Gallium arsenide crystal bar double-layer cutting device resistant to cutting deformation

Abstract

The utility model discloses a cutting deformation resistant gallium arsenide crystal bar double-layer cutting device which comprises a bottom plate, a side mounting plate is mounted on one side of the bottom plate, a rotating top plate is mounted on the side surface of the middle section of the side mounting plate, and gallium arsenide crystal bars are placed on the upper surface of the bottom plate and the upper surface of the top plate. A supporting mechanism is arranged between the bottom plate and the top plate, and the relative angle between the top plate and the bottom plate is adjusted by changing the supporting height. According to the gallium arsenide crystal bar double-layer cutting device resistant to cutting deformation, by means of the mode that two gallium arsenide crystal bars are bonded to the bottom plate and the top plate at the same time, cutting lines can be utilized to the maximum degree, the purpose of saving the cutting lines is achieved, meanwhile, the cutting efficiency is greatly improved through the double-layer cutting mode, and by means of the mode that a supporting cap on a limiting column rotates, the cutting efficiency is improved. And supporting force and downward pulling force are applied to the top plate at the same time, so that the stability in the cutting process is guaranteed while the top plate can be rotated and finely adjusted, and normal cutting work is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of gallium arsenide wafer processing, in particular to a gallium arsenide crystal rod double-layer cutting device which is resistant to cutting deformation. Background Art

[0002] Gallium arsenide is an important semiconductor material. Gallium arsenide can be made into semi-insulating high-resistance materials with resistivity more than 3 orders of magnitude higher than that of silicon and germanium. It is used to make integrated circuit substrates, infrared detectors, gamma photon detectors, etc. Because its electron mobility is 5 to 6 times greater than that of silicon, it is important in the production of microwave devices and high-speed digital circuits. Semiconductor devices made of gallium arsenide have the advantages of high frequency, high temperature, good low temperature performance, low noise, strong radiation resistance, etc. Gallium arsenide is a material with many advantages among semiconductor materials, but the crystal triode made of it has a small amplification factor and poor thermal conductivity, and is not suitable for making high-power devices. Although gallium arsenide has It has excellent performance, but because it decomposes at high temperatures, it is technically demanding to produce high-purity single crystal materials with an ideal chemical ratio. Wafers made of gallium arsenide are formed by processing crystal rods through a wire cutting process. The wire cutting process arranges the cutting wires at the same distance and cuts them on the crystal rod at the same time, so that the crystal rod is cut into wafers of the same thickness. This wire cutting process can greatly save the cutting time of the crystal rod and ensure the high consistency of the wafer thickness during the processing stroke. However, the length of the cutting wire arrangement in the wire cutting process is fixed, so that when cutting the crystal rod, part of the cutting wire is not cut, resulting in a waste of cutting wires. Utility Model Content

[0003] The utility model aims to provide a gallium arsenide crystal rod double-layer cutting device that is resistant to cutting deformation, so as to solve the problem of poor gallium arsenide wafer cutting method proposed in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a double-layer cutting device for gallium arsenide crystal rods that resists cutting deformation, comprising a bottom plate, a side mounting plate installed on one side of the bottom plate, and a rotating top plate installed on the side surface of the middle section of the side mounting plate, gallium arsenide crystal rods are placed on the upper surfaces of the bottom plate and the top plate, the cross-section of the side mounting plate is T-shaped, and the side mounting plate is installed in a clamping manner with the bottom plate, a supporting mechanism is provided between the bottom plate and the top plate, and the relative angle between the top plate and the bottom plate is adjusted by changing the support height.

[0005] Preferably, the support mechanism comprises: a limiting column, a support cap is arranged at the upper end of the limiting column, a limiting groove is provided on the lower surface of one end of the top plate, and a limiting rod is fixedly arranged on the upper end of the support cap below the limiting groove.

[0006] By adopting the above technical solution, the support cap can limit the top plate through the sliding of the limit rod and the limit groove to prevent the top plate from rotating upward.

[0007] Preferably, the support cap is threadedly connected to the limit column, the upper end surface of the limit column offset from the limit groove is in contact with the lower surface of the top plate, the upper end of the limit rod passes through the limit groove, and the end of the limit rod located inside the limit groove is spherical in design, and the limit rod is slidably connected to the limit groove.

[0008] By adopting the above technical solution, the limiting rod can slide inside the limiting groove and maintain connection with the limiting groove during the process of fine-tuning the rotation of the top plate.

[0009] Preferably, a side surface of the side mounting plate is provided with a clearance groove and a contact groove, and the contact groove is designed to be arc-shaped, and the side surface of the contact groove fits with the outer surface of the gallium arsenide crystal rod.

[0010] By adopting the above technical solution, the gallium arsenide crystal rod can be fixed more stably by increasing the supported area through the fit with the contact groove.

[0011] Preferably, an anti-deformation mechanism is provided at one end of the bottom plate, and the gallium arsenide crystal rod is supported and limited by the anti-deformation mechanism to prevent the gallium arsenide crystal rod from moving.

[0012] By adopting the above technical solution, the side mounting plate will not be deformed due to force, causing the gallium arsenide crystal rod to move.

[0013] Preferably, the anti-deformation mechanism includes: a mounting plate, which is fixedly arranged on the upper surface of one end of the base plate, and a sliding anti-slip block is installed on the outer surface of the mounting plate, a tensile column is fixedly arranged on the upper surface of one end of the base plate, and side support plates and tensile blocks are respectively fixedly arranged on the outer surfaces of both sides of the tensile column.

[0014] By adopting the above technical solution, the tensile column can limit the deformation and movement of the side mounting plate through the tensile block under the action of the side support plate.

[0015] Preferably, a spring is connected between the mounting plate and the anti-slip block, and the anti-slip block is designed in a right-angled trapezoid, and the inclined surface of the anti-slip block is arranged upward, the anti-slip block is mounted by snap-fitting with the side mounting plate, the anti-tensile block is designed in a right-angled trapezoid, and the anti-tensile column is mounted by snap-fitting with the side mounting plate through the anti-tensile block.

[0016] By adopting the above technical solution, the side mounting plate can obtain support from the tensile column.

[0017] Compared with the prior art, the utility model has the following beneficial effects: the gallium arsenide crystal rod double-layer cutting device that resists cutting deformation:

[0018] 1. By bonding two GaAs crystal rods to the bottom plate and the top plate at the same time, the cutting line can be used to the maximum extent, thus saving the cutting line. At the same time, the double-layer cutting method also greatly increases the cutting efficiency;

[0019] 2. Furthermore, by rotating the support cap on the limit column, the top plate is simultaneously subjected to supporting force and downward pulling force, so that the top plate can be rotated and fine-tuned while ensuring stability during the cutting process, thus ensuring the normal progress of the cutting work;

[0020] 3. Furthermore, by providing an anti-slip block and a tensile column at the connection between the bottom plate and the side mounting plate, the side mounting plate will not undergo lateral and longitudinal displacement and deformation under the action of external force during the cutting process, thereby ensuring that the flatness of the wafer cut from the gallium arsenide crystal rod will not be affected. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the three-dimensional structure of the connection between the tensile column and the side support plate of the utility model;

[0023] Figure 3 This is a schematic diagram of the three-dimensional structure of the connection between the mounting plate and the anti-slip block of the utility model;

[0024] Figure 4 It is a three-dimensional structural schematic diagram of the cross-section surface of the connection between the side mounting plate and the anti-slip block of the utility model;

[0025] Figure 5 It is a three-dimensional structural schematic diagram of the cross-section surface connecting the side mounting plate and the tensile block of the utility model;

[0026] Figure 6 It is a three-dimensional structural schematic diagram of the connection section of the limit groove and the limit rod of the utility model.

[0027] In the figure: 1. bottom plate; 2. side mounting plate; 3. top plate; 4. gallium arsenide crystal rod; 5. limiting column; 6. supporting cap; 7. limiting groove; 8. limiting rod; 9. giving way groove; 10. contact groove; 11. mounting plate; 12. anti-slip block; 13. tensile column; 14. side support plate; 15. tensile block. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] See also Figure 1-6 The utility model provides a technical solution: a double-layer cutting device for gallium arsenide crystal rods that is resistant to cutting deformation.

[0030] Embodiment 1

[0031] The present embodiment discloses: a bottom plate 1, a side mounting plate 2 is mounted on one side of the bottom plate 1, and a rotating top plate 3 is mounted on the side surface of the middle section of the side mounting plate 2, gallium arsenide crystal rods 4 are placed on the upper surfaces of the bottom plate 1 and the top plate 3, the cross section of the side mounting plate 2 is T-shaped, and the side mounting plate 2 is mounted in engagement with the bottom plate 1, and a support mechanism is provided between the bottom plate 1 and the top plate 3, and the relative angle between the top plate 3 and the bottom plate 1 is adjusted by changing the support height;

[0032] The support mechanism includes: a limit column 5, a support cap 6 is arranged at the upper end of the limit column 5, a limit groove 7 is arranged on the lower surface of one end of the top plate 3, and a limit rod 8 is fixedly arranged at the upper end of the support cap 6 below the limit groove 7;

[0033] The support cap 6 is threadedly connected to the limiting column 5, the upper end surface of the limiting column 5 offset from the limiting groove 7 is in contact with the lower surface of the top plate 3, the upper end of the limiting rod 8 passes through the limiting groove 7, and the end of the limiting rod 8 located inside the limiting groove 7 is spherical, and the limiting rod 8 is slidably connected to the limiting groove 7;

[0034] When it is necessary to adjust the parallelism of the bottom plate 1 and the top plate 3, first screw the support cap 6 on the limit column 5 that is misaligned with the limit groove 7, so that the support cap 6 on the limit column 5 that is misaligned with the limit groove 7 moves downward to release the support for the top plate 3, and then screw the support cap 6 on the limit column 5 below the limit groove 7. Through the up and down movement of the support cap 6, the limit rod 8 can slide inside the limit groove 7 to achieve the purpose of driving the mounting plate 2 on the opposite side of the top plate 3 to rotate. After the adjustment is completed, screw the support cap 6 on the limit column 5 that is misaligned with the limit groove 7, so that the support cap 6 on the limit column 5 that is misaligned with the limit groove 7 moves upward to support the top plate 3, so that the top plate 3 can be further limited and supported and cannot move, thereby ensuring the stability of the gallium arsenide crystal rod 4 during the cutting process.

[0035] Embodiment 2

[0036] This embodiment is disclosed on the basis of the embodiment 1: the side surface of the side mounting plate 2 is provided with a clearance groove 9 and a contact groove 10, and the contact groove 10 is designed to be arc-shaped, and the side surface of the contact groove 10 is in contact with the outer surface of the gallium arsenide crystal rod 4;

[0037] An anti-deformation mechanism is provided at one end of the bottom plate 1, and the anti-deformation mechanism is used to support and limit the gallium arsenide crystal rod 4 to prevent the gallium arsenide crystal rod 4 from moving;

[0038] The anti-deformation mechanism comprises: a mounting plate 11, the mounting plate 11 is fixedly arranged on the upper surface of one end of the bottom plate 1, and a sliding anti-dropping block 12 is installed on the outer surface of the mounting plate 11, a tensile column 13 is fixedly arranged on the upper surface of one end of the bottom plate 1, and side support plates 14 and tensile blocks 15 are fixedly arranged on the outer surfaces of both sides of the tensile column 13;

[0039] A spring is connected between the mounting plate 11 and the anti-slip block 12, and the anti-slip block 12 is designed as a right-angled trapezoid, and the inclined surface of the anti-slip block 12 is arranged upward, the anti-slip block 12 is mounted in engagement with the side mounting plate 2, the tensile block 15 is designed as a right-angled trapezoid, and the tensile column 13 is mounted in engagement with the side mounting plate 2 through the tensile block 15;

[0040] Before cutting, the gallium arsenide crystal rod 4 is tightly attached to the side mounting plate 2 through the contact groove 10 and fixed to the bottom plate 1, the side mounting plate 2 and the top plate 3 through an adhesive. During the cutting process, after the cutting line completely cuts the gallium arsenide crystal rod 4, the gallium arsenide crystal rod 4 is passed through the give way groove 9 to avoid the gallium arsenide wafer from sticking due to incomplete cutting. The tensile column 13 prevents the side mounting plate 2 from bending when subjected to force under the support of the side support plate 14 and the connection between the tensile block 15 and the side mounting plate 2. When the side mounting plate 2 needs to be disassembled and maintained, the support cap 6 on the limit column 5 that is misaligned with the limit groove 7 is twisted to move the support cap 6 on the limit column 5 that is misaligned with the limit groove 7 downward to release the support for the top plate 3. At this time, the anti-slip block 12 is slid and disengaged from the side mounting plate 2. At this time, the side mounting plate 2 is slid up to complete the separation of the side mounting plate 2 from the bottom plate 1. At this time, the side mounting plate 2 is slid laterally to make the side mounting plate 2 slide laterally and disengage from the rotating shaft connection with the top plate 3. During installation, the side mounting plate 2 is slid laterally to make the side mounting plate 2 slide laterally and be plugged into the rotating shaft of the top plate 3. At this time, the side mounting plate 2 is slid downward, and the lower end of the side mounting plate 2 squeezes the inclined surface of the anti-slip block 12 to make the anti-slip block 12 slide over the side mounting plate 2. Until the side mounting plate 2 is installed in place, the anti-slip block 12 slides under the support of the spring between the mounting plate 11 and engages with the side mounting plate 2 to limit the side mounting plate 2.

[0041] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A gallium arsenide crystal rod double-layer cutting device that resists cutting deformation, comprising a bottom plate (1), a side mounting plate (2) being mounted on one side of the bottom plate (1), and a rotating top plate (3) being mounted on the middle side surface of the side mounting plate (2), gallium arsenide crystal rods (4) being placed on the upper surfaces of both the bottom plate (1) and the top plate (3), the cross section of the side mounting plate (2) being of T-shaped design, and the side mounting plate (2) being mounted in a snap fit with the bottom plate (1), characterized in that: A support mechanism is provided between the bottom plate (1) and the top plate (3), and the relative angle between the top plate (3) and the bottom plate (1) can be adjusted by changing the support height.

2. The double-layer cutting device for gallium arsenide crystal rods resistant to cutting deformation according to claim 1, characterized in that: The support mechanism comprises: a limiting column (5), a supporting cap (6) is arranged at the upper end of the limiting column (5), a limiting groove (7) is provided on the lower surface of one end of the top plate (3), and a limiting rod (8) is fixedly arranged at the upper end of the supporting cap (6) below the limiting groove (7).

3. The double-layer cutting device for gallium arsenide crystal rods resistant to cutting deformation according to claim 2, characterized in that: The support cap (6) is threadedly connected to the limiting column (5), the upper end surface of the limiting column (5) offset from the limiting groove (7) is in contact with the lower surface of the top plate (3), the upper end of the limiting rod (8) passes through the limiting groove (7), and the end of the limiting rod (8) located inside the limiting groove (7) is spherical in design, and the limiting rod (8) is slidably connected to the limiting groove (7).

4. The double-layer cutting device for gallium arsenide crystal rods resistant to cutting deformation according to claim 1, characterized in that: The side surface of the side mounting plate (2) is provided with a clearance groove (9) and a contact groove (10), and the contact groove (10) is designed to be arc-shaped, and the side surface of the contact groove (10) is in contact with the outer surface of the gallium arsenide crystal rod (4).

5. The double-layer cutting device for gallium arsenide crystal rods resistant to cutting deformation according to claim 1, characterized in that: An anti-deformation mechanism is provided at one end of the bottom plate (1), and the gallium arsenide crystal rod (4) is supported and limited by the anti-deformation mechanism to prevent the gallium arsenide crystal rod (4) from moving.

6. The double-layer cutting device for gallium arsenide crystal rods resistant to cutting deformation according to claim 5, characterized in that: The anti-deformation mechanism comprises: a mounting plate (11), the mounting plate (11) being fixedly arranged on the upper surface of one end of the base plate (1), and a sliding anti-slip block (12) being installed on the outer surface of the mounting plate (11), a tensile column (13) being fixedly arranged on the upper surface of one end of the base plate (1), and side support plates (14) and tensile blocks (15) being fixedly arranged on the outer surfaces of both sides of the tensile column (13), respectively.

7. The double-layer cutting device for gallium arsenide crystal rods resistant to cutting deformation according to claim 6, characterized in that: A spring is connected between the mounting plate (11) and the anti-slip block (12), and the anti-slip block (12) is designed as a right-angled trapezoid, and the inclined surface of the anti-slip block (12) is arranged upward, the anti-slip block (12) is mounted by snapping with the side mounting plate (2), the anti-tension block (15) is designed as a right-angled trapezoid, and the anti-tension column (13) is mounted by snapping with the side mounting plate (2) through the anti-tension block (15).

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