Preheating device for semiconductor product sintering equipment

Abstract

The utility model relates to the field of semiconductor product sintering, in particular to a preheating device for semiconductor product sintering equipment. The preheating device for the semiconductor product sintering equipment comprises a preheating chamber, a preheating mechanism, an elastic thermocouple and a control device, the preheating chamber is located at the bottom of a preheating cavity of the semiconductor product sintering equipment, and an avoiding hole is formed in the top wall of the preheating chamber; the preheating mechanism is mounted in the preheating chamber; an elastic thermocouple is mounted in the preheating chamber, a detection head of the elastic thermocouple extends into the preheating cavity from the avoiding hole, and when a tool for bearing a semiconductor product is arranged above the outside of the preheating chamber, the elastic thermocouple is compressed by the tool; and a control device is respectively connected with the elastic thermocouple and the preheating mechanism. According to the utility model, the temperature of the tool can be directly and accurately measured so as to accurately control the preheating temperature of a semiconductor product.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor product sintering, in particular to a preheating device for semiconductor product sintering equipment. Background Art

[0002] Semiconductor product packaging using sintering technology is based on semiconductor product sintering equipment, which has preheating, sintering and cooling stations. During the preheating process, the tooling carries the semiconductor product and is placed in the preheating chamber of the semiconductor product sintering equipment for preheating. This process has strict requirements on temperature.

[0003] At present, the temperature in the preheating chamber is mainly detected by thermocouples, and the preheating device is controlled according to the temperature. Since the temperature in the preheating chamber is directly detected, the preheating chamber temperature is used to represent the tooling temperature, which leads to inaccurate tooling temperature. Naturally, the preheating temperature of the semiconductor product cannot be accurately controlled at the preset value, which affects the preheating effect. Summary of the invention

[0004] The technical problem to be solved by the utility model is to overcome the defects of the prior art and provide a preheating device for semiconductor product sintering equipment, which can directly and accurately measure the temperature of the tooling to accurately control the preheating temperature of the semiconductor product.

[0005] In order to solve the above technical problems, the technical solution of the utility model is: a preheating device for semiconductor product sintering equipment, comprising:

[0006] The preheating chamber is located at the bottom of the preheating chamber of the semiconductor product sintering equipment, and the top wall is provided with an avoidance hole;

[0007] A preheating mechanism installed in the preheating chamber;

[0008] An elastic thermocouple is installed in the preheating chamber, and its detection head extends into the preheating chamber from the avoidance hole. When a tool carrying a semiconductor product is placed in the preheating chamber, the tool compresses the elastic thermocouple;

[0009] A control device is connected to the elastic thermocouple and the preheating mechanism respectively.

[0010] In order to exhaust the oxygen in the preheating chamber, the side wall and / or the bottom wall of the preheating chamber are respectively provided with a plurality of air holes.

[0011] A specific structure of a preheating mechanism is further provided, wherein the preheating mechanism is a plurality of quartz heating tubes, and the top wall of the preheating chamber is made of quartz glass.

[0012] In order to further ensure that semiconductor products at different acupoints of the tooling are heated evenly, the number of the quartz heating tubes is consistent with the number of rows of the acupoints of the tooling, and each quartz heating tube is directly opposite to the center position of a row of acupoints of the tooling in the longitudinal direction.

[0013] In order to further reduce the heat loss of the tooling as much as possible, a supporting portion for supporting the corners of the tooling is provided outside the preheating chamber, and after the tooling is arranged on the supporting portion, a gap is left between the tooling and the top wall of the preheating chamber.

[0014] In order to further ensure the position accuracy of the tooling, a positioning pin is further provided outside the preheating chamber for cooperating with the positioning hole of the tooling to achieve positioning.

[0015] In order to further avoid heat transfer through the positioning pin, a gap is left between the positioning pin and the peripheral wall of the positioning hole.

[0016] Furthermore, the preheating device for semiconductor product sintering equipment also includes a tooling detection device for detecting whether there is a tooling in the preheating chamber, and the tooling detection device is connected to the control device.

[0017] Furthermore, an elastic telescopic rod is installed in at least part of the support portion. When no tooling is placed on the support portion, the elastic telescopic rod extends upward beyond the support portion. When a tooling is placed on the support portion, the elastic telescopic rod moves downward under the action of the tooling to a position that can be detected by the tooling detection device.

[0018] A specific structure of an elastic thermocouple is further provided, the elastic thermocouple comprising:

[0019] A mounting body, mounted on the bottom wall of the preheating chamber, having a cavity;

[0020] The thermocouple body is inserted into the mounting body, the detection head of the thermocouple body extends from the top of the mounting body, and the part of the thermocouple body located in the cavity is provided with an abutment part;

[0021] The elastic member has a lower end portion abutting against the bottom wall in the preheating chamber or the mounting body, and an upper end portion abutting against the abutting portion.

[0022] After adopting the above technical solution, the detection head of the elastic thermocouple extends into the preheating chamber from the avoidance hole. When the tooling is placed in the preheating chamber, the tooling compresses the elastic thermocouple, so the elastic thermocouple can press against the tooling, thereby directly and accurately measuring the temperature of the tooling. The semiconductor product directly contacts the tooling, and the temperature of the tooling is also the temperature of the semiconductor product. The control device then controls the preheating mechanism to work according to the temperature feedback from the elastic thermocouple. Because the elastic thermocouple can accurately measure the temperature of the tooling, and the preheating mechanism is controlled according to the temperature measured by the elastic thermocouple, the utility model can achieve the purpose of accurately controlling the preheating temperature of the tooling and the semiconductor product in the tooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the structure after the tooling is placed on the preheating device for semiconductor product sintering equipment of the utility model;

[0024] Figure 2 This is a schematic structural diagram of the preheating device for semiconductor product sintering equipment of the utility model without the tooling placed therein;

[0025] Figure 3 for Figure 2 A cross-sectional view of

[0026] Figure 4 for Figure 3 A magnified view of part A;

[0027] In the figure, 1, preheating chamber; 11, top wall; 111, avoidance hole; 12, side wall; 13, bottom wall; 101, air vent; 2, preheating mechanism; 3, elastic thermocouple; 31, mounting body; 32, thermocouple body; 321, abutment portion; 33, elastic member; 4, tooling; 41, positioning hole; 5, supporting portion; 6, positioning pin; 7, elastic telescopic rod. DETAILED DESCRIPTION

[0028] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below based on specific embodiments and in conjunction with the accompanying drawings.

[0029] Embodiment 1

[0030] like Figure 1-Figure 4 As shown, a preheating device for semiconductor product sintering equipment comprises:

[0031] The preheating chamber 1 is located at the bottom of the preheating chamber of the semiconductor product sintering equipment, and the top wall 11 is provided with an avoidance hole 111;

[0032] A preheating mechanism 2 is installed in the preheating chamber 1;

[0033] The elastic thermocouple 3 is installed in the preheating chamber, and its detection head extends into the preheating chamber from the avoidance hole 111. When the tooling 4 carrying the semiconductor product is placed in the preheating chamber, the tooling 4 compresses the elastic thermocouple 3;

[0034] The control device is connected to the elastic thermocouple 3 and the preheating mechanism 2 respectively.

[0035] Among them, the detection head of the elastic thermocouple 3 extends into the preheating chamber from the avoidance hole 111. When the tooling 4 is placed in the preheating chamber, the tooling 4 compresses the elastic thermocouple 3, so the elastic thermocouple 3 can be pressed against the tooling 4, thereby directly and accurately measuring the temperature of the tooling 4. The semiconductor product is in direct contact with the tooling 4, and the temperature of the tooling 4 is also the temperature of the semiconductor product. The control device then controls the operation of the preheating mechanism 2 according to the temperature feedback from the elastic thermocouple 3, mainly controlling the power of the preheating mechanism 2 and / or the number of units put into operation.

[0036] In this embodiment, since the elastic thermocouple 3 can accurately measure the temperature of the tooling 4, the preheating mechanism 2 is controlled according to the temperature measured by the elastic thermocouple 3, so the purpose of accurately controlling the preheating temperature of the tooling 4 and the semiconductor product in the tooling 4 can be achieved.

[0037] The elastic thermocouple 3 only needs to be elastic, and there can be many specific structures. Here is one example, specifically 3, Figure 4 As shown, the elastic thermocouple 3 comprises:

[0038] The mounting body 31 is mounted on the bottom wall 13 in the preheating chamber 1 and has a cavity;

[0039] The thermocouple body 32 is inserted into the mounting body 31, and its detection head extends from the top of the mounting body 31, and its part located in the cavity is provided with an abutment portion 321;

[0040] The elastic member 33 has a lower end portion abutting against the bottom wall 13 or the mounting body 31 in the preheating chamber 1 , and an upper end portion abutting against the abutting portion 321 .

[0041] Embodiment 2

[0042] Based on the first embodiment, Figure 1 , 2 As shown, the side wall 12 and / or the bottom wall 13 of the preheating chamber 1 are respectively provided with a plurality of air holes 101 .

[0043] In the semiconductor product sintering equipment, the preheating chamber 1 is connected to the preheating cavity through the avoidance hole 111. The sintering process requires that the preheating cavity is in a nitrogen atmosphere with the oxygen content as low as possible. In order to prevent the gas in the preheating chamber 1 from affecting the oxygen content in the preheating cavity, it is required that the preheating chamber 1 is also in a nitrogen atmosphere with the oxygen content as low as possible, so as to ensure that the preheating cavity 1 meets the requirement of low oxygen content.

[0044] Based on this, before the semiconductor product sintering equipment is operated, the air in the preheating chamber 1 needs to be exhausted; considering that it is impossible to completely seal the preheating chamber 1, there must be a continuous nitrogen flow in the preheating chamber 1 during the operation of the sintering equipment to exhaust the air that flows in. Therefore, it is necessary to set air holes 101 on the side wall 12 and / or the bottom wall 13 of the preheating chamber, on the one hand to ensure that the air can be exhausted during the exhaust process, and on the other hand to ensure that a continuous nitrogen flow can be formed after the nitrogen is introduced during the sintering process, thereby exhausting the air that has newly entered the preheating chamber 1.

[0045] Embodiment 3

[0046] On the basis of Example 1 or Example 2, Figure 1 , Figure 2 and Figure 3 As shown, the preheating mechanism 2 is a plurality of quartz heating tubes, and the top wall 11 of the preheating chamber 1 is made of quartz glass.

[0047] In this embodiment, far-infrared heating is used to preheat the tooling 1 and the semiconductor product in the tooling 1 , and the control device controls the power of the quartz heating tube according to the temperature feedback from the elastic thermocouple 3 .

[0048] Preferably, if Figure 1 , Figure 2 and Figure 3 As shown, the number of quartz heating tubes is consistent with the number of rows of acupuncture points of the tooling 4, and each quartz heating tube is directly opposite to the center position of a row of acupuncture points of the tooling 4 in the longitudinal direction. In this way, various parts of the tooling 4 can be preheated relatively evenly to avoid uneven heating.

[0049] exist Figure 1 , Figure 2 and Figure 3 In the structure shown, the tooling 4 has three rows of acupuncture points, and the number of quartz heating tubes is also three. The number of rows of acupuncture points of the tooling 4 is not limited thereto, and when the number of rows of acupuncture points of the tooling 4 is adjusted, the number of quartz heating tubes is also adjusted accordingly.

[0050] Embodiment 4

[0051] Based on the third embodiment, Figure 1 and Figure 2 As shown, a support portion 5 for supporting the corner of the tooling 4 is provided outside the preheating chamber 1 , and after the tooling 4 is placed on the support portion 5 , a gap is left between the tooling 4 and the top wall 11 of the preheating chamber 1 .

[0052] Specifically, by supporting the four corners of the tooling 4 only through the support portion 5 , the contact area between the tooling 4 and other components can be reduced, thereby preventing the heat of the tooling 4 from being conducted away.

[0053] Preferably, if Figure 1 , Figure 2 and Figure 3 As shown, a positioning pin 6 is also provided outside the preheating chamber 1 for cooperating with the positioning hole 41 of the tool 4 to achieve positioning. The positioning pin 6 is provided to prevent the tool 4 from being placed off-center.

[0054] More preferably, a gap is left between the positioning pin 6 and the peripheral wall of the positioning hole 41. In this way, the contact area between the tooling 4 and other components is prevented from increasing due to the presence of the positioning pin 41, thereby preventing the heat of the tooling 4 from being conducted away by the positioning pin 6.

[0055] Embodiment 5

[0056] On the basis of the fourth embodiment, the preheating device for semiconductor product sintering equipment further includes a tooling detection device for detecting whether there is a tooling 4 in the preheating chamber, and the tooling detection device is connected to the control device.

[0057] Among them, the tooling detection device can be a proximity switch, etc. There can be many installation methods and installation positions, as long as they can achieve the expected effect. Now a preferred one is listed.

[0058] like Figure 1 , 2 As shown, an elastic telescopic rod 7 is installed in at least part of the support portion 5. When the tooling 4 is not placed on the support portion 5, the elastic telescopic rod 7 extends upward beyond the support portion 5. When the tooling 4 is placed on the support portion 5, the elastic telescopic rod 7 moves downward under the action of the tooling 4 to a position that can be detected by the tooling detection device.

[0059] More specifically, the tool detection device is located below the preheating chamber 1. When the tool 4 is placed on the support 5, the tool 4 pushes the elastic telescopic rod 7 downward, and the lower end of the elastic telescopic rod 7 moves downward to a position where it can be detected by the tool detection device. In this way, even if the tool detection device is located outside the preheating chamber 1, it can detect whether there is a tool 4. In addition, the tool detection device does not need to be in a high temperature environment, which is conducive to long-term stable operation.

[0060] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A preheating device for semiconductor product sintering equipment, characterized in that: include: A preheating chamber (1) is located at the bottom of a preheating chamber of a semiconductor product sintering device, and a top wall (11) is provided with an avoidance hole (111); A preheating mechanism (2) installed in the preheating chamber (1); An elastic thermocouple (3) is installed in the preheating chamber, and its detection head extends from the avoidance hole (111) into the preheating chamber. When a tool (4) carrying a semiconductor product is placed in the preheating chamber, the tool (4) compresses the elastic thermocouple (3); A control device is connected to the elastic thermocouple (3) and the preheating mechanism (2) respectively.

2. The preheating device for semiconductor product sintering equipment according to claim 1, characterized in that: The side wall (12) and / or the bottom wall (13) of the preheating chamber (1) are respectively provided with a plurality of air holes (101).

3. The preheating device for semiconductor product sintering equipment according to claim 1, characterized in that: The preheating mechanism (2) is a plurality of quartz heating tubes, and the top wall (11) of the preheating chamber (1) is made of quartz glass.

4. The preheating device for semiconductor product sintering equipment according to claim 3, characterized in that: The number of the quartz heating tubes is consistent with the number of rows of acupuncture points of the tooling (4), and each quartz heating tube is directly opposite to the center position of a row of acupuncture points of the tooling (4) in the longitudinal direction.

5. The preheating device for semiconductor product sintering equipment according to claim 3, characterized in that: A support portion (5) for supporting the corner of the tooling (4) is provided outside the preheating chamber (1); after the tooling (4) is placed on the support portion (5), a gap is left between the tooling (4) and the top wall (11) of the preheating chamber (1).

6. The preheating device for semiconductor product sintering equipment according to claim 5, characterized in that: A positioning pin (6) is also provided outside the preheating chamber (1) for cooperating with the positioning hole (41) of the tooling (4) to achieve positioning.

7. The preheating device for semiconductor product sintering equipment according to claim 6, characterized in that: A gap is left between the positioning pin (6) and the peripheral wall of the positioning hole (41).

8. The preheating device for semiconductor product sintering equipment according to claim 5, characterized in that: It also includes a tooling detection device for detecting whether there is a tooling (4) in the preheating chamber, and the tooling detection device is connected to the control device.

9. The preheating device for semiconductor product sintering equipment according to claim 8, characterized in that: An elastic telescopic rod (7) is installed in at least part of the support portion (5); when the tooling (4) is not placed on the support portion (5), the elastic telescopic rod (7) extends upward beyond the support portion (5); when the tooling (4) is placed on the support portion (5), the elastic telescopic rod (7) moves downward under the action of the tooling (4) to a position that can be detected by the tooling detection device.

10. The preheating device for semiconductor product sintering equipment according to claim 1, characterized in that: The elastic thermocouple (3) comprises: A mounting body (31) mounted on the bottom wall (13) in the preheating chamber (1) and having a cavity; A thermocouple body (32) is inserted into the mounting body (31), a detection head thereof protruding from the top end of the mounting body (31), and a contact portion (321) is provided at the portion thereof located in the cavity; The elastic member (33) has a lower end portion abutting against the bottom wall (13) in the preheating chamber (1) or the mounting body (31), and an upper end portion abutting against the abutting portion (321).

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