid supply device and a semiconductor cleaning system to solve the problem that the semiconductor liquid supply equipment occupies a large space and can only provide a single cleaning liquid.

[0006] To achieve the above-mentioned purpose and other related purposes, in a first aspect, the present application provides a semiconductor liquid supply device, comprising at least one set of liquid supply equipment and a liquid mixing device connected to all the liquid supply equipment;

[0007] The liquid supply device comprises a liquid supply inlet port, a buffer, a delivery pump, and a liquid supply outlet port which are sequentially connected through pipelines;

[0008] The liquid mixing device includes a liquid mixing inlet port group, a first flow controller, a mixing valve and at least one liquid mixing outlet port connected in sequence by pipelines, and the liquid mixing inlet port group includes at least one liquid mixing inlet port; wherein the liquid supply outlet port of each set of the liquid supply device is only connected to one liquid mixing inlet port in the liquid mixing inlet port group in a one-to-one correspondence.

[0009] The mixing valve can mix solutions in real time without the need for a storage tank to store liquid, which greatly reduces the volume of the semiconductor liquid supply device, effectively improves space utilization, and thus reduces production costs. The first flow controller can accurately control the amount of solution entering the mixing valve to make the solution ratio more accurate and achieve higher cleaning requirements. At the same time, multiple liquid supply devices can provide a variety of different solutions, which enter the mixing device through different mixing liquid inlet ports, achieving flexible and changeable cleaning liquid ratios to meet different cleaning requirements.

[0010] Preferably, the liquid supply device further comprises a first filter and a second filter;

[0011] The first filter is arranged on the pipeline between the liquid supply inlet port and the buffer, and the second filter is arranged on the pipeline between the delivery pump and the liquid supply outlet port.

[0012] The first filter and the second filter are used to filter the solution to obtain a cleaner solution to meet higher cleaning requirements.

[0013] Preferably, the liquid supply device further comprises: a first manual valve and a first pneumatic valve which are sequentially arranged on the pipeline between the liquid supply inlet port and the first filter.

[0014] The first manual valve and the first pneumatic valve are used to control the solution to enter the liquid supply device.

[0015] Preferably, the liquid supply device further comprises a liquid supply flow meter, which is arranged on the pipeline between the second filter and the liquid supply outlet port.

[0016] The liquid supply flow meter is used to accurately measure the amount of solution output by the liquid supply device. The solution enters the liquid mixing system through the liquid supply system for mixing. The liquid supply flow meter can obtain the accurate amount of solution to accurately control the solution ratio.

[0017] Preferably, the liquid supply device further comprises a liquid supply water inlet port; the liquid supply water inlet port is connected to the buffer via a pipeline.

[0018] The liquid supply water inlet port is used to transport pure water into the liquid supply device so that the pure water can enter the liquid supply device for cleaning, thereby avoiding the influence of the liquid remaining in the pipeline on the solution ratio accuracy after each solution ratio.

[0019] Preferably, the liquid supply device further comprises: a second manual valve and a second pneumatic valve which are sequentially arranged on the pipeline between the liquid supply water inlet port and the buffer, and are used to control the pure water to enter the liquid supply device.

[0020] Preferably, the liquid supply device further comprises a liquid level sensor arranged in the buffer, for detecting whether the amount of solution received in the buffer reaches a required liquid level.

[0021] Preferably, the liquid mixing device also includes a second flow controller, which is arranged on the pipeline between the mixing valve and the liquid mixing outlet port, and is used to control the amount of solution output from the liquid mixing device, so as to accurately control the amount of cleaning liquid for cleaning the wafer and save costs.

[0022] Preferably, the first flow controller includes a first flow meter and a first needle valve; the second flow controller includes a second flow meter and a second needle valve.

[0023] The first and second flow meters are used to accurately measure the amount of solution passing through; the first and second needle valves are used to control the delivery of the solution, and are fine-tuning valves. When the first and second needle valves are closed, the solution stops being delivered, and when the first and second needle valves are opened, the solution continues to be delivered. By using the flow meter and the needle valve in combination, the solution flow can be precisely controlled.

[0024] In a second aspect, the present application also provides a semiconductor cleaning system, comprising:

[0025] A semiconductor liquid supply device and a cleaning chamber connected by a pipeline;

[0026] Wherein, the semiconductor liquid supply device is the aforementioned semiconductor liquid supply device.

[0027] The semiconductor liquid supply device is used to transport the solution to the cleaning chamber; the cleaning chamber is used to store the cleaning solution provided by the semiconductor liquid supply device and the wafer to be cleaned, and to achieve cleaning of the semiconductor wafer.

[0028] As described above, the present application provides a semiconductor liquid supply device and a semiconductor cleaning system. The mixing valve is used to perform real-time solution mixing. There is no need for a storage tank to store liquid, which greatly reduces the volume of the semiconductor liquid supply device, effectively improves space utilization, and reduces the space required for the semiconductor cleaning system, thereby reducing production costs. At the same time, the first flow controller accurately controls the flow rate of the solution, effectively improves the accuracy of the solution, and achieves higher cleaning requirements. At the same time, the first pneumatic valve, the first manual valve, and the delivery pump control whether each liquid supply unit supplies liquid, and further controls the composition of the cleaning liquid. By adjusting the first flow controller, the ratio of each solution is changed, and the cleaning solution can be flexibly changed to meet different cleaning requirements. The present application can reduce the space occupied by the semiconductor cleaning system, and provide a variety of cleaning solutions with precise ratios to achieve better wafer cleaning effects, which is conducive to the practical application of semiconductor cleaning systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Shown is a schematic diagram of the connection relationship of the semiconductor cleaning system described in an embodiment of the present application.

[0030] Figure 2 Shown is a schematic diagram of the structure of the liquid supply equipment described in an embodiment of the present application.

[0031] Figure 3 Shown is a schematic diagram of the structure of the liquid mixing equipment described in an embodiment of the present application.

[0032] Figure 4 Shown is a schematic diagram of the structure of a semiconductor cleaning system described in an embodiment of the present application.

[0033] Component number description

[0034] 100 Liquid supply equipment

[0035] 110 Pipe

[0036] 111 Fluid supply inlet port

[0037] 112 First manual valve

[0038] 113 First pneumatic valve

[0039] 114 First Filter

[0040] 121 Liquid supply inlet port

[0041] 122 Second manual valve

[0042] 123 Second pneumatic valve

[0043] 131 Buffer

[0044] 132 Liquid level sensor

[0045] 141 Delivery Pump

[0046] 142 Output pneumatic valve

[0047] 143 Second filter

[0048] 144 Liquid supply flow meter

[0049] 145 Liquid supply outlet port

[0050] 200 Liquid mixing equipment

[0051] 210 Mixed liquid inlet port group

[0052] 211 Mixed liquid inlet port

[0053] 220 First flow controller

[0054] 221 First Flow Meter

[0055] 222 First needle valve

[0056] 230 Mixing valve

[0057] 240 Second flow controller

[0058] 241 Second flow meter

[0059] 242 Second needle valve

[0060] 250 Mixed liquid outlet port

[0061] 300 Cleaning chamber DETAILED DESCRIPTION

[0062] The following describes the embodiments of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0063] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present application in a schematic manner, and therefore the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0064] The present embodiment provides a semiconductor liquid supply device. In the semiconductor single-wafer cleaning process, liquid supply and liquid replenishment are very critical. If the cleaning liquid is placed in a storage tank after being proportioned and supplied to the semiconductor cleaning equipment, the cleaning equipment will occupy a large space, and the proportion of the cleaning liquid is fixed, which cannot meet higher cleaning requirements. Based on this, the present embodiment proposes a semiconductor liquid supply device that occupies a small space and can accurately configure a variety of different cleaning liquids. The following will be combined with the accompanying drawings to explain in detail the principle and implementation of a semiconductor liquid supply device of this embodiment, so that those skilled in the art can understand the semiconductor liquid supply device of this embodiment without creative work.

[0065] like Figure 1As shown, the semiconductor liquid supply device includes a liquid supply device 100 and a liquid mixing device 200, wherein the liquid supply device 100 receives the original solution required for configuring the cleaning liquid, and the original solution is heated and filtered here, and then flows into the liquid mixing device 200 through the liquid supply device 100. The original solution is precisely controlled and configured into the required cleaning liquid in the liquid mixing device 200, and finally enters the cleaning chamber 300.

[0066] like Figure 2 As shown, the liquid supply device 100 is sequentially provided on the pipeline 110 with: a liquid supply inlet port 111, a buffer 131, a delivery pump 141, and a liquid supply outlet port 145. Among them, the liquid supply inlet port 111 is the pipeline inlet, and the liquid supply outlet port 145 is the pipeline outlet.

[0067] The buffer 131 disposed before the delivery pump 141 can store a small amount of solution to stabilize the solution pressure, so as to obtain a more stable solution flow rate, and then the delivery pump 141 is used to provide power for solution delivery. It should be noted that the buffer 131 temporarily stores less solution, which is smaller in volume than the storage tank in the prior art, effectively reducing the volume of the liquid supply device 100, and further reducing the volume of the semiconductor cleaning system.

[0068] Meanwhile, the buffer 131 can also be used in combination with a liquid level sensor 132. The liquid level sensor 132 can detect whether the liquid pressure in the buffer reaches a preset value, so as to further stabilize the flow rate of the solution.

[0069] The working mode of the liquid supply device 100 will be described in detail below. Figure 2 . Open the first manual valve 112 and the first pneumatic valve 113, the original solution enters the liquid supply device 100 from the liquid supply inlet port 111, is powered by the delivery pump 141 to continue to flow forward, and finally flows out from the liquid supply outlet port 145 to enter the liquid mixing device 200. It should be noted that in addition to setting the first manual valve 112 and the first pneumatic valve 113 at the liquid inlet port to control the input of the solution, the output pneumatic valve 142 can also be set at the liquid outlet port to control the output of the solution. The output pneumatic valve 142 should be located close to the liquid supply outlet port 145, such as Figure 2 As shown, it is arranged after the delivery pump 141, but is not limited thereto.

[0070] Furthermore, a liquid supply flow meter 144 is provided in front of the liquid supply outlet port 145 to measure the amount of solution output by the liquid supply device 100, so as to accurately control the liquid flow output by the liquid supply device 100, thereby further making the volume of the cleaning liquid finally provided to the cleaning chamber 300 more accurate and the proportioning accuracy higher.

[0071] Since the wet cleaning equipment has a high cleanliness requirement for the required chemical solution, the original solution is filtered by the first filter 114 to obtain a clean solution before entering the buffer 131. Furthermore, the original solution is filtered by the second filter 143 before flowing out from the liquid supply and outlet port 145 to further remove impurities and obtain a cleaner solution.

[0072] Furthermore, the pipe used to transport the solution in this embodiment is preferably a fluororesin pipe, but is not limited thereto. Since the fluororesin pipe has the characteristics of corrosion resistance and chemical resistance, it can be used as a pipe for transporting the original cleaning solution to further obtain a cleaner solution. Figure 2 As shown, the liquid supply device 100 of this embodiment also includes a liquid supply water inlet pipeline 120, which is used to connect pure water to clean various pipeline components in the entire liquid supply device 100 to prevent impurities or solution residues in the pipeline from affecting the cleanliness of the transported solution.

[0073] See also Figure 2 , pure water enters through the liquid supply water inlet port 121 and is transported to the buffer 131 through a pipeline. Thereafter, the pipeline path through which the pure water passes completely overlaps with the pipeline path through which the original solution passes, so as to facilitate the cleaning of the entire liquid supply device 100. Further, the entry of pure water is controlled by the second manual valve 122 and the second pneumatic valve 123. When cleaning is required, the second manual valve 122 and the second pneumatic valve 123 are opened, and pure water enters the liquid supply device 100, passes through the entire pipeline and various components of the liquid supply device 200, and finally flows out from the liquid supply outlet port 145. It should be noted that the pure water mentioned in this embodiment refers to H2O without impurities. For example, it can be distilled water, water filtered by a water purifier, or water purified by other means.

[0074] Furthermore, since the solution may need to be heated in actual applications, a heating device may be added to the liquid supply device 200 , specifically, it may be arranged after the delivery pump 141 (not shown in the figure).

[0075] As described above, the original solution required for preparing the cleaning solution leaves the liquid supply device 100 through the liquid supply outlet port 145 after being heated and filtered, and enters the liquid mixing device 200 , where the original solution is prepared into the required cleaning solution.

[0076] like Figure 3As shown, the straight line shown in the figure is an infusion pipeline, and the mixing device 200 includes multiple pipelines, which include a liquid inlet pipeline and a liquid outlet pipeline. Among them, the inlet of the liquid inlet pipeline is set as a mixed liquid inlet port 211, and multiple mixed liquid inlet ports 211 are combined into a mixed liquid inlet port group 210, and each mixed liquid inlet port 211 is connected to a liquid supply outlet port 145 of a liquid supply device 100 in a one-to-one correspondence. A first flow controller 220 is provided on each liquid inlet pipeline, and the outlet is connected to the inlet of the mixing valve 230, which is used to transport the original solution required for configuring the cleaning solution into the mixing valve 230 for mixing. The inlet of the liquid outlet pipeline is connected to the outlet of the mixing valve 230, and the outlet is a mixed liquid outlet port 250, which is used to output the cleaning solution mixed by the mixing valve 230 to the cleaning chamber, and a second flow controller 240 is provided on each liquid outlet pipeline.

[0077] Specifically, see Figure 3 The raw solution enters the liquid mixing device 200 from the liquid mixing inlet port group 210, wherein, according to the specific requirements of the configured cleaning solution, multiple raw solutions may be required for configuration. Accordingly, the liquid mixing inlet port group 210 has multiple liquid mixing inlet ports 211, which are connected to multiple liquid supply devices 100 one by one to provide different raw solutions.

[0078] The raw solutions entering the liquid mixing device 200 are mixed in the mixing valve 230. The mixing valve 230 has different inlets for receiving different raw solutions. Figure 3 As shown, manual valves can be installed at each inlet of the mixing valve, and the manual valve corresponding to the original solution required for configuring the cleaning liquid is opened to allow it to enter the mixing valve 230. After sufficient mixing inside the mixing valve 230, the manual valve at the outlet of the mixing valve is opened, and the mixed solution is output through the pipeline, that is, the configured cleaning liquid, and supplied to the cleaning chamber 300 through the mixed liquid outlet port 250 for cleaning the semiconductor wafer. In this embodiment, the cleaning liquid is mixed online through the mixing valve 230 and is delivered to the cleaning chamber 300 in real time. The storage tank of the traditional cleaning equipment is not required to store the well-proportioned cleaning liquid, which greatly reduces the volume of the semiconductor liquid supply device, effectively improves the space utilization rate, reduces the cleaning cost of the semiconductor wafer, and is conducive to the development of the semiconductor industry.

[0079] Furthermore, in order to make the ratio of the cleaning liquid more accurate and achieve a better cleaning effect, the present embodiment further adds a first flow controller 220 to precisely measure and control the amount and ratio of the original solution entering the mixing valve 230 to ensure the accuracy of the configured cleaning liquid ratio. At the same time, the state of the first flow controller 220 can be changed in real time according to the actual situation to flexibly change the ratio of each original solution and realize a variety of cleaning liquid configurations, which is convenient and simple. Compared with the existing method of placing the configured cleaning liquid in a storage tank for liquid supply, the present embodiment greatly reduces the time cost and production cost of replacing the cleaning liquid and can meet higher cleaning requirements.

[0080] Specifically, see Figure 3 The first flow controller 220 includes a first flow meter 221 and a first needle valve 222. The first flow meter 221 can accurately measure the instantaneous flow of the solution, and the first needle valve 222 is a fine-tuning valve that can continuously and finely adjust the flow of the solution. By adjusting the first needle valve 222, the amount of the original solution entering the mixing valve can be accurately controlled according to the value displayed by the first flow meter 221.

[0081] Furthermore, in order to accurately control the flow rate of the cleaning liquid entering the cleaning chamber 300, a second flow controller 240 is provided before the mixed liquid outlet port 250. Similarly, the second flow controller 240 includes a second flow meter 241 and a second needle valve 242, and the second needle valve 242 can continuously and finely adjust the flow rate of the cleaning liquid, and obtain a specific instantaneous flow rate through the second flow meter 241 to achieve accurate control, so that the cleaning liquid in the cleaning chamber 300 reaches the highest cleaning efficiency while avoiding waste, thereby reducing production costs.

[0082] It should be noted that the present embodiment may include a plurality of mixed liquid outlet ports 250 to supply a plurality of cleaning chambers 300 .

[0083] For example, a specific example will be used below to illustrate:

[0084] See also Figure 3 In this embodiment, the liquid mixing device 200 has four liquid mixing inlet ports 210, corresponding to pipes a, b, c, and d, wherein solution a enters pipe a, solution b enters pipe b, solution c enters pipe c, and solution d enters pipe d. Two cleaning liquids need to be configured, and enter two cleaning chambers E and F through pipes E and F, respectively, wherein pipe E transports cleaning liquid E, and pipe F transports cleaning liquid F. For example, the preparation ratio of cleaning liquid E is a:b:c=1:1:1, and the preparation ratio of cleaning liquid F is b:c:d=2:1:1. The configuration method is as follows:

[0085] Open the manual valve of the mixing valve 230 corresponding to the pipelines a, b, and c and adjust the corresponding first needle valve 222, so that the solutions a, b, and c enter the mixing valve 230, and the instantaneous flow ratio displayed by the corresponding first flow meter 221 is a:b:c=1:1:1. After the solutions are fully mixed in the mixing valve 230, open the manual valve of the mixing valve 230 on the pipeline E, so that the configured cleaning liquid E is supplied to the cleaning chamber E, and the flow of the cleaning liquid E is controlled by the second flow meter 241 and the second needle valve 242 on the pipeline E. After the cleaning in the cleaning chamber E is completed, stop the configuration of the cleaning liquid E and close the manual valve on the pipeline E.

[0086] Close the manual valve of the mixing valve 230 corresponding to the pipeline a, open the manual valve of the mixing valve 230 corresponding to the pipelines b, c, d and adjust the corresponding first needle valve 222, so that the solutions a, b, c enter the mixing valve 230, and the instantaneous flow ratio displayed by the corresponding first flow meter 221 is b:c:d=2:1:1. After the solutions are fully mixed in the mixing valve 230, open the manual valve of the mixing valve 230 on the pipeline F, so that the configured cleaning liquid F is supplied to the cleaning chamber F, and the flow rate of the cleaning liquid F is controlled by the second flow meter 241 and the second needle valve 242 on the pipeline F. After the cleaning in the cleaning chamber F is completed, stop the configuration of the cleaning liquid F and close the manual valve on the pipeline F.

[0087] As described above, the configuration of multiple cleaning liquids can be completed and supplied to different cleaning chambers. It should be noted that the configuration method of multiple cleaning liquids and the specific setting of the liquid mixing device 200 are not limited to the above embodiment. The required original solution can be multiple or single, and the configured cleaning liquid can be different original solutions, different ratios, or different original solutions and ratios. The cleaning liquids delivered to multiple cleaning chambers 300 can be the same or different. The specific situation should be set by the technician according to actual needs.

[0088] In summary, the first flow controller 220 of this embodiment can accurately control the type and proportion of the original solution of the cleaning solution through the above-mentioned implementation method, realize the accurate proportion of the solution, and achieve higher cleaning requirements. Combined with the mixing valve 230, real-time mixing of the solution can be achieved, which not only avoids the use of a bulky storage tank, but also facilitates the miniaturization of the semiconductor liquid supply device, and at the same time enables the semiconductor liquid supply device to provide different cleaning solutions, greatly reducing the cost of the semiconductor cleaning process, which is beneficial to the cleaning of semiconductor wafers.

[0089] like Figure 4As shown, this embodiment also provides a semiconductor liquid supply cleaning system, which includes a liquid supply device 100, a liquid mixing device 200 and a cleaning chamber 300. The liquid supply device 100 heats and filters the original solution of the cleaning liquid to be configured, and transports it to the liquid mixing device 200; the liquid mixing device 200 can be connected to multiple liquid supply devices to receive different original solutions and configure the required cleaning liquid; the original solution is mixed and configured inside the liquid mixing device 200, and is transported to the cleaning chamber 300 for cleaning semiconductor wafers. The number of cleaning chambers 300 can be multiple, for example, Figure 4 As shown, there are two cleaning chambers E and F. The cleaning liquids entering the two cleaning chambers can be two cleaning liquids with different original solutions or different ratios, or they can be the same two cleaning liquids. Alternatively, the amount of cleaning liquid required in the two cleaning chambers 300 may be different, which can also be achieved by controlling the liquid mixing device 200. Specifically, it is achieved through the second flow controller 240, the second flow meter 241 can obtain the precise and specific amount of solution entering the cleaning chamber, and control whether the cleaning liquid continues to enter the cleaning chamber through the second needle valve 242. Furthermore, the cleaning chamber 300 can also be set to other reasonable numbers, and the specific situation should be set by the technician according to actual needs.

[0090] This embodiment connects the cleaning chamber to the semiconductor liquid supply device to achieve liquid supply and cleaning of the semiconductor cleaning system. The type and amount of the cleaning liquid entering the cleaning chamber can be accurately controlled and flexibly changed. The semiconductor cleaning system provided by this embodiment is small in size, which reduces the cost of the wafer cleaning process and is beneficial to the development of the semiconductor industry.

[0091] It should be noted that, in the description of this specification, "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or structures. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features or structures. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0092] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A semiconductor liquid supply device, characterized in that: It includes at least one set of liquid supply equipment and a liquid mixing device connected to all the liquid supply equipment; The liquid supply device comprises a liquid supply inlet port, a buffer, a delivery pump and a liquid supply outlet port which are sequentially connected through pipelines; The liquid mixing device comprises a liquid mixing inlet port group, a first flow controller, a mixing valve and at least one liquid mixing outlet port connected in sequence through pipelines, and the liquid mixing inlet port group comprises at least one liquid mixing inlet port; The liquid supply outlet port of each set of the liquid supply equipment is connected to only one mixed liquid inlet port in the mixed liquid inlet port group in a one-to-one correspondence.

2. The semiconductor liquid supply device according to claim 1, characterized in that: The liquid supply device also includes a first filter and a second filter; The first filter is arranged on the pipeline between the liquid supply inlet port and the buffer, and the second filter is arranged on the pipeline between the delivery pump and the liquid supply outlet port.

3. The semiconductor liquid supply device according to claim 2, characterized in that: The liquid supply device further comprises: a first manual valve and a first pneumatic valve which are sequentially arranged on the pipeline between the liquid supply inlet port and the first filter.

4. The semiconductor liquid supply device according to claim 2, characterized in that: The liquid supply device also includes a liquid supply flow meter, which is arranged on the pipeline between the second filter and the liquid supply outlet port.

5. The semiconductor liquid supply device according to claim 1, characterized in that: The liquid supply device also includes a liquid supply water inlet port; the liquid supply water inlet port is connected to the buffer through a pipeline.

6. The semiconductor liquid supply device according to claim 5, characterized in that: The liquid supply device further comprises: a second manual valve and a second pneumatic valve which are sequentially arranged on the pipeline between the liquid supply water inlet port and the buffer.

7. The semiconductor liquid supply device according to claim 1, characterized in that: The liquid supply device also includes a liquid level sensor arranged in the buffer.

8. The semiconductor liquid supply device according to claim 1, characterized in that: The liquid mixing device further comprises a second flow controller, which is arranged on a pipeline between the mixing valve and the liquid mixing outlet port.

9. The semiconductor liquid supply device according to claim 8, characterized in that: The first flow controller includes a first flow meter and a first needle valve; the second flow controller includes a second flow meter and a second needle valve.

10. A semiconductor cleaning system, characterized in that: include: A semiconductor liquid supply device and a cleaning chamber connected by a pipeline; Wherein, the semiconductor liquid supply device is the semiconductor liquid supply device described in any one of claims 1-9.

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