Chip mounting mechanism for integrated circuit processing

Abstract

The utility model discloses a chip mounting mechanism for integrated circuit processing, which relates to the technical field of integrated circuit processing and comprises a processing box, a main driving mechanism and a connecting mechanism. The pressure sensor sends an electric signal to an external controller to enable the conveying platform to stop running, so that the integrated circuit board stops moving, surface mounting processing on the integrated circuit board is facilitated, the driving assembly is arranged, and the driving assembly can drive the pressure sensor to be away from the integrated circuit board in the process that the main driving mechanism clamps the integrated circuit board; therefore, the pressure sensor is prevented from hindering the transmission of the integrated circuit board after the surface mounting of the integrated circuit board is completed, the lifting assembly is arranged, a servo motor is operated to drive a lifting rod to move upwards or downwards at the same time, and the connection mechanism, the main driving mechanism and the integrated circuit board can be located on the same horizontal line conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit processing, in particular to a patch mechanism for integrated circuit processing. Background Art

[0002] An integrated circuit is a miniature electronic device or component. By using a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, it is made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function. Integrated circuits have promoted the development of electronic components towards miniaturization, low power consumption, intelligence and high reliability. During the processing of integrated circuits, it is often necessary to perform chip processing on the circuit board.

[0003] For example, a patch device for integrated circuit processing disclosed in the utility model with authorization announcement number CN218388159U sets a height adjustment mechanism in conjunction with an auxiliary adjustment mechanism, adopts an adjustment screw as a braking component at the main drive end, and adopts a sliding method at the auxiliary drive end, thereby driving the driving rod and the components thereon to adjust the height, and sets a connection mechanism in conjunction with the main drive mechanism to limit and fix the integrated circuit board, and after the patch is completed, the integrated circuit is flipped over and the patch is performed on the other side of the integrated circuit.

[0004] This prior art also has the following problems when used:

[0005] The device transports the integrated circuit board through a conveying platform. When the integrated circuit board moves to the bottom of the processing end, it is difficult for the conveying platform to stop running automatically, and the operator is required to monitor the position of the integrated circuit board. The device sets symmetrical installation vertical rods on the front and rear sides of the conveying platform, and adjusts the height of the driving rod through a height adjustment mechanism and an auxiliary adjustment mechanism. Since the height adjustment components on both sides are independent of each other, in order to ensure that the connection mechanism, the main drive mechanism and the integrated circuit board are on the same horizontal line, the process of adjusting the height of the two sets of driving rods is relatively cumbersome. Utility Model Content

[0006] In order to overcome the deficiencies of the prior art, the utility model provides a patch mechanism for integrated circuit processing to solve the technical problems mentioned in the above background.

[0007] In order to solve the above technical problems, the utility model provides the following technical solutions: a patch mechanism for integrated circuit processing, comprising a processing box, a main drive mechanism and a connection mechanism, wherein the main drive mechanism and the connection mechanism are arranged inside the processing box;

[0008] A pressure sensor is arranged inside the processing box, and the pressure sensor can stop the integrated circuit board from moving when the integrated circuit board moves to the position to be mounted;

[0009] A driving component is arranged inside the processing box. The driving component can prevent the pressure sensor from hindering the transmission of the integrated circuit board after the integrated circuit board is mounted;

[0010] The lifting component is arranged outside the main driving mechanism and the connecting mechanism, and the lifting component can drive the main driving mechanism and the connecting mechanism to move upward or downward at the same time.

[0011] As a preferred technical solution of the utility model, a conveying platform is installed on the bottom surface of the processing box, and a processing end is installed on the top surface of the processing box.

[0012] As a preferred technical solution of the utility model, the driving assembly includes a first rotating plate, a second rotating plate, a first spring, a first fixed plate and a fixed shaft. The first rotating plate is connected to the inner top surface of the processing box by rotation, the second rotating plate is fixedly arranged on the side of the first rotating plate, the first spring is fixedly arranged on the other side of the second rotating plate, the first fixed plate is fixedly arranged on the other end of the first spring, and the fixed shaft is fixedly arranged on the inner top surface of the processing box.

[0013] As a preferred technical solution of the utility model, the second rotating plate is fixedly connected to the pressure sensor on one side close to the first rotating plate, the back of the first fixed plate is fixedly connected to the processing box, and the fixed shaft passes through the second rotating plate and is connected to the second rotating plate through rotation.

[0014] As a preferred technical solution of the utility model, a fixed cylinder is provided on the outside of the pressure sensor, the fixed cylinder is fixedly connected to the second rotating plate, a slide plate is slidably connected to the inner wall of the fixed cylinder, a second spring is fixedly provided between the slide plate and the second rotating plate, a movable rod is fixedly provided on the side of the slide plate away from the second spring, the movable rod passes through the fixed cylinder and is slidably connected to the fixed cylinder.

[0015] As a preferred technical solution of the utility model, the lifting assembly includes a servo motor, a first gear, a second gear, a lifting rod, a slide groove, a toothed belt and a second fixed plate. The servo motor is fixedly installed on the top surface of the processing box, the first gear is fixedly arranged at the output end of the servo motor, the second gear is connected to the rear of the first gear by meshing, the lifting rod is symmetrically fixed to the front of the main drive mechanism and the back of the connecting mechanism, the slide groove is arranged on the left and right sides of the lifting rod, the toothed belt is fixedly arranged on the inner side of the lifting rod, and the second fixed plate is connected to the left and right sides of the second gear by rotation.

[0016] As a preferred technical solution of the utility model, the lifting rod and the toothed belt respectively penetrate the processing box to the inside of the processing box, a slider adapted to the slide groove is fixedly arranged under the top surface of the processing box, the slider is slidably connected to the lifting rod through the slide groove, the toothed belt is respectively meshed with the first gear and the second gear, and the bottom surface of the second fixed plate is fixedly connected to the processing box.

[0017] Compared with the prior art, the utility model can achieve the following beneficial effects:

[0018] The utility model sets a pressure sensor, and when the integrated circuit board moves to the position to be patched, the slide plate contacts the pressure sensor, and the pressure sensor sends an electrical signal to an external controller to stop the transmission platform from running, thereby stopping the integrated circuit board from moving, which is convenient for patch processing of the integrated circuit board. By setting a driving component, the driving component can drive the pressure sensor away from the integrated circuit board during the process of the main drive mechanism clamping the integrated circuit board, thereby avoiding the pressure sensor from hindering the transmission of the integrated circuit board after the integrated circuit board completes the patching. By setting a lifting component, running the servo motor can drive the lifting rod to move upward or downward at the same time, which is convenient for the connection mechanism, the main drive mechanism and the integrated circuit board to be located on the same horizontal line. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the main view structure of the utility model;

[0021] Figure 3 It is a schematic diagram of the cross-sectional structure of the utility model in top view;

[0022] Figure 4 It is a schematic diagram of the cross-sectional structure of the left side view of the utility model;

[0023] Figure 5 This is a schematic diagram of the cross-sectional structure of the fixed cylinder of the utility model in a top view;

[0024] Among them: 1. processing box; 2. conveying platform; 3. main drive mechanism; 4. connecting mechanism; 5. processing end; 6. first rotating plate; 7. second rotating plate; 8. first spring; 9. first fixed plate; 10. fixed shaft; 11. fixed cylinder; 12. slide plate; 13. second spring; 14. pressure sensor; 15. movable rod; 16. servo motor; 17. first gear; 18. second gear; 19. lifting rod; 20. slide groove; 21. toothed belt; 22. second fixed plate. DETAILED DESCRIPTION

[0025] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the protection scope of the present invention.

[0026] Example

[0027] Please refer to Figure 1-Figure 4 As shown, the utility model provides a patch mechanism for integrated circuit processing, including a processing box 1, a main drive mechanism 3 and a connection mechanism 4, the main drive mechanism 3 and the connection mechanism 4 are arranged inside the processing box 1, a conveying platform 2 is installed on the bottom surface of the processing box 1, and a processing end 5 is installed on the top surface of the processing box 1. The processing end 5 can perform patch processing on the integrated circuit board, the main drive mechanism 3 cooperates with the connection mechanism 4 to clamp and limit the integrated circuit board, and after the patch is completed, the integrated circuit board is turned over, and the other side of the integrated circuit board is patched.

[0028] like Figure 1-Figure 5 As shown, a pressure sensor 14 is arranged inside the processing box 1, and a fixed cylinder 11 is arranged outside the pressure sensor 14. The fixed cylinder 11 protects the pressure sensor 14. The inner wall of the fixed cylinder 11 is connected with a slide plate 12 by sliding. A second spring 13 is fixedly arranged on the side of the slide plate 12. A movable rod 15 is fixedly arranged on the side of the slide plate 12 away from the second spring 13. The movable rod 15 penetrates the fixed cylinder 11 and is connected to the fixed cylinder 11 by sliding. The second spring 13 cooperates with the slide plate 12 and the movable rod 15 to prevent the pressure sensor 14 from directly contacting the integrated circuit board, causing damage to the pressure sensor 14. The spring 13 also reduces the force of the slide plate 12 contacting the pressure sensor 14. When the conveying platform 2 drives the integrated circuit board to move to the position to be mounted, the integrated circuit board just pushes the movable rod 15 to drive the slide plate 12 to contact the pressure sensor 14. The pressure sensor 14 sends an electrical signal to an external controller. The controller receives the electrical signal of the pressure sensor 14 and controls the conveying platform 2 to stop running, thereby stopping the integrated circuit board from moving, making it convenient for the integrated circuit board to be mounted. The elasticity of the second spring 13 is much smaller than that of the first spring 8. It is difficult for the slide plate 12 to cause deformation to the first spring 8 when it approaches the pressure sensor 14.

[0029] like Figure 1-Figure 5As shown, a driving assembly is arranged inside the processing box 1, and the driving assembly consists of a first rotating plate 6, a second rotating plate 7, a first spring 8, a first fixed plate 9 and a fixed shaft 10. The top surface of the processing box 1 is connected to the first rotating plate 6 by rotation, and the second rotating plate 7 is fixedly arranged on the side of the first rotating plate 6. The side of the second rotating plate 7 close to the first rotating plate 6 is fixedly connected to the pressure sensor 14, and the second rotating plate 7 is fixedly connected to the fixed cylinder 11. The end of the second spring 13 away from the slide plate 12 is fixedly connected to the second rotating plate 7, and the other side of the second rotating plate 7 is fixedly arranged with the first spring 8. The other end of the first spring 8 is fixedly arranged with the first fixed plate 9, and the back of the first fixed plate 9 is fixedly connected to the processing box 1. A fixed shaft 10 is fixedly arranged on the top surface of the processing box 1, and the fixed shaft 10 passes through the second rotating plate 7 and is connected to the second rotating plate 7 by rotation. The driving assembly can drive the pressure sensor 14 away from the integrated circuit board during the process of the main driving mechanism 3 clamping the integrated circuit board, thereby avoiding the pressure sensor 14 from hindering the transmission of the integrated circuit board after the integrated circuit board is completed.

[0030] Specifically, during the process of the main drive mechanism 3 clamping the integrated circuit board, the main drive mechanism 3 extends and contacts the first rotating plate 6 to drive the first rotating plate 6 to rotate along the central axis of the fixed axis 10. The rotation of the first rotating plate 6 drives the second rotating plate 7 to rotate, thereby driving the fixed cylinder 11 and the pressure sensor 14 to rotate, and the first spring 8 is compressed. After the patch is completed, the main drive mechanism 3 contracts to release the limit on the integrated circuit board. The controller controls the conveying platform 2 to drive the integrated circuit board to move to the right. During the contraction of the main drive mechanism 3, the first spring 8 pushes the second rotating plate 7 to rotate until the second rotating plate 7 rotates to its original position. At this time, the second rotating plate 7 is perpendicular to the moving direction of the integrated circuit board, and the main drive mechanism 3 is separated from the first rotating plate 6. After the patch is completed, the integrated circuit board never contacts the second rotating plate 7, the fixed cylinder 11 and the movable rod 15 during the movement.

[0031] like Figure 1-Figure 4As shown, a lifting assembly is arranged outside the main drive mechanism 3 and the connection mechanism 4, and the lifting assembly consists of a servo motor 16, a first gear 17, a second gear 18, a lifting rod 19, a slide 20, a toothed belt 21 and a second fixed plate 22. The servo motor 16 is fixedly installed on the top surface of the processing box 1, and the first gear 17 is fixedly arranged at the output end of the servo motor 16. The second gear 18 is connected to the rear of the first gear 17 by meshing. The appearance of the first gear 17 and the second gear 18 are the same. Symmetrical lifting rods 19 are fixedly arranged on the front of the main drive mechanism 3 and the back of the connection mechanism 4. Slides 20 are arranged on the left and right sides of the lifting rod 19. A slider adapted to the slide groove 20 is fixedly arranged below the top surface, and the slider is slidably connected to the lifting rod 19 through the slide groove 20. A toothed belt 21 is fixedly arranged on the inner side of the lifting rod 19. The lifting rod 19 and the toothed belt 21 respectively penetrate the processing box 1 to the inside of the processing box 1, and the toothed belt 21 is respectively meshed with the first gear 17 and the second gear 18. The left and right sides of the second gear 18 are connected with the second fixed plate 22 by rotation, and the bottom surface of the second fixed plate 22 is fixedly connected to the processing box 1. The operation of the servo motor 16 can drive the lifting rod 19 to move upward or downward at the same time, so that the main drive mechanism 3, the connection mechanism 4 and the integrated circuit board are conveniently located at the same horizontal line.

[0032] Specifically, running the servo motor 16 drives the first gear 17 to rotate, the rotation of the first gear 17 drives the second gear 18 to rotate, the rotation of the first gear 17 and the second gear 18 drives the toothed belt 21 to move upward or downward at the same time, the movement of the toothed belt 21 drives the lifting rod 19 to move upward or downward at the same time, and the movement of the lifting rod 19 drives the main drive mechanism 3 and the connecting mechanism 4 to move upward or downward at the same time.

[0033] Specific working principle:

[0034] When the device is in use, the integrated circuit board is placed on the top surface of the conveying platform 2 for conveying. When the conveying platform 2 drives the integrated circuit board to move to the position to be mounted, the integrated circuit board just pushes the movable rod 15 to drive the slide plate 12 to contact the pressure sensor 14. The pressure sensor 14 sends an electrical signal to an external controller. The controller receives the electrical signal of the pressure sensor 14 and controls the conveying platform 2 to stop running, thereby stopping the integrated circuit board from moving, making it convenient for the integrated circuit board to be mounted.

[0035] The main drive mechanism 3 and the connection mechanism 4 are controlled to clamp and limit the integrated circuit board. During the clamping process of the main drive mechanism 3 on the integrated circuit board, the main drive mechanism 3 extends and contacts the first rotating plate 6 to drive the first rotating plate 6 to rotate along the central axis of the fixed axis 10. The rotation of the first rotating plate 6 drives the second rotating plate 7 to rotate, thereby driving the fixed cylinder 11 and the pressure sensor 14 to rotate. The first spring 8 is compressed. After the limit is completed, the processing end 5 is operated to perform patch processing on the integrated circuit board. After the patch is completed, the main drive mechanism 3 contracts to release the limit on the integrated circuit board. The controller controls the transmission platform 2 to drive the integrated circuit board to move to the right. During the contraction of the main drive mechanism 3, the first spring 8 pushes the second rotating plate 7 to rotate until the second rotating plate 7 rotates to its original position. At this time, the second rotating plate 7 is perpendicular to the moving direction of the integrated circuit board, and the main drive mechanism 3 is separated from the first rotating plate 6. After the patch is completed, the integrated circuit board never contacts the second rotating plate 7, the fixed cylinder 11 and the movable rod 15 during the movement.

[0036] When the height of the integrated circuit board needs to be adjusted, the servo motor 16 is operated to drive the first gear 17 to rotate, and the rotation of the first gear 17 drives the second gear 18 to rotate. The rotation of the first gear 17 and the second gear 18 drives the toothed belt 21 to move upward or downward at the same time. The movement of the toothed belt 21 drives the lifting rod 19 to move upward or downward at the same time. The movement of the lifting rod 19 drives the main drive mechanism 3 and the connecting mechanism 4 to move upward or downward at the same time, so that the main drive mechanism 3, the connecting mechanism 4 and the integrated circuit board are conveniently located on the same horizontal line.

[0037] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A chip placement mechanism for integrated circuit processing, comprising a processing box (1), a main drive mechanism (3) and a connection mechanism (4), wherein the main drive mechanism (3) and the connection mechanism (4) are arranged inside the processing box (1), characterized in that: A pressure sensor (14), the pressure sensor (14) being arranged inside the processing box (1), and the pressure sensor (14) being capable of stopping the integrated circuit board from moving when the integrated circuit board moves to a position to be mounted; A driving component, the driving component is arranged inside the processing box (1), and the driving component can prevent the pressure sensor (14) from hindering the transmission of the integrated circuit board after the integrated circuit board is pasted; A lifting component is arranged outside the main drive mechanism (3) and the connecting mechanism (4), and the lifting component can drive the main drive mechanism (3) and the connecting mechanism (4) to move upward or downward at the same time.

2. The chip placement mechanism for integrated circuit processing according to claim 1, characterized in that: A conveying platform (2) is installed on the bottom surface of the processing box (1), and a processing end (5) is installed on the top surface of the processing box (1).

3. The chip placement mechanism for integrated circuit processing according to claim 2, characterized in that: The driving assembly comprises a first rotating plate (6), a second rotating plate (7), a first spring (8), a first fixed plate (9) and a fixed shaft (10); the first rotating plate (6) is connected to the inner top surface of the processing box (1) by rotation; the second rotating plate (7) is fixedly arranged on the side of the first rotating plate (6); the first spring (8) is fixedly arranged on the other side of the second rotating plate (7); the first fixed plate (9) is fixedly arranged on the other end of the first spring (8); and the fixed shaft (10) is fixedly arranged on the inner top surface of the processing box (1).

4. The chip placement mechanism for integrated circuit processing according to claim 3, characterized in that: The side of the second rotating plate (7) close to the first rotating plate (6) is fixedly connected to the pressure sensor (14), the back side of the first fixed plate (9) is fixedly connected to the processing box (1), and the fixed shaft (10) passes through the second rotating plate (7) and is connected to the second rotating plate (7) by rotation.

5. The chip placement mechanism for integrated circuit processing according to claim 4, characterized in that: A fixed cylinder (11) is arranged outside the pressure sensor (14), and the fixed cylinder (11) is fixedly connected to the second rotating plate (7). A sliding plate (12) is slidably connected to the inner wall of the fixed cylinder (11), and a second spring (13) is fixedly arranged between the sliding plate (12) and the second rotating plate (7). A movable rod (15) is fixedly arranged on the side of the sliding plate (12) away from the second spring (13), and the movable rod (15) passes through the fixed cylinder (11) and is slidably connected to the fixed cylinder (11).

6. The chip placement mechanism for integrated circuit processing according to claim 4, characterized in that: The lifting assembly comprises a servo motor (16), a first gear (17), a second gear (18), a lifting rod (19), a slide groove (20), a toothed belt (21) and a second fixed plate (22), wherein the servo motor (16) is fixedly mounted on the top surface of the processing box (1), the first gear (17) is fixedly arranged at the output end of the servo motor (16), the second gear (18) is connected to the rear of the first gear (17) by meshing, the lifting rod (19) is symmetrically fixed to the front of the main drive mechanism (3) and the back of the connecting mechanism (4), the slide groove (20) is arranged on the left and right sides of the lifting rod (19), the toothed belt (21) is fixedly arranged on the inner side of the lifting rod (19), and the second fixed plate (22) is connected to the left and right sides of the second gear (18) by rotation.

7. The chip placement mechanism for integrated circuit processing according to claim 6, characterized in that: The lifting rod (19) and the toothed belt (21) respectively penetrate the processing box (1) to the inside of the processing box (1); a slider adapted to the slide groove (20) is fixedly arranged below the top surface of the processing box (1); the slider is slidably connected to the lifting rod (19) through the slide groove (20); the toothed belt (21) is respectively meshedly connected to the first gear (17) and the second gear (18); and the bottom surface of the second fixed plate (22) is fixedly connected to the processing box (1).

Images