Structure of FPC acquisition module
The FPC acquisition module with reinforced circuit board and extended circuit windows addresses issues of open lines and abnormal connections, improving structural strength and yield by reducing deformation risks and enhancing fixing effects.
Patent Information
- Application Number
- CN202323491673.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-21
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2033-12-21
AI Technical Summary
The existing battery module collection modules are prone to issues such as open lines and abnormal connections of NTC temperature sensors during production and use, leading to decreased yield.
The FPC acquisition module design includes a reinforced circuit board with cantilevers, a conductive sheet, and a temperature sensor, featuring a reinforcing sheet, cantilever connecting ribs, and a skirt at the welding end of the conductive sheet, along with axially symmetric circuit pads and extended circuit windows, to enhance structural strength and reduce deformation risks.
This design increases the structural strength and yield of the FPC acquisition module, reduces the risk of damage, and improves the fixing effect of the conductive sheet, thereby enhancing the reliability and production efficiency.
Smart Images
Figure CN222235124U_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of battery packs, and more particularly to the structure of an FPC acquisition module. Background Art
[0002] With the rapid development of the new energy industry and the society's demand for green and sustainable development, measures to improve efficiency and reduce costs are particularly important. The composition of new energy is inseparable from the battery module, and CCS is the core component of the battery module, so CCS has great research value.
[0003] Cell Connection System is referred to as CCS, which is mainly composed of brackets, conductive sheets, collection modules, thermal pads and other structural parts. The collection module uses the NTC temperature sensor to detect and monitor the voltage and temperature of the battery cell in real time during operation, and transmits the collected parameters to the BMS battery management system to achieve overcurrent protection and thermal runaway management of the battery module. However, in the prior art, the collection module is prone to problems such as open lines and abnormal connection of NTC temperature sensors during production and use. The above problems will lead to a decrease in the yield of the collection module. Therefore, it is necessary to provide an optimized structure of an FPC collection module.
[0004] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the utility model and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because these solutions are described in the background technology section of the utility model. Utility Model Content
[0005] The purpose of this specification is to provide a structure of an FPC acquisition module to solve the above problems.
[0006] The structure of an FPC acquisition module provided in this specification includes:
[0007] An FPC circuit board and a connector, a conductive sheet, a reinforcing sheet and a temperature sensor arranged on the FPC circuit board;
[0008] The end of the FPC circuit board in the extension direction is connected to the connector, and a plurality of cantilevers are hollowed out on both sides of the FPC circuit board in the extension direction, and one end of the cantilever carrying the conductive sheet, the reinforcing sheet and the temperature sensor is connected to the FPC circuit board through a connecting rib;
[0009] The conductive sheet is welded to the cantilever, a welding hole for accommodating the temperature sensor is provided at the welding end of the conductive sheet, and a skirt is provided at the periphery of the end of the welding end of the conductive sheet; the reinforcing sheet is provided at the other side of the welding area between the cantilever and the conductive sheet, and the area of the reinforcing sheet is larger than the area of the welding area; the temperature sensor is provided in the welding hole and is fixed to the cantilever by welding.
[0010] Preferably, the conductive sheet is electrically connected to the cantilever surface by a welding process.
[0011] Preferably, the temperature sensor may be an NTC temperature sensor, and welding areas are provided at both ends of the NTC temperature sensor, and the welding areas are used for being fixed to the cantilever of the FPC circuit board by welding.
[0012] Preferably, the cantilever surface of the FPC circuit board is provided with a circuit pad and a circuit window for welding the temperature sensor, and the area of the circuit window is larger than the area of the circuit pad.
[0013] Preferably, the circuit pad includes two pads arranged axially symmetrically, and two ends of the circuit window perpendicular to the direction of the symmetry axis are located outside the circuit pad.
[0014] Preferably, the FPC circuit board comprises a laminated substrate surface, a circuit surface and a covering film, the substrate surface and the covering film are respectively bonded to two sides of the circuit surface, and the covering film has a window to expose the circuit surface to form the circuit window.
[0015] Compared with the prior art, the beneficial effects of the utility model are:
[0016] 1. The utility model can increase the structural strength of the circuit board by adding a reinforcing sheet on the back of the circuit board, thereby improving the service life of the FPC acquisition module.
[0017] 2. The utility model provides cantilever connecting ribs so that once the conductive sheet is subjected to an external force that causes deformation, the deformation force will only act on the cantilever connecting ribs to tear them off, so that the deformation force has no effect on the circuit of the acquisition module, reducing the risk of damaging the FPC acquisition module.
[0018] 3. The utility model can reduce the probability of SMT process abnormality and improve the yield rate of the FPC acquisition module by extending the left and right sides of the circuit window beyond the circuit pad.
[0019] 4. The utility model designs a skirt at the welding end of the conductive sheet, thereby lengthening the perimeter of the welding portion of the conductive sheet, thereby increasing the tin creeping area and improving the fixing effect of the conductive sheet and the FPC circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0021] Figure 1 It is a structural diagram of an FPC acquisition module provided in an embodiment of this specification;
[0022] Figure 2 It is a partial enlarged view of an FPC acquisition module provided in an embodiment of this specification;
[0023] Figure 3 This is a circuit window diagram of an FPC acquisition module provided in an embodiment of this specification;
[0024] Figure 4 This is a conductive sheet structure diagram of an FPC acquisition module provided in an embodiment of this specification.
[0025] In the figure: 1. FPC circuit board; 11. Cantilever; 12. Connecting rib; 2. Connector; 3. Conductive sheet; 31. Welding hole; 32. Skirt; 4. Temperature sensor; 5. Reinforcement sheet; 6. Circuit pad; 7. Circuit window. DETAILED DESCRIPTION
[0026] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this specification.
[0027] In the description of the present utility model, it should be noted that the terms "upper", "middle", "lower", "inner", "outer", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model. The terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. The following describes the implementation method of the present utility model based on its overall structure.
[0028] Reference Figures 1 to 4 As shown, the embodiment of the present application provides a structure of an FPC acquisition module, including:
[0029] An FPC circuit board 1 and a connector 2 , a conductive sheet 3 , a reinforcing sheet 5 and a temperature sensor 4 arranged on the FPC circuit board 1 .
[0030] The end of the FPC circuit board 1 in the extension direction is connected to the connector 2, and a plurality of cantilevers 11 are hollowed out on both sides of the FPC circuit board 1 in the extension direction. One end of the cantilever 11 carrying the conductive sheet 3, the reinforcement sheet 5 and the temperature sensor 4 is connected to the FPC circuit board 1 through a connecting rib 12.
[0031] The FPC circuit board 1 includes a substrate surface, a circuit surface and a covering film which are stacked, and the substrate surface and the covering film are respectively bonded to the two sides of the circuit surface. The covering film on the FPC circuit board 1 has a window to expose the circuit surface to form the circuit window 7, thereby forming a pad for welding the temperature sensor 4 and the conductive sheet 3. Further, the circuit pad 6 and the circuit window 7 for welding the temperature sensor 4 can be arranged on the surface of the cantilever 11 of the FPC circuit board 1, and the circuit pad 6 includes two pads arranged in an axisymmetric manner, and the two ends of the circuit window 7 perpendicular to the direction of the symmetry axis are located outside the circuit pad 6. And the pad is designed as an OPEN PAD, that is, the area of the circuit window 7 is larger than the area of the circuit pad 6. In the original design, the FPC circuit surface is protected by the covering film, and only the window position is not covered by the covering film; however, due to the expansion and contraction of the circuit surface and the covering film and the deviation when the covering film is attached, the pad may be offset, so that the actual object will be inconsistent with the design, resulting in abnormal SMT process. The OPEN PAD design makes the circuit windows 7 on the left and right sides of the circuit pad 6 exceed the coverage area of the circuit pad 6, and the exceeding part is within the fitting tolerance range and will not affect the pad size, thereby reducing the probability of SMT process abnormalities and improving the yield rate of the FPC acquisition module.
[0032] The conductive sheet 3 is welded to the cantilever 11, and a welding hole 31 for accommodating the temperature sensor 4 is provided at the welding end of the conductive sheet 3, and a skirt 32 is provided at the outer periphery of the end of the welding end of the conductive sheet 3; the skirt 32 is designed to lengthen the circumference of the welding end of the conductive sheet 3, so that the conductive sheet 3 can contact a larger area of the circuit surface while the pad area on the FPC circuit board 1 remains unchanged, thereby improving the fixing effect of the conductive sheet 3.
[0033] The reinforcing sheet 5 is arranged on the other side of the welding area between the cantilever 11 and the conductive sheet 3, and the area of the reinforcing sheet 5 is larger than the area of the welding area; if the reinforcing sheet 5 is designed to be flush with the conductive sheet 3, then a situation will be formed in which two hard objects clamp the circuit in the circuit board. At this time, if the conductive sheet 3 and the reinforcing sheet 5 are offset in actual production, the resulting gap will squeeze the circuit and there will be a risk of open circuit. Therefore, setting the area of the reinforcing sheet 5 to be larger than the area of the welding area of the conductive sheet 3 can avoid the risk of open circuit and increase the service life of the FPC acquisition module.
[0034] The temperature sensor 4 may be an NTC temperature sensor 4, which is disposed in the welding hole 31 and fixed to the cantilever 11 by welding. Welding areas are disposed at both ends of the temperature sensor 4, and the welding areas are used to be fixed to the cantilever 11 of the FPC circuit board 1 by welding.
[0035] Although different specific embodiments are mentioned in the content of this application, this application is not limited to the situations described in the industry standards or embodiments, etc. Some industry standards or slightly modified implementation plans based on the implementation of the custom methods or embodiments can also achieve the same, equivalent or similar, or predictable implementation effects after deformation of the above embodiments. The embodiments of data acquisition, processing, output, judgment methods, etc. after these modifications or deformations can still fall within the scope of the optional implementation plans of this application.
[0036] Although the present application has been described through embodiments, those skilled in the art will appreciate that there are many modifications and changes to the present application without departing from the spirit of the present application. It is intended that the attached embodiments include these modifications and changes without departing from the present application.
Claims
1. A structure of an FPC acquisition module, characterized in that: include: An FPC circuit board and a connector, a conductive sheet, a reinforcing sheet and a temperature sensor arranged on the FPC circuit board; The end of the FPC circuit board in the extension direction is connected to the connector, and a plurality of cantilevers are hollowed out on both sides of the FPC circuit board in the extension direction, and one end of the cantilever carrying the conductive sheet, the reinforcing sheet and the temperature sensor is connected to the FPC circuit board through a connecting rib; The conductive sheet is welded to the cantilever, a welding hole for accommodating the temperature sensor is provided at the welding end of the conductive sheet, and a skirt is provided at the periphery of the end of the welding end of the conductive sheet; the reinforcing sheet is provided at the other side of the welding area between the cantilever and the conductive sheet, and the area of the reinforcing sheet is larger than the area of the welding area; the temperature sensor is provided in the welding hole and is fixed to the cantilever by welding.
2. The structure of the FPC acquisition module according to claim 1 is characterized in that: The conductive sheet is electrically connected to the cantilever surface through a welding process.
3. The structure of the FPC acquisition module according to claim 1 is characterized in that: The temperature sensor may be an NTC temperature sensor, and welding areas are provided at both ends of the NTC temperature sensor, and the welding areas are used for welding and fixing with the cantilever of the FPC circuit board.
4. The structure of the FPC acquisition module according to claim 1 is characterized in that: The cantilever surface of the FPC circuit board is provided with a circuit pad and a circuit window for welding the temperature sensor, and the area of the circuit window is larger than the area of the circuit pad.
5. The structure of the FPC acquisition module according to claim 4 is characterized in that: The circuit pad includes two pads arranged in an axisymmetric manner, and two ends of the circuit window perpendicular to the direction of the symmetry axis are located outside the circuit pad.
6. The structure of the FPC acquisition module according to claim 4 is characterized in that: The FPC circuit board comprises a base material surface, a circuit surface and a covering film which are stacked, wherein the base material surface and the covering film are respectively bonded to two sides of the circuit surface, and the covering film has a window opening to expose the circuit surface to form the circuit window.