ESOP9L multi-base-island lead frame capable of enhancing heat dissipation

Abstract

The utility model discloses an ESOP9L multi-base-island lead frame capable of enhancing heat dissipation, and belongs to the technical field of integrated circuits. The lead frame comprises a frame body, the upper side and the lower side of the frame body are provided with round holes and elliptical holes used for positioning and identification, a plurality of small units arranged vertically and horizontally are arranged between the holes in the upper side and the lower side, and each small unit comprises a plurality of base islands, inner pins and outer pins connected to the base islands, and connecting ribs connecting the inner pins and the outer pins. The base island is fixed to the whole frame through the Tibar, lock holes are formed in the base island, glue inlet holes or cut-off holes are formed between the adjacent rows of small units, and the glue inlet holes and the cut-off holes are formed in a staggered mode in the transverse direction of the whole frame. The beneficial effects of the utility model are that the back leakage base islands can enhance the heat dissipation performance of the chip in the use process, the non-recessed base islands are provided with lock holes, the reliability of plastic package is enhanced, the yield of products is improved, and the invested cost in the production process is reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of integrated circuits, and in particular relates to an ESOP9L multi-island lead frame with enhanced heat dissipation. Background Art

[0002] As the chip carrier of integrated circuits, the lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead ends of the chip and the external leads to form an electrical circuit. It serves as a bridge to connect to external wires and is also the main way to dissipate heat inside the chip. Lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry.

[0003] like Figure 1 As shown in the figure, it is a conventional multi-base island lead frame. It can be seen that the conventional multi-base island lead frame is a flat frame, and the plastic encapsulation and lead bonding process are prone to plastic encapsulation delamination and poor lead bonding. At the same time, since the finished product frame is completely inside the plastic encapsulation body, the heat dissipation performance is poor, which affects the service life of the product. The utility model designs a way to add a concave and a lock hole to the base island to solve this problem. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide an ESOP9L multi-island lead frame with enhanced heat dissipation, which solves the problem that the carrier and the pins of the existing SOP multi-island lead frame are in the same plane, which is easy to be delaminated during plastic sealing, and the finished chip is easy to be damaged during cutting and forming, and the lead bonding is easy to cause poor wire bonding. During the use of the chip, since the entire base island is in the plastic sealing material, the heat dissipation performance is poor. At the same time, during the production process of the frame, it is easy to cause scratches when stacking, etc., resulting in a low finished product yield and a high cost investment, thereby solving at least one technical problem involved in the background technology.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] An embodiment of the present application provides an ESOP9L multi-island lead frame with enhanced heat dissipation, including an overall frame, wherein the upper and lower sides of the overall frame are provided with circular holes and elliptical holes for positioning and identification, and a plurality of small units arranged vertically and horizontally are provided between the holes on the upper and lower sides, each of the small units includes a plurality of islands, inner feet and outer feet connected to the islands, connecting ribs connecting the inner feet and the outer feet, and a Tibar for fixing the islands to the overall frame, a locking hole is provided on the islands, and glue holes or cutting holes are provided between the small units in adjacent columns, and the glue holes and the cutting holes are staggered along the lateral direction of the overall frame.

[0007] As a preferred improvement of the present invention, the frame as a whole is provided with 6 rows and 20 columns of the small units.

[0008] As a preferred improvement of the present invention, the distances between adjacent small units in the transverse direction and the longitudinal direction of the frame as a whole are 12.650 mm and 14.000 mm respectively.

[0009] As a preferred improvement of the present invention, each of the small units is provided with three base islands.

[0010] As a preferred improvement of the present invention, the outer feet of each of the small units are symmetrically arranged up and down, and stress release grooves are provided between the outer feet along the overall longitudinal direction of the frame.

[0011] As a preferred improvement of the present invention, the overall length of the frame is 280 mm, the width is 83 mm, and the thickness is 0.254 mm.

[0012] As a preferred improvement of the present invention, stress release grooves and air holes are provided between each row of the small units along the vertical direction of the entire frame.

[0013] As a preferred improvement of the present invention, the frame as a whole is provided with 64 columns and 17 rows of the small units.

[0014] As a preferred improvement of the present invention, the base island includes a fixed base island which is in the same plane as the Tibar and a sunken base island which is sunken, and the lock hole is arranged on the fixed base island.

[0015] Compared with the prior art, this application has the following beneficial effects:

[0016] By increasing the pressure edge around the two base islands and concave the base islands at the same time, the back of the base island can be exposed after plastic sealing. The pressure edge can increase the bonding strength of the plastic seal, and the back-leaking base island can enhance the heat dissipation of the chip during use. Adding lock holes to the non-concave base island enhances the reliability of the plastic seal, improves the product yield, and reduces the cost invested in the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0018] Figure 1 It is a structural schematic diagram of an existing conventional multi-island lead frame;

[0019] Figure 2 This is a schematic diagram of the overall structure of the ESOP9L multi-island lead frame with enhanced heat dissipation according to the utility model;

[0020] Figure 3 One of the structural schematic diagrams of the small unit provided by the utility model;

[0021] Figure 4 This is the second structural schematic diagram of the small unit provided by the utility model. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0023] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0024] See also Figures 2 to 4 As shown, an embodiment of the present application provides an ESOP9L multi-island lead frame with enhanced heat dissipation, including a frame as a whole 1, wherein circular holes 11 and elliptical holes 12 for positioning and identification are provided on the upper and lower sides of the frame as a whole 1, and a plurality of small units 13 are arranged vertically and horizontally between the circular holes 11 and the elliptical holes 12 on the upper and lower sides of the frame as a whole 1. Specifically, the frame as a whole 1 is provided with 64 columns and 17 rows of the small units 13.

[0025] The frame as a whole 1 has a length of 280 mm, a width of 83 mm, and a thickness of 0.254 mm, and is made of 0.254 mm C194SH copper alloy material.

[0026] The small unit 13 includes a plurality of base islands and inner legs 131 and outer legs 132 connected to the base islands. The base islands include a fixed base island 1341 and a sinking base island 1342. The fixed base island 1341 and the Tibar 1351 are in the same plane. The fixed base island 1341 is provided with a lock hole, which includes an elliptical lock hole 13411 and a circular lock hole 13412. Specifically, the elliptical lock hole 13411 has a width of 0.254 mm and a length of 0.5232 mm. The radius of the circular lock hole 13412 is 0.140 mm.

[0027] The sinking base island 1342 is set to sink. Specifically, the connection between it and Tibar1352 is concave, so that the sinking base island 1342 sinks 0.496mm and the inclination angle is 44.77°. The pressing edge width of the sinking base island 1342 is 0.200mm.

[0028] The inner and outer legs are connected via a connecting rib 133, and the small unit 13 also includes a Tibar 135 for fixing the base island.

[0029] Adjacent rows of small units 13 are provided with glue holes 14 or cutting holes 15, and the glue holes 14 and the cutting holes 15 are staggered along the lateral direction of the frame 1. Specifically, the glue holes 14 are elliptical glue holes, and the cutting holes 15 are rectangular cutting holes.

[0030] The outer legs 132 of the small unit 13 are symmetrical in the upper and lower parts, and a stress release groove 16 is designed between the outer legs 132 of two adjacent small units 13 in the longitudinal direction of the frame as a whole 1. The spacing between two adjacent small units 13 in the longitudinal direction of the frame as a whole 1 is 12.65 mm, and the spacing in the transverse direction is 14.00 mm.

[0031] In order to improve the efficiency of glue injection, reduce the impact force on the pressure welding gold wire during glue injection, and facilitate the production of packaging molds, a glue injection port 136 is opened on the side of the small unit 13, and the glue injection port 136 is arranged corresponding to the injection flow channel.

[0032] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0033] In addition, it should be noted that the scope of the methods and systems in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved. For example, the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

[0034] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An ESOP9L multi-island lead frame with enhanced heat dissipation, characterized in that: The invention comprises an overall frame, wherein the upper and lower sides of the overall frame are provided with round holes and elliptical holes for positioning and identification, a plurality of small units arranged vertically and horizontally are provided between the holes on the upper and lower sides, each of the small units comprises a plurality of base islands, inner feet and outer feet connected to the base islands, connecting ribs connecting the inner feet and the outer feet, and a Tibar for fixing the base islands to the overall frame, a locking hole is provided on the base islands, and glue holes or cutting holes are provided between the small units in adjacent columns, and the glue holes and the cutting holes are staggered along the lateral direction of the overall frame.

2. The ESOP9L multi-island lead frame with enhanced heat dissipation according to claim 1, characterized in that: The frame as a whole is provided with 6 rows and 20 columns of the small units.

3. The ESOP9L multi-island lead frame with enhanced heat dissipation according to claim 1, characterized in that: The distances between adjacent small units in the transverse direction and the longitudinal direction of the frame as a whole are 12.650 mm and 14.000 mm respectively.

4. The ESOP9L multi-island lead frame with enhanced heat dissipation according to claim 1, characterized in that: Each of the small units is provided with three base islands.

5. The ESOP9L multi-island lead frame with enhanced heat dissipation according to claim 1, characterized in that: The outer legs of each of the small units are symmetrically arranged up and down, and stress release grooves are arranged between the outer legs along the overall longitudinal direction of the frame.

6. The ESOP9L multi-island lead frame with enhanced heat dissipation according to claim 1, characterized in that: The overall length of the frame is 280 mm, the width is 83 mm, and the thickness is 0.254 mm.

7. The ESOP9L multi-island lead frame with enhanced heat dissipation according to claim 1, characterized in that: Along the vertical direction of the entire frame, stress release grooves and air holes are arranged between each row of the small units.

8. The ESOP9L multi-island lead frame with enhanced heat dissipation according to claim 1, characterized in that: The frame as a whole is provided with 64 columns and 17 rows of the small units.

9. The ESOP9L multi-island lead frame with enhanced heat dissipation according to claim 1, characterized in that: The base island includes a fixed base island which is in the same plane as the Tibar and a sunken base island which is sunken, and the locking hole is arranged on the fixed base island.

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