Circuit board welding spot testing device

Abstract

The utility model relates to the technical field of circuit board testing, and provides a circuit board welding spot testing device which comprises a machine base control bottom plate, a machine base driving top box, a testing host, a lower probe installation assembly, a circuit board fixing bottom plate assembly, a circuit board pressing plate, an upper probe installation assembly, a driving plate assembly and a driving shaft. The machine base control bottom plate is fixedly connected with the machine base driving top box, the test host is arranged on the machine base control bottom plate, the lower probe installation assembly is fixedly installed on the test host, the circuit board fixing bottom plate assembly is arranged on the lower probe installation assembly, the circuit board pressing plate is arranged above the circuit board fixing bottom plate assembly, and the circuit board pressing plate is arranged above the circuit board fixing bottom plate assembly. The upper side of the circuit board pressing plate is fixedly connected with the upper probe installation assembly, the driving plate assembly is arranged on the upper side of the upper probe installation assembly, and the driving plate assembly is fixedly connected with the machine base driving top box through the driving shaft. The circuit board double-face welding spot testing machine is reasonable in structure, convenient to use and high in automation degree, can test circuit board double-face welding spots at the same time, and improves work efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board testing, in particular to a circuit board soldering point testing device. Background Art

[0002] With the continuous development of electronic technology, electronic products are constantly enriching our lives. As the most important part of electronic products, the quality of circuit boards is related to the performance and quality of the products themselves.

[0003] For example, a circuit board testing device disclosed in application number: CN202122246127.X belongs to the field of circuit board testing technology and solves the technical problem of poor contact between the existing circuit board testing device and the circuit board. The circuit board testing device includes a test box, a power supply, a switch, a warning mechanism, and a number of probes corresponding to the solder joints to be tested on the circuit board. The power supply is installed in the test box, and the probes, switches, and warning mechanisms are all installed on the top wall of the test box and are all located outside the test box. Each probe is electrically connected to a wire, and a number of wires are all arranged in the test box. The power supply, switch, warning mechanism, and a number of wires are connected in series to form a circuit. A support column for supporting the circuit board is provided on the top wall of the test box, and a pressure plate tooling for pressing the circuit board is also installed on the test box.

[0004] However, the above device can only perform single-sided testing when testing solder joints on a circuit board, and the testing of solder joints on a circuit board needs to be completed twice, resulting in low testing efficiency. Utility Model Content

[0005] In order to solve the problem that the existing device can only perform single-sided testing on the solder joints of a circuit board, and the solder joint detection of a circuit board needs to be completed twice, resulting in low testing efficiency, the utility model provides a circuit board solder joint testing device to solve this problem.

[0006] In order to achieve the above object, the utility model provides the following technical solutions:

[0007] A circuit board solder joint testing device comprises: a machine base control bottom plate, a machine base drive top box, a test host, a lower probe mounting assembly, a circuit board fixed bottom plate assembly, a circuit board pressure plate, an upper probe mounting assembly, a driving plate assembly and a driving shaft, wherein the machine base control bottom plate and the machine base drive top box are fixedly connected, the test host is arranged on the machine base control bottom plate, the lower probe mounting assembly is fixedly installed on the test host, the circuit board fixed bottom plate assembly is arranged on the lower probe mounting assembly, the circuit board pressure plate is arranged above the circuit board fixed bottom plate assembly, the upper side of the circuit board pressure plate is fixedly connected to the upper probe mounting assembly, the driving plate assembly is arranged on the upper side of the upper probe mounting assembly, and the driving plate assembly is fixedly connected to the machine base drive top box via the driving shaft.

[0008] Preferably, the lower probe mounting assembly includes: a lower mounting base plate and a lower test probe, and the lower test probes are provided with multiple groups, and the multiple groups of lower test probes are arranged on the lower mounting base plate. The setting positions of the lower test probes are arranged according to the positions of the solder points on the lower surface of the circuit board to be tested, and the lower test probes pass through the circuit board fixing base plate assembly and cooperate with the circuit board.

[0009] Preferably, the circuit board fixing base plate assembly includes: a circuit board fixing base plate, a support column and a limit block. The circuit board fixing base plate is fixedly mounted on the upper side of the lower probe mounting assembly through the support column. Multiple groups of limit blocks are provided. The multiple groups of limit blocks are fixedly mounted on the upper side of the circuit board fixing base plate. The multiple groups of limit blocks are used to limit the circuit board. The circuit board fixing base plate is provided with a through hole for accommodating the lower test probe to pass through. The circuit board fixing base plate is used in conjunction with the circuit board pressure plate.

[0010] Preferably, the upper probe mounting assembly includes: an upper mounting plate and an upper test probe, wherein the upper test probes are provided in multiple groups, and the multiple groups of upper test probes are arranged on the upper mounting plate, and the setting positions of the upper test probes are arranged according to the positions of the solder points on the surface of the circuit board to be tested, and the upper test probes pass through the circuit board pressure plate and cooperate with the circuit board, and the upper side of the upper mounting plate is fixedly connected to the driving board assembly.

[0011] Preferably, the circuit board pressing plate is provided with a through hole for accommodating the upper test probe to pass through.

[0012] Preferably, the circuit board pressing plate is provided with a clearance hole for avoiding the limit block.

[0013] Preferably, the driving plate assembly comprises: a driving plate and a connecting column, wherein the upper side of the driving plate is connected to the base driving top box through a driving shaft, and the lower side of the driving plate is fixedly connected to the upper mounting plate through the connecting column.

[0014] The advantages of the utility model are: the utility model can simultaneously test the solder joints on both sides of the circuit board by setting a lower probe installation component and an upper probe installation component, cooperating with a circuit board fixing base plate component and a circuit board pressing plate, thereby improving work efficiency; and the degree of automation is improved by setting a drive plate component and a drive shaft, which is easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the accompanying drawings:

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2 It is the front view of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the lower probe installation assembly of the utility model;

[0019] Figure 4 It is a structural schematic diagram of the circuit board fixing base plate assembly of the utility model;

[0020] Figure 5 It is a structural schematic diagram of the circuit board pressing plate of the utility model;

[0021] Figure 6 It is a structural schematic diagram of the probe installation assembly of the utility model;

[0022] Figure 7 It is a structural schematic diagram of the drive plate assembly of the utility model.

[0023] Description of reference numerals:

[0024] 1. Machine base control bottom plate; 2. Machine base drive top box; 3. Test host; 4. Lower probe installation assembly; 5. Circuit board fixed bottom plate assembly; 6. Circuit board pressure plate; 7. Upper probe installation assembly; 8. Drive board assembly; 9. Drive shaft; 41. Lower installation bottom plate; 42. Lower test probe; 51. Circuit board fixed bottom plate; 52. Support column; 53. Limit block; 71. Upper installation plate; 72. Upper test probe; 81. Drive board; 82. Connecting column. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0026] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0028] Embodiment 1, combined with Figure 1 and Figure 2 To explain:

[0029] A circuit board solder joint test device comprises: a machine base control base plate 1, a machine base drive top box 2, a test host 3, a lower probe installation assembly 4, a circuit board fixed base plate assembly 5, a circuit board pressure plate 6, an upper probe installation assembly 7, a drive plate assembly 8 and a drive shaft 9, wherein the machine base control base plate 1 and the machine base drive top box 2 are fixedly connected, the test host 3 is arranged on the machine base control base plate 1, the lower probe installation assembly 4 is fixedly installed on the test host 3, the circuit board fixed base plate assembly 5 is arranged on the lower probe installation assembly 4, the circuit board pressure plate 6 is arranged above the circuit board fixed base plate assembly 5, the upper side of the circuit board pressure plate 6 is fixedly connected to the upper probe installation assembly 7, the drive plate assembly 8 is arranged on the upper side of the upper probe installation assembly 7, and the drive plate assembly 8 is fixedly connected to the machine base drive top box 2 through the drive shaft 9. By using the machine base drive top box 2 to automatically move the probe and contact the solder joint, the detection efficiency is improved and the labor cost is reduced. By using the lower probe installation assembly 4 and the upper probe installation assembly 7, the position of the probe can be accurately controlled to ensure that the solder joint is accurately tested. By using the machine base control bottom plate 1, the machine base drive top box 2, the test host 3, the lower probe installation assembly 4, the circuit board fixing bottom plate assembly 5, the circuit board pressing plate 6, the upper probe installation assembly 7, the drive plate assembly 8 and the drive shaft 9, the unstable factors caused by manual operation can be reduced to ensure the repeatability and consistency of each test. By using the double-sided solder joint test device, the work intensity can be reduced and the manual fatigue can be reduced. The whole device is compactly designed and can complete complex test tasks in a limited space.

[0030] Embodiment 2, based on embodiment 1, combined with Figure 3 To explain:

[0031] The lower probe mounting assembly 4 includes: a lower mounting base plate 41 and lower test probes 42. The lower test probes 42 are provided with multiple groups. The multiple groups of lower test probes 42 are arranged on the lower mounting base plate 41. The lower test probes 42 are arranged according to the positions of the solder joints on the lower surface of the circuit board to be tested. The lower test probes 42 pass through the circuit board fixing base plate assembly 5 and cooperate with the circuit board. The lower test probes 42 can be arranged according to the specific positions of the solder joints on the lower surface of the circuit board to be tested, and can adapt to circuit boards of different designs and specifications. The setting of multiple groups of lower test probes 42 allows multiple solder joints to be tested at the same time, which improves the density and efficiency of the test. The arrangement and position control of the lower test probes 42 can be very precise, ensuring that each solder joint can be accurately tested. The test probes 42 pass through the circuit board fixing base plate assembly 5 and cooperate with the circuit board to help achieve uniform pressure distribution during the test process and avoid damage to the circuit board due to excessive local pressure. Since the lower test probes 42 are in direct contact with the circuit board, they can quickly respond to the quality of the solder joints and complete the test without complicated operations. If a lower test probe 42 is damaged or needs to be replaced, it is relatively easy to replace because it is arranged on the lower mounting base plate 41 .

[0032] Embodiment 3, based on embodiment 2, combined with Figure 4 To explain:

[0033] The circuit board fixing base plate assembly 5 includes: a circuit board fixing base plate 51, a support column 52 and a limit block 53. The circuit board fixing base plate 51 is fixedly mounted on the upper side of the lower probe mounting assembly 4 through the support column 52. The limit blocks 53 are provided in multiple groups. The multiple groups of limit blocks 53 are fixedly mounted on the upper side of the circuit board fixing base plate 51. The multiple groups of limit blocks 53 are used to limit the circuit board. The circuit board fixing base plate 51 is provided with a through hole for accommodating the lower test probe 42 to pass through. The circuit board fixing base plate 51 is used in conjunction with the circuit board pressing plate 6. The circuit board fixing base plate 51 is fixedly mounted on the upper side of the lower probe mounting assembly 4 through the support column 52, which can provide a stable support to ensure that the circuit board will not move during the test process. The multiple groups of limit blocks 53 are fixedly mounted on the upper side of the circuit board fixing base plate 51, so as to accurately define the position of the circuit board and ensure that the test probe can accurately contact the solder joint. By setting the limit blocks 53, circuit boards of different sizes and shapes can be adapted, so that the assembly 5 has a wide range of applicability. The circuit board fixing base plate 51 is provided with a through hole for accommodating the test probe 42 to pass through, thereby helping to guide the probe to accurately pass through the base plate and reach the solder joint for testing. The stable circuit board fixing base plate assembly 5 helps to improve the repeatability and consistency of the test, thereby improving the overall test efficiency.

[0034] Embodiment 4, based on embodiment 3, combined with Figure 6 To explain:

[0035] The upper probe mounting assembly 7 comprises: an upper mounting plate 71 and an upper test probe 72, wherein the upper test probe 72 is provided with multiple groups, and the multiple groups of upper test probes 72 are arranged on the upper mounting plate 71, and the upper test probe 72 is arranged according to the position of the solder joint on the upper surface of the circuit board to be tested, and the upper test probe 72 passes through the circuit board pressing plate 6 and is used in conjunction with the circuit board, and the upper side of the upper mounting plate 71 is fixedly connected to the driving board assembly 8. The upper test probe 72 can be arranged according to the specific position of the solder joint on the upper surface of the circuit board to be tested, and can thus adapt to circuit boards of different designs and specifications. The setting of multiple groups of upper test probes 72 allows multiple solder joints to be tested at the same time, thereby improving the density and efficiency of the test. The arrangement and position control of the upper test probe 72 can be very precise, ensuring that each solder joint can be accurately tested. The upper test probe 72 passes through the circuit board pressing plate 6 and is used in conjunction with the circuit board, which can help achieve uniform pressure distribution during the test process and avoid damage to the circuit board due to excessive local pressure.

[0036] Embodiment 5, based on embodiment 4, combined with Figure 5 To explain:

[0037] The circuit board pressing plate 6 is provided with a through hole for accommodating the upper test probe 72 to pass through.

[0038] The circuit board pressing plate 6 is provided with a clearance hole for avoiding the limit block 53. Through the clearance hole, the circuit board pressing plate 6 can be prevented from interfering with the limit block 53, thereby extending its service life.

[0039] Embodiment 6, based on embodiment 5, combined with Figure 7 To explain:

[0040] The drive plate assembly 8 includes: a drive plate 81 and a connecting column 82, wherein the upper side of the drive plate 81 is connected to the base drive top box 2 through the drive shaft 9, and the lower side of the drive plate 81 is fixedly connected to the upper mounting plate 71 through the connecting column 82. The upper side of the drive plate 81 is connected to the base drive top box 2 through the drive shaft 9, which can ensure that the drive plate 81 remains stable during operation and reduce failures caused by vibration or movement. The lower side of the drive plate 81 is fixedly connected to the upper mounting plate 71 through the connecting column 82, so that the drive plate 81 can be flexibly installed in different positions to adapt to different working environments and requirements. If the drive plate 81 needs to be maintained or replaced, due to the design of the connecting column 82, it can be quickly disassembled and reinstalled, which improves the convenience of maintenance.

[0041] Working principle of the utility model: When the utility model is in use, the circuit board is placed on the circuit board fixing base plate 51, the position of the circuit board is fixed by the limit block 53, and then the machine base is started to drive the top box 2 to drive the driving shaft 9 to move downward, and the circuit board pressing plate 6 and the upper probe mounting assembly 7 are driven downward by the driving plate assembly 8 until the upper test probe 72 contacts the probe on the upper surface of the circuit board, and then the test host 3 is started to test the solder joints of the circuit board. The utility model can simultaneously test the double-sided solder joints of the circuit board by setting the lower probe mounting assembly 4 and the upper probe mounting assembly 7, in cooperation with the circuit board fixing base plate assembly 5 and the circuit board pressing plate 6, thereby improving work efficiency, and the degree of automation is improved by setting the driving plate assembly 8 and the driving shaft 9, which is easy to operate.

[0042] For those skilled in the art, the present invention is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, so it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0043] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any minor modifications, equivalent substitutions and improvements made to the above embodiments based on the technical essence of the present invention should be included in the protection scope of the technical solution of the present invention.

Claims

1. A circuit board solder joint testing device, characterized in that: include: A machine base control base plate (1), a machine base drive top box (2), a test host (3), a lower probe mounting assembly (4), a circuit board fixed base plate assembly (5), a circuit board pressing plate (6), an upper probe mounting assembly (7), a driving plate assembly (8) and a driving shaft (9); the machine base control base plate (1) and the machine base drive top box (2) are fixedly connected; the test host (3) is arranged on the machine base control base plate (1); the lower probe mounting assembly (4) is fixedly mounted on the test host (3); the circuit board fixed base plate assembly (5) is arranged on the lower probe mounting assembly (4); the circuit board pressing plate (6) is arranged above the circuit board fixed base plate assembly (5); the upper side of the circuit board pressing plate (6) is fixedly connected to the upper probe mounting assembly (7); the driving plate assembly (8) is arranged on the upper side of the upper probe mounting assembly (7); and the driving plate assembly (8) is fixedly connected to the machine base drive top box (2) via the driving shaft (9).

2. A circuit board solder joint testing device according to claim 1, characterized in that: The lower probe mounting assembly (4) comprises: a lower mounting base plate (41) and lower test probes (42); the lower test probes (42) are provided in multiple groups; the multiple groups of lower test probes (42) are arranged on the lower mounting base plate (41); the lower test probes (42) are arranged in positions according to the positions of the solder joints on the lower surface of the circuit board to be tested; the lower test probes (42) pass through the circuit board fixing base plate assembly (5) and cooperate with the circuit board for use.

3. A circuit board solder joint testing device according to claim 2, characterized in that: The circuit board fixing base plate assembly (5) comprises: a circuit board fixing base plate (51), a support column (52) and a limit block (53); the circuit board fixing base plate (51) is fixedly mounted on the upper side of the lower probe mounting assembly (4) via the support column (52); a plurality of limit blocks (53) are provided; the plurality of limit blocks (53) are fixedly mounted on the upper side of the circuit board fixing base plate (51); the plurality of limit blocks (53) are used to limit the circuit board; a through hole for accommodating the lower test probe (42) to pass through is provided on the circuit board fixing base plate (51); the circuit board fixing base plate (51) is used in conjunction with a circuit board pressing plate (6).

4. A circuit board solder joint testing device according to claim 1, characterized in that: The upper probe mounting assembly (7) comprises: an upper mounting plate (71) and upper test probes (72); the upper test probes (72) are provided in multiple groups; the multiple groups of upper test probes (72) are arranged on the upper mounting plate (71); the upper test probes (72) are arranged in positions according to the positions of the solder joints on the upper surface of the circuit board to be tested; the upper test probes (72) pass through the circuit board pressing plate (6) and cooperate with the circuit board for use; and the upper side of the upper mounting plate (71) is fixedly connected to the driving board assembly (8).

5. A circuit board solder joint testing device according to claim 4, characterized in that: The circuit board pressing plate (6) is provided with a through hole for accommodating the upper test probe (72) to pass through.

6. A circuit board solder joint testing device according to claim 4, characterized in that: The circuit board pressing plate (6) is provided with a clearance hole for avoiding the limit block (53).

7. A circuit board solder joint testing device according to claim 4, characterized in that: The drive plate assembly (8) comprises: a drive plate (81) and a connecting column (82); the upper side of the drive plate (81) is connected to the machine base drive top box (2) via a drive shaft (9); and the lower side of the drive plate (81) is fixedly connected to the upper mounting plate (71) via the connecting column (82).

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