Die head structure of granulator
By using the combination of heating elements of ceramic semiconductor materials and annular heat sinks in the pelletizer, the problems of short life and uneven heating of traditional heating rods are solved, and efficient and long-life temperature control is achieved, and the quality of finished products is improved.
Patent Information
- Application Number
- CN202420945043.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-04-30
AI Technical Summary
In traditional pelletizers, the heating rod has a short life, uneven heating method and large energy consumption, which leads to difficult temperature control and affects the quality of the finished product.
The heating element of ceramic semiconductor material is combined with corrugated spring sheet, and the heating system is combined with an annular heat sink to improve heat conduction efficiency and temperature control accuracy.
It realizes a more efficient heating method, extends the life of the part, increases the ultimate temperature, reduces the frequency of shutdown and replacement, and improves the accuracy and stability of temperature control.
Smart Images
Figure CN222246026U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of plastic processing, in particular to a die head structure of a pelletizer. Background Art
[0002] In traditional pelletizers, the die head needs to be accurately monitored and controlled in temperature. If the temperature does not reach the preset value, the polymer will flow unevenly in the cross section of the die head hole, or even solidify in the die head hole. This situation is called freezing. In order to prevent the die head from freezing, the minimum polymer speed must be maintained through the extrusion hole and the correct die head temperature must be maintained. Therefore, temperature monitoring and control are essential functions of the die head.
[0003] The current mainstream practice is to use thermocouples to read the temperature, and then use heating rods to adjust the temperature. However, the heating rod has a short life, especially when the die head uses multiple plug-in connections, so it is easy for one of them to be damaged, which will affect the temperature, and the slight temperature difference will affect the final product. Therefore, it is easy to cause repeated shutdowns for replacement, which is a major problem with the current pelletizer. Secondly, due to the use of a ring-shaped plug-in connection, the actual heating in this way is not uniform. Finally, the heating rod heating method consumes a lot of energy.
[0004] To solve the above problems, we made a series of improvements. Utility Model Content
[0005] The purpose of the utility model is to provide a die head structure of a pelletizer to overcome the above-mentioned shortcomings and deficiencies in the prior art.
[0006] A die head structure of a pelletizer, comprising: an outer die plate, an inner die plate, a heating hole, an extrusion hole, a heating system and a heat sink, wherein the inner die plate is connected to the outer die plate, the outer die plate is connected to a discharge pipe, a heating hole is arranged at a side end of the outer die plate, an extrusion hole is arranged on a surface of the inner die plate, the heating system is arranged in the heating hole, the heat sink is connected to the heating system, a head of the heat sink is arranged on the extrusion hole, and the head of the heat sink is an annular structure;
[0007] The heating system comprises: a heating element, an insulating layer, a fixed pressure plate, a corrugated spring sheet and an electrode terminal, one end of the heating element is in contact with the corrugated spring sheet, the other end of the heating element is connected to the electrode terminal, the heating element and the corrugated spring sheet are fixed on the fixed pressure plate, and the insulating layer covers the heating element.
[0008] Furthermore, the number of the heat sinks corresponds to the number of the extrusion holes, and the heat sinks include: a head annular structure and a tail extension structure, the inner height of the annular structure of the heat sink is greater than the outer height, and the tail extension structure connects the head annular structure and the heating system.
[0009] Furthermore, the heating element is made of ceramic semiconductor material.
[0010] Beneficial effects of the utility model:
[0011] Compared with the traditional technology, the utility model realizes a more efficient heating method, a longer service life of parts and a higher heating temperature by improving the heating system. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a structural schematic diagram of the utility model.
[0013] Figure 2 It is a side structural schematic diagram of the utility model.
[0014] Figure 3 It is a schematic diagram of the structure of the heating system.
[0015] Figure 4 It is a structural schematic diagram of the head ring structure.
[0016] Figure 5 It is a schematic diagram of the structure of the heat sink.
[0017] Reference numerals:
[0018] The outer mold plate 100 , the inner mold plate 200 , the heating holes 300 and the extrusion holes 400 .
[0019] The heating system 500 , the heating element 510 , the insulating layer 520 , the fixing plate 530 , the corrugated spring sheet 540 and the electrode terminal 550 .
[0020] The heat sink 600 , the head ring structure 610 and the tail extension structure 620 . DETAILED DESCRIPTION
[0021] The following is a further description of the present invention in conjunction with specific embodiments. It should be understood that the following embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention.
[0022] Example 1
[0023] Figure 1 It is a structural schematic diagram of the utility model. Figure 2 It is a side structural schematic diagram of the utility model. Figure 3 It is a schematic diagram of the heating system. Figure 4 It is a structural schematic diagram of the head ring structure. Figure 5 It is a schematic diagram of the structure of the heat sink.
[0024] like Figure 1 and 2 As shown, a die head structure of a pelletizer includes: an outer mold plate 100, an inner mold plate 200, a heating hole 300, an extrusion hole 400, a heating system 500 and a heat sink 600, the inner mold plate 200 is connected to the outer mold plate 100, the outer mold plate 100 is connected to a discharge pipe, a heating hole 300 is provided at a side end of the outer mold plate 100, an extrusion hole 400 is provided on the surface of the inner mold plate 200, the heating system 500 is provided in the heating hole 300, the heat sink 600 is connected to the heating system 500, the head of the heat sink 600 is provided on the extrusion hole 400, and the head of the heat sink 600 is a ring structure.
[0025] like Figure 3 As shown, the heating system 500 includes: a heating element 510, an insulating layer 520, a fixed pressure plate 530, a corrugated spring sheet 540 and an electrode terminal 550, one end of the heating element 510 is in contact with the corrugated spring sheet 540, and the other end of the heating element 510 is connected to the electrode terminal 550, the heating element 510 and the corrugated spring sheet 540 are fixed on the fixed pressure plate 530, and the insulating layer 520 covers the heating element 510.
[0026] like Figure 4 and 5 As shown, the number of heat sinks 600 corresponds to the number of extrusion holes 400 , and the heat sink 600 includes: a head annular structure 610 and a tail extension structure 620 , the inner height of the annular structure of the heat sink 600 is greater than the outer height, and the tail extension structure 620 connects the head annular structure 610 and the heating system 500 .
[0027] The heating element 510 is made of ceramic semiconductor material.
[0028] The function of the utility model in the whole pelletizer is to provide a sufficiently high temperature for the liquid polymer at the die head to prevent it from solidifying quickly. After a part of the liquid polymer is extruded from the extrusion hole 400, it is cut into particles by the cutter outside the die head and then falls into the water to cool and solidify. Therefore, the temperature control of the die head is particularly important. It must have a high enough temperature to maintain different types of polymers, and must be controlled within a set range to avoid the freezing phenomenon in the background technology.
[0029] In the present utility model, we remove the traditional heating rod as a heating system and adopt a new structure. This heating system adopts a combination of a heating element 510 and a corrugated spring sheet 540, and the heating element 510 is a ceramic semiconductor material. The electrode terminal 550 is connected to an external power supply, the insulating layer 520 protects the heating element, and the corrugated spring sheet 540 presses the heating element 510. Then in order to cooperate with the heating system 500, we also need to add a heat sink 600 structure. On the one hand, the high-temperature heating element 510 needs to dissipate the heat, and on the other hand, the heat sink also needs to be used as a carrier to transfer the heat of the heating element 510 to the vicinity of the extrusion hole 400. Therefore, the head ring structure 610 of the heat sink 600 we designed adopts a circular ring structure, which wraps around the extrusion hole 400 to ensure that the heat is effectively transferred to the extrusion hole 400. At the same time, the inner height of the ring structure of the heat sink 600 is greater than the outer height. It is a trapezoidal structure when viewed from the side. Such a design can gather heat to the inner side of the central ring, thereby better conducting heat to the extrusion hole 400. The tail extension structure 620 conducts the heat.
[0030] In summary, the utility model enhances the overall heating efficiency through a new heating system with targeted heat sinks, and the heat conversion rate can be as high as 98%. At the same time, the overall limit temperature is increased. Compared with the limit temperature of the heating rod of only 150°C, the limit temperature of the ceramic semiconductor material is above 250°C. The service life can also exceed 10 years and almost no replacement is required. Moreover, as underwater pelletizing work, the use of heat sinks also allows ceramic semiconductor materials to avoid the biggest high heat problem, and they complement each other. Compared with traditional technologies, the utility model achieves a more efficient heating method, longer parts life, and higher heating temperature by improving the heating system.
[0031] The specific implementation modes of the present invention are described above, but the present invention is not limited thereto. The present invention can also have various changes without departing from the purpose of the present invention.
Claims
1. A die head structure of a pelletizer, characterized in that: include: An outer template (100), an inner template (200), a heating hole (300), an extrusion hole (400), a heating system (500) and a heat sink (600), wherein the inner template (200) is connected to the outer template (100), the outer template (100) is connected to a discharge pipe, a heating hole (300) is provided at a side end of the outer template (100), an extrusion hole (400) is provided on a surface of the inner template (200), the heating system (500) is provided in the heating hole (300), the heat sink (600) is connected to the heating system (500), the head of the heat sink (600) is provided on the extrusion hole (400), and the head of the heat sink (600) is an annular structure; The heating system (500) comprises: a heating element (510), an insulating layer (520), a fixed pressing plate (530), a corrugated spring sheet (540) and an electrode terminal (550); one end of the heating element (510) is in contact with the corrugated spring sheet (540); the other end of the heating element (510) is connected to the electrode terminal (550); the heating element (510) and the corrugated spring sheet (540) are fixed on the fixed pressing plate (530); and the insulating layer (520) covers the heating element (510).
2. The die head structure of a pelletizer according to claim 1, characterized in that: The number of the heat sinks (600) corresponds to the number of the extrusion holes (400), and the heat sink (600) comprises: a head annular structure (610) and a tail extension structure (620), the inner height of the annular structure of the heat sink (600) is greater than the outer height, and the tail extension structure (620) connects the head annular structure (610) and the heating system (500).
3. The die head structure of a pelletizer according to claim 1, characterized in that: The heating element (510) is made of ceramic semiconductor material.