Four-head vertical silicon wafer degumming, inserting and cleaning all-in-one machine

Abstract

The utility model discloses a four-head vertical silicon wafer degumming, inserting and cleaning all-in-one machine. Comprising a degumming mechanism, a four-head vertical sheet inserting machine, a cleaning mechanism, a feeding conveying line, a drying mechanism, an output conveying belt, a backflow conveying line, a transfer conveying line, a first mechanical arm mechanism, a second mechanical arm mechanism, a third mechanical arm mechanism, a fourth mechanical arm mechanism, a fifth mechanical arm mechanism, a six-axis robot and a cleaning water recycling mechanism. The all-in-one machine provided by the utility model greatly improves the production efficiency of silicon wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production, in particular to a four-head vertical silicon wafer degumming, inserting and cleaning integrated machine. Background Art

[0002] In the production process of single crystal silicon wafers, the raw materials are glued to the material holder and sliced ​​by cutting equipment to form a single silicon wafer. With the continuous improvement of single crystal silicon wafer production technology, the production capacity of single crystal silicon wafers has been greatly improved.

[0003] The sliced ​​silicon wafers and the material holder are loaded into the material frame together, and then the degumming process is carried out to separate the silicon wafers from the material holder. Then the silicon wafers in the material frame are taken out one by one and loaded into the material basket to complete the insertion operation. After that, the silicon wafers in the material basket are cleaned and dried. As the production capacity of silicon wafers has increased, the efficiency of existing insertion cleaning equipment can no longer meet the production needs. For this reason, a four-head vertical silicon wafer degumming and insertion cleaning all-in-one machine is designed, which can effectively improve production efficiency to meet the needs of production capacity. Utility Model Content

[0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desired to provide a four-head vertical silicon wafer degumming and wafer cleaning all-in-one machine, which greatly improves the production efficiency of silicon wafers.

[0005] The utility model provides a four-head vertical silicon wafer degumming and wafer cleaning integrated machine, comprising:

[0006] The debonding mechanism is used to separate the silicon wafer contained in the material frame from the material seat;

[0007] A four-head vertical wafer inserting machine, arranged at the output end of the debonding mechanism, is used to separate the silicon wafers on four parallel working lines and insert them into the material basket;

[0008] A cleaning mechanism is arranged at the output end of the four-head vertical inserting machine, and the cleaning mechanism includes a plurality of cleaning tanks arranged side by side in a direction away from the four-head vertical inserting machine;

[0009] A feeding conveyor line is arranged on one side between the four-head vertical inserting machine and the cleaning mechanism; a turning mechanism is arranged at the starting end of the feeding conveyor line, which is used to turn the vertical material basket to a horizontal position and place it on the feeding conveyor line;

[0010] A drying mechanism, arranged at the output end of the cleaning mechanism, the drying mechanism comprising a plurality of drying boxes arranged side by side in a direction away from the cleaning mechanism;

[0011] An output conveyor belt, arranged at the output end of the drying mechanism;

[0012] A reflux conveyor line is arranged from one side of the output end of the output conveyor belt to one side of the output end of the four-head vertical inserting machine;

[0013] A transfer conveyor line, the output end of which extends to the end between the two working lines on one side of the four-head vertical inserting machine and the two working lines on the other side, and the end of the transfer conveyor line is provided with the flipping mechanism for flipping the horizontal basket to a vertical position;

[0014] A first manipulator mechanism is disposed above the debonding mechanism to the input end of the four-head vertical wafer inserting machine, and is used to transport the material frame containing the silicon wafers;

[0015] A second manipulator mechanism is disposed above the output end of the four-head vertical tablet inserting machine, and is used to transport the full basket output by the four-head vertical tablet inserting machine to the loading conveyor line, and to transport the empty basket output by the transfer conveyor line to the output end of the four-head vertical tablet inserting machine;

[0016] A third manipulator mechanism is disposed between the upper portion of the output end of the feeding conveyor line and the upper portion of the input end of the cleaning mechanism;

[0017] A fourth manipulator mechanism is disposed above the cleaning mechanism, the drying mechanism and the output conveyor belt;

[0018] A fifth manipulator mechanism is disposed above the end of the return conveyor line and the starting end of the transfer conveyor line;

[0019] A six-axis robot, arranged at the starting end of the return conveyor line, for placing the empty basket on the return conveyor line;

[0020] The cleaning water recycling mechanism is connected to the cleaning mechanism and is used to reuse the cleaning water of the subsequent sequence into the previous sequence.

[0021] Furthermore, the four-head vertical tablet inserting machine includes a tablet conveying line, a lifting mechanism and a material basket;

[0022] There are four parallel slice conveyor lines, and the slice conveyor lines are used to slice and output a silicon wafer contained in a material frame;

[0023] The lifting mechanism is provided with four groups, which are arranged one by one at the output end of the slice conveying line to drive the material basket to rise and fall;

[0024] The top of the material basket is open to form a feed inlet, and both sides of the material basket are symmetrically and evenly distributed with insert slots.

[0025] Further, the cleaning tank includes a feeding immersion tank, an ultrasonic cleaning tank, an ultrasonic alkaline cleaning tank, a first ultrasonic rinsing tank, an ultrasonic hydrogen peroxide tank, a second ultrasonic rinsing tank and a slow pull-off tank which are sequentially arranged in a direction away from the four-head vertical inserting machine;

[0026] The ultrasonic alkaline cleaning tank and the second ultrasonic rinsing tank are respectively arranged in multiple groups side by side; the ultrasonic cleaning tank, the ultrasonic alkaline cleaning tank, the first ultrasonic rinsing tank, the ultrasonic hydrogen peroxide tank, the second ultrasonic rinsing tank and the slow pull-off tank are all provided with electric heating tubes;

[0027] A dehydration bracket is arranged in the slow-pull dehydration tank, and a deceleration driving mechanism for driving the dehydration bracket to rise and fall is symmetrically arranged at both ends of the slow-pull dehydration tank.

[0028] Furthermore, the flipping mechanism includes brackets symmetrically arranged on both sides of the starting end of the feeding conveyor line or on both sides of the end of the transfer conveyor line, an axle rod is arranged between the two brackets, one end of the axle rod is arranged with a reduction motor driving it to rotate, a transmission seat is fixedly connected to the axle rod, a first support plate is fixedly arranged on the top of the transmission seat, and a second support plate is vertically fixedly arranged on the top surface of the first support plate on one side close to the end of the feeding conveyor line or on the side close to the starting end of the transfer conveyor line.

[0029] Furthermore, the first manipulator mechanism includes two first X-axes arranged in parallel, a first Y-axis is transmission-connected between the two first X-axes, a first Z-axis is transmission-connected on the first Y-axis, a first mounting plate is fixedly connected to the bottom end of the first Z-axis, and first hooks are respectively arranged at the four corners of the bottom surface of the first mounting plate.

[0030] Furthermore, the second manipulator mechanism includes two second X-axes arranged in parallel, two second Y-axes are transmission-connected between the two second X-axes, each of the second Y-axes is transmission-connected to a second Z-axis, the bottom end of the second Z-axis is fixedly connected to a second mounting plate, and pneumatic clamps are symmetrically fixedly installed on both sides of the bottom surface of the second mounting plate.

[0031] Furthermore, the third manipulator mechanism includes a third Y-axis fixedly arranged above the feeding conveyor line and the cleaning mechanism, the third Y-axis is transmission-connected to the third Z-axis, one side of the third Z-axis is transmission-connected to the third mounting plate, a first crossbeam is fixedly arranged on the third mounting plate, first cylinders are symmetrically arranged at both ends of the bottom of the first crossbeam, a first lifting plate is fixedly connected to the telescopic end of the first cylinder, and second hooks are symmetrically arranged on both sides of the bottom end of the first lifting plate.

[0032] Further, the fourth manipulator mechanism is provided with three groups, the first group of the fourth manipulator mechanism is provided above the feeding immersion tank to the first ultrasonic rinsing tank, the second group of the fourth manipulator mechanism is provided above the first ultrasonic rinsing tank to the slow pull-off water tank, and the third group of the fourth manipulator mechanism is provided above the slow pull-off water tank to the output conveyor belt;

[0033] The fourth manipulator mechanism includes two fourth X-axes arranged in parallel, a fourth Y-axis is transmission-connected between the two fourth X-axes, a fourth Z-axis is transmission-connected on the fourth Y-axis, a fourth mounting plate is fixedly connected to the bottom end of the fourth Z-axis, a plurality of second cylinders are symmetrically arranged on both sides of the bottom surface of the fourth mounting plate, the telescopic ends of the second cylinders are fixedly connected to the second lifting plates, and third hooks are symmetrically arranged on both sides of the bottom end of the second lifting plate.

[0034] Furthermore, the fifth manipulator mechanism includes a fifth Y-axis fixedly arranged above the end of the reflux conveyor line and the starting end of the transfer conveyor line, the fifth Y-axis is transmission-connected with a fifth Z-axis, one side of the fifth Z-axis is transmission-connected with a fifth mounting plate, a second cross beam is fixedly arranged on the fifth mounting plate, third cylinders are symmetrically arranged at both ends of the bottom of the second cross beam, a third lifting plate is fixedly connected to the telescopic end of the third cylinder, and fourth hooks are symmetrically arranged on both sides of the bottom end of the third lifting plate.

[0035] Further, the cleaning water recycling mechanism includes a first water storage tank, a first circulation pump, a plate heat exchanger, a second water storage tank and a first circulation pump;

[0036] The heights of the slow pull-off water tank and the plurality of second ultrasonic rinsing tanks are gradually reduced in the direction close to the four-head vertical inserting machine to form an overflow structure, and the water in the second ultrasonic rinsing tank at the lowest position overflows to the first water storage tank, and the first water storage tank is connected to the plate heat exchanger via a first circulation pump, and the output end of the plate heat exchanger is respectively connected to the first ultrasonic rinsing tank and the four-head vertical inserting machine;

[0037] The water in the first ultrasonic rinsing tank overflows to the second water storage tank, and the second water storage tank is connected to the ultrasonic cleaning tank via a second circulation pump. The ultrasonic cleaning tank is arranged at a height higher than the loading immersion tank to form an overflow structure.

[0038] Compared with the prior art, the beneficial effects of the utility model are:

[0039] (1) The integrated machine of the utility model is provided with a four-head vertical wafer inserting machine, a cleaning mechanism and a drying mechanism. The cleaning mechanism is provided with a plurality of cleaning tanks, and the drying mechanism is provided with a plurality of drying boxes. The four-head vertical wafer inserting machine is used to separate the silicon wafers and insert them into the material baskets respectively on four working lines. The subsequent multiple cleaning tanks and multiple drying boxes cooperate with the efficient output of the four-head vertical wafer inserting machine to complete the cleaning and drying operations of the silicon wafers in a timely manner, greatly improving the production efficiency of the silicon wafers and achieving a good cleaning effect.

[0040] (2) The integrated machine of the utility model is provided with an output conveyor belt, a reflux conveyor line, a transfer conveyor line and a six-axis robot. The basket filled with silicon wafers is conveyed to the subsequent sorting equipment via the output conveyor belt. After the silicon wafers are sorted, the six-axis robot transports the empty basket output by the sorting equipment to the reflux conveyor line. After the reflux conveyor line transports the empty basket to the end, the fifth manipulator mechanism transports it to the transfer conveyor line. The transfer conveyor line transports the empty basket to the middle of the four operating lines of the four-head vertical wafer inserting machine for the second manipulator mechanism to grab and place on the four-head vertical wafer inserting machine for wafer inserting operation, thus realizing the automatic recycling of the basket and achieving good operation continuity. The setting of the transfer conveyor line effectively shortens the distance that the second manipulator mechanism transports the empty basket, and can operate synchronously with the second manipulator mechanism, thereby improving production efficiency.

[0041] (3) The integrated machine of the utility model is provided with a cleaning water recycling mechanism, through which the relatively clean water in the later stage of the cleaning process can be reused in the previous stage, thus saving water resources.

[0042] It should be understood that the contents described in the utility model summary are not intended to limit the key or important features of the embodiments of the utility model, nor are they intended to limit the scope of the utility model. Other features of the utility model will become easy to understand through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0044] Figure 1 This is a schematic diagram of the structure of a four-head vertical silicon wafer degumming, inserting and cleaning machine;

[0045] Figure 2 It is a schematic diagram of the distribution structure of the four-head vertical inserting machine, the feeding conveyor line, the transfer conveyor line, the third manipulator mechanism and the fifth manipulator mechanism;

[0046] Figure 3 It is a schematic diagram of the structure of a four-head vertical inserting machine and a transfer conveyor line;

[0047] Figure 4It is a structural diagram of the feeding conveyor line and the third manipulator mechanism;

[0048] Figure 5 It is a structural schematic diagram of the slow pull-off water tank;

[0049] Figure 6 It is a structural diagram of the feeding conveying line and the turning mechanism;

[0050] Figure 7 It is a structural schematic diagram of the drying mechanism;

[0051] Figure 8 is a structural schematic diagram of a first manipulator mechanism;

[0052] Fig. 9 is a structural schematic diagram of the second manipulator mechanism;

[0053] Fig.10 is a structural schematic diagram of the fifth manipulator mechanism;

[0054] Fig.11 This is a schematic diagram of the structure of a six-axis robot.

[0055] Numbers in the figure: 1. Four-head vertical inserting machine; 2. Cleaning mechanism; 3. Feeding conveyor line; 4. Turning mechanism; 5. Drying mechanism; 6. Output conveyor belt; 7. Reflux conveyor line; 8. Transfer conveyor line; 9. First manipulator mechanism; 10. Second manipulator mechanism; 11. Third manipulator mechanism; 12. Fifth manipulator mechanism; 13 Six-axis robot; 14. Material frame;

[0056] 101. Slice conveyor line; 102. Lifting mechanism; 103. Material basket;

[0057] 201, feeding soaking tank; 202, ultrasonic cleaning tank; 203, ultrasonic alkali cleaning tank; 204, first ultrasonic rinsing tank; 205, ultrasonic hydrogen peroxide tank; 206, second ultrasonic rinsing tank; 207, slow pull dehydration tank; 208, dehydration bracket; 209, deceleration drive mechanism;

[0058] 401, bracket; 402, shaft; 403, reduction motor; 404, transmission seat; 405, first support plate; 406, second support plate;

[0059] 501, drying box;

[0060] 901, first X-axis; 902, first Y-axis; 903, first Z-axis; 904, first mounting plate; 905, first hook;

[0061] 1001, second X-axis; 1002, second Y-axis; 1003, second Z-axis; 1004, second mounting plate; 1005, pneumatic gripper;

[0062] 1101, third Y axis; 1102, third Z axis; 1103, third mounting plate; 1104, first crossbeam; 1105, first cylinder; 1106, first lifting plate;

[0063] 1201. fifth Y-axis; 1202. fifth Z-axis; 1203. fifth mounting plate; 1204. second crossbeam; 1205. third cylinder; 1206. third lifting plate. DETAILED DESCRIPTION

[0064] The utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are only used to explain the relevant utility model, rather than to limit the utility model. It is also necessary to explain that, for the convenience of description, only the parts related to the utility model are shown in the accompanying drawings.

[0065] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0066] Please refer to Figures 1 to 11 The embodiment of the utility model provides a four-head vertical silicon wafer degumming and wafer cleaning integrated machine, comprising:

[0067] The debonding mechanism is used to separate the silicon wafer contained in the material frame 14 from the material seat;

[0068] A four-head vertical wafer inserting machine 1 is arranged at the output end of the debonding mechanism and is used to separate the silicon wafers on four parallel working lines and insert them into the material basket 103;

[0069] A cleaning mechanism 2 is arranged at the output end of the four-head vertical inserting machine 1, and the cleaning mechanism 2 includes a plurality of cleaning tanks arranged side by side in a direction away from the four-head vertical inserting machine 1;

[0070] The feeding conveyor line 3 is arranged on one side between the four-head vertical inserting machine 1 and the cleaning mechanism 2; a turning mechanism 4 is arranged at the starting end of the feeding conveyor line 3, which is used to turn the vertical material basket 103 to a horizontal position and place it on the feeding conveyor line 3;

[0071] A drying mechanism 5 is arranged at the output end of the cleaning mechanism 2, and the drying mechanism 5 includes a plurality of drying boxes 501 arranged side by side in a direction away from the cleaning mechanism 2;

[0072] An output conveyor belt 6 is arranged at the output end of the drying mechanism 5;

[0073] The return conveyor line 7 is arranged from one side of the output end of the output conveyor belt 6 to one side of the output end of the four-head vertical inserting machine 1;

[0074] The transfer conveyor line 8 has an output end extending to the end between the two working lines on one side and the two working lines on the other side of the four-head vertical inserting machine 1. The end of the transfer conveyor line 8 is provided with a flipping mechanism 4 for flipping the horizontal material basket 103 to a vertical position;

[0075] The first manipulator mechanism 9 is disposed above the input end of the four-head vertical wafer inserting machine 1 from the debonding mechanism, and is used to transfer the material frame 14 containing the silicon wafers;

[0076] The second manipulator mechanism 10 is arranged above the output end of the four-head vertical tablet inserting machine 1, and is used to transport the full material basket 103 output by the four-head vertical tablet inserting machine 1 to the feeding conveyor line 3, and to transport the empty material basket 103 output by the transfer conveyor line to the output end of the four-head vertical tablet inserting machine 1;

[0077] The third manipulator mechanism 11 is arranged between the upper part of the output end of the feeding conveyor line 3 and the upper part of the input end of the cleaning mechanism 2;

[0078] The fourth manipulator mechanism is arranged above the cleaning mechanism 2, the drying mechanism 5 and the output conveyor belt 6;

[0079] The fifth manipulator mechanism 12 is disposed above the end of the return conveyor line 7 and the starting end of the transfer conveyor line 8;

[0080] The six-axis robot 13 is disposed at the starting end of the return conveyor line 7 and is used to place the empty basket 103 onto the return conveyor line 7;

[0081] The cleaning water recycling mechanism is connected to the cleaning mechanism 2 and is used to reuse the cleaning water of the subsequent sequence into the previous sequence.

[0082] In this embodiment, when silicon wafers are produced, the silicon material is adhered to the bottom of the material holder, and then formed into silicon wafers through wire cutting and placed in the material frame 14. After the silicon wafers are transported to the input end of the degumming mechanism along with the material frame 14 by the robot cart, the first manipulator mechanism 5 moves the material frame to the degumming mechanism for degumming treatment to separate the silicon wafer from the material holder.

[0083] The degumming mechanism comprises a cleaning box and a degumming box; a spray mechanism is arranged in the cleaning box to spray and clean the silicon wafers; a transmission frame is arranged in the degumming box, and a mounting frame is arranged at the bottom of the transmission frame; an electric heating tube is arranged in the degumming box to heat the water in the degumming box to soften the colloid; degumming auxiliary mechanisms are symmetrically arranged on both sides of the degumming box to press down the silicon wafers from both sides so that they are all detached from the material seat; a driving mechanism is arranged on the outside of the degumming box, which is connected to the transmission frame for driving the transmission frame to rise and fall; a silicon wafer folding mechanism is arranged in the mounting frame, and a material frame loaded with single crystal silicon wafers is placed on the silicon wafer folding mechanism, which is used to tilt the material frame after the transmission frame rises, so as to make the degummed single crystal silicon wafers tightly stacked and folded toward one end of the material frame.

[0084] After the silicon wafers contained in the material frame 14 are debonded, the first robot mechanism 9 moves the material frame 14 to the four-head vertical wafer inserting machine 1. The four-head vertical wafer inserting machine 1 slices the silicon wafers on four working lines and inserts them into the material basket 103. Then the first robot mechanism 9 moves the empty material frame 14 away and puts in the material frame 14 containing the debonded silicon wafers, which greatly improves the wafer insertion efficiency.

[0085] The basket 103 filled with silicon wafers output by the four-head vertical wafer inserter 1 is placed by the second manipulator mechanism 10 on the flip mechanism 4 at the starting end of the feeding conveyor line 3. The flip mechanism 4 flips the vertical basket 103 to the horizontal and places it on the feeding conveyor line 3. The feeding conveyor line 3 transfers the basket 103 to one side of the input end of the cleaning mechanism 2. The third manipulator mechanism 11 transports the basket 103 to the cleaning mechanism 2. Then the fourth manipulator mechanism transports the basket 103 between the cleaning mechanism 2, the drying mechanism 5 and the output conveyor belt 6 to complete the cleaning and drying of the silicon wafers. In the cleaning process of the silicon wafers, the cleaning water reuse mechanism reuses the cleaner water in the later sequence of the cleaning process into the previous sequence, saving water resources.

[0086] The basket 103 filled with silicon wafers is transported to the subsequent sorting equipment via the output conveyor belt 6. After the silicon wafers are sorted, the six-axis robot 13 transports the empty basket 103 output by the sorting equipment to the reflux conveyor line 7. The reflux conveyor line 7 transports the empty basket 103 to one side of the four-head vertical inserting machine 1. The fifth manipulator mechanism 12 transports the empty basket 103 to the transfer conveyor line 8. After the empty basket 103 is transmitted to the middle position of the four operating lines of the four-head vertical inserting machine 1, the flipping mechanism 4 flips the horizontal basket 103 upright. At this time, the second manipulator mechanism 10 grabs the empty basket 103 and transports it to the end of the four-head vertical inserting machine 1 for inserting operations, realizing the automatic recycling of the basket 103, and the operation continuity is good. The output of silicon wafer inserting of the all-in-one machine of this application has been greatly improved. The configuration of multiple cleaning tanks and multiple drying boxes meets the production capacity requirements with the cooperation of the fourth manipulator mechanism, which greatly improves the production efficiency of silicon wafers.

[0087] In a preferred embodiment, if Figure 2 and 3 As shown, the four-head vertical inserting machine 1 includes a sheet conveying line 101, a lifting mechanism 102 and a material basket 103;

[0088] Four slice conveying lines 101 are arranged in parallel, and the slice conveying lines 101 are used to slice and output a silicon wafer contained in the material frame 14;

[0089] There are four sets of lifting mechanisms 102, which are arranged one by one at the output end of the slice conveying line 101, and are used to drive the material basket 103 to rise and fall;

[0090] The top of the material basket 103 is open to form a material feed port, and insert slots are symmetrically distributed on both sides of the material basket 103 .

[0091] In this embodiment, the material basket 103 is vertically placed on each lifting mechanism 102, with its feed port facing the output end of the wafer conveyor line 101. A blade of silicon wafers loaded in the material frame 14 is output one by one from the output end through the wafer conveyor line 11 and inserted into the wafer insertion slot of the material basket 103. As the silicon wafers are output, the lifting mechanism 102 drives the material basket 103 to rise until the material basket 103 is filled with silicon wafers.

[0092] The four slicing conveyor lines 101 have four output ends distributed side by side, namely station 1#, station 2#, station 3# and station 4#. By controlling the silicon wafer output interval of the four slicing conveyor lines 101, the time for each station to complete the basket loading is controlled.

[0093] After each workstation completes the silicon wafer basketing, the full baskets of each workstation are placed one by one on the turning mechanism 4 at the starting end of the loading conveyor line 3 through the second manipulator mechanism 10, and the empty baskets on the turning mechanism 4 at the end of the transfer conveyor line 8 are placed on the lifting mechanism 102 to complete the replacement of the material basket 103, thereby realizing the continuous output of full baskets, good operation continuity, and greatly improving the efficiency of wafer insertion.

[0094] In a preferred embodiment, if Figure 1 , 4 As shown in , 5, the cleaning tank includes a feeding soaking tank 201, an ultrasonic cleaning tank 202, an ultrasonic alkaline cleaning tank 203, a first ultrasonic rinsing tank 204, an ultrasonic hydrogen peroxide tank 205, a second ultrasonic rinsing tank 206 and a slow pull-off water tank 207 which are sequentially arranged in a direction away from the four-head vertical inserting machine 1;

[0095] The ultrasonic alkali cleaning tank 203 and the second ultrasonic rinsing tank 206 are respectively arranged in multiple groups side by side; the ultrasonic cleaning tank 202, the ultrasonic alkali cleaning tank 203, the first ultrasonic rinsing tank 204, the ultrasonic hydrogen peroxide tank 205, the second ultrasonic rinsing tank 206 and the slow pull-off tank 207 are all provided with electric heating tubes;

[0096] A dehydration bracket 208 is arranged in the slow-pull dehydration tank 207, and a deceleration driving mechanism (209) for driving the dehydration bracket 208 to rise and fall is symmetrically arranged at both ends of the slow-pull dehydration tank 207.

[0097] In this embodiment, the feeding soaking tank 201 is filled with clean water;

[0098] The ultrasonic cleaning tank 202 is filled with clean water;

[0099] The ultrasonic alkali cleaning tank 203 is filled with clean water and alkali solution;

[0100] The first ultrasonic rinsing tank 204 is filled with clean water;

[0101] The ultrasonic hydrogen peroxide tank 205 is filled with clean water and hydrogen peroxide;

[0102] The second ultrasonic rinsing tank 206 and the slow pull-off tank 207 are both filled with clean water.

[0103] The third manipulator mechanism 11 transports the baskets 103 at the end of the feeding conveyor line 3 one by one into the feeding immersion tank 201, so that a plurality of baskets 103 are placed side by side in the feeding immersion tank 201. Then the fourth manipulator mechanism transports the plurality of baskets 103 placed side by side to the ultrasonic cleaning tank 202 for ultrasonic cleaning. This cleaning step takes a short time, so only one ultrasonic cleaning tank 202 can meet the production needs.

[0104] Then the basket 103 is transported to the ultrasonic alkali cleaning tank 203. This cleaning step takes a long time. In order not to affect the output of the ultrasonic cleaning tank 202, multiple ultrasonic alkali cleaning tanks 203 are arranged side by side. If the first ultrasonic alkali cleaning tank 203 has not completed the operation, the basket 103 output by the ultrasonic cleaning tank 202 is placed in the second one, and the subsequent operations are carried out in this way to avoid stagnation and waiting.

[0105] Then the material basket 103 is transported to the first ultrasonic rinsing tank 204. The time consumption for rinsing the silicon wafers after alkali washing is relatively short. Therefore, only one first ultrasonic rinsing tank 204 is required to meet the production demand.

[0106] Then the basket 103 is transported to the ultrasonic hydrogen peroxide tank 205. This cleaning step takes a short time, so only one ultrasonic hydrogen peroxide tank 205 is required to meet production needs.

[0107] Then the basket 103 is transported to the second ultrasonic rinsing tank 206. It takes a long time to rinse the silicon wafers after hydrogen peroxide cleaning. In order not to affect the output of the ultrasonic hydrogen peroxide tank 205, multiple second ultrasonic rinsing tanks 206 are arranged side by side. If the first second ultrasonic rinsing tank 206 has not completed the operation, the basket 103 output by the ultrasonic hydrogen peroxide tank 205 is placed in the second one, and the subsequent operations are carried out in this way to avoid stagnation and waiting.

[0108] Then the basket 103 is transported to the slow pull dewatering tank 207, and the basket 103 falls on the dewatering bracket 208. The dewatering bracket 208 is driven to rise above the water surface by the deceleration drive mechanism 209 to empty the basket 103. The dewatering bracket 208 is left to stand for a period of time, and the water in the basket 103 falls into the slow pull dewatering tank 207, and the basket 103 can be transported to the drying mechanism 3 for drying to avoid excessive water in the basket 103 affecting the drying efficiency. The cleaning mechanism 2 has a good cleaning effect and high production capacity, which greatly improves the production efficiency of silicon wafers.

[0109] In some embodiments, the deceleration drive mechanism 209 includes a frame, a transmission belt and a deceleration motor. The transmission belt is installed on the frame, and the dehydration bracket 208 is fixedly connected to the transmission belt. The transmission belt is driven to rotate through the gears of the deceleration motor, thereby driving the dehydration bracket 208 to slowly rise or fall.

[0110] In other embodiments, the deceleration drive mechanism 209 includes a telescopic cylinder and a transmission frame, the dehydration bracket 208 is fixedly connected to the rotating frame, and the dehydration bracket 208 is driven by the telescopic cylinder to slowly rise or fall.

[0111] In a preferred embodiment, if Figure 3 , 4 As shown in , 6, the flipping mechanism 4 includes brackets 401 symmetrically arranged on both sides of the starting end of the feeding conveyor line 3 or on both sides of the end of the transfer conveyor line 8, an axle rod 402 is arranged between the two brackets 401, one end of the axle rod 402 is arranged with a reduction motor 403 for driving the rotation thereof, a transmission seat 404 is fixedly connected to the axle rod 402, a first support plate 405 is fixedly arranged on the top of the transmission seat 404, and a second support plate 406 is vertically fixedly arranged on the top surface of the first support plate 405 on one side close to the end of the feeding conveyor line 3 or on one side close to the starting end of the transfer conveyor line 8.

[0112] In this embodiment, after the vertical material basket 103 is placed on the first support plate 405 at the starting end of the loading conveyor line 3, the reduction motor 403 drives the shaft 402 to rotate 90°, and the material basket 103 is flattened and falls to the starting end of the loading conveyor line 3 so that it can be grasped by the subsequent third robot mechanism 11.

[0113] The turning mechanism 4 at the end of the transfer conveyor line 8, the reduction motor 403 drives the shaft 402 to rotate 90° to make the second support plate 406 flat and the first support plate 405 stand up; when the horizontal material basket 103 is transmitted to the end of the transfer conveyor line 8, it is placed on the second support plate 406. At this time, the reduction motor 403 drives the shaft 402 to rotate 90° in the opposite direction to stand up the material basket 103, so that the second manipulator mechanism 10 grabs the empty material basket 103 and places it on the lifting mechanism 102 for insertion operation.

[0114] The provision of the turnover mechanism 4 allows the material basket 103 to flow more smoothly between various processes, thus ensuring the normal operation of the equipment.

[0115] In a preferred embodiment, if Figure 1 and Figure 8As shown, the first manipulator mechanism 9 includes two parallel first X-axes 901, a first Y-axis 902 is transmission-connected between the two first X-axes 901, a first Z-axis 903 is transmission-connected on the first Y-axis 902, a first mounting plate 904 is fixedly connected to the bottom end of the first Z-axis 903, and first hooks 905 are respectively provided at the four corners of the bottom surface of the first mounting plate 904.

[0116] In this embodiment, the first Z axis 903 is lowered so that the first hook 905 is located on one side of the hanging points at both ends of the material frame 14, and then the first Y axis 902 drives the second Z axis 903 to translate so that each first hook 905 is hung on the corresponding hanging point. At this time, the first Z axis 903 rises to lift the material frame 14, and then the first Y axis 902 moves along the first X axis 901 to the feed end of the four-head vertical inserter 1, and the material frame 14 is put down to complete the automatic loading of the silicon wafer. After the silicon wafer is output in slices, the second manipulator mechanism 10 then moves the empty material frame 14 away, realizing automatic loading and ensuring production efficiency.

[0117] In a preferred embodiment, if Figure 1 and Figure 8 As shown, the second manipulator mechanism 10 includes two parallel second X-axes 1001, two parallel second Y-axes 1002 are transmission-connected between the two second X-axes 1001, the second Y-axes 1002 are transmission-connected to the second Z-axes 1003, the bottom end of the second Z-axis 1003 is fixedly connected to a second mounting plate 1004, and pneumatic clamps 1005 are symmetrically fixedly installed on both sides of the bottom surface of the second mounting plate 1004.

[0118] In this embodiment, the second manipulator mechanism 10 is configured with two groups of second Z axes 1003, one group is used to grab and carry empty material baskets 103, and the other group is used to grab and carry full material baskets 103. When the material basket 103 at the output end of the four-head vertical inserting machine 1 is full, the two groups of pneumatic clamps 1005 cooperate to achieve rapid replacement of the material basket 103, thereby improving production efficiency.

[0119] In a preferred embodiment, if Figure 2 and Figure 4 As shown, the third manipulator mechanism 11 includes a third Y-axis 1101 fixedly arranged above the feeding conveyor line 3 and the cleaning mechanism 2, the third Y-axis 1101 is transmission-connected to the third Z-axis 1102, one side of the third Z-axis 1102 is transmission-connected to the third mounting plate 1103, the third mounting plate 1103 is fixedly provided with a first beam 1104, the two ends of the bottom of the first beam 1104 are symmetrically provided with first cylinders 1105, the telescopic end of the first cylinder 1105 is fixedly connected to the first lifting plate 1106, and second hooks are symmetrically provided on both sides of the bottom end of the first lifting plate 1106.

[0120] In this embodiment, after the horizontal material basket 103 is transferred to one side of the material immersion tank 201 by the material feeding conveyor line 3, the third Z axis 1102 drives the third mounting plate 1103 to descend, so that the first lifting plate 1106 is placed at both ends of the material basket 103; then the first cylinder 1105 contracts to place the second hook below the hanging points at both ends of the material basket 103, at this time, the third Z axis 1102 drives the third mounting plate 1103 to rise so that the second hook hooks the corresponding hanging points to lift the material basket 103; then the third Y axis 1101 drives the third Z axis 1102 to translate to the top of the material immersion tank 201, and the material basket 103 is placed in the material immersion tank 201. The third manipulator mechanism 11 repeats the above actions to transport the material baskets 103 to the material immersion tank 201 one by one, until the material immersion tank 201 is full of material baskets 103 side by side, so that the silicon wafers in multiple material baskets 103 are cleaned together, ensuring the production efficiency of silicon wafers.

[0121] In a preferred embodiment, three groups of fourth manipulator mechanisms are provided, the first group of fourth manipulator mechanisms is provided above the feeding immersion tank 201 to the first ultrasonic rinsing tank 204, the second group of fourth manipulator mechanisms is provided above the first ultrasonic rinsing tank 204 to the slow pull-off water tank 207, and the third group of fourth manipulator mechanisms is provided above the slow pull-off water tank 207 to the output conveyor belt 6;

[0122] The fourth manipulator mechanism includes two fourth X-axes arranged in parallel, a fourth Y-axis is transmission-connected between the two fourth X-axes, a fourth Z-axis is transmission-connected on the fourth Y-axis, a fourth mounting plate is fixedly connected to the bottom end of the fourth Z-axis, a plurality of second cylinders are symmetrically arranged on both sides of the bottom surface of the fourth mounting plate, the telescopic ends of the second cylinders are fixedly connected to the second lifting plates, and third hooks are symmetrically arranged on both sides of the bottom end of the second lifting plates.

[0123] In this embodiment, the first group of fourth manipulator mechanisms are used to transport multiple baskets 103 placed side by side, and transport them from the loading immersion tank 201 to the first ultrasonic rinsing tank 204; the second group of fourth manipulator mechanisms are used to transport the baskets 103 from the first ultrasonic rinsing tank 204 to the slow pull-off water tank 207; and the third group of fourth manipulator mechanisms are used to transport the baskets 103 from the slow pull-off water tank 207 to the output conveyor belt 6. The segmented transport of the baskets 103 is achieved, and the stagnation and waiting of the baskets 103 during the cleaning and drying of the silicon wafers is avoided, thereby improving the production efficiency of the silicon wafers.

[0124] Synchronous transportation of multiple side-by-side material baskets 103 is achieved through multiple groups of symmetrically arranged second cylinders and second lifting plates, thereby improving the transportation efficiency of the material baskets 103 between the cleaning mechanism 2, the drying mechanism 5 and the output conveyor belt 6.

[0125] In a preferred embodiment, if Figure 2 and Fig.10 As shown, the fifth manipulator mechanism 12 includes a fifth Y-axis 1201 fixedly arranged above the end of the reflux conveyor line 7 and the starting end of the transfer conveyor line, the fifth Y-axis 1201 is transmission-connected with the fifth Z-axis 1202, one side of the fifth Z-axis 1202 is transmission-connected with the fifth mounting plate 1203, the fifth mounting plate 1203 is fixedly provided with a second beam 1204, the two ends of the bottom of the second beam 1204 are symmetrically provided with third cylinders 1205, the telescopic end of the third cylinder 1205 is fixedly connected with a third lifting plate 1206, and fourth hooks are symmetrically provided on both sides of the bottom end of the third lifting plate 1206.

[0126] In this embodiment, the fifth manipulator mechanism 12 adopts the same structure as the third manipulator mechanism 11, and transports the material basket 103 from the end of the reflux conveyor line 7 to the starting end of the transfer conveyor line 8, and transmits the material basket 103 to the optimal return basket position through the transport conveyor line 8, thereby improving production efficiency.

[0127] In a preferred embodiment, if Figure 1 As shown, the cleaning water recycling mechanism includes a first water storage tank, a first circulation pump, a plate heat exchanger, a second water storage tank and a first circulation pump;

[0128] The heights of the slow pull-off water tank 207 and the plurality of second ultrasonic rinsing tanks 206 are gradually reduced in the direction close to the four-head vertical inserting machine 1 to form an overflow structure. The water in the lowest second ultrasonic rinsing tank 206 overflows to the first water storage tank. The first water storage tank is connected to the plate heat exchanger via the first circulation pump. The output end of the plate heat exchanger is respectively connected to the first ultrasonic rinsing tank 204 and the four-head vertical inserting machine 1.

[0129] The water in the first ultrasonic rinsing tank 204 overflows to the second water storage tank, and the second water storage tank is connected to the ultrasonic cleaning tank 202 via a second circulation pump. The ultrasonic cleaning tank 202 is arranged at a height higher than the loading immersion tank 201 to form an overflow structure.

[0130] In this embodiment, the water in the cleaning tank containing pure water can be reused, and the water in the cleaning tank containing a mixture of water and cleaning agent (alkali solution, hydrogen peroxide) cannot be reused. The water at the end of the cleaning process is cleaner, and the water at the beginning is more turbid. Therefore, the water at the end can be reused in the beginning, which ensures the cleaning effect while saving water resources.

[0131] The cold water entering the cleaning mechanism 2 can be preliminarily heated by the plate heat exchanger, so as to save more time for heating the electric heating tube in the cleaning tank and will not affect the cleaning operation of the silicon wafer.

[0132] In the description of this specification, the terms "connection", "installation", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0133] In the description of this specification, the description of the terms "one embodiment", "some embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0134] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A four-head vertical silicon wafer degumming and wafer cleaning integrated machine, characterized in that: include: A debonding mechanism, used for separating the silicon wafer contained in the material frame (14) from the material seat; A four-head vertical wafer inserting machine (1), arranged at the output end of the debonding mechanism, for respectively separating the silicon wafers on four parallel working lines and inserting them into a material basket (103); A cleaning mechanism (2) is arranged at the output end of the four-head vertical inserting machine (1), and the cleaning mechanism (2) comprises a plurality of cleaning tanks arranged side by side in a direction away from the four-head vertical inserting machine (1); A feeding conveyor line (3) is arranged on one side between the four-head vertical inserting machine (1) and the cleaning mechanism (2); a turning mechanism (4) is arranged at the starting end of the feeding conveyor line (3) for turning the vertical material basket (103) to a horizontal position and placing it on the feeding conveyor line (3); A drying mechanism (5) is arranged at the output end of the cleaning mechanism (2), and the drying mechanism (5) comprises a plurality of drying boxes (501) arranged side by side in a direction away from the cleaning mechanism (2); An output conveyor belt (6) is arranged at the output end of the drying mechanism (5); A reflux conveyor line (7) is arranged from one side of the output end of the output conveyor belt (6) to one side of the output end of the four-head vertical inserting machine (1); A transfer conveyor line (8), the output end of which extends to the end between the two working lines on one side and the two working lines on the other side of the four-head vertical inserting machine (1), and the end of the transfer conveyor line (8) is provided with the flipping mechanism (4) for flipping the horizontal material basket (103) to a vertical position; A first manipulator mechanism (9) is arranged above the debonding mechanism to the input end of the four-head vertical wafer inserting machine (1) and is used for transporting a material frame (14) containing silicon wafers; A second manipulator mechanism (10) is disposed above the output end of the four-head vertical tablet inserting machine (1), and is used to transport the full material basket (103) output by the four-head vertical tablet inserting machine (1) to the loading conveyor line (3), and to transport the empty material basket (103) output by the transfer conveyor line to the output end of the four-head vertical tablet inserting machine (1); A third manipulator mechanism (11) is arranged between the upper part of the output end of the feeding conveyor line (3) and the upper part of the input end of the cleaning mechanism (2); a fourth manipulator mechanism, arranged above the cleaning mechanism (2), the drying mechanism (5) and the output conveyor belt (6); A fifth manipulator mechanism (12) is disposed above the end of the return conveyor line (7) and the starting end of the transfer conveyor line (8); A six-axis robot (13) is arranged at the starting end of the return conveyor line (7) and is used to place the empty basket (103) on the return conveyor line (7); The cleaning water recycling mechanism is connected to the cleaning mechanism (2) and is used to reuse the cleaning water of the subsequent sequence into the previous sequence.

2. The four-head vertical silicon wafer degumming and wafer cleaning integrated machine according to claim 1 is characterized in that: The four-head vertical slice inserting machine (1) comprises a slice conveying line (101), a lifting mechanism (102) and a material basket (103); Four slicing conveying lines (101) are arranged in parallel, and the slicing conveying lines (101) are used to slicing and output a silicon wafer contained in a material frame (14); The lifting mechanism (102) is provided with four groups, which are arranged one by one at the output end of the slice conveying line (101) and are used to drive the material basket (103) to rise and fall; The top of the material basket (103) is open to form a material feed port, and insert slots are symmetrically distributed on both sides of the material basket (103).

3. The four-head vertical silicon wafer degumming and wafer cleaning integrated machine according to claim 1 is characterized in that: The cleaning tank comprises a loading soaking tank (201), an ultrasonic cleaning tank (202), an ultrasonic alkaline cleaning tank (203), a first ultrasonic rinsing tank (204), an ultrasonic hydrogen peroxide tank (205), a second ultrasonic rinsing tank (206) and a slow pull-off water tank (207) which are sequentially arranged in a direction away from the four-head vertical inserting machine (1); The ultrasonic alkali cleaning tank (203) and the second ultrasonic rinsing tank (206) are respectively arranged in multiple groups side by side; the ultrasonic cleaning tank (202), the ultrasonic alkali cleaning tank (203), the first ultrasonic rinsing tank (204), the ultrasonic hydrogen peroxide tank (205), the second ultrasonic rinsing tank (206) and the slow pull-off tank (207) are all provided with electric heating pipes; A dehydration support (208) is arranged in the slow-pull dehydration tank (207), and a deceleration driving mechanism (209) for driving the dehydration support (208) to rise and fall is symmetrically arranged at both ends of the slow-pull dehydration tank (207).

4. The four-head vertical silicon wafer degumming and wafer cleaning integrated machine according to claim 1, characterized in that: The flipping mechanism (4) comprises brackets (401) symmetrically arranged on both sides of the starting end of the feeding conveyor line (3) or on both sides of the end of the transfer conveyor line (8), an axle rod (402) is arranged between the two brackets (401), one end of the axle rod (402) is arranged with a reduction motor (403) for driving the rotation thereof, a transmission seat (404) is fixedly connected to the axle rod (402), a first support plate (405) is fixedly arranged on the top of the transmission seat (404), and a second support plate (406) is vertically fixedly arranged on the top surface of the first support plate (405) on one side close to the end of the feeding conveyor line (3) or on the side close to the starting end of the transfer conveyor line (8).

5. The four-head vertical silicon wafer degumming and wafer cleaning integrated machine according to claim 1, characterized in that: The first manipulator mechanism (9) comprises two first X axes (901) arranged in parallel, a first Y axis (902) being transmission-connected between the two first X axes (901), a first Z axis (903) being transmission-connected on the first Y axis (902), a first mounting plate (904) being fixedly connected at the bottom end of the first Z axis (903), and first hooks (905) being respectively arranged at the four corners of the bottom surface of the first mounting plate (904).

6. The four-head vertical silicon wafer degumming and wafer cleaning integrated machine according to claim 1, characterized in that: The second manipulator mechanism (10) comprises two second X axes (1001) arranged in parallel, two second Y axes (1002) are transmission-connected between the two second X axes (1001), the second Y axes (1002) are transmission-connected with second Z axes (1003), the bottom ends of the second Z axes (1003) are fixedly connected with a second mounting plate (1004), and pneumatic clamps (1005) are symmetrically fixedly mounted on both sides of the bottom surface of the second mounting plate (1004).

7. The four-head vertical silicon wafer degumming and wafer cleaning integrated machine according to claim 1, characterized in that: The third manipulator mechanism (11) comprises a third Y-axis (1101) fixedly arranged above the feeding conveyor line (3) and the cleaning mechanism (2); the third Y-axis (1101) is transmission-connected to a third Z-axis (1102); one side of the third Z-axis (1102) is transmission-connected to a third mounting plate (1103); a first crossbeam (1104) is fixedly arranged on the third mounting plate (1103); first cylinders (1105) are symmetrically arranged at both ends of the bottom of the first crossbeam (1104); the telescopic end of the first cylinder (1105) is fixedly connected to a first lifting plate (1106); and second hooks are symmetrically arranged on both sides of the bottom of the first lifting plate (1106).

8. The four-head vertical silicon wafer degumming and wafer cleaning integrated machine according to claim 3 is characterized in that: The fourth manipulator mechanism is provided in three groups, the first group of the fourth manipulator mechanism is provided above the feeding immersion tank (201) to the first ultrasonic rinsing tank (204), the second group of the fourth manipulator mechanism is provided above the first ultrasonic rinsing tank (204) to the slow pulling and debonding water tank (207), and the third group of the fourth manipulator mechanism is provided above the slow pulling and debonding water tank (207) to the output conveyor belt (6); The fourth manipulator mechanism includes two fourth X-axes arranged in parallel, a fourth Y-axis is transmission-connected between the two fourth X-axes, a fourth Z-axis is transmission-connected on the fourth Y-axis, a fourth mounting plate is fixedly connected to the bottom end of the fourth Z-axis, a plurality of second cylinders are symmetrically arranged on both sides of the bottom surface of the fourth mounting plate, the telescopic ends of the second cylinders are fixedly connected to the second lifting plates, and third hooks are symmetrically arranged on both sides of the bottom end of the second lifting plate.

9. The four-head vertical silicon wafer degumming and wafer cleaning integrated machine according to claim 1, characterized in that: The fifth manipulator mechanism (12) includes a fifth Y-axis (1201) fixedly arranged above the end of the reflux conveyor line (7) and the starting end of the transfer conveyor line, the fifth Y-axis (1201) is transmission-connected with a fifth Z-axis (1202), one side of the fifth Z-axis (1202) is transmission-connected with a fifth mounting plate (1203), a second crossbeam (1204) is fixedly arranged on the fifth mounting plate (1203), third cylinders (1205) are symmetrically arranged at both ends of the bottom of the second crossbeam (1204), the telescopic end of the third cylinder (1205) is fixedly connected with a third lifting plate (1206), and fourth hooks are symmetrically arranged on both sides of the bottom of the third lifting plate (1206).

10. The four-head vertical silicon wafer degumming and wafer cleaning integrated machine according to claim 3, characterized in that: The cleaning water recycling mechanism comprises a first water storage tank, a first circulation pump, a plate heat exchanger, a second water storage tank and a first circulation pump; The heights of the slow pull-off water tank (207) and the plurality of second ultrasonic rinsing tanks (206) are gradually reduced in a direction close to the four-head vertical sheet inserting machine (1) to form an overflow structure, and the water in the second ultrasonic rinsing tank (206) at the lowest position overflows to the first water storage tank, and the first water storage tank is connected to the plate heat exchanger via a first circulation pump, and the output end of the plate heat exchanger is respectively connected to the first ultrasonic rinsing tank (204) and the four-head vertical sheet inserting machine (1); The water in the first ultrasonic rinsing tank (204) overflows into the second water storage tank, and the second water storage tank is connected to the ultrasonic cleaning tank (202) via a second circulation pump. The ultrasonic cleaning tank (202) is arranged at a height higher than the loading immersion tank (201) to form an overflow structure.

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