Power conversion device

Abstract

The utility model discloses a power conversion device, which relates to the technical field of power conversion and comprises a voltage regulation assembly, a radiator, a first circuit board, a second circuit board and a circuit element. Wherein the radiator is arranged on one side of the voltage adjusting assembly. The first circuit board is arranged on the radiator, and the first circuit board is electrically connected with the voltage adjusting assembly. The second circuit board, the first circuit board and the radiator are arranged at intervals to reduce signal interference, and the second circuit board is electrically connected with the first circuit board. The circuit elements comprise a power element arranged on the first circuit board and a signal processing element arranged on the second circuit board. According to the power conversion device, the heat dissipation efficiency of the circuit element can be improved, and meanwhile, the working stability of the circuit element is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of power conversion, in particular to a power conversion device. Background Art

[0002] In the prior art, different circuit elements in a power conversion device are arranged in a staggered manner on a circuit board. As power conversion devices develop towards high power, high power density and large capacity, and as the power of circuit elements on the circuit board continues to increase, the heat dissipation problem becomes more and more prominent. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a power conversion device, which can improve the heat dissipation efficiency of circuit elements and improve the working stability of circuit elements.

[0004] According to an embodiment of the utility model, the power conversion device includes: a voltage regulating component; a heat sink, which is arranged on one side of the voltage regulating component; a first circuit board, which is arranged on the heat sink and is electrically connected to the voltage regulating component; a second circuit board, which is spaced apart from the first circuit board and the heat sink to reduce signal interference, and is electrically connected to the first circuit board; and circuit elements, which include power elements arranged on the first circuit board and signal processing elements arranged on the second circuit board.

[0005] According to the power conversion device of the embodiment of the utility model, the power element and the signal processing element can be respectively arranged on the first circuit board and the second circuit board according to the size of the heat generation and the ability to resist signal interference, so that the power element with a larger heat generation can obtain a higher heat dissipation efficiency on the first circuit board, so as to improve the overall heat dissipation efficiency of the power conversion device. At the same time, the signal processing element that is easily affected by signal interference is arranged on the second circuit board, which can reduce or avoid the signal processing element from being affected by the signal interference of the heat sink, the power element and the voltage regulating component, ensure the working stability of the signal processing element, and improve the overall working stability of the power conversion component.

[0006] In some embodiments, a mounting groove is formed on the surface of the heat sink, at least a portion of the first circuit board is disposed in the mounting groove, and an orthographic projection of the first circuit board on the bottom surface of the mounting groove coincides with the bottom surface of the mounting groove.

[0007] In some embodiments, the power conversion device further includes a first supporting column, and the second circuit board is connected to the heat sink and / or the first circuit board through the first supporting column.

[0008] Further, at least a portion of the first supporting column is a first conductive portion, and the first circuit board and the second circuit board are electrically connected via the first conductive portion of the first supporting column.

[0009] Furthermore, the first support column is provided with a connecting thread at one end away from the first circuit board, and the power conversion device further comprises a crimping nut assembled at the connecting thread.

[0010] In some embodiments, the power conversion device also includes: an electrical connector and an insulating member, the insulating member is arranged on the surface of the voltage regulating component, the electrical connector is arranged on the insulating member, one end of the electrical connector is connected to the first circuit board, and the other end of the electrical connector passes through the insulating member and extends into the voltage regulating component.

[0011] Furthermore, the electrical connector includes an electrical connection bar and an electrical connection column, and the electrical connection column is arranged at two ends of the electrical connection bar to respectively connect the voltage regulating component and the first circuit board.

[0012] Furthermore, the electrical connecting strip is a third circuit board or a metal strip; and / or the insulating member is an insulating cover or an insulating film; the first circuit board and the voltage regulating component are spaced apart, a portion of the electrical connecting strip is placed on the insulating member, and both ends of the electrical connecting strip are respectively connected to the first circuit board and the voltage regulating component through the electrical connecting columns.

[0013] In some embodiments, the heat sink and the first circuit board are located on the low-voltage side of the voltage regulating component; the second circuit board is stacked and spaced apart from the first circuit board, and the orthographic projections of the second circuit board and the first circuit board on the heat sink at least partially overlap.

[0014] In some embodiments, the first circuit board is an aluminum substrate or a ceramic substrate.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0017] Figure 1 It is a side view structural schematic diagram of a power conversion device according to an embodiment of the utility model;

[0018] Figure 2 A top view of the power conversion device according to an embodiment of the utility model;

[0019] Figure 3 Schematic diagram of the structure of the second circuit board according to an embodiment of the utility model.

[0020] Reference numerals:

[0021] Power conversion device 100,

[0022] Voltage regulating component 10,

[0023] Radiator 20, mounting groove 21,

[0024] The first circuit board 30,

[0025] The second circuit board 40,

[0026] The first support column 50, the crimping nut 51,

[0027] Electrical connection column 61, third circuit board 62, metal strip 63,

[0028] Insulating member 70 and housing 80 . DETAILED DESCRIPTION

[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0030] In the description of the present utility model, it should be understood that the terms "thickness", "upper", "lower", "front", "back", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] The power conversion device 100 according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0033] like Figure 1 As shown, the power conversion device 100 according to the embodiment of the utility model includes: a voltage regulating component 10, a heat sink 20, a first circuit board 30, a second circuit board 40 and circuit elements (not shown in the figure).

[0034] The heat sink 20 is disposed on one side of the voltage regulating component 10. The first circuit board 30 is disposed on the heat sink 20, and the first circuit board 30 is electrically connected to the voltage regulating component 10. The second circuit board 40 is spaced apart from the first circuit board 30 and the heat sink 20 to reduce signal interference, and the second circuit board 40 is electrically connected to the first circuit board 30. The circuit elements include power elements disposed on the first circuit board 30 and signal processing elements disposed on the second circuit board 40.

[0035] It is understandable that the heat dissipation effect of the heat sink 20 is attenuated as the distance from the heat sink 20 increases. The heat sink 20 is arranged on one side of the voltage regulating component 10 to ensure the heat dissipation effect of the heat sink 20 on the voltage regulating component 10. At the same time, the first circuit board 30 is arranged on the heat sink 20, which can also ensure the heat dissipation effect of the heat sink 20 on the first circuit board 30. The power element is used for power processing, that is, it has functions such as frequency conversion, voltage conversion, current conversion, and power management. Since the power element is used to process high voltage and large current, its heat generation is relatively high. The signal processing element includes, for example, a filter element, and its operation is easily disturbed by the magnetic field. Therefore, the signal processing element is arranged on the second circuit board 40, so that the signal processing element is far away from the heat sink 20, the power element and the voltage regulating component 10, thereby improving the stability of the signal processing element. In unit time, the unit volume heat generation of the power element is greater than the unit volume heat generation of the signal processing element, that is, the heat on the power element is more concentrated, and the signal processing element is more susceptible to signal interference than the power element.

[0036] Therefore, the heat dissipation efficiency of the radiator 20 for the first circuit board 30 can be higher than that for the second circuit board 40, so that the power element with higher heat generation is arranged on the first circuit board 30, which can improve the heat dissipation efficiency of the power element and improve the heat dissipation efficiency of the power conversion device 100 as a whole.

[0037] In addition, electromagnetic interference is likely to exist near the voltage regulating component 10, so the second circuit board 40 is spaced apart from the first circuit board 30 and the heat sink 20. Since the heat sink 20 and the first circuit board 30 are at a relatively short distance from the voltage regulating component 10, the second circuit board 40 can also be spaced apart from the voltage regulating component 10, thereby reducing the interference of the voltage regulating component 10 and the heat sink 20 with the signal of the signal processing component, thereby improving the working stability of the signal processing component on the second circuit board 40.

[0038] The power conversion device 100 of the present application can respectively arrange the power components and the signal processing components on the first circuit board 30 and the second circuit board 40 according to the size of the heat generated and the ability to resist signal interference, so that the power components with greater heat generation can obtain higher heat dissipation efficiency on the first circuit board 30, so as to improve the overall heat dissipation efficiency of the power conversion device 100. At the same time, the signal processing components that are susceptible to signal interference are arranged on the second circuit board 40, which can reduce or avoid the signal processing components from being interfered by the signal of the heat sink 20, the power components and the voltage regulating component 10, ensure the working stability of the signal processing components, and improve the overall working stability of the power conversion component.

[0039] It should be noted that the present application does not limit the type of the power conversion device 100, and based on different types of power conversion devices 100, does not limit the location of the first circuit board 30 and the second circuit board 40 relative to the voltage regulating component 10. For example, if the power conversion device 100 is a photovoltaic inverter, the volume of the voltage regulating component 10 is relatively large. Figure 1 In the example, the first circuit board 30 and the second circuit board 40 are arranged on the same side of the heat sink 20 and the voltage regulating component 10. In another example, the power conversion device 100 can also be an energy storage converter, in which case the voltage regulating component 10 is a transformer.

[0040] In some embodiments, the heat sink 20 is grounded and the first circuit board 30 is disposed on the heat sink 20 , so that the first circuit board 30 can be grounded through the heat sink 20 , thereby reducing or avoiding the risk of short circuit on the first circuit board 30 .

[0041] In some embodiments, Figure 1 , Figure 2As shown, a mounting groove 21 is formed on the surface of the heat sink 20, and at least a portion of the first circuit board 30 is disposed in the mounting groove 21. Thus, the mounting groove 21 has a positioning effect on the arrangement of the first circuit board 30 on the surface of the heat sink 20, thereby limiting the arrangement position of the first circuit board 30 on the surface of the heat sink 20. When the first circuit board 30 is arranged in the mounting groove 21, it can also reduce or avoid the movement of the first circuit board 30 on the surface of the heat sink 20, and maintain the stability of the position of the first circuit board 30 on the surface of the heat sink 20.

[0042] At the same time, the installation groove 21 can increase the contact area between the first circuit board 30 and the heat sink 20, thereby improving the heat dissipation effect of the heat sink 20 on the first circuit board 30 and further improving the heat dissipation efficiency of the power components.

[0043] In addition, the installation space of the first circuit board 30 can be saved in the thickness direction of the first circuit board 30 , thereby facilitating the reduction of the overall volume of the power conversion device 100 .

[0044] Preferably, the first circuit board 30 is at least partially fixed in the mounting groove 21 by screws to ensure that the first circuit board 30 is stably disposed in the mounting groove 21 .

[0045] Furthermore, the orthographic projection of the first circuit board 30 on the bottom surface of the mounting groove 21 coincides with the bottom surface of the mounting groove 21. Thus, the first circuit board 30 is entirely located in the mounting groove 21, which can improve the positioning effect of the mounting groove 21 on the first circuit board 30. When installing the first circuit board 30, the mounting groove 21 can play a foolproof role, simplify the difficulty of installing the first circuit board 30 on the heat sink 20, and reduce or avoid the risk of incorrect installation of the first circuit board 30 on the heat sink 20.

[0046] In some specific embodiments, the number of the first circuit board 30 is not limited to one. Figure 2 In the example, two mounting grooves 21 are formed on one side of the heat sink 20 , a first circuit board 30 is disposed in each of the two grooves, and the two first circuit boards 30 are electrically connected to the second circuit board 40 , respectively.

[0047] In some embodiments, Figure 1 , Figure 2 As shown, the power conversion device 100 further includes a first support column 50 , and the second circuit board 40 is connected to the heat sink 20 or the first circuit board 30 , or is connected to both the heat sink 20 and the first circuit board 30 via the first support column 50 .

[0048] It can be understood that the second circuit board 40 is spaced apart from the first circuit board 30 and the radiator 20, and the first support column 50 can provide support between the second circuit board 40 and the radiator 20, or between the first circuit board 30 and the second circuit board 40, thereby ensuring the position stability of the second circuit board 40 relative to the first circuit board 30 or the radiator 20.

[0049] In the present application, there is no limitation on whether the first support column 50 is formed on the first circuit board 30 or the second circuit board 40. Figure 1 , Figure 2 In the example of, the first support column 50 is formed on the first circuit board 30, and the second circuit board 40 is connected to one end of the first support column 50 away from the first circuit board 30. In another example, the first support column 50 is formed on the second circuit board 40, and the first circuit board 30 is connected to one end of the first support column 50 away from the second circuit board 40. In another example, the first support column 50 can be provided as an independent part, and the first circuit board 30 and the second circuit board 40 are respectively connected to both ends of the first support column 50.

[0050] Furthermore, at least a portion of the first support column 50 is a first conductive portion, and the first circuit board 30 and the second circuit board 40 are electrically connected via the first conductive portion of the first support column 50. Thus, the first support column 50 can support the second circuit board 40 and also serve as a conductive member between the first circuit board 30 and the second circuit board 40, so that the first support column 50 can be used for two purposes, eliminating the need to provide an additional conductive structure between the first circuit board 30 and the second circuit board 40, thereby simplifying the electrical connection structure between the first circuit board 30 and the second circuit board 40, and saving the space required for arranging the conductive structure, which is conducive to reducing the overall volume of the power conversion device 100.

[0051] In addition, the first support column 50 is a rigid structure. The first conductive portion on the first support column 50 serves as an electrical connection structure between the first circuit board 30 and the second circuit board 40. The position of the first conductive portion relative to the first circuit board 30 and the second circuit board 40 can be kept stable, and the structure of the first conductive portion itself can also be kept stable, thereby avoiding or reducing the risk of electrical connection reliability caused by the shaking of the conductive structure relative to the first circuit board 30 or the second circuit board 40, and maintaining the electrical connection stability between the first circuit board 30 and the second circuit board 40.

[0052] Furthermore, the first support column 50 is provided with a connecting thread at one end away from the first circuit board 30 , and the power conversion device 100 further includes a crimping nut 51 assembled at the connecting thread.

[0053] Therefore, the crimping nut 51 can be pressed against the second circuit board 40. By cooperating with the crimping nut 51 at the connecting thread at the end of the first support column 50 away from the first circuit board 30, the crimping nut 51 can press the second circuit board 40 against the end of the first support column 50 away from the first circuit board 30, thereby achieving the fixation of the second circuit board 40 on the end of the first support column 50 away from the first circuit board 30. The operation difficulty of cooperating with the connecting thread of the crimping nut 51 is relatively low, which can simplify the installation difficulty of connecting the second circuit board 40 with the first support column 50.

[0054] It should be noted that the first support column 50 is formed on the first circuit board 30. The first support column 50 can be integrally formed on the first circuit board 30, or can be welded to the first circuit board 30. The present application does not limit the manner in which the first support column 50 is formed on the first circuit board 30.

[0055] Preferably, a plurality of first supporting columns 50 are formed on the first circuit board 30 , and the second circuit board 40 is connected to one end of each first supporting column 50 away from the first circuit board 30 .

[0056] In some specific embodiments, Figure 1-Figure 3 As shown, when there are multiple first circuit boards 30, the second circuit board 40 can be connected to the multiple first circuit boards 30 through multiple first support columns 50. Figure 2 , Figure 3 For example, the power conversion device 100 includes two first circuit boards 30, both of which are arranged on the heat sink 20, and both of which are provided with a first support column 50, each support column is provided with a connecting thread away from the first end, and the second circuit board 40 is respectively matched with the connecting thread of the first support column 50 through a crimping nut 51 at the position corresponding to the two circuit boards.

[0057] In some embodiments, the power conversion device 100 also includes: an electrical connector and an insulating member 70, the insulating member 70 is disposed on the surface of the voltage regulating component 10, the electrical connector is disposed on the insulating member 70, one end of the electrical connector is connected to the first circuit board 30, and the other end of the electrical connector passes through the insulating member 70 and extends into the voltage regulating component 10.

[0058] Therefore, the insulating member 70 can play an insulating protection role on the surface of the voltage regulating component 10, thereby preventing the induced current or leakage of the voltage regulating component 10 from being transferred to the first circuit board 30 or the second circuit board 40, causing signal interference to the power elements or signal processing elements, while avoiding or reducing leakage in the housing 80 of the power conversion device 100.

[0059] The electrical connector is arranged through the insulating member 70. While ensuring the electrical connection between the first circuit board 30 and the voltage regulating component 10 through the electrical connector, the insulating member 70 can provide insulation protection for at least part of the electrical connector, thereby reducing or avoiding contact between the electrical connector and other structures in the power conversion device 100, and ensuring the stability of current conduction through the electrical connector.

[0060] Furthermore, if Figure 1 As shown, the electrical connector includes an electrical connection bar and an electrical connection column 61, and the electrical connection column 61 is arranged at both ends of the electrical connection bar to respectively connect the voltage regulating component 10 and the first circuit board 30. It can be understood that the electrical connection bar and the electrical connection column 61 are both rigid structures.

[0061] Therefore, by adopting rigid electrical connection strips and electrical connection columns 61, the connection structures between the voltage regulating component 10 and the first circuit board 30 are rigid structures, so that the setting position of the electrical connector relative to the first circuit board 30 and the voltage regulating component 10 can remain stable, and the structure of the electrical connector itself can also remain stable, thereby reducing or avoiding the risk of electrical connection reliability caused by the shaking of the electrical connector relative to the first circuit board 30 or the voltage regulating component 10, and maintaining the electrical connection stability between the first circuit board 30 and the voltage regulating component 10.

[0062] Furthermore, if Figure 1 As shown, the electrical connecting strip is a third circuit board 62 or a metal strip 63, or the connecting strip includes a third circuit board 62 and a metal strip 63, both the third circuit board 62 and the metal strip 63 can conduct current, and both the third circuit board 62 and the metal strip 63 are rigid structures, which can ensure the stability of the structure of the electrical connecting strip itself.

[0063] Preferably, the third circuit board 62 is replaced by another metal strip, and the metal strip can have a smaller resistance and a larger current carrying capacity than the third circuit board 62, thereby further improving the current conducting capacity of the electrical connector.

[0064] In the present application, there is no limitation on the type of the metal strip 63. For example, the metal strip 63 may be a copper bar.

[0065] exist Figure 1 , Figure 2 In the example, the first circuit board 30 is arranged on the same side of the voltage regulating component 10 and the heat dissipation component, and the electrical connecting strip includes a third circuit board 62 and a metal strip 63. The third circuit board 62 is connected to the first circuit board 30 through an electrical connecting column 61 at one end, and the third circuit board 62 is electrically connected to the voltage regulating component 10 through the metal strip 63 at the other end.

[0066] Therefore, the metal strip 63, the third circuit board 62 and the electrical connection column 61 together constitute an electrical connection between the voltage regulating component 10 and the first circuit board 30, realizing current conduction from the voltage regulating component 10 to the first circuit board 30, and the metal strip 63, the third circuit board 62 and the electrical connection column 61 are all rigid structures, which can improve the reliability of the electrical connection between the voltage regulating component 10 and the first circuit board 30.

[0067] Among them, the electrical connecting column 61 is provided with a connecting thread at the end away from the first circuit board 30, and is matched with a crimping nut 51 at the end away from the first circuit board 30 to press the third circuit board 62 against the end of the electrical connecting column 61 away from the circuit board, thereby realizing the connection between the first circuit board 30 and the second circuit board 40.

[0068] It is understandable that, while the first circuit board 30 and the third circuit board 62 form a conducting circuit through the electrical connection column 61, the electrical connection column 61 also serves as a supporting structure between the first circuit board 30 and the third circuit board 62. Therefore, the operation difficulty of connecting the crimping nut 51 with the connecting thread is relatively low, which can simplify the installation difficulty of connecting the third circuit board 62 with the electrical connection column 61.

[0069] In the present application, there is no limitation on whether the electrical connection column 61 is formed on the third circuit board 62 or the first circuit board 30. Figure 1 , Figure 2 In the example of, the electrical connection column 61 is formed on the first circuit board 30, and the third circuit board 62 is connected to one end of the electrical connection column 61 away from the first circuit board 30. In another example, the electrical connection column 61 can be formed on the third circuit board 62, and the first circuit board 30 is connected to one end of the electrical connection column 61 away from the third circuit board 62. In another example, the electrical connection column 61 is provided as an independent part, and the first circuit board 30 and the third circuit board 62 are respectively connected to both ends of the electrical connection column 61.

[0070] It should be noted that there is no limitation on the structure of the electrical connection column 61 formed on the first circuit board 30 or the third circuit board 62. The electrical connection column 61 can be integrally formed on the first circuit board 30 or the third circuit board 62, or can be connected to the first circuit board 30 or the third circuit board 62 by welding.

[0071] In addition, the insulating member 70 is arranged on the surface of the voltage regulating component 10, the third circuit board 62 is located on the side of the insulating member 70 away from the voltage regulating component 10, and the metal strip 63 passes through the insulating member 70 and connects the voltage regulating component 10 and the third circuit board 62 at both ends.

[0072] Preferably, Figure 1In the example, the thickness of the insulating member 70 is the same as the height of the electrical connection column 61, and one end of the third circuit board 62 is connected to the electrical connection column 61, and the other end is placed on the insulating member 70. Therefore, the insulating member 70 and the electrical connection column 61 can provide support at both ends of the third circuit board 62, and the support of the insulating member 70 and the electrical connection column 61 to the third circuit board 62 can be balanced, thereby improving the position stability of the third circuit board 62.

[0073] Thus, the insulating member 70 can provide insulation protection for the metal strip 63, reduce or avoid the insulating member 70 from electrically contacting structures other than the third circuit board 62 and the voltage regulating assembly 10, and maintain the conductive stability of the metal strip 63. At the same time, the insulating member 70 can isolate the voltage regulating assembly 10 from the third circuit board 62, thereby reducing or avoiding the third circuit board 62 from electromagnetic interference from the voltage regulating assembly 10, and avoiding leakage between the third circuit board 62 and the voltage regulating assembly 10, thereby ensuring the stability of current conduction on the third circuit board 62.

[0074] In some embodiments, the insulating member 70 is an insulating cover or an insulating film. The first circuit board 30 is spaced apart from the voltage regulating assembly 10, a portion of the electrical connection strip is placed on the insulating member 70, and the two ends of the electrical connection strip are respectively connected to the first circuit board 30 and the voltage regulating assembly 10 through the electrical connection column 61. Therefore, the spacing between the first circuit board 30 and the voltage regulating assembly 10 can reduce or avoid the electromagnetic interference of the voltage regulating assembly 10 on the power element, and improve the working stability of the power element. While the insulating member 70 provides insulation protection for the electrical connection strip, it can support the electrical connection strip and improve the position stability of the electrical connection strip. In addition, the two ends of the electrical connection strip are respectively connected to the first circuit board 30 and the voltage regulating assembly 10 through the electrical connection column 61, which can further improve the structural stability between the electrical connection strip and the first circuit board 30 and the voltage regulating assembly 10.

[0075] In some embodiments, the heat sink 20 and the first circuit board 30 are located on the low voltage side of the voltage regulating assembly 10. The second circuit board 40 is stacked and spaced apart from the first circuit board 30, and the orthographic projections of the second circuit board 40 and the first circuit board 30 on the heat sink 20 at least partially overlap. It can be understood that the voltage regulating assembly 10 has a relatively low voltage side and a high voltage side.

[0076] Therefore, by arranging the heat sink 20 and the first circuit board 30 on the low-voltage side of the voltage regulating component 10, the risk of high-voltage breakdown in the circuit structure within the heat sink 20 or on the first circuit board 30 can be reduced or avoided, thereby maintaining the working stability of the first circuit board 30 and the heat sink 20.

[0077] In some embodiments, the first circuit board 30 is an aluminum substrate or a ceramic substrate. Therefore, the aluminum substrate and the ceramic substrate have good thermal conductivity, so that the first circuit board 30 can better conduct the heat generated by the power element and improve the heat dissipation efficiency of the heat sink 20 to the first circuit board 30, that is, improve the heat dissipation efficiency of the heat sink 20 to the power element.

[0078] In some specific embodiments, Figure 2 As shown, the voltage regulating assembly 10 , the heat sink 20 , the first circuit board 30 , the third circuit board 62 and the second circuit board 40 are all disposed in a housing 80 .

[0079] Other structures and operations of the power conversion device 100 according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0080] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0081] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A power conversion device, characterized in that: include: Voltage regulation components; A heat sink, the heat sink being arranged on one side of the voltage regulating component; a first circuit board, the first circuit board being disposed on the heat sink, and the first circuit board being electrically connected to the voltage regulating component; a second circuit board, wherein the second circuit board is spaced apart from the first circuit board and the heat sink to reduce signal interference, and the second circuit board is electrically connected to the first circuit board; The circuit element includes a power element arranged on the first circuit board and a signal processing element arranged on the second circuit board.

2. The power conversion device according to claim 1, characterized in that: A mounting groove is formed on the surface of the heat sink, at least a portion of the first circuit board is disposed in the mounting groove, and an orthographic projection of the first circuit board on the bottom surface of the mounting groove coincides with the bottom surface of the mounting groove.

3. The power conversion device according to claim 1, characterized in that: It also includes a first supporting column, and the second circuit board is connected to the heat sink and / or the first circuit board through the first supporting column.

4. The power conversion device according to claim 3, characterized in that: At least a portion of the first supporting column is a first conductive portion, and the first circuit board and the second circuit board are electrically connected via the first conductive portion of the first supporting column.

5. The power conversion device according to claim 4, characterized in that: The first supporting column is provided with a connecting thread at one end away from the first circuit board, and the power conversion device further comprises a crimping nut assembled at the connecting thread.

6. The power conversion device according to any one of claims 1 to 5, characterized in that: Also includes: An electrical connector and an insulating member, wherein the insulating member is disposed on the surface of the voltage regulating component, the electrical connector is disposed on the insulating member, one end of the electrical connector is connected to the first circuit board, and the other end of the electrical connector passes through the insulating member and extends into the voltage regulating component.

7. The power conversion device according to claim 6, characterized in that: The electrical connector includes an electrical connection bar and electrical connection columns, and the electrical connection columns are arranged at two ends of the electrical connection bar to respectively connect the voltage regulating component and the first circuit board.

8. The power conversion device according to claim 7, characterized in that: The electrical connection strip is a third circuit board or a metal strip; And / or, the insulating member is an insulating cover or an insulating film; The first circuit board is spaced apart from the voltage regulating component, a portion of the electrical connecting strip is placed on the insulating member, and two ends of the electrical connecting strip are respectively connected to the first circuit board and the voltage regulating component through the electrical connecting columns.

9. The power conversion device according to any one of claims 1 to 5, characterized in that: The heat sink and the first circuit board are located on the low voltage side of the voltage regulating assembly; The second circuit board is stacked and spaced apart from the first circuit board, and the orthographic projections of the second circuit board and the first circuit board on the heat sink at least partially overlap.

10. The power conversion device according to any one of claims 1 to 5, characterized in that: The first circuit board is an aluminum substrate or a ceramic substrate.

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