Semiconductor lead frame mold convenient to demold

Abstract

The utility model provides a semiconductor lead frame mold convenient to demold, and relates to the field of semiconductor lead frame processing. The semiconductor lead frame mold convenient to demold comprises a fixed mold base and a movable mold base, a first forming module is fixedly installed on the upper side of the fixed mold base, a second forming module matched with the first forming module is fixedly installed at the bottom of the movable mold base, and a demolding structure is arranged at the bottom of the fixed mold base. The demolding structure comprises a plurality of ejection columns penetrating through the first forming module, and a mounting groove is formed in the fixed mold base. According to the semiconductor lead frame mold convenient to demold, the multiple ejection columns and the adjusting assembly are arranged in the demolding structure at the bottom of the fixed mold base in a matched mode, the adjusting assembly is used for driving the ejection columns to ascend and descend, and when semiconductor lead frame raw materials are broken, the ejection columns can be controlled to ascend; therefore, the operation of ejecting out the semiconductor lead frame raw material remaining in the first forming module can be realized, so that quick demolding is facilitated.

Description

Technical Field

[0001] The present application relates to the field of semiconductor lead frame processing, and in particular to a semiconductor lead frame mold that is easy to demould. Background Art

[0002] The semiconductor lead frame is an important component in semiconductor packaging, used to connect the semiconductor chip and the external circuit. During the semiconductor packaging process, the semiconductor chip needs to be connected to the external lead through the lead frame to realize the input and output of electrical signals. The lead frame is usually made of metal materials, such as brass, nickel-iron alloy, etc., with good conductivity and mechanical strength.

[0003] Semiconductor lead frame molds are tools used to manufacture semiconductor lead frames, usually made of metal or plastic materials. In the semiconductor industry, lead frame molds play a vital role, they are used to produce a large number of lead frames, ensuring their accuracy and consistency.

[0004] Although the semiconductor lead frame mold in the prior art can realize the molding function of the raw material through the structure of the prior art, it still has the following defects: during the stamping process, the semiconductor lead frame raw material may sometimes break, and the machine will be stopped for rectification to remove the broken raw material. However, most of the existing semiconductor lead frame molds require manual operation by the operator, and it is difficult to complete the rapid demolding operation; therefore, a semiconductor lead frame mold that is easy to demold is proposed, which can facilitate the ejection of the broken semiconductor lead frame raw material. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the present application provides a semiconductor lead frame mold that is easy to demold, solving the problems mentioned in the above background technology.

[0007] (II) Technical solution

[0008] To achieve the above objectives, the present application is implemented through the following technical solutions: a semiconductor lead frame mold that is easy to demold, including a fixed mold base and a movable mold base, a first molding module is fixedly installed on the upper side of the fixed mold base, a second molding module that is compatible with the first molding module is fixedly installed on the bottom of the movable mold base, a demolding structure is arranged at the bottom of the fixed mold base, the demolding structure includes a plurality of ejector columns arranged through the first molding module, an installation groove is opened inside the fixed mold base, and the demolding structure also includes an adjustment component arranged inside the installation groove, and the adjustment component is used to drive the ejector column to rise and fall.

[0009] By adopting the above technical solution, when the semiconductor lead frame material breaks, the ejector pin can be controlled to rise, so that the semiconductor lead frame material remaining in the first molding module can be ejected, which is convenient for rapid demolding.

[0010] Preferably, the adjustment assembly includes a threaded rod with opposite thread directions on both sides, the outer sides of both ends of the threaded rod are threadedly connected with a threaded sleeve, the tops of the two threaded sleeves are hinged with support rods, the tail ends of the two support rods are jointly hinged with a movable plate, and the ejector column is fixedly installed on the upper side of the movable plate.

[0011] By adopting the above technical solution, the rotating threaded rod can drive the two threaded sleeves threadedly connected to it to move in opposite directions. When the threaded sleeve moves, the support rod can rotate along its hinge point, thereby driving the movable plate to move, and the movable plate in turn drives the ejector column to move, thereby controlling the lifting and lowering of the ejector column.

[0012] Preferably, the threaded rod is rotatably mounted inside the mounting groove via a bearing seat, one end of the threaded rod passes through the mounting groove and extends to the outside of the fixed mold seat, and an adjustment block is fixedly mounted on the tail end of the threaded rod.

[0013] By adopting the above technical solution, the threaded rod can be driven to rotate by rotating the adjustment block, thereby controlling the rotation direction of the threaded rod.

[0014] Preferably, limit blocks are fixedly installed on both sides of the threaded sleeve, and two limit rods symmetrically arranged on both sides of the threaded rod are fixedly connected between the inner walls at both ends of the installation groove. The limit rods pass through the limit blocks, and the limit blocks are slidably connected to the limit rods.

[0015] By adopting the above technical solution, the limit blocks on both sides of the threaded sleeve can slide along the limit rod, thereby limiting the limit blocks and the threaded sleeve.

[0016] Preferably, four guide rods distributed in a rectangular array are fixedly installed on the bottom of the movable mold base, four directional grooves adapted to the guide rods are fixedly installed on the upper side of the fixed mold base, and the guide rods are slidably connected to the directional grooves.

[0017] By adopting the above technical solution, the guide rod at the bottom of the movable mold seat can slide along the directional groove on the upper side of the fixed mold seat, so as to play a role in positioning the movable mold seat.

[0018] (III) Beneficial effects

[0019] The present application provides a semiconductor lead frame mold that is easy to demould. The beneficial effects are as follows:

[0020] The semiconductor lead frame mold which is easy to demold has a plurality of ejector posts and an adjusting component in a demolding structure at the bottom of a fixed mold base. The adjusting component is used to drive the ejector posts to be raised and lowered. When the semiconductor lead frame raw material is broken, the ejector posts can be controlled to rise, and the semiconductor lead frame raw material remaining in the first molding module can be ejected, so that rapid demolding can be performed, thereby improving the practicality of the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the implementation scheme of the utility model or the technical scheme in the prior art, the drawings required for use in the implementation scheme or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation schemes of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 A schematic diagram of the three-dimensional structure of this application;

[0023] Figure 2 This is a schematic diagram of the three-dimensional structure of a local movable mold base of this application;

[0024] Figure 3 This is a schematic diagram of the three-dimensional structure of a local fixed mold base of this application;

[0025] Figure 4 This is a schematic diagram of the three-dimensional structure of the first partial cross-section of the fixed mold base of the present application;

[0026] Figure 5 This is a schematic diagram of the three-dimensional structure of the second local cross-section of the fixed mold base of this application.

[0027] In the figure: 1. fixed mold base; 11. first molding module; 12. orientation groove; 13. demoulding structure; 131. ejector column; 132. adjustment assembly; 1321. threaded rod; 1322. threaded kit; 1323. support rod; 1324. movable plate; 1325. adjustment block; 1326. limit block; 1327. limit rod; 14. installation groove; 2. movable mold base; 21. second molding module; 22. guide rod. DETAILED DESCRIPTION

[0028] The present application is further described in detail below through drawings and examples.

[0029] Reference Figures 1 to 5The embodiment of the present application provides a semiconductor lead frame mold that is easy to demold, including a fixed mold base 1 and a movable mold base 2, a first molding module 11 is fixedly installed on the upper side of the fixed mold base 1, and a second molding module 21 that is compatible with the first molding module 11 is fixedly installed on the bottom of the movable mold base 2, a demolding structure 13 is arranged at the bottom of the fixed mold base 1, the demolding structure 13 includes a plurality of ejector columns 131 that are arranged through the first molding module 11, a mounting groove 14 is opened inside the fixed mold base 1, and the demolding structure 13 also includes an adjustment component 132 that is arranged inside the mounting groove 14, and the adjustment component 132 is used to drive the ejector columns 131 to rise and fall. Through the coordination of the plurality of ejector columns 131 and the adjustment component 132 in the demolding structure 13 at the bottom of the fixed mold base 1, when the semiconductor lead frame raw material is broken, the ejector columns 131 can be controlled to rise, so that the semiconductor lead frame raw material remaining in the first molding module 11 can be ejected, which is convenient for rapid demolding.

[0030] Reference Figure 4 and Figure 5 In one aspect of the present embodiment, the adjusting assembly 132 includes a threaded rod 1321 with opposite thread directions on both sides, and the outer sides of both ends of the threaded rod 1321 are threadedly connected with a threaded sleeve 1322, the tops of the two threaded sleeves 1322 are hinged with a support rod 1323, and the tail ends of the two support rods 1323 are hinged with a movable plate 1324, and the ejection column 131 is fixedly installed on the upper side of the movable plate 1324. Because the thread directions on both sides of the threaded rod 1321 are opposite, under the limiting action of the limit block 1326 and the limit rod 1327, the rotating threaded rod 1321 can drive the two threaded sleeves 1322 threadedly connected thereto to move in opposite directions. When the threaded sleeve 1322 moves, the support rod 1323 can rotate along its hinge point, thereby driving the movable plate 1324 to move, and the movable plate 1324 further drives the ejection column 131 to move, thereby controlling the lifting and lowering of the ejection column 131.

[0031] In one aspect of the present embodiment, the threaded rod 1321 is rotatably installed inside the mounting groove 14 through a bearing seat, one end of the threaded rod 1321 passes through the mounting groove 14 and extends to the outside of the fixed mold seat 1, and an adjustment block 1325 is fixedly installed at the tail end of the threaded rod 1321. By rotating the adjustment block 1325, the threaded rod 1321 can be driven to rotate and the rotation direction of the threaded rod 1321 can be controlled.

[0032] In one aspect of the present embodiment, limit blocks 1326 are fixedly installed on both sides of the threaded kit 1322, and two limit rods 1327 symmetrically arranged on both sides of the threaded rod 1321 are fixedly connected between the inner walls at both ends of the installation groove 14. The limit rods 1327 pass through the limit blocks 1326, and the limit blocks 1326 are slidably connected to the limit rods 1327. The limit blocks 1326 on both sides of the threaded kit 1322 can slide along the limit rods 1327, thereby limiting the limit blocks 1326 and the threaded kit 1322.

[0033] Reference Figures 1 to 3 In one aspect of the present embodiment, four guide rods 22 distributed in a rectangular array are fixedly installed at the bottom of the movable mold base 2, and four directional grooves 12 adapted to the guide rods 22 are fixedly installed on the upper side of the fixed mold base 1, and the guide rods 22 are slidably connected to the directional grooves 12. The guide rods 22 at the bottom of the movable mold base 2 can slide along the directional grooves 12 on the upper side of the fixed mold base 1, thereby playing a role in positioning the movable mold base 2.

[0034] Working principle: The semiconductor lead frame mold which is easy to demold, when the semiconductor lead frame raw material is broken, the adjusting block 1325 can be rotated to drive the threaded rod 1321 to rotate. Because the threads on both sides of the threaded rod 1321 are in opposite directions, under the limiting action of the limiting block 1326 and the limiting rod 1327, the rotating threaded rod 1321 drives the two threaded sleeves 1322 threadedly connected thereto to move toward each other. When the threaded sleeve 1322 moves, the support rod 1323 can be rotated along its hinge point, thereby driving the movable plate 1324 and the ejection column 131 to move upward, and the ejection column 131 can eject the semiconductor lead frame raw material remaining in the first molding module 11; then, the adjusting block 1325 is rotated to drive the threaded rod 1321 to rotate in the opposite direction, driving the two threaded sleeves 1322 threadedly connected thereto to move in the opposite direction, thereby driving the movable plate 1324 and the ejection column 131 to move downward and reset.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0036] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor lead frame mold that is easy to demould, comprising a fixed mold base (1) and a movable mold base (2), characterized in that: A first molding module (11) is fixedly mounted on the upper side of the fixed mold base (1), a second molding module (21) adapted to the first molding module (11) is fixedly mounted on the bottom of the movable mold base (2), a demoulding structure (13) is arranged at the bottom of the fixed mold base (1), the demoulding structure (13) comprises a plurality of ejector columns (131) penetrating the first molding module (11), a mounting groove (14) is provided inside the fixed mold base (1), the demoulding structure (13) further comprises an adjustment component (132) arranged inside the mounting groove (14), the adjustment component (132) being used to drive the ejector columns (131) to be raised and lowered.

2. The semiconductor lead frame mold that is easy to demould according to claim 1, characterized in that: The adjustment assembly (132) comprises a threaded rod (1321) with opposite thread directions on both sides, the outer sides of both ends of the threaded rod (1321) are threadedly connected with a threaded sleeve (1322), the tops of the two threaded sleeves (1322) are hinged with a support rod (1323), the tail ends of the two support rods (1323) are hinged with a movable plate (1324), and the ejector column (131) is fixedly installed on the upper side of the movable plate (1324).

3. The semiconductor lead frame mold that is easy to demould according to claim 2, characterized in that: The threaded rod (1321) is rotatably mounted inside the mounting groove (14) via a bearing seat, one end of the threaded rod (1321) passes through the mounting groove (14) and extends to the outside of the fixed mold seat (1), and an adjustment block (1325) is fixedly mounted on the rear end of the threaded rod (1321).

4. The semiconductor lead frame mold that is easy to demould according to claim 2, characterized in that: Limit blocks (1326) are fixedly installed on both sides of the threaded sleeve (1322), and two limit rods (1327) symmetrically arranged on both sides of the threaded rod (1321) are fixedly connected between the inner walls at both ends of the installation groove (14), and the limit rods (1327) are arranged to pass through the limit blocks (1326), and the limit blocks (1326) are slidably connected to the limit rods (1327).

5. The semiconductor lead frame mold that is easy to demould according to claim 1, characterized in that: Four guide rods (22) arranged in a rectangular array are fixedly mounted on the bottom of the movable mold base (2). Four directional grooves (12) adapted to the guide rods (22) are fixedly mounted on the upper side of the fixed die base (1). Furthermore, the guide rod (22) is slidably connected to the orientation groove (12).

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