Semiconductor lead frame

Abstract

The utility model relates to the field of semiconductors, in particular to a semiconductor lead frame, which is characterized in that a radiating plate is fixedly arranged below a lead frame body, a plurality of radiating fins are arranged at the lower end of the radiating plate, a limiting groove is arranged at the bottom of a side plate, two ends of a bottom plate are fixed inside the limiting groove, an air outlet plate is arranged at the upper end of the bottom plate, and the air outlet plate is arranged at the lower end of the bottom plate. A plurality of air outlet holes are formed in the air outlet plate, a fan is fixedly arranged at the lower end of the bottom plate, heat generated on the lead frame body can be dissipated through the cooling fins, and when the fan is started, air can be discharged from the air outlet holes, so that a heat dissipation effect can be provided for the cooling fins, and the heat dissipation effect of the cooling fins on the lead frame body can be accelerated; when the power of the lead frame body is too large, the heat of the lead frame body can be timely dissipated, and the heat dissipation efficiency is high.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, in particular to a semiconductor lead frame. Background Art

[0002] As we all know, semiconductor refers to a material whose conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are widely used in radios, televisions, and temperature measurement. For example, a diode is a device made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous.

[0003] In the semiconductor manufacturing process, lead frames are often needed. As the chip carrier of integrated circuits, lead frames are key structural parts that use bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. They act as a bridge to connect to external wires. Lead frames are required in most semiconductor integrated blocks and are important basic materials in the electronic information industry.

[0004] The existing lead frame has a simple structure when in use. When its own power is too large, it cannot dissipate its own heat in time, and the heat dissipation efficiency is low. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides a semiconductor lead frame.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor lead frame, comprising a lead frame body and a base plate, side plates are fixedly arranged on both sides of the lead frame body, and a plurality of legs are provided on the side plates, a heat sink is fixedly arranged below the lead frame body, and a plurality of heat sinks are provided at the lower end of the heat sink, a limiting groove is provided at the bottom of the side plate, and the two ends of the base plate are fixed inside the limiting groove, an air outlet plate is provided at the upper end of the base plate, and a plurality of air outlet holes are provided on the air outlet plate, and a fan is fixedly arranged at the lower end of the base plate, and the air outlet end of the fan is connected to the air outlet holes.

[0009] In order to facilitate the operation of the bottom plate, the utility model has the following improvements: a toggle block is provided at the lower end of the bottom plate.

[0010] In order to facilitate the assembly of the base plate, the improvement of the utility model is that cavities are provided at both ends of the base plate, a spring is provided inside the cavity, a clamping block is provided at the upper end of the spring, a clamping groove is provided on the inner wall of the limiting groove, and the clamping block cooperates with the clamping groove.

[0011] Furthermore, the present invention is improved in that the card slot and the card block are both hemispherical structures.

[0012] Furthermore, the improvement of the utility model is that the heat sink is bonded to the lower end of the lead frame body.

[0013] Furthermore, the improvement of the utility model is that the bottom plate and the air outlet plate are an integrated structure.

[0014] (III) Beneficial effects

[0015] Compared with the prior art, the utility model provides a semiconductor lead frame, which has the following beneficial effects:

[0016] The semiconductor lead frame can fix the lead frame body at a specified position through the support legs. The heat generated on the lead frame body will be dissipated through the heat sink. When the fan is started, air will be discharged from the air outlet, which can provide a heat dissipation effect for the heat sink and accelerate the heat dissipation effect of the heat sink on the lead frame body. When the power of the lead frame body is too large, its own heat can be dissipated in time, and the heat dissipation efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of the utility model Figure 1 ;

[0018] Figure 2 This is a schematic diagram of the structure of the utility model Figure 2 ;

[0019] Figure 3 This is a schematic diagram of the structure of the utility model Figure 3 ;

[0020] Figure 4 It is a schematic diagram of the matching structure of the card block and the card slot in the utility model;

[0021] In the figure: 1. lead frame body; 2. support foot; 3. side panel; 4. limit groove; 5. bottom plate; 6. air outlet plate; 7. air outlet hole; 8. heat sink; 9. heat sink; 10. fan; 11. spring; 12. slot; 13. block. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-4 A semiconductor lead frame comprises a lead frame body 1 and a bottom plate 5, side plates 3 are fixedly arranged on both sides of the lead frame body 1, and a plurality of legs 2 are arranged on the side plates 3, a heat sink 8 is fixedly arranged below the lead frame body 1, and a plurality of heat sinks 9 are arranged at the lower end of the heat sink 8, a limiting groove 4 is arranged at the bottom of the side plate 3, and the two ends of the bottom plate 5 are fixed inside the limiting groove 4, an air outlet plate 6 is arranged at the upper end of the bottom plate 5, and a plurality of air outlet holes 7 are arranged on the air outlet plate 6, and the bottom plate 5 A fan 10 is fixedly arranged at the lower end, and the air outlet end of the fan 10 is connected with the air outlet hole 7. The lead frame body 1 can be fixed at a specified position through the support leg 2. The heat generated on the lead frame body 1 will be dissipated through the heat sink 9. When the fan 10 is started, air will be discharged from the air outlet 7, which can provide a heat dissipation effect for the heat sink 9 and accelerate the heat dissipation effect of the heat sink 9 on the lead frame body 1. When the power of the lead frame body 1 is too large, its own heat can be dissipated in time, and the heat dissipation efficiency is high.

[0024] In this structure, a toggle block is provided at the lower end of the bottom plate 5, which makes the bottom plate 5 easy to operate.

[0025] In this structure, cavities are provided at both ends of the base plate 5, and a spring 11 is provided inside the cavity. A clamping block 13 is provided at the upper end of the spring 11. A clamping slot 12 is provided on the inner wall of the limiting groove 4. The clamping block 13 cooperates with the clamping slot 12. The spring 11 can provide an elastic force to the clamping block 13. Through the cooperation between the clamping slot 12 and the clamping block 13, a limiting effect can be provided to the two ends of the base plate 5 in the limiting groove 4, so that the base plate 5 can be easily assembled.

[0026] Furthermore, the card slot 12 and the card block 13 may both be hemispherical structures.

[0027] In this structure, the heat sink 8 is bonded to the lower end of the lead frame body 1 , and the bonding method enables the heat sink 8 to be easily assembled.

[0028] Furthermore, the bottom plate 5 and the air outlet plate 6 may be an integrated structure.

[0029] In the description of this article, it should be noted that relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor lead frame, comprising a lead frame body (1) and a bottom plate (5), side plates (3) being fixedly arranged on both sides of the lead frame body (1), and a plurality of legs (2) being arranged on the side plates (3), characterized in that: A heat sink (8) is fixedly arranged below the lead frame body (1), and a plurality of heat sinks (9) are arranged at the lower end of the heat sink (8). A limiting groove (4) is arranged at the bottom of the side plate (3), and both ends of the bottom plate (5) are fixed inside the limiting groove (4). An air outlet plate (6) is arranged at the upper end of the bottom plate (5), and a plurality of air outlet holes (7) are arranged on the air outlet plate (6). A fan (10) is fixedly arranged at the lower end of the bottom plate (5), and an air outlet end of the fan (10) is connected to the air outlet hole (7).

2. A semiconductor lead frame according to claim 1, characterized in that: A toggle block is provided at the lower end of the bottom plate (5).

3. A semiconductor lead frame according to claim 2, characterized in that: Cavities are provided at both ends of the bottom plate (5), a spring (11) is provided inside the cavity, a clamping block (13) is provided at the upper end of the spring (11), a clamping groove (12) is provided on the inner wall of the limiting groove (4), and the clamping block (13) cooperates with the clamping groove (12).

4. A semiconductor lead frame according to claim 3, characterized in that: The card slot (12) and the card block (13) are both hemispherical structures.

5. A semiconductor lead frame according to claim 4, characterized in that: The heat dissipation plate (8) is bonded to the lower end of the lead frame body (1).

6. A semiconductor lead frame according to claim 5, characterized in that: The bottom plate (5) and the air outlet plate (6) are an integrated structure.

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