Semiconductor part machining and cutting device

Abstract

The utility model discloses a semiconductor part machining and cutting device which comprises an operation table, the upper surface of the operation table is connected with a cutting frame, a collecting mechanism is installed in a dust collecting box, a cutting mechanism is installed in the cutting frame, and the bottom of the cutting frame is connected with an adjusting mechanism. The lower surface of the operation table is connected with a first recycling box. According to the semiconductor part machining and cutting device, firstly, the fixed handle is rotated to drive the lead screw to rotate, then the fixed block is driven to move, semiconductor materials are limited in the horizontal direction, the powerful fan is started while cutting is conducted, and then the semiconductor materials are cut. Harmful gas generated during cutting can be extracted into a dust collecting box through a dust suction cover, then dust is filtered through a material baffle, some harmful gas is filtered and discharged through an activated carbon filter screen, pollution to the working environment is reduced, the personal safety of workers is guaranteed, and the device is more environmentally friendly.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production and processing, in particular to a semiconductor parts processing and cutting device. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to complete specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium or gallium arsenide. They can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. Cutting devices are used to cut the components during the production of semiconductor parts.

[0003] The Chinese patent application with application number CN202122253618.7 discloses a cutting device for semiconductor material processing, including a device body, a cutting platform is provided on the top surface of the device body, a movable track is provided on the top surface of the cutting platform, a transport plate is provided on the top surface of the cutting platform, a support column is fixedly connected to the middle position of one side of the cutting platform, a rotating plate is movably connected to the top of the support column, and a power motor is bolted to one side of the rotating plate. The utility model is suitable for cutting semiconductor materials. The semiconductor material can be fixed by the fixed plate, which greatly improves the cutting effect of the semiconductor material. The rotating sleeve can slide on the side of the limit rod and squeeze the rotating seat through the pressure spring. The rotating seat squeezes the fixed plate so that the fixed plate is squeezed on the top surface of the semiconductor material to fix the semiconductor material. The pressure spring can play a buffering role to prevent excessive pressure from causing damage to the semiconductor material.

[0004] However, the existing cutting devices still have some defects. When cutting semiconductor materials, harmful smoke and dust will be generated. If the smoke and dust are inhaled for a long time, it may cause pneumoconiosis and endanger the personal safety of the workers. Utility Model Content

[0005] In view of the above-mentioned deficiencies in the prior art, the utility model provides a semiconductor parts processing and cutting device, the purpose of which is to solve the problem that harmful smoke and dust are generated when cutting semiconductor materials. If the smoke and dust are inhaled for a long time, it can cause pneumoconiosis and endanger the personal safety of workers.

[0006] In order to achieve the above-mentioned utility model object, the technical solution adopted by the utility model is: a semiconductor parts processing and cutting device, including an operating table, the upper surface of the operating table is connected to a cutting frame, the upper surface of the cutting frame is connected to a dust collection box, a collection mechanism is installed inside the dust collection box, a cutting mechanism is installed inside the cutting frame, an adjustment mechanism is connected to the bottom of the cutting frame, a baffle is connected to one side of the adjustment mechanism, a fixing mechanism is connected to one side of the baffle, and a first recovery box is connected to the lower surface of the operating table;

[0007] The collecting mechanism includes a dust suction pipe connected to one side of the dust collection box, the bottom end of the dust suction pipe is connected to a dust hood, the interior of the dust collection box is connected to a material baffle plate, a second recovery box is installed below the material baffle plate, a filter screen is provided on one side of the material baffle plate, an activated carbon filter screen is connected to one side of the filter screen, a powerful fan is connected to one side of the activated carbon filter screen, and an exhaust port is provided on one side of the dust collection box.

[0008] Furthermore, the cutting mechanism includes a cutting motor installed on the upper surface of the cutting frame, the output end of the cutting motor is connected to a threaded rod, an adjustment block is threadedly connected to the threaded rod, one side of the adjustment block is connected to a driving motor, the output end of the driving motor is connected to a cutting blade, a slide rail is provided on the cutting frame, and the adjustment block slides on the slide rail.

[0009] Furthermore, the adjustment mechanism includes a fixed seat installed on the upper surface of the operating table, an electric push rod is connected to one side of the fixed seat, the output end of the electric push rod is fixedly connected to the baffle, a slide groove is provided inside the operating table, an auxiliary block is provided on the slide groove, and the bottom end of the baffle is fixedly connected to the auxiliary block.

[0010] Furthermore, the fixing mechanism includes a screw rod installed inside the baffle, one side of the screw rod is connected to a fixed handle, the screw rod is connected to a fixed block, one side of the baffle is connected to a strip-shaped long hole, one end of the fixed block is connected to a limiting plate, the limiting plate is connected to an electric push rod 2, and the protruding end of the electric push rod 2 is connected to a pressure plate.

[0011] Furthermore, a sewage pipe is connected to the bottom of the first recovery box, and a recovery port is connected to the top of the first recovery box.

[0012] Furthermore, a support leg is fixedly connected to the lower surface of the operating table.

[0013] The beneficial effects of the utility model are:

[0014] The utility model discloses a semiconductor parts processing and cutting device. When cutting, firstly, by rotating the fixed handle, the lead screw is driven to rotate, and then the fixed block is driven to move, so that the distance between the limit plates can be adjusted, and then the semiconductor material is limited in the horizontal direction. By driving the pressure plate to move by the electric push rod, the semiconductor material can be effectively fixed to prevent displacement during cutting, thereby preventing the cutting effect from being affected. By starting the cutting motor, the threaded rod is driven to rotate, and then the cutting blade is driven to move, and the material is cut. While cutting, a powerful fan is started, and harmful gases generated during cutting can be extracted into the inside of the dust collection box through the dust hood, and then the dust is filtered by the material blocking plate, and some harmful gases are filtered and discharged through the activated carbon filter, thereby reducing pollution to the working environment, ensuring the personal safety of the staff, and making the device more environmentally friendly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a cross-sectional view of a semiconductor parts processing and cutting device of the utility model;

[0016] Figure 2 This is a cross-sectional view of a fixing mechanism of a semiconductor parts processing and cutting device of the utility model;

[0017] Figure 3 It is a right view of a fixing mechanism of a semiconductor parts processing and cutting device of the utility model.

[0018] Reference table of reference numerals:

[0019] 1. Operation table; 2. Cutting frame; 3. Dust collection box; 4. Collection mechanism; 401. Dust suction pipe; 402. Dust hood; 403. Material blocking plate; 404. Second recovery box; 405. Filter; 406. Activated carbon filter; 407. Powerful fan; 408. Exhaust port; 5. Cutting mechanism; 501. Cutting motor; 502. Threaded rod; 503. Adjustment block; 504. Drive motor; 505. Cutting blade; 5 06. Slide rail; 6. Adjustment mechanism; 601. Fixed seat; 602. Electric push rod 1; 603. Slide groove; 604. Auxiliary block; 7. Baffle; 8. Fixing mechanism; 801. Screw rod; 802. Fixed handle; 803. Fixed block; 804. Long strip hole; 805. Limiting plate; 806. Electric push rod 2; 807. Pressing plate; 9. First recycling box; 901. Drain pipe; 902. Recycling port; 10. Support leg. DETAILED DESCRIPTION

[0020] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings, wherein the same parts are represented by the same reference numerals.

[0021] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0022] In order to make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0023] like Figures 1 to 3 As shown, a semiconductor parts processing and cutting device comprises an operating table 1, a cutting frame 2 is connected to the upper surface of the operating table 1, a dust collecting box 3 is connected to the upper surface of the cutting frame 2, a collecting mechanism 4 is installed inside the dust collecting box 3, a cutting mechanism 5 is installed inside the cutting frame 2, an adjusting mechanism 6 is connected to the bottom of the cutting frame 2, a baffle 7 is connected to one side of the adjusting mechanism 6, a fixing mechanism 8 is connected to one side of the baffle 7, and a first recovery box 9 is connected to the lower surface of the operating table 1;

[0024] The collecting mechanism 4 includes a dust suction pipe 401 connected to one side of the dust collecting box 3, the bottom end of the dust suction pipe 401 is connected to a dust hood 402, the interior of the dust collecting box 3 is connected to a material baffle plate 403, a second recovery box 404 is installed below the material baffle plate 403, a filter screen 405 is provided on one side of the material baffle plate 403, an activated carbon filter screen 406 is connected to one side of the filter screen 405, a powerful fan 407 is connected to one side of the activated carbon filter screen 406, and an exhaust port 408 is provided on one side of the dust collecting box 3.

[0025] Specifically, while cutting, a powerful fan 407 is started, and the harmful gases generated during cutting can be extracted into the dust collection box 3 through the dust hood 402, and then the dust is filtered by the baffle plate 403, and some harmful gases are filtered and discharged through the activated carbon filter 406, thereby reducing pollution to the working environment, ensuring the personal safety of the staff, and making the device more environmentally friendly.

[0026] The cutting mechanism 5 includes a cutting motor 501 installed on the upper surface of the cutting frame 2, the output end of the cutting motor 501 is connected to a threaded rod 502, the threaded rod 502 is threadedly connected to an adjustment block 503, one side of the adjustment block 503 is connected to a drive motor 504, the output end of the drive motor 504 is connected to a cutting blade 505, and a slide rail 506 is provided on the cutting frame 2, and the adjustment block 503 slides on the slide rail 506.

[0027] Specifically, the cutting motor 501 is started to drive the threaded rod 502 to rotate, thereby driving the cutting blade 505 to move, thereby cutting the material.

[0028] The adjustment mechanism 6 includes a fixed seat 601 installed on the upper surface of the operating table 1, and an electric push rod 602 is connected to one side of the fixed seat 601. The output end of the electric push rod 602 is fixedly connected to the baffle 7. A slide groove 603 is provided inside the operating table 1, and an auxiliary block 604 is provided on the slide groove 603. The bottom end of the baffle 7 is fixedly connected to the auxiliary block 604.

[0029] Specifically, the baffle 7 is driven to move by the electric push rod 602, so that the cutting length can be adjusted, which is convenient and quick.

[0030] The fixing mechanism 8 includes a screw rod 801 installed inside the baffle 7, one side of the screw rod 801 is connected to a fixing handle 802, the screw rod 801 is connected to a fixing block 803, one side of the baffle 7 is connected to a strip-shaped long hole 804, one end of the fixing block 803 is connected to a limiting plate 805, the limiting plate 805 is connected to an electric push rod 806, and the protruding end of the electric push rod 806 is connected to a pressure plate 807.

[0031] Specifically, when cutting, first rotate the fixed handle 802 to drive the screw 801 to rotate, and then drive the fixed block 803 to move, so as to adjust the distance between the limit plates 805, and then limit the semiconductor material in the horizontal direction. The electric push rod 806 drives the pressure plate 807 to move, which can effectively fix the semiconductor material and prevent displacement during cutting, thereby affecting the cutting effect.

[0032] The bottom of the first recovery box 9 is connected to a sewage pipe 901 , and the top of the first recovery box 9 is connected to a recovery port 902 .

[0033] Specifically, the larger particles generated during cutting can be recovered through the recovery port 902 .

[0034] A supporting leg 10 is fixedly connected to the lower surface of the operating platform 1 .

[0035] The working principle of the present invention is that when cutting, firstly, by rotating the fixed handle 802, the screw rod 801 is driven to rotate, and then the fixed block 803 is driven to move, so that the distance between the limit plates 805 can be adjusted, and then the semiconductor material can be limited in the horizontal direction. The electric push rod 806 drives the pressure plate 807 to move, which can effectively fix the semiconductor material to prevent displacement during cutting and affect the cutting effect. The cutting motor 501 is started to drive the threaded rod 502 to rotate, and then the cutting blade 505 is driven to move, and the material is cut. While cutting, the powerful fan 407 is started, and the harmful gas generated during cutting can be extracted into the dust collection box 3 through the dust hood 402, and then the dust is filtered by the material blocking plate 403, and some harmful gases are filtered and discharged through the activated carbon filter 406, thereby reducing the pollution to the working environment, ensuring the personal safety of the staff, and making the device more environmentally friendly.

[0036] The above description is only a preferred embodiment of the present utility model patent and is not intended to limit the present utility model patent. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model patent shall be included in the protection scope of the present utility model patent.

Claims

1. A semiconductor parts processing and cutting device, characterized in that: The operating table (1) comprises a cutting frame (2) connected to the upper surface of the operating table (1), a dust collecting box (3) connected to the upper surface of the cutting frame (2), a collecting mechanism (4) installed inside the dust collecting box (3), a cutting mechanism (5) installed inside the cutting frame (2), an adjusting mechanism (6) connected to the bottom of the cutting frame (2), a baffle (7) connected to one side of the adjusting mechanism (6), a fixing mechanism (8) connected to one side of the baffle (7), and a first recovery box (9) connected to the lower surface of the operating table (1); The collecting mechanism (4) comprises a dust suction pipe (401) connected to one side of the dust collecting box (3); the bottom end of the dust suction pipe (401) is connected to a dust hood (402); the interior of the dust collecting box (3) is connected to a material baffle plate (403); a second recovery box (404) is installed below the material baffle plate (403); a filter screen (405) is provided on one side of the material baffle plate (403); an activated carbon filter screen (406) is connected to one side of the filter screen (405); a powerful fan (407) is connected to one side of the activated carbon filter screen (406); and an exhaust port (408) is provided on one side of the dust collecting box (3).

2. A semiconductor parts processing and cutting device according to claim 1, characterized in that: The cutting mechanism (5) comprises a cutting motor (501) mounted on the upper surface of the cutting frame (2); the output end of the cutting motor (501) is connected to a threaded rod (502); an adjusting block (503) is threadedly connected to the threaded rod (502); one side of the adjusting block (503) is connected to a driving motor (504); the output end of the driving motor (504) is connected to a cutting blade (505); a slide rail (506) is provided on the cutting frame (2); and the adjusting block (503) slides on the slide rail (506).

3. A semiconductor parts processing and cutting device according to claim 1, characterized in that: The adjustment mechanism (6) comprises a fixed seat (601) mounted on the upper surface of the operating table (1); one side of the fixed seat (601) is connected to an electric push rod (602); the output end of the electric push rod (602) is fixedly connected to a baffle (7); a slide groove (603) is provided inside the operating table (1); an auxiliary block (604) is provided on the slide groove (603); and the bottom end of the baffle (7) is fixedly connected to the auxiliary block (604).

4. A semiconductor parts processing and cutting device according to claim 1, characterized in that: The fixing mechanism (8) comprises a screw rod (801) installed inside the baffle (7), one side of the screw rod (801) is connected to a fixing handle (802), a fixing block (803) is connected to the screw rod (801), one side of the baffle (7) is connected to a strip-shaped long hole (804), one end of the fixing block (803) is connected to a limiting plate (805), the limiting plate (805) is connected to an electric push rod 2 (806), and the protruding end of the electric push rod 2 (806) is connected to a pressure plate (807).

5. The semiconductor parts processing and cutting device according to claim 1, characterized in that: The bottom of the first recovery box (9) is connected to a sewage discharge pipe (901), and the top of the first recovery box (9) is connected to a recovery port (902).

6. A semiconductor parts processing and cutting device according to claim 1, characterized in that: The lower surface of the operating table (1) is fixedly connected with a supporting leg (10).

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