Circuit function module suitable for vacuum environment

Abstract

The utility model relates to the technical field of spaceflight manufacturing, in particular to a circuit function module suitable for a vacuum environment, which comprises a hollow thin-wall-shaped box body assembly with an opening at the top, a module plate assembly arranged in the box body assembly, a cover plate assembly arranged at the opening at the top of the box body assembly and a heat conduction material, a plurality of through holes are formed in the cover plate assembly, pins of the through hole devices on the module plate assembly extend out of the through holes, and the space defined by the box body assembly and the cover plate assembly is filled with the heat conduction material. According to the circuit function module, spare parts and installation are facilitated, and the anti-seismic performance and the heat dissipation performance are effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of aerospace manufacturing, in particular to a circuit function module suitable for a vacuum environment. Background Art

[0002] In the manufacturing process of electronic products in the aerospace field, through-hole devices or surface-mount devices are usually directly welded and fixed on a printed circuit board. Under high vibration and high impact conditions, it is easy to cause product failure due to broken device pins. In addition, electronic components will inevitably generate heat energy when working. In the presence of air, the heat energy generated can be conducted and dissipated through media such as air. However, in a vacuum environment, there is no medium for conduction and heat dissipation, and the heat energy generated cannot be dissipated in time and effectively, which greatly reduces the reliability and service life of the product. In addition, welding all electronic components on the same printed circuit board will lead to poor versatility of parts and components and inconvenient installation and replacement. Utility Model Content

[0003] The utility model provides a circuit function module suitable for a vacuum environment, which solves the technical problems in the prior art of poor versatility of parts, inconvenient installation and replacement, and poor heat conduction and shock resistance by differentiating the electronic components on a flywheel control board according to their functions and performing modular production and potting.

[0004] In order to achieve the above object, the technical solution of the utility model is as follows:

[0005] The utility model provides a circuit function module suitable for a vacuum environment, comprising a hollow thin-walled box body component with an opening at the top, a module board component arranged in the box body component, a cover plate component installed at the top opening of the box body component, and a heat-conducting material, wherein a plurality of through holes are opened on the cover plate component, pins of through-hole devices on the module board component extend from the plurality of through holes, and the heat-conducting material is filled in a space enclosed by the box body component and the cover plate component.

[0006] Preferably, the box body assembly is square, including a bottom, and a left side wall, a front side wall, a right side wall and a rear side wall perpendicular to the bottom, and fixing parts are provided on the four corners of the opening end of the box body assembly.

[0007] Preferably, the outer dimensions of the cover assembly are compatible with the outer dimensions of the opening end of the box body assembly. The cover assembly includes a sealing plate with a plurality of through holes. The cover assembly is clamped on the opening end of the box body assembly, and the pins of the through-hole device on the module board assembly extend from the plurality of through holes on the sealing plate.

[0008] Preferably, support platforms are provided on the inner sides of the left and right walls of the box body assembly, and the module plate assembly is arranged on the support platforms, and the support platforms are used to limit the relative position of the bottom of the module plate assembly and the bottom of the box body.

[0009] Preferably, limit buckles are relatively provided on the front side wall and the rear side wall of the box body assembly and close to the opening end, and the cover plate assembly also includes a group of mounting parts perpendicular to and opposite to the sealing plate, each mounting part is provided with limit holes corresponding to the same number of limit buckles, and the cover plate assembly is clamped on the limit buckles of the box body assembly through the limit holes on the mounting parts, and the ends of the mounting parts abut against the edges of the module plate assembly.

[0010] Preferably, the inner sides of the left and right walls of the box body assembly are also provided with first limiting portions whose number is the same as the support platforms, and the first limiting portions are located above the support platforms. The inner sides of the front and right walls of the box body assembly are also relatively provided with second limiting portions, and the first limiting portions are used to limit the relative positions of the edges of the module plate assembly to the left and right walls of the box body assembly, and the second limiting portions are used to limit the relative positions of the edges of the module plate assembly to the front and rear walls of the box body assembly.

[0011] Preferably, the first limiting portion and the supporting platform can be integrally formed into an L-shape.

[0012] Preferably, the cover plate assembly also includes a group of supporting parts arranged perpendicularly and opposite to the sealing plate, the supporting parts and the mounting parts are respectively located on adjacent sides of the sealing plate, and the distance between the end faces of the supporting parts and the plane where the supporting platform on the box body assembly is located is the circuit board thickness of the module board assembly.

[0013] Preferably, a sealing hole is further provided on the sealing plate of the cover assembly, and the thermal conductive material is filled into the space enclosed by the box body assembly and the cover assembly through the sealing hole.

[0014] Preferably, the cover plate assembly also includes an insulating sheet with a number equal to the number of through holes, and the insulating sheet is installed at the through holes of the sealing plate. The insulating sheet is provided with holes that are compatible with the number and size of pins of the through-hole devices on the module board assembly. The insulating sheet is used to prevent the pins of the through-hole devices on the module board assembly from directly contacting the sealing plate.

[0015] Beneficial effects of the utility model:

[0016] 1. Divide the electronic components on the existing circuit board assembly according to their functions, re-arrange some of the divided electronic components and make them into modular board assemblies, which are easy to replace and have strong versatility;

[0017] 2. A structure designed to protect the module board can solve the problem of product failure caused by broken device pins under high vibration and high impact conditions;

[0018] 3. Install the module board assembly in the box assembly, fix it through the cover assembly, and then fill the cavity formed by the box assembly and the cover assembly with thermal conductive material to solve the heat dissipation problem of the board in a vacuum environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the overall structure of a circuit function module suitable for a vacuum environment provided by the utility model;

[0020] Figure 2 A schematic diagram of the structure of a box assembly provided by the utility model;

[0021] Figure 3 The utility model provides a schematic diagram of the structure of an upper cover assembly.

[0022] Description of reference numerals:

[0023] 1. Box body assembly; 2. Module board assembly; 3. Cover plate assembly; 11. Bottom; 12. Left side wall; 13. Front side wall; 14. Right side wall; 15. Rear side wall; 16. Fixing part; 17. Limiting buckle; 18. Support platform; 19. First limiting part; 20. Second limiting part; 31. Sealing plate; 32. Installation part; 33. Support part; 34. Insulating sheet; 35. Potting hole; 321. Limiting hole. DETAILED DESCRIPTION

[0024] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0025] The directions such as “upper”, “lower”, “left” and “right” involved in the present invention are all relative positions, and refer to the directions on the paper of the accompanying drawings.

[0026] Reference Figures 1 to 3 , Figure 1 The utility model provides a schematic diagram of the overall structure of a circuit function module suitable for a vacuum environment. Figure 2 A schematic diagram of the structure of a box assembly provided by the utility model. Figure 3 The utility model provides a schematic diagram of the structure of an upper cover assembly.

[0027] The utility model provides a circuit function module suitable for a vacuum environment, comprising a hollow thin-walled box body component 1 with an opening at the top, a module board component 2 ( Figure 1Only the pins of the through-hole devices on the module board component 2 are shown), the cover component 3 installed at the top opening of the box body component 1, and the thermal conductive material, wherein a plurality of through holes are opened on the cover component 3, and the pins of the through-hole devices on the module board component 2 extend out from the plurality of through holes, and the thermal conductive material is filled in the space enclosed by the box body component 1 and the cover component 3.

[0028] .Divide some components from the existing control circuit board assembly according to their functions, redesign the circuit board for these divided components, solder the divided components on the newly designed circuit board, thereby obtaining the module board assembly 2, re-layout the existing control circuit board, reserve the position where the module board assembly 2 needs to be installed, and design corresponding hole positions, thereby obtaining the re-layout control circuit board, solder the undivided components on the re-layout control circuit board, thereby obtaining the re-layout control circuit board assembly.

[0029] In order to better dissipate heat, a structural member is designed to protect the module board assembly 2. The structural member includes a box body assembly 1 and a cover assembly 3. The module board assembly 2 is arranged in the box body assembly 1, and the cover assembly 3 is installed at the top opening of the box body assembly 1. A plurality of through holes are opened on the cover assembly 3. The pins of the through-hole devices on the module board assembly 2 extend from the through holes on the cover assembly 3. Finally, a thermal conductive material is encapsulated and cured in the accommodating space enclosed by the box body assembly 1 and the cover assembly 3, thereby obtaining a circuit function module suitable for a vacuum environment.

[0030] In actual use, the circuit function module is installed on the rearranged control circuit board assembly, the pins of the through-hole devices on the module board assembly 2 are welded to the corresponding holes to achieve electrical connection, and the fixing part 16 on the box assembly 1 is installed at the corresponding mounting hole. By rearranging the existing control circuit board and reserving the mounting area, the universal level of the module board assembly 2 can be improved and spare parts can be prepared in advance to achieve plug-and-play installation. Gluing in the box to replace the original vacuum environment can not only enhance the heat dissipation performance of the module board assembly, but also play a bonding and fixing role for the components on the module board assembly 2 and the cover assembly 3.

[0031] Furthermore, the box assembly 1 is square, including a bottom 11 and four side walls (left side wall 12, front side wall 13, right side wall 14 and rear side wall 15) perpendicular to the bottom 11, and fixing parts 16 are provided at the four corners of the opening end of the box assembly 1. By setting the box assembly 1 to be square and providing the fixing parts 16 at the four corners of the square box body, when installing, the fixing parts 16 are installed at the mounting holes reserved for the control circuit board, which can enhance the mechanical fixing effect and further protect the pins of the through-hole devices on the module board assembly 2. In order to better conduct heat, the box assembly 1 and the cover assembly 3 can be made of metal materials (such as stainless steel or aluminum), or other materials with good thermal conductivity and good mechanical properties.

[0032] Furthermore, the outer dimensions of the cover assembly 3 match the outer dimensions of the opening end of the box body assembly 1. The cover assembly 3 includes a sealing plate 31, and a plurality of through holes are formed on the sealing plate 31. The cover assembly 3 is clamped at the opening end of the box body assembly 1, and the pins of the through-hole components on the module board assembly 2 extend from the plurality of through holes on the sealing plate 31. Compared with ordinary screw connection, the clamping method of the cover assembly 3 and the box body assembly 1 can improve the assembly efficiency.

[0033] Furthermore, in order to define the relative position between the bottom of the module panel assembly 2 and the bottom 11 of the box body, a support platform 18 is further provided on the inner side of the left side wall 12 and the right side wall 14 of the box body assembly 1, and the module panel assembly 2 is provided on the support platform 18. The support platforms 18 are provided in pairs on the opposite side walls, and the height of the support platforms 18 determines the installation height of the module panel assembly 2 in the box body assembly 1. Specifically, there can be four support platforms 18. When four support platforms 18 are used to support the module panel assembly 2, two support platforms 18 are provided at intervals at the relative positions of the left side wall 12 and the right side wall 14. The support platforms 18 can be integrally formed with the box body assembly 1, or fixed to the side wall by spot welding.

[0034] Furthermore, limiting buckles 17 are relatively provided on the front side wall 13 and the rear side wall 15 of the box body assembly 1 and close to the opening end. The cover plate assembly 3 also includes a group of mounting parts 32 which are perpendicular to and relatively arranged with the sealing plate 31. Each mounting part 32 is provided with limiting holes 321 corresponding to the same number and positions as the limiting buckles 17. The cover plate assembly 3 is clamped on the limiting buckles 17 of the box body assembly 1 through the limiting holes 321 on the mounting part 32, and the end of the mounting part 32 abuts against the edge of the module plate assembly 2.

[0035] With such a design, after installation, the limit buckle 17 is locked in the limit hole 321 to prevent the cover plate assembly 3 from falling off, and the end of the mounting portion 32 abuts against the edge of the module plate assembly 2 to further fix the module plate assembly 2.

[0036] Furthermore, in order to limit the relative position between the edge of the module board assembly 2 and the left side wall 12 and the right side wall 14 of the box body, a first limiting portion 19 is further provided on the inner side of the left side wall 12 and the right side wall 14 of the box body 1. The first limiting portion 19 is located above the support platform 18. The number of the first limiting portions 19 is consistent with the number of the support platforms 18. The thickness of the first limiting portion 19 determines the distance between the edge of the module board assembly 2 and the left side wall 12 and the right side wall 14. The first limiting portions 19 can be specifically 4. When 4 first limiting portions 19 are used, the first limiting portion 19 and the support platform 18 can be integrally formed into an L shape for easy processing. When such a design is adopted, the first limiting portion 19 and the support platform 18 can be integrally formed with the box body, or the first limiting portion 19 and the support platform 18 can be integrally formed into an L shape first and then fixed to the box body by spot welding.

[0037] In order to limit the relative position of the edge of the module board assembly 2 and the front side wall 13 and the rear side wall 15 of the box body, a second limiting portion 20 is relatively provided on the inner side of the front side wall 13 and the right side wall 15 of the box body 1. The thickness of the second limiting portion 20 determines the relative position of the edge of the module board assembly 2 from the front side wall 13 and the rear side wall 15 of the box body assembly 1. In order to better play a limiting role and avoid interference with the mounting portion 32, the end of the second limiting portion 20 is higher than the plane where the support platform 18 is located, and the end of the second limiting portion 20 is lower than the plane where the circuit board of the module board assembly 2 installed on the support platform 18 is located.

[0038] It is understandable that, for the sake of aesthetics and processing consistency, the distance between the end of the first limit portion 19 and the plane where the opening end of the box body assembly 1 is located can be set to the thickness of the sealing plate 31, so that after the cover assembly 3 is clamped on the opening end of the box body assembly 1, the sealing plate 31 can be flush with the opening end of the box body assembly 1.

[0039] Furthermore, in order to better fix the module board assembly 2, the cover plate assembly 3 is also designed with a group of support parts 33 that are perpendicular to and opposite to the sealing plate 31. The support part 33 and the mounting part 32 are respectively located on adjacent sides of the sealing plate 31. The distance between the end face of the support part 33 and the plane where the support platform 18 on the box body assembly 1 is located is the thickness of the circuit board of the module board assembly 2. With such a design, when the cover plate assembly 3 is clamped at the open end of the box body assembly 1 by the limiting buckle 17, the end face of the support part 33 can also abut against the circuit board of the module board assembly 2.

[0040] It is understandable that when affected by the layout of components on the module board assembly 2, when components need to be set at the position corresponding to the support portion 33 on the module board assembly 2, the end face of the support portion 33 may not abut against the circuit board of the module board assembly 2. At this time, the module board assembly 2 can be fixed only by the mounting portion 32.

[0041] Furthermore, in order to facilitate potting, a potting hole 35 is provided on the sealing plate 31 of the cover assembly 3, and the heat conductive material is filled into the space enclosed by the box body assembly 1 and the cover assembly 3 through the potting hole 35. In order to reduce bubbles, potting can be performed in a vacuum environment (for example, in a vacuum tank), so that basically no bubbles are generated (the bubble penetration rate exceeds 98%). In addition, a potting glue with better thermal conductivity and wider temperature resistance range can be selected to make it more suitable for the packaging of high-power electronic components.

[0042] Furthermore, in order to prevent the pins of the through-hole devices on the module board assembly 2 from directly contacting the sealing plate 31 of the cover plate assembly 1, an insulating sheet 34 is also designed. The number of insulating sheets 34 is equal to the number of through holes. The insulating sheets 34 are installed at the through holes of the sealing plate 31. The insulating sheet 34 is provided with holes that are compatible with the number and size of the pins of the through-hole devices on the module board assembly 2. During installation, the insulating sheet 34 is first pasted on the through holes of the sealing plate 31, and then the pins of the through-hole devices on the module board assembly 2 are passed through the holes on the insulating sheet 34, and then extended out from the through holes on the sealing plate 31 of the cover plate assembly 3.

[0043] It is understandable that when the cover assembly 3 is made of metal material (such as stainless steel or aluminum), it is necessary to paste the insulating sheet 34 at the through hole of the sealing plate 31 to better achieve the insulation between the pins of the through-hole device on the module board assembly 2 and the sealing plate 31. In order to reduce the process and reduce the cost, the cover assembly 3 can also be directly made of insulating material (such as acrylic plate), so that the insulating sheet 34 does not need to be installed.

[0044] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited to this. Any technician familiar with the technical field can easily think of changes or replacements within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. In addition, the technical solutions between the various implementations of the utility model can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope of the utility model. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.

Claims

1. A circuit function module suitable for a vacuum environment, characterized in that: The invention comprises a hollow thin-walled box body component (1) with a top opening, a module board component (2) arranged in the box body component, a cover board component (3) installed at the top opening of the box body component (1), and a heat-conducting material, wherein the cover board component (3) is provided with a plurality of through holes, pins of through-hole components on the module board component (2) extend out from the plurality of through holes, and the heat-conducting material is filled in a space enclosed by the box body component (1) and the cover board component (3).

2. The circuit function module suitable for a vacuum environment according to claim 1, characterized in that: The box body assembly (1) is square in shape and comprises a bottom (11), a left side wall (12) perpendicular to the bottom (11), a front side wall (13), a right side wall (14) and a rear side wall (15). The four corners of the opening end of the box body assembly (1) are provided with fixing parts (16).

3. The circuit function module suitable for a vacuum environment according to claim 2, characterized in that: The outer dimensions of the cover plate assembly (3) are matched to the outer dimensions of the opening end of the box body assembly (1). The cover plate assembly (3) comprises a sealing plate (31) on which a plurality of through holes are formed. The cover plate assembly (3) is clamped on the opening end of the box body assembly (1), and pins of the through-hole components on the module board assembly (2) extend out from the plurality of through holes on the sealing plate (31).

4. The circuit function module suitable for a vacuum environment according to claim 3, characterized in that: A support platform (18) is provided on the inner side of the left side wall (12) and the right side wall (14) of the box body assembly (1), and the module board assembly (2) is arranged on the support platform (18). The support platform (18) is used to define the relative position of the bottom of the module board assembly (2) and the bottom (11) of the box body.

5. The circuit function module suitable for vacuum environment according to claim 4, characterized in that: Limiting buckles (17) are arranged on the front side wall (13) and the rear side wall (15) of the box body assembly (1) and are close to the opening end. The cover plate assembly (3) also includes a group of mounting parts (32) arranged perpendicularly to and opposite to the sealing plate (31). Each mounting part (32) is provided with limiting holes (321) whose number and position match those of the limiting buckles (17). The cover plate assembly (3) is clamped on the limiting buckle (17) of the box body assembly (1) through the limiting holes (321) on the mounting parts (32). The end of the mounting part (32) abuts against the edge of the module plate assembly (2).

6. The circuit function module suitable for vacuum environment according to claim 5, characterized in that: The left side wall (12) and the right side wall (14) of the box body assembly (1) are also provided with first limiting portions (19) whose number is the same as the number of the support platforms (18); the first limiting portions (19) are located above the support platforms (18); the front side wall (13) and the right side wall (14) of the box body assembly (1) are also provided with second limiting portions (20) on the inner sides thereof; the first limiting portions (19) are used to limit the relative positions of the edges of the module board assembly (2) and the left side wall (12) and the right side wall (14) of the box body assembly (1); and the second limiting portions (20) are used to limit the relative positions of the edges of the module board assembly (2) and the front side wall (13) and the rear side wall (15) of the box body assembly (1).

7. The circuit function module suitable for a vacuum environment according to claim 6, characterized in that: The first limiting portion (19) and the supporting platform (18) can be integrally formed into an L-shape.

8. The circuit function module suitable for vacuum environment according to claim 7, characterized in that: The cover plate assembly (3) further comprises a group of support portions (33) arranged perpendicularly and opposite to the sealing plate (31); the support portions (33) and the mounting portions (32) are respectively located on adjacent side surfaces of the sealing plate (31); and the distance between the end surface of the support portion (33) and the plane where the support platform (18) on the box body assembly (1) is located is equal to the thickness of the circuit board of the module board assembly (2).

9. The circuit function module suitable for vacuum environment according to claim 8, characterized in that: A sealing hole (35) is also provided on the sealing plate (31) of the cover plate assembly (3), and the heat conductive material is filled into the space enclosed by the box body assembly (1) and the cover plate assembly (3) through the sealing hole (35).

10. The circuit function module suitable for vacuum environment according to claim 9, characterized in that: The cover plate assembly (3) further comprises an insulating sheet (34) having a number equal to the number of through holes. The insulating sheet (34) is mounted at the through holes of the sealing plate (31). The insulating sheet (34) is provided with holes matching the number and size of the pins of the through-hole device on the module plate assembly (2). The insulating sheet (34) is used to prevent the pins of the through-hole device on the module plate assembly (2) from directly contacting the sealing plate (31).

Images