Silicon wafer bearing device for ensuring connection strength
By designing the support structure of the bearing frame and the bearing disk in the silicon wafer bearing device, including horizontal and longitudinal support rods and segmented thick plates, the problem of insufficient connection strength in the prior art is solved, and the temperature uniformity during the coating process is achieved and the stability of silicon wafers avoids the phenomenon of yellow powder.
Patent Information
- Application Number
- CN202322612566.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-26
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2033-09-26
AI Technical Summary
The existing silicon wafer bearing device is insufficient in connection strength during positioning and installation, and is prone to damage when the screw is locked, resulting in uneven coating temperature and yellow powder problem of silicon wafers.
A silicon wafer bearing device including a bearing frame and a bearing disk is designed. A storage groove is provided on the bearing disk. The silicon wafer is placed in the groove by a robot. The bearing frame is equipped with horizontal and longitudinal support rods, and the outer plane of the storage groove and the bearing frame are stored. The plane is the same level, and the thick plate and screw fixing positions are set in sections to ensure the connection strength.
The connection strength between the bearing disk and the bearing frame is improved, the screw locking damages the bearing disk is avoided, and the yellow powder is prevented after coating is coated, ensuring the reliability and convenience of processing.
Smart Images
Figure CN222260985U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of silicon wafer equipment and relates to a silicon wafer bearing device for ensuring connection strength. Background Art
[0002] Silicon wafers need to go through multiple processes to become solar cells, one of which is plasma enhanced chemical vapor deposition (PECVD), which aims to reduce light reflection loss and enhance the intensity of absorbed light, thereby improving battery efficiency. This process requires a silicon wafer carrier to load the silicon wafer and drive the silicon wafer to move between various processing stations to achieve silicon wafer coating or other processing.
[0003] Currently, the connection strength of the carrier plate when it is positioned and installed on the carrier frame is relatively poor, and the carrier plate will be damaged when the screws are used for tightening, resulting in uneven temperature coating, and yellow powder will appear on the silicon wafer after the coating is completed. Utility Model Content
[0004] In view of the above problems existing in the prior art, the present application provides a silicon wafer supporting device for ensuring connection strength.
[0005] The technical solution of the utility model is as follows:
[0006] A silicon wafer carrying device for ensuring connection strength comprises a carrying frame and a carrying plate. The carrying plate is provided with one or more storage slots. When loading, the silicon wafers to be processed are placed in the storage slots by a robot. When processing, the silicon wafers are transferred between various processing stations by the movement of the carrying frame. The carrying frame is provided with transverse support rods and longitudinal support rods. The carrying plate is positioned and installed on the carrying frame. The outer plane of the storage slots is on the same horizontal plane as the outer plane of the carrying frame. The outer plane of the storage slots is provided with thick plates in sections.
[0007] As a preferred implementation manner of the utility model: the thick plate includes a left raised plate, a lower raised plate, a right raised plate, and an upper raised plate.
[0008] As a preferred implementation manner of the utility model: the left raised plate and the right raised plate are symmetrically arranged, and the lower raised plate and the upper raised plate are symmetrically arranged.
[0009] As a preferred implementation manner of the utility model: connecting rods are arranged between adjacent transverse support rods.
[0010] As a preferred implementation mode of the present invention: the number of the transverse support rods is set to be multiple, the bearing frame is a quadrilateral structure, and the anti-collision strips are distributed at the four vertices of the bearing frame.
[0011] As a preferred implementation manner of the utility model: the left raised plate, the lower raised plate, the right raised plate and the upper raised plate are equipped with screws for fixing the positions.
[0012] The beneficial effects of the utility model are:
[0013] The utility model discloses a silicon wafer carrying device for ensuring connection strength, wherein a carrying plate is positioned and installed on a carrying frame, an outer plane of a storage groove and an outer plane of the carrying frame are on the same horizontal plane, the outer plane of the storage groove is segmentedly provided with thick plates, a left raised plate and a right raised plate are symmetrically arranged, and a lower raised plate and an upper raised plate are symmetrically arranged, thereby ensuring the connection strength between the carrying plate and the carrying frame, the left raised plate, the lower raised plate, the right raised plate and the upper raised plate are respectively equipped with screws for fixing the position, the screws will not cause damage to the carrying plate when being tightened, and yellow powder can be avoided after coating, which is convenient and reliable. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a front view of a silicon wafer supporting device for ensuring connection strength according to the utility model;
[0015] Figure 2 It is a rear view of the utility model;
[0016] Figure 3 It is a three-dimensional diagram of the utility model;
[0017] Figure 4 This is the enlarged view of point A;
[0018] Figure 5 This is an enlarged view of point B.
[0019] In the figure: 1-carrying frame; 2-carrying plate; 3-storage slot; 4-left raised plate; 5-lower raised plate; 6-right raised plate; 7-upper raised plate; 8-transverse support rod; 9-connecting rod; 10-longitudinal support rod; 11-anti-collision strip. DETAILED DESCRIPTION
[0020] The present invention is described in detail below in conjunction with the accompanying drawings and embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0021] like Figure 1-5As shown, a silicon wafer carrying device for ensuring connection strength includes a carrying frame 1 and a carrying plate 2. The carrying plate 2 is provided with one or more storage slots 3. When loading, the silicon wafers to be processed are placed in the storage slots 3 by a robot. When processing, the silicon wafers are transferred between various processing stations by the movement of the carrying frame 1. The carrying frame 1 is provided with a transverse support rod 8 and a longitudinal support rod 10. The carrying plate 2 is positioned and installed on the carrying frame 1. The outer plane of the storage slots 3 is on the same horizontal plane as the outer plane of the carrying frame 1. The outer plane of the storage slots 3 is segmented with thick plates.
[0022] The thick plate includes a left raised plate 4, a lower raised plate 5, a right raised plate 6, and an upper raised plate 7; the left raised plate 4 and the right raised plate 6 are symmetrically arranged, and the lower raised plate 5 and the upper raised plate 7 are symmetrically arranged; a connecting rod 9 is arranged between adjacent transverse support rods 8; the number of transverse support rods 8 is set to multiple, the bearing frame 1 is a quadrilateral structure, and the anti-collision strips 11 are distributed at the four vertices of the bearing frame 1. The anti-collision strips 11 have a buffering and vibration reduction effect to prevent the guide bar from colliding with the guide wheel to produce powder and avoid pollution; the left raised plate 4, the lower raised plate 5, the right raised plate 6, and the upper raised plate 7 are equipped with screws for fixing the position. The force performance when the screws are tightened is good and the operation is convenient.
[0023] In summary, the utility model is a silicon wafer carrying device for ensuring connection strength, the carrying plate is positioned and installed on the carrying frame, the outer plane of the storage groove and the outer plane of the carrying frame are on the same horizontal plane, the outer plane of the storage groove is segmented with thick plates, the thick plates can ensure the connection strength between the carrying plate and the carrying frame, the thick plates include a left raised plate, a lower raised plate, a right raised plate, and an upper raised plate and are respectively equipped with screws for fixing the position, the screws will not cause damage to the carrying plate when tightened, and yellow powder can be avoided after coating.
[0024] Although the implementation scheme of the utility model has been disclosed as above, it is not limited to the applications listed in the specification and implementation modes, and it can be fully applicable to various fields suitable for the utility model. For those familiar with the art, for ordinary technicians in the art, these embodiments can be changed, modified, replaced and modified without departing from the principle and spirit of the utility model. Therefore, without departing from the general concept defined by the claims and the equivalent scope, the utility model is not limited to specific details.
Claims
1. A silicon wafer support device for ensuring connection strength, characterized in that: It comprises a carrying frame (1) and a carrying plate (2), wherein the carrying plate (2) is provided with one or more storage slots (3), and when loading, a silicon wafer to be processed is placed in the storage slot (3) by a robot, and when processing, the silicon wafer is moved between various processing stations by the movement of the carrying frame (1), the carrying frame (1) is provided with a transverse support rod (8) and a longitudinal support rod (10), the carrying plate (2) is positioned and mounted on the carrying frame (1), the outer plane of the storage slot (3) is on the same horizontal plane as the outer plane of the carrying frame (1), and the outer plane of the storage slot (3) is provided with thick plates in sections; The thick plate comprises a left raised plate (4), a lower raised plate (5), a right raised plate (6), and an upper raised plate (7); The left raised plate (4) and the right raised plate (6) are symmetrically arranged, and the lower raised plate (5) and the upper raised plate (7) are symmetrically arranged; The left raised plate (4), the lower raised plate (5), the right raised plate (6) and the upper raised plate (7) are equipped with screws for fixing the positions.
2. The silicon wafer supporting device for ensuring connection strength according to claim 1, characterized in that: Connecting rods (9) are provided between adjacent transverse support rods (8).
3. The silicon wafer supporting device for ensuring connection strength according to claim 1, characterized in that: The number of the transverse support rods (8) is set to be multiple, the bearing frame (1) is a quadrilateral structure, and the anti-collision strips (11) are distributed at the four vertices of the bearing frame (1).