High-voltage diode processing device

Abstract

The utility model discloses a high-voltage diode processing device which comprises an acid pickling barrel, supporting legs are symmetrically arranged at the bottom of the acid pickling barrel, a water inlet pipe is communicated with the acid pickling barrel, a sealing cover is arranged at the top of the acid pickling barrel, and an acid pickling mechanism extending into the acid pickling barrel is installed in the center of the top of the sealing cover. Supporting plates are fixedly installed on the two sides of the outer wall of the pickling barrel, electric telescopic rods are installed on the supporting plates, a supporting transverse plate is connected between the top ends of the electric telescopic rods, a connecting column is connected between the supporting transverse plate and the sealing cover, and an auxiliary heating mechanism is arranged at the inner bottom of the pickling barrel. The device has the advantages that the device is simple in structure and convenient to use, it can be guaranteed that a diode chip can make full contact with a pickling solution, the problem that due to dead angles, pickling is incomplete is solved, and the effects of dehydration and auxiliary heating are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of high-voltage diode processing, in particular to a high-voltage diode processing device. Background Art

[0002] A diode is an electronic device made of semiconductor materials. It has unidirectional conductivity, that is, when a forward voltage is applied to the anode and cathode of the diode, the diode is turned on. When a reverse voltage is applied to the anode and cathode, the diode is turned off. Therefore, the conduction and cutoff of the diode are equivalent to the on and off of the switch. The diode is one of the earliest semiconductor devices and is widely used. When high-voltage power diodes are processed and manufactured, the general production process includes six aspects, namely welding, pickling, molding, electroplating, straightening, testing and packaging.

[0003] At present, the diode needs to be pickled during the manufacturing process, that is, various acids and water are used to chemically corrode the edge surface around the PN junction of the chip to improve mechanical damage, remove impurities adsorbed on the surface, reduce the surface electric field, and make the breakdown of the PN junction first occur from the body to obtain a reverse breakdown voltage close to the theoretical value and a very small surface leakage current. The pickling machine used for diode processing on the market has the problem of insufficient pickling when pickling the diode, that is, a large number of diode chips are stacked in the pickling machine, and the overlapping parts between the chips are difficult to get sufficient contact with the acid solution, which makes the pickling effect poor and the pickling efficiency low. In addition, dehydration is required after pickling, and it needs to be placed in a dehydration device for dehydration. The process is complicated and the production efficiency is low.

[0004] Currently, no effective solution has been proposed for the problems in the related technologies. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model aims to provide a high-voltage diode processing device.

[0006] In order to achieve the above-mentioned purpose, the utility model is implemented through the following technical scheme: a high-voltage diode processing device, including a pickling barrel, the bottom of the pickling barrel is symmetrically provided with support legs, the pickling barrel is connected to a water inlet pipe, the top of the pickling barrel is provided with a sealing cover, a pickling mechanism extending into the pickling barrel is installed at the top center of the sealing cover, support plates are fixedly installed on both sides of the outer wall of the pickling barrel, electric telescopic rods are installed on the support plates, support cross plates are connected between the top ends of the electric telescopic rods, connecting columns are connected between the support cross plates and the sealing cover, and an auxiliary heating mechanism is provided at the inner bottom of the pickling barrel.

[0007] Preferably, the pickling mechanism includes a motor installed at the top center of the sealing cover, the output end of the motor is connected to a transmission rod that passes through the sealing cover and extends into the pickling barrel, two sub-filling tanks are fixedly mounted on the transmission rod, and a plurality of water leakage holes are provided at the bottom of the sub-filling tanks.

[0008] Preferably, the two sub-packaging tanks are installed on the transmission rod in an upper and lower manner, the outer walls of the sub-packaging tanks are each installed with a plurality of stirring blades, and a circular retaining ring is provided at the opening of the sub-packaging tank.

[0009] Preferably, the auxiliary heating mechanism includes a heat-resistant shell installed at the bottom center of the pickling barrel, a heat-conducting plate is provided on the top of the heat-resistant shell, an inner cavity is opened in the heat-resistant shell, a heating element is arranged in the inner cavity, an opening communicating with the inner cavity is opened on the heat-resistant shell, and the heating end of the heating element passes through the opening and contacts with the heat-conducting plate.

[0010] Preferably, the bottom of the heating element is connected to a power interface via a wire, and the power interface is installed at the bottom of the outer wall of the pickling barrel.

[0011] Preferably, one side of the bottom of the pickling barrel is connected to a drainage pipe, and a sealing plug is installed on the drainage pipe.

[0012] The utility model provides a high voltage diode processing device, which has the following beneficial effects:

[0013] The pickling barrel is connected with a water inlet pipe, which can be used for adding pickling liquid and cleaning liquid. The sealing cover is provided to seal the pickling barrel during pickling and cleaning. The pickling mechanism can assist the diode chip in pickling and has the effect of dehydration, so that the cleaned diode chip can be quickly dehydrated, so that the diode chip can be fully in contact with the pickling liquid, avoiding the problem of dead angles and imperfect pickling. The two electric telescopic rods are provided to drive the supporting cross plate to rise and fall, so that the supporting cross plate drives the sealing cover to rise and fall, so that the pickling mechanism can be raised and lowered, which is convenient for putting the diode chip before pickling and taking out the diode chip after pickling and cleaning. The auxiliary heating mechanism is provided at the inner bottom of the pickling barrel, which can ensure the temperature during pickling and cooperate with the dehydration work after cleaning is completed. The device of the present application has a simple structure and is easy to use. It can ensure that the diode chip can be fully in contact with the pickling liquid, avoiding the problem of dead angles and imperfect pickling, and has the effects of dehydration and auxiliary heating. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 This is a front view of a high-voltage diode processing device according to an embodiment of the utility model;

[0016] Figure 2 It is a schematic diagram of the internal structure of a pickling barrel in a high-voltage diode processing device according to an embodiment of the utility model;

[0017] Figure 3 It is a structural schematic diagram of a pickling mechanism in a high-voltage diode processing device according to an embodiment of the utility model;

[0018] Figure 4 It is a structural schematic diagram of an auxiliary heating mechanism in a high-voltage diode processing device according to an embodiment of the utility model.

[0019] In the figure:

[0020] 1. Pickling barrel; 2. Support legs; 3. Sealing cover; 4. Pickling mechanism; 5. Support plate; 6. Electric telescopic rod; 7. Support cross plate; 8. Connecting column; 9. Auxiliary heating mechanism; 10. Motor; 11. Transmission rod; 12. Packaging tank; 13. Leakage hole; 14. Circular retaining ring; 15. Agitator; 16. Heat-resistant shell; 17. Inner cavity; 18. Heat-generating element; 19. Opening; 20. Heat-conducting plate; 21. Wire; 22. Power interface; 23. Drainage pipe; 24. Sealing plug. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] See also Figure 1-4 According to an embodiment of the utility model, a high-voltage diode processing device comprises a pickling barrel 1, the bottom of which is symmetrically provided with supporting legs 2, the pickling barrel 1 is connected with a water inlet pipe, the top of the pickling barrel 1 is provided with a sealing cover 3, a pickling mechanism 4 extending into the pickling barrel 1 is installed at the top center of the sealing cover 3, support plates 5 are fixedly installed on both sides of the outer wall of the pickling barrel 1, electric telescopic rods 6 are installed on the support plates 5, support cross plates 7 are connected between the top ends of the electric telescopic rods 6, a connecting column 8 is connected between the support cross plate 7 and the sealing cover 3, and an auxiliary heating mechanism 9 is provided at the inner bottom of the pickling barrel 1.

[0023] In one embodiment, please refer to the attached manual. Figure 3 As shown, the pickling mechanism 4 includes a motor 10 installed at the top center of the sealing cover 3, the output end of the motor 10 is connected to a transmission rod 11 that penetrates the sealing cover 3 and extends into the pickling barrel 1, two sub-packaging tanks 12 are fixedly installed on the transmission rod 11, the bottom of each sub-packaging tank 12 is provided with a plurality of water leakage holes 13, the two sub-packaging tanks 12 are installed on the transmission rod 11 up and down, the outer wall of each sub-packaging tank 12 is provided with a plurality of stirring blades 15, and a circular retaining ring 14 is provided at the opening of the sub-packaging tank 12. The motor 10 drives the transmission rod 11 to rotate, the diode chip to be pickled is placed in the two sub-packaging tanks 12, the transmission rod 11 drives the sub-packaging tank 12 to rotate, and cooperates with the stirring blade 15 to stir the pickling liquid therein, so that the diode chip in the sub-packaging tank 12 can be fully in contact with the pickling liquid, thereby improving the pickling effect, and at the same time, when dehydrating, it is only necessary to drain the water in the pickling barrel 1 to drive the diode chip to rotate and perform the dehydration work.

[0024] In one embodiment, please refer to the attached manual. Figure 4 As shown, the auxiliary heating mechanism 9 includes a heat-resistant shell 16 installed at the bottom center of the pickling barrel 1, a heat-conducting plate 20 is provided on the top of the heat-resistant shell 16, an inner cavity 17 is provided in the heat-resistant shell 16, a heating element 18 is provided in the inner cavity 17, an opening 19 communicating with the inner cavity 17 is provided on the heat-resistant shell 16, a heating end of the heating element 18 passes through the opening 19 and contacts the heat-conducting plate 20, and a power connection 22 is connected to the bottom of the outer wall of the pickling barrel 1 through a wire 21, and the power connection 22 is installed at the bottom of the outer wall of the pickling barrel 1. The power interface 22 is connected to an external power source, so that the heating element 18 is powered, and heat is generated through the work of the resistance wire, and the heat is transferred to the heat-conducting plate 20, so that the heat-conducting plate 20 heats the pickling liquid in the pickling barrel 1, thereby ensuring the temperature of the pickling liquid during pickling and ensuring the pickling effect.

[0025] In one embodiment, please refer to the attached manual. Figure 1 As shown, one side of the bottom of the pickling barrel 1 is connected to a drainage pipe 23, and a sealing plug 24 is installed on the drainage pipe 23. The drainage pipe 23 is provided to facilitate the discharge of sewage after use, and the sealing plug 24 has a sealing effect.

[0026] In actual application, the pickling barrel 1 is connected with a water inlet pipe, which can be used for adding pickling liquid and cleaning liquid. The sealing cover 3 is provided to seal the pickling barrel 1 during pickling and cleaning. The pickling mechanism 4 is provided to assist the diode chip in pickling and has the effect of dehydration, so that the cleaned diode chip can be quickly dehydrated, so that the diode chip can be fully in contact with the pickling liquid, avoiding the occurrence of dead angles, resulting in imperfect pickling problems. The two electric telescopic rods 6 are provided to drive the supporting cross plate 7 to rise and fall, so that the supporting cross plate 7 drives the sealing cover 3 to rise and fall, so that the pickling mechanism 4 can be lifted and lowered, which is convenient for placing the diode chip before pickling and taking out the diode chip after pickling and cleaning. The auxiliary heating mechanism 9 is provided at the inner bottom of the pickling barrel 1, which can ensure the temperature during pickling, and after cleaning is completed, cooperate with the dehydration work. The device of the present application has a simple structure and is easy to use. It can ensure that the diode chip can be fully in contact with the pickling liquid, avoiding the occurrence of dead angles, resulting in imperfect pickling problems, and has the effects of dehydration and auxiliary heating.

[0027] Although this specification is described according to implementation modes, not every implementation mode includes only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A high voltage diode processing device, characterized in that: The pickling barrel (1) comprises a pickling barrel (1), wherein the bottom of the pickling barrel (1) is symmetrically provided with support legs (2), the pickling barrel (1) is connected to a water inlet pipe, the top of the pickling barrel (1) is provided with a sealing cover (3), a pickling mechanism (4) extending into the pickling barrel (1) is installed at the center of the top of the sealing cover (3), support plates (5) are fixedly installed on both sides of the outer wall of the pickling barrel (1), the support plates (5) are installed with electric telescopic rods (6), the top ends of the electric telescopic rods (6) are connected with support cross plates (7), the support cross plates (7) and the sealing cover (3) are connected with a connecting column (8), and the inner bottom of the pickling barrel (1) is provided with an auxiliary heating mechanism (9).

2. A high voltage diode processing device according to claim 1, characterized in that: The pickling mechanism (4) comprises a motor (10) mounted at the top center of the sealing cover (3), the output end of the motor (10) being connected to a transmission rod (11) penetrating the sealing cover (3) and extending into the pickling barrel (1), two sub-packaging tanks (12) being fixedly mounted on the transmission rod (11), and a plurality of water leakage holes (13) being provided at the bottom of each of the sub-packaging tanks (12).

3. A high voltage diode processing device according to claim 2, characterized in that: The two sub-packaging tanks (12) are mounted on the transmission rod (11) in an upper and lower position, the outer walls of the sub-packaging tanks (12) are each mounted with a plurality of stirring blades (15), and a circular retaining ring (14) is provided at the opening of the sub-packaging tank (12).

4. A high voltage diode processing device according to claim 3, characterized in that: The auxiliary heating mechanism (9) comprises a heat-resistant shell (16) installed at the bottom center of the pickling barrel (1), a heat-conducting plate (20) is provided on the top of the heat-resistant shell (16), an inner cavity (17) is provided in the heat-resistant shell (16), a heating element (18) is provided in the inner cavity (17), an opening (19) communicating with the inner cavity (17) is provided on the heat-resistant shell (16), and a heating end of the heating element (18) passes through the opening (19) and contacts the heat-conducting plate (20).

5. A high voltage diode processing device according to claim 4, characterized in that: The bottom of the heating element (18) is connected to a power interface (22) via a wire (21); the power interface (22) is installed at the bottom of the outer wall of the pickling barrel (1).

6. The high voltage diode processing device according to claim 5, characterized in that: One side of the bottom of the pickling barrel (1) is connected to a drainage pipe (23), and a sealing plug (24) is installed on the drainage pipe (23).

Images