Novel chamfering grinding wheel
The novel chamfering grinding wheel with unified notches addresses inefficiencies and costs by enabling simultaneous rough and fine chamfering without switching, improving production efficiency and reducing chamfering diameter variations.
Patent Information
- Application Number
- CN202323377627.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-12
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2033-12-12
AI Technical Summary
Conventional chamfering wheels require time-consuming notch switching between rough and fine chamfering, leading to inefficiencies, increased costs, and inconsistent chamfering results due to differential groove specifications and vertical displacements.
A novel chamfering grinding wheel with equidistant, uniformly specified chamfering notches on a single annular surface, allowing simultaneous rough and fine chamfering control without notch switching, and a simplified production process.
Enhances production efficiency by saving 5-10 seconds per piece, reduces chamfering diameter differences, and lowers production costs by minimizing the need for dual groove production and vertical spindle movements.
Smart Images
Figure CN222244348U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a novel chamfering grinding wheel. Background Art
[0002] Semiconductor wafer chamfering refers to the chamfering process performed on the edge of a semiconductor wafer, usually to reduce edge damage and improve wafer reliability.
[0003] Grinding wheels are often used for chamfering of wafers. In the prior art, conventional chamfering wheels are divided into rough chamfering and fine chamfering. The rough chamfering notches and the fine chamfering notches are made on a grinding wheel base. Take a 3-rough 5-fine (8-groove chamfering wheel) as an example. When chamfering, according to different product specifications, the wafer is first rough-chamfered on a rough groove, and the chamfering amount is generally 0.1-0.5mm. Then the chamfering wheel spindle descends vertically (the wafer suction cup spindle remains in the vertical direction); or the wafer suction cup spindle descends vertically (the chamfering wheel spindle remains stationary in the vertical direction), and the chamfering wheel corresponding to the wafer in the horizontal direction switches from a rough groove to a fine groove, and then fine chamfering is performed according to different product specifications. In theory, the smaller the fine chamfering amount, the better (0.01-0.05mm is enough), but the actual fine chamfering diameter chamfering amount is generally 0.05-0.1mm.
[0004] Therefore, the conventional chamfering process has several disadvantages:
[0005] 1. Each time the chamfering wheel notch is switched (from rough notch to fine notch), the chamfering wheel spindle or wafer chuck spindle will have a slight displacement in the vertical direction. Therefore, the diameter of the fine chamfer must be 0.05-0.1mm more than the theoretical amount, otherwise there will be a phenomenon of partial failure of fine chamfering.
[0006] 2. Because the same grinding wheel metal base generally has coarse grooves and fine grooves integrated on it, the sand content, hardness, gravel diameter and material of the two grooves are different. When making the grinding wheel, the coarse grooves and fine grooves containing sand surface need to be made twice, the production process is cumbersome and the cost is high.
[0007] 3. To ensure that each time the chamfering wheel notch is switched (from rough notch to fine notch), there is no partial failure to chamfer, the actual fine notch diameter is generally increased to 0.05-0.1mm, which wastes efficiency and processing costs. Moreover, it takes about 60 seconds to complete a standard recipe of rough notch + fine notch for an 8-12 inch wafer, and the switching from rough notch to fine notch also takes time, generally 5-10 seconds, and this 5-10 seconds is non-working time, which is invalid time.
[0008] Therefore, we need to propose a new type of chamfering grinding wheel. Utility Model Content
[0009] The purpose of the utility model is to provide a new type of chamfering grinding wheel, which does not need to switch the groove, can save the switching time of the original rough groove and fine groove grinding wheel, and improve efficiency; the amount of fine chamfering can be set to a minimum value according to pure theory, and the diameter difference before and after the chip chamfering is reduced as a whole; the grinding wheel is simpler to manufacture, and the same grinding wheel only needs to produce the same sand-containing surface layer, and the processing cost is reduced, so as to solve the problems raised in the above-mentioned background technology.
[0010] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0011] A novel chamfering grinding wheel comprises a metal base mounted on a main shaft of a chamfering device and an annular grinding wheel for chamfering a wafer;
[0012] The annular grinding wheel is located outside the metal base, and a plurality of groups of chamfering notches for chamfering are arranged around the annular grinding wheel, and the plurality of groups of chamfering notches are arranged with the same specifications.
[0013] Preferably, eight groups of chamfering grooves are provided on the annular grinding wheel, and the eight groups of chamfering grooves are equidistantly distributed.
[0014] Preferably, the chamfered notch is composed of a rough notch with a chip diameter reduction of 0.1 to 0.5 mm and a fine notch with a chip diameter reduction of 0.01 to 0.05 mm, and the inner diameter of the chamfered notch decreases from the outside to the inside.
[0015] Preferably, the rough chamfering and fine chamfering of the wafer chamfering in the chamfering notch are separately controlled by a recipe in the same notch.
[0016] Preferably, a sleeve for sleeve-connecting to the main shaft of the chamfering equipment is arranged at the center of the metal base, and an axial hole corresponding to the main shaft is arranged on the sleeve.
[0017] Compared with the prior art, the beneficial effects of the utility model are:
[0018] When using the new chamfering grinding wheel and the matching recipe to chamfer each wafer, the grinding wheel spindle does not move vertically relative to the wafer chuck spindle during the entire recipe process, which has the following advantages:
[0019] 1. Roughing and fine grinding can be controlled separately by recipe in the same notch, without switching notches, which can save the switching time of the original roughing and fine grinding wheels, saving 5 to 10 seconds per piece and improving efficiency.
[0020] 2. The amount of fine chamfering can be set to the minimum value according to pure theory, which can reduce the diameter difference before and after the chip chamfering as a whole (the diameter processing synchronization of the crystal rod can be minimized in theory, saving the cost of the crystal rod).
[0021] 3. Grinding wheel production is simpler. The same grinding wheel only needs to produce the same sand-containing surface layer, which reduces processing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 It is a structural schematic diagram of the utility model;
[0023] Figure 2 This is a schematic diagram of the structure of the annular grinding wheel of the utility model;
[0024] Figure 3 It is a structural schematic diagram of the chamfered notch of the utility model.
[0025] In the figure: 1. Metal base; 2. Bushing; 3. Shaft hole; 4. Annular grinding wheel; 5. Chamfered notch. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] See also Figure 1-3 , the utility model provides a technical solution:
[0028] A new type of chamfering grinding wheel includes a metal base 1 installed on the main shaft of the chamfering equipment and an annular grinding wheel 4 for chamfering wafers; the annular grinding wheel 4 is located outside the metal base 1, and multiple groups of chamfering notches 5 for chamfering are arranged around the annular grinding wheel 4, and the multiple groups of chamfering notches 5 are arranged with the same specifications.
[0029] There are eight groups of chamfering grooves 5 on the annular grinding wheel 4, and the eight groups of chamfering grooves 5 are equidistantly distributed. The chamfering grooves 5 are composed of a rough groove with a chip diameter reduction of 0.1 to 0.5 mm and a fine groove with a chip diameter reduction of 0.01 to 0.05 mm, and the inner diameter of the chamfering groove 5 decreases from the outside to the inside. The rough chamfering and fine chamfering of the chip chamfering in the chamfering groove 5 are controlled separately by recipe in the same groove. A sleeve 2 for sleeved on the main shaft of the chamfering equipment is provided at the center of the metal base 1, and an axial hole 3 corresponding to the main shaft is provided on the sleeve 2.
[0030] The new chamfering wheel design changes the 8 grooves of the general grinding wheel into fine grooves with reference to the original fine grooves. When chamfering a wafer, it is only necessary to design the recipe for two or more rounds of continuous processing, of which at least the first round is a rough groove recipe (the amount of wafer diameter removed is 0.1-0.5mm, with a corresponding wafer diameter linear speed of 5-50mm / s), and at least the last round is a fine groove recipe (the amount of wafer diameter removed is 0.01-0.05mm, with a corresponding wafer diameter linear speed of 5-50mm / s). During rough or fine chamfering, the rotation speed of the chamfering wheel is generally 3,000-50,000rpm.
[0031] Compared with the traditional chamfering grinding wheel and matching recipe, the new chamfering grinding wheel and matching recipe have the following advantages because the grinding wheel spindle does not move vertically relative to the wafer chuck spindle during the entire recipe process:
[0032] 1. Roughing and fine grinding can be controlled separately by recipe in the same notch, without switching notches, which can save the switching time of the original roughing and fine grinding wheels, saving 5 to 10 seconds per piece and improving efficiency.
[0033] For example, for 8-12 inch wafers, the number of wafers chamfered by a single chamfering machine increased from about 30,000 to about 31,500 per month, with a 5% increase in production capacity.
[0034] 2. The amount of fine chamfering can be set to the minimum value according to pure theory, which can reduce the diameter difference before and after the chip chamfering as a whole (the diameter processing synchronization of the crystal rod can be minimized in theory, saving the cost of the crystal rod).
[0035] For example, the diameter of an 8-12 inch crystal rod can be reduced by about 0.5 mm before chamfering, and the cost of the crystal rod can be reduced by about 0.5-1%.
[0036] 3. Chamfering grinding wheel is easier to make. The same grinding wheel only needs to make the same sand-containing surface layer.
[0037] The processing cost of a single grinding wheel has dropped from around 5,000 to 10,000 yuan to around 4,000 to 8,000 yuan.
[0038] 4. After the above-mentioned new chamfering grinding wheel and matching recipe processing, the quality of the chamfered surface of the chip after chamfering is no different from that of the traditional chamfering grinding wheel and matching recipe processing.
[0039] 4.1 The diameter tolerance after chamfering is about ±0.01 mm;
[0040] 4.2 The angle deviation after chamfering is about ±10 mm;
[0041] 4.3 The surface roughness Ra value after chamfering is about 0.05 to 0.20 microns;
[0042] 4.4 The depth of the surface damage layer after chamfering is about 1 to 5 microns.
[0043] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A new type of chamfering grinding wheel, characterized by: It comprises a metal base (1) mounted on the main shaft of a chamfering device and an annular grinding wheel (4) for chamfering a wafer; The annular grinding wheel (4) is located outside the metal base (1), and a plurality of groups of chamfering notches (5) for chamfering are arranged around the annular grinding wheel (4), and the plurality of groups of chamfering notches (5) are arranged with the same specifications.
2. A new chamfering grinding wheel according to claim 1, characterized in that: A total of eight groups of chamfering notches (5) are provided on the annular grinding wheel (4), and the eight groups of chamfering notches (5) are distributed at equal distances.
3. A new chamfering grinding wheel according to claim 1, characterized in that: The chamfered notch (5) is composed of a coarse notch with a chip diameter reduction of 0.1 to 0.5 mm and a fine notch with a chip diameter reduction of 0.01 to 0.05 mm, and the inner diameter of the chamfered notch (5) decreases from the outside to the inside.
4. A new chamfering grinding wheel according to claim 1, characterized in that: A shaft sleeve (2) for sleeve-connecting to a main shaft of a chamfering device is arranged at the center of the metal base (1), and a shaft hole (3) corresponding to the main shaft is arranged on the shaft sleeve (2).