Circuit board component

Abstract

The utility model relates to a circuit board component, which comprises a main board, an electronic element and an insulating substrate, the main board is provided with a main board upper surface and a main board lower surface, the main board upper surface is provided with a second bonding pad, the insulating substrate is arranged between the main board upper surface of the main board and the electronic element and is fixed on the main board, the insulating substrate is provided with a substrate upper surface and a substrate lower surface, and the substrate upper surface is provided with a first bonding pad and a second bonding pad. The lower surface of the substrate is provided with a first bonding pad, and the first bonding pad corresponds to the second bonding pad and is connected with the second bonding pad. By means of the circuit board component, the safety distance between the electronic element and another electronic element on the mainboard can be increased. Besides, the insulating substrate arranged between the main board and the electronic element also has the effects of heightening and isolating the electronic element, so that the risk that the electronic element is damaged due to the fact that overhigh temperature is conducted to the electronic element during wave soldering is avoided, and the service life of the electronic element can be further prolonged.

Description

Technical Field

[0001] The utility model relates to a circuit board component, in particular to a circuit board component capable of increasing safety distance and heat insulation. Background Art

[0002] Today's electronic products are not only short, light and thin but also have multiple and complex functions. Therefore, they are usually equipped with a large number of electronic components. Taking power supplies as an example, the required power density is increasing year by year. In other words, under the same volume, the number of electronic components inside the power supply is increasing, resulting in the heat dissipation problem of the internal components themselves and the safety distance problem between electronic components, which have become difficult problems in the design of today's electronic products.

[0003] At present, in order to meet the safety distance requirements, such as the space distance or creepage distance requirements, most electronic components solve the safety distance requirements by coating the outer surface of the component with one or more layers of insulating tape. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board component. By arranging an insulating substrate between a mainboard and an electronic component, the space distance or creepage distance between the electronic component and another electronic component on the mainboard can be increased, thereby increasing the safety distance. In addition, it also has the function of increasing and isolating the electronic component, avoiding the risk of excessively high temperature being transmitted to the electronic component during wave soldering and damaging the electronic component, thereby further increasing the service life of the electronic component.

[0005] To achieve the aforementioned purpose, the present invention provides a circuit board component, which includes: a mainboard having an upper surface and a lower surface; a first electronic component having at least one plug pin; an insulating substrate disposed between the mainboard and the first electronic component and fixed to the mainboard by a fixing assembly.

[0006] In some embodiments, the insulating substrate has an upper surface and a lower surface of the substrate, and the fixing component includes a first solder pad and a second solder pad, the first solder pad is opened on the lower surface of the substrate, and the second solder pad is opened on the upper surface of the mainboard; the first solder pad corresponds to the second solder pad and is connected to the second solder pad.

[0007] In some embodiments, the circuit board component also includes a plug-in board, one end of the plug-in board has at least one first welding hole, the at least one plug-in pin passes through the at least one first welding hole, and the other end of the plug-in board is provided with a welding pin, and the welding pin is inserted into a second welding hole of the main board.

[0008] In some embodiments, the first electronic component further has a side edge, and the side edge abuts against the upper surface of the insulating substrate.

[0009] In some embodiments, the first electronic component further has a bottom, and the bottom is against the upper surface of the insulating substrate.

[0010] In some embodiments, the insulating substrate further has at least one through hole, and the at least one plug pin passes through the at least one through hole.

[0011] In some embodiments, a width of the insulating substrate is greater than or equal to a width of the first electronic component.

[0012] In some embodiments, the first electronic component has a plurality of plug pins, the insulating substrate is clamped between the plurality of plug pins, and the plurality of plug pins are directly fixed to the mainboard and electrically connected to the mainboard.

[0013] In some embodiments, at least a portion of the insulating substrate is located between the plug pins of the first electronic component.

[0014] In some embodiments, the shape of the insulating substrate corresponds to the appearance of the first electronic component.

[0015] In some embodiments, the insulating substrate is a printed circuit board.

[0016] In some embodiments, the insulating substrate is a printed circuit board of FR-4 grade, and its relative tracking index is greater than 175.

[0017] In some embodiments, the circuit board component further includes at least one second electronic component, which is disposed on the main board, wherein the first electronic component is located at the primary side of a power circuit formed by the circuit board component, and the second electronic component is located at the secondary side or ground of the power circuit.

[0018] In some embodiments, there are multiple second electronic components, and when the first electronic component is located at the primary side and the second electronic component is located at the ground, the creepage distance between the second electronic component closest to the first electronic component and the first electronic component is greater than 1.5 mm, and the spatial distance between the second electronic component closest to the first electronic component and the first electronic component is greater than 0.5 mm.

[0019] In some embodiments, there are multiple second electronic components. When the first electronic component is located on the primary side and multiple second electronic components are located on the secondary side, the creepage distance between the second electronic component closest to the first electronic component and the first electronic component is greater than 3 mm, and the spatial distance between the second electronic component closest to the first electronic component and the first electronic component is greater than 1 mm.

[0020] In summary, the present invention provides a circuit board component, which includes a main board, an electronic component and an insulating substrate. The insulating substrate is disposed between the upper surface of the main board of the main board and the electronic component, and is fixed to the main board. A first solder pad is provided on the lower surface of the substrate, and a second solder pad is provided on the upper surface of the main board. The first solder pad corresponds to the second solder pad and is connected to the second solder pad so that the insulating substrate is fixed to the main board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional exploded view of a circuit board component of the first preferred embodiment of the present invention;

[0022] Figure 2 It is an enlarged bottom view of the insulating substrate of the circuit board component of the first preferred embodiment of the present case;

[0023] Figure 3 It is a front view of the circuit board component after assembly of the first preferred embodiment of the present case;

[0024] Figure 4 A front view of a circuit board component of a second preferred embodiment of the present invention;

[0025] Figure 5 A top view of an insulating substrate of a circuit board component of a second preferred embodiment of the present invention;

[0026] Figure 6 A front view of a circuit board component of a third preferred embodiment of the present invention;

[0027] Figure 7 A top view of an insulating substrate of a circuit board component of a third preferred embodiment of the present invention;

[0028] Figure 8 A bottom view of the insulating substrate of the circuit board component of the third preferred embodiment of the present invention

[0029] Fig. 9 This is a three-dimensional exploded view of the circuit board component of the fourth preferred embodiment of the present invention.

[0030] The reference numerals are described as follows:

[0031] 10: Motherboard

[0032] 11: Mainboard upper surface

[0033] 12: Bottom surface of motherboard

[0034] 13, 13c: Second welding hole

[0035] 14: Second pad

[0036] 20, 20a, 20b, 20c: first electronic component

[0037] 21, 21a, 21b, 21c: Plug pins

[0038] 22: Side edge

[0039] 23: Bottom

[0040] 30, 30a, 30b, 30c: insulating substrate

[0041] 31, 31a, 31b: upper surface of substrate

[0042] 32, 32b: Lower surface of substrate

[0043] 33, 33b: First pad

[0044] 34a, 34b: Through hole

[0045] 40: Plug-in board

[0046] 41: Welding pin

[0047] 42: First welding hole

[0048] 50: Second electronic component

[0049] 100, 100a, 100b, 100c: circuit board components DETAILED DESCRIPTION

[0050] Some typical embodiments that embody the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different aspects without departing from the scope of the present invention, and the descriptions and drawings are essentially for illustrative purposes rather than for limiting the present invention.

[0051] Please refer to Figure 1 , Figure 2 as well as Figure 3 As shown. Figure 1 This is a three-dimensional exploded view of the circuit board component of the first preferred embodiment of the present invention. Figure 2 This is an enlarged bottom view of the insulating substrate of the circuit board component of the first preferred embodiment of the present invention. Figure 31 is a front view of the circuit board component after the assembly of the first preferred embodiment of the present case. In this example, the circuit board component 100 is arranged inside an electronic product such as a power supply (not shown in the figure), and the circuit board component 100 includes a main board 10, a first electronic component 20, an insulating substrate 30, a plug board 40, and a second electronic component 50 arranged on the main board 10. Taking the power supply as an example, the main board 10 is the main circuit board of the power supply, which can be a printed circuit board (Printed circuitboard), and the currently more commonly used specification is a printed circuit board of FR-4 grade. A power conversion circuit (not shown in the figure) is arranged on the main board 10 to convert AC power or DC power into an appropriate DC power. The main board 10 has a main board upper surface 11 and a main board lower surface 12. The first electronic component 20 is a pin-type electronic component, such as a pin-type capacitor, which has at least one plug pin 21, and the first electronic component 20 is fixed to the plug board 40 and electrically connected to the plug board 40 through the plug pin 21. In this embodiment, the plug board 40 may also be a printed circuit board, the plug board 40 has at least one soldering foot 41 and a first soldering hole 42, and the main board 10 has at least one second soldering hole 13, the plugging foot 21 of the first electronic component 20 passes through the first soldering hole 42 and is fixed to the first soldering hole 42, and the soldering foot 41 at the other end of the plug board 40 passes through the second soldering hole 13 of the main board 10 and is fixed to the second soldering hole 13. After the circuit board component 100 is assembled, the plug board 40 is fixed on the main board 10 and is electrically connected to the main board 10.

[0052] In order to increase the safety distance between the first electronic component 20 and the second electronic component 50, the circuit board component 100 of the present case is provided with an insulating substrate 30. The insulating substrate 30 is provided between the first electronic component 20 and the main board 10. When the circuit board component 100 is assembled, since the insulating substrate 30 is provided between the first electronic component 20 and the main board 10, the distance between the first electronic component 20 and the main board upper surface 11 of the main board 10 is raised, so that the space distance or creepage distance between the first electronic component 20 and the second electronic component 50 is increased, thereby increasing the safety distance, and the safety requirements when the parts are densely arranged inside the power supply can be met. The insulating substrate 30 can be any substrate with insulating properties, having a certain insulating dielectric capacity, such as a comparative tracking index (CTI) greater than 175. Preferably, the insulating substrate 30 can be a printed circuit board (PCB), and its grade can be FR-4. The printed circuit board of FR-4 grade is a commonly used circuit board, so it has the advantage of low cost, but the present case is not limited to this. The above safety distance includes space distance (i.e. electrical clearance) and creepage distance (surface distance), wherein space distance is defined as the shortest distance between two adjacent conductors or one conductor and the adjacent motor housing surface measured along the air, and creepage distance is defined as the shortest distance between two adjacent conductors or one conductor and the adjacent motor housing surface measured along the insulating surface. The insulating substrate 30 is disposed between the main board 10 and the first electronic component 20, and is fixed to the main board 10 through a fixing assembly. The insulating substrate 30 has a substrate upper surface 31 and a substrate lower surface 32. The substrate upper surface 31 and the substrate lower surface 32 are arranged oppositely, and the substrate lower surface 32 is adjacent to the main board upper surface 11. In this embodiment, the substrate lower surface 32 of the insulating substrate 30 is provided with a first solder pad 33, and the main board upper surface of the main board 10 is correspondingly provided with a second solder pad 14, that is, the first solder pad 33 and the second solder pad 14 are correspondingly arranged, and the first solder pad 33 and the second solder pad 14 constitute the aforementioned fixing assembly to fix the insulating substrate 30 to the main board 10. Accordingly, the insulating substrate 30 can be fixedly connected to the mainboard 10 by means of the first solder pad 33 and the second solder pad 14 through the surface mount technology (SMT). Figure 3As shown, the insulating substrate 30 is located between the first electronic component 20 and the main board 10, thereby increasing the safety distance between the first electronic component 20 and the second electronic component 50, and a side edge 22 of the first electronic component 20 can be reliably against the upper surface 31 of the insulating substrate 30 or there is a gap between the two, and this case does not need to be particularly limited. In addition, the insulating substrate 30 disposed between the main board 10 and the first electronic component 20 also has the function of isolating the heat generated by the first electronic component 20 from being conducted to the main board 10. Furthermore, compared with the prior art, the first electronic component 20 of this case does not need to be provided with an insulating tape, which further improves the heat dissipation performance and service life of the first electronic component 20.

[0053] Of course, the insulating substrate 30 is not limited to being fixed to the mainboard 10 by the first solder pad 33 and the second solder pad 14 forming the aforementioned fixing assembly. For example, in some embodiments, the lower surface 32 of the insulating substrate 30 may include a first connector (not shown), and the upper surface of the mainboard of the mainboard 10 may include a second connector (not shown) correspondingly. The first connector may be assembled and fixed with the second connector to form a fixing assembly, so that the insulating substrate 30 is fixed to the mainboard 10, wherein any fixing form known in the art can be used as the first connector and the second connector.

[0054] In some embodiments, the first electronic component 20 is located at the primary side of a power circuit (not shown) formed by the circuit board component 100, and the plurality of second electronic components 50 are located at the secondary side or ground of the power circuit. In addition, when the first electronic component 20 is located at the primary side and the second electronic component 50 is located at the ground, the first electronic component 20 and the second electronic component 50 are basically insulated, and the creepage distance between the second electronic component 50 closest to the first electronic component 20 and the first electronic component 20 is greater than 1.5 mm, and the space distance between the second electronic component 50 closest to the first electronic component 20 and the first electronic component 20 is greater than 0.5 mm. When the first electronic component 20 is located at the primary side and the plurality of second electronic components 50 are located at the secondary side, the insulation between the first electronic component 20 and the second electronic component 50 needs to be strengthened, so the creepage distance between the second electronic component 50 closest to the first electronic component 20 and the first electronic component 20 is greater than 3 mm, and the space distance between the second electronic component 50 closest to the first electronic component 20 and the first electronic component 20 is greater than 1 mm.

[0055] Please refer to Figure 4 as well as Figure 5 .in, Figure 4 This is a front view of the circuit board component of the second preferred embodiment of the present invention. Figure 5The top view of the insulating substrate of the circuit board component of the second preferred embodiment of the present case. In the present embodiment, the shape of the insulating substrate 30a of the circuit board component 100a can be designed to match the appearance of the first electronic component 20a. For example, when the first electronic component 20a is a capacitor and is assembled with the mainboard 10 in a vertical manner, the insulating substrate 30a is circular, that is, its shape corresponds to the appearance of the first electronic component 20a. In this way, not only can the aforementioned effect of increasing the safety distance be achieved, but also the assembly density of the overall circuit board component 100a can be improved. In other embodiments, the insulating substrate 30a can also be other shapes, such as waist-shaped, rectangular, square, etc., as long as it can correspond to the appearance of the first electronic component 20a, and this case does not need to be particularly limited. In addition, in the present embodiment, the first electronic component 20a is a plug-in capacitor with a plug pin 21a, so the insulating substrate 30a is correspondingly provided with a through hole 34a for the plug pin 21a to pass through, so that the first electronic component 20a can be assembled and fixed to the mainboard 10 and electrically connected to the mainboard 10. In addition, a bottom portion 23 of the first electronic component 20 a may be in contact with the substrate upper surface 31 a of the insulating substrate 30 a or there may be a gap between the two, and the present invention is not particularly limited.

[0056] Please refer to Figure 6 , Figure 7 as well as Figure 8 .in, Figure 6 This is a front view of the circuit board component of the third preferred embodiment of the present invention. Figure 7 This is a top view of the insulating substrate of the circuit board component of the third preferred embodiment of the present case, Figure 8 The bottom view is a view of the insulating substrate of the circuit board component of the third preferred embodiment of the present case. In the circuit board component 100b of this embodiment, the first electronic component 20b is a relay. Generally, the bottom of commercially available relays is usually recessed upward. Therefore, in this embodiment, the width W2 of the insulating substrate 30b is greater than or equal to the width W1 of the first electronic component 20b. Accordingly, the first electronic component 20b can be firmly disposed on the insulating substrate 30b without being skewed. In addition, the insulating substrate 30b has a substrate upper surface 31b and a substrate lower surface 32b. As described in the previous embodiment, in this embodiment, the first electronic component 20b also has a plug pin 21b. Therefore, the insulating substrate 30b is correspondingly provided with a through hole 34b for the plug pin 21b to pass through, so that the first electronic component 20b can be assembled and fixed to the mainboard 10 and electrically connected to the mainboard 10. In addition, please refer to Figure 8 As described in the previous embodiment, a first solder pad 33b is provided on the lower surface 32b of the insulating substrate 30b to be relatively fixed to the corresponding second solder pad 14 on the main board 10 through surface mounting technology (SMT), thereby fixing the insulating substrate 30b on the main board 10.

[0057] Please refer to Fig. 9 , Fig. 9 3D exploded view of the circuit board component of the fourth preferred embodiment of the present invention. This embodiment is similar to the aforementioned third embodiment. The first electronic component 20b is also a relay, but the insulating substrate 30c does not need to be provided with a through hole. In this case, the plurality of plug pins 21c of the first electronic component 20c directly pass through the second welding hole 13c fixed on the main board 10 and are electrically connected to the main board 10. In addition, the insulating substrate 30c is clamped between the plurality of plug pins 21c. In some embodiments, at least a portion of the insulating substrate 30c is located between the plug pins of the first electronic component 20b.

[0058] In summary, the present invention provides a circuit board component, which includes a mainboard, an electronic component and an insulating substrate. The insulating substrate is arranged between the upper surface of the mainboard of the mainboard and the electronic component, and is fixed to the mainboard. A second solder pad is provided on the upper surface of the mainboard, and a first solder pad is provided on the lower surface of the substrate. The first solder pad corresponds to the second solder pad and is connected to the second solder pad to fix the insulating substrate to the mainboard. By means of the above-mentioned circuit board component, the insulating substrate raises the distance between the electronic component and the upper surface of the mainboard of the mainboard, thereby increasing the space distance or creepage distance between the electronic component and another electronic component on the mainboard, thereby increasing the safety distance, and meeting the safety requirements when the parts are densely arranged inside the electronic product. In addition, the insulating substrate arranged between the mainboard and the electronic component also has the function of raising and isolating the electronic component, avoiding the risk of excessive temperature being transmitted to the electronic component during wave soldering and damaging the electronic component, so that the service life of the electronic component can be further improved. Furthermore, compared with the prior art, the electronic component of the present invention does not need to be provided with insulating tape, which further improves the heat dissipation performance and service life of the electronic component.

[0059] The present invention can be modified in various ways by those skilled in the art, but all modifications are within the protection scope of the appended claims.

Claims

1. A circuit board component, characterized in that: include: A mainboard, having a mainboard upper surface and a mainboard lower surface; A first electronic component having at least one plug pin; The insulating substrate is disposed between the main board and the first electronic component and is fixed to the main board through a fixing assembly.

2. The circuit board component according to claim 1, wherein: The insulating substrate has an upper surface and a lower surface of the substrate, and the fixing component includes a first solder pad and a second solder pad. The first solder pad is opened on the lower surface of the substrate, and the second solder pad is opened on the upper surface of the mainboard; the first solder pad corresponds to the second solder pad and is connected to the second solder pad.

3. The circuit board component according to claim 1, wherein: The circuit board component also includes a plug-in board, one end of which has at least one first welding hole, the at least one plug-in pin passes through the at least one first welding hole, and the other end of the plug-in board is provided with a welding pin, which is inserted into a second welding hole of the main board.

4. The circuit board component according to claim 1, wherein: The first electronic component also has a side edge, and the side edge abuts against the upper surface of the insulating substrate.

5. The circuit board component according to claim 1, wherein: The first electronic component also has a bottom, and the bottom is against the upper surface of the insulating substrate.

6. The circuit board component according to claim 5, characterized in that: The insulating substrate also has at least one through hole, and the at least one plug pin passes through the at least one through hole.

7. The circuit board component according to claim 3 or 5, characterized in that: The width of the insulating substrate is greater than or equal to the width of the first electronic component.

8. The circuit board component according to claim 1, wherein: The first electronic component has a plurality of plug pins, the insulating substrate is clamped between the plurality of plug pins, and the plurality of plug pins are directly fixed to the mainboard and electrically connected to the mainboard.

9. The circuit board component according to claim 8, wherein: At least a portion of the insulating substrate is located between the plug pins of the first electronic component.

10. The circuit board component according to claim 1, wherein: The shape of the insulating substrate corresponds to the appearance of the first electronic component.

11. The circuit board component according to claim 1, wherein: The insulating substrate is a printed circuit board.

12. The circuit board component according to claim 1, wherein: The insulating substrate is a printed circuit board of FR-4 grade, and its relative tracking index is greater than 175.

13. The circuit board component according to claim 1, wherein: The circuit board component further includes at least one second electronic component, which is arranged on the main board, wherein the first electronic component is located at the primary side of a power circuit formed by the circuit board component, and the second electronic component is located at the secondary side or ground of the power circuit.

14. The circuit board component according to claim 13, wherein: There are multiple second electronic components, and when the first electronic component is located at the primary side and the second electronic component is located at the ground, the creepage distance between the second electronic component closest to the first electronic component and the first electronic component is greater than 1.5 mm, and the spatial distance between the second electronic component closest to the first electronic component and the first electronic component is greater than 0.5 mm.

15. The circuit board component according to claim 13, wherein: There are multiple second electronic components. When the first electronic component is located on the primary side and the multiple second electronic components are located on the secondary side, the creepage distance between the second electronic component closest to the first electronic component and the first electronic component is greater than 3 mm, and the spatial distance between the second electronic component closest to the first electronic component and the first electronic component is greater than 1 mm.

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